TPD4S010DQAR [TI]
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE; 4通道ESD解决方案为高速差分接口![TPD4S010DQAR](http://pdffile.icpdf.com/pdf1/p00146/img/icpdf/TPD4S_806334_icpdf.jpg)
型号: | TPD4S010DQAR |
厂家: | ![]() |
描述: | 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE |
文件: | 总12页 (文件大小:706K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPD4S009
TPD4S010
www.ti.com ....................................................................................................................................................... SLVS817A–MAY 2008–REVISED OCTOBER 2008
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE
1
FEATURES
2
•
•
•
•
Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz)
•
IEC 61000-4-2 (Level 4) System-Level ESD
Compliance
0.05-pF Matching Capacitance Between
Differential Signal Pairs
•
•
•
2.5-A Peak Pulse Current (8/20-µs Pulse)
Ioff Feature
Low 0.8-pF Line Capacitance for Each Data
Line to GND
Industrial Temperature Range:
–40°C to 85°C
Flow-Through Single-in-Line Pin Mapping for
High-Speed Lines Ensures No Additional
Board Layout Burden While Placing ESD
Protection Chip Near Connector
•
Space-Saving Package Options
TPD4S009...DGS PACKAGE
(TOP VIEW)
TPD4S009...DBV OR DCK PACKAGE
(TOP VIEW)
TPD4S010...DQA PACKAGE
(TOP VIEW)
TPD4S009...DRY PACKAGE
(TOP VIEW)
1
2
3
6
5
4
D1+
GND
D2+
D1–
VCC
1
2
3
10
9
D1+
D1–
GND
D2+
D2–
N.C.
N.C.
D1+
D1+
D1–
GND
D2+
D2–
10
9
N.C.
N.C.
VCC
1
2
3
6
5
4
D1–
1
2
3
4
5
D2–
GND
D2+
8
VCC
D2–
GND
N.C.
N.C.
8
4
5
7
6
7
N.C.
N.C.
6
DESCRIPTION/ORDERING INFORMATION
TPD4S009/TPD4S010 provide an electrostatic discharge (ESD) solution for high-speed differential lines. This
device offers four ESD clamp circuits for dual differential lines. The monolithic silicon technology allows matching
between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF
line-line) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz).
TPD4S009/TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia
interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA),
Ethernet, 1394 (FireWire®), etc.
TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD. TPD4S009 is offered in space-saving DBV,
DCK, DGS, and DRY packages. TPDS4010 is offered in a DQA package.
TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
FireWire is a registered trademark of Apple Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPD4S009
TPD4S010
SLVS817A–MAY 2008–REVISED OCTOBER 2008....................................................................................................................................................... www.ti.com
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
TA
PACKAGE(1)(2)
Reel of
NOMINAL DIMENSIONS (mm)
W = 4.9, L = 3, H < 1.1, Pitch = 0.5
W = 1, L = 2.5, H < 1.1, Pitch = 0.5
W = 1, L = 1.45, H = 0.55, Pitch = 0.5
W = 2.1, L = 2, H = 0.95, Pitch = 0.65
MARKING(3)
MSOP – DGS
TPD4S009DGSR
TPD4S010DQAR
TPD4S009DRYR
TPD4S009DCKR
PREVIEW
PREVIEW
3H
3000
Reel of
3000
SON – DQA
Reel of
5000
–40°C to 85°C SON – DRY
SOT (SC-70) – DCK
SOT (SOT-23) – DBV
Reel of
3000
3H_
Reel of
3000
W = 2.9, L = 2.8, H < 1.45, Pitch = 0.95 TPD4S009DBVR
NFJK
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCK: The actual top-side marking has one additional character that designates assembly/test site.
CIRCUIT DIAGRAM
V
CC
D2+
D2–
D1+
D1–
GND
TERMINAL FUNCTIONS
DBV, DCK,
OR DRY
PIN NO.
DGS
PIN NO.
DQA
PIN NO.
NAME
I/O
DESCRIPTION
1, 3,
4, 6
1, 2,
4, 5
1, 2,
4, 5
D1+, D1–,
D2+, D2–
High-speed ESD clamp provides ESD protection to the
high-speed differential data lines.
ESD port
2
–
5
3
6, 7, 9, 10
8
3, 8
6, 7, 9, 10
–
GND
N.C.
VCC
GND
–
Ground
Not internally connected
Supply
Pwr
2
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
www.ti.com ....................................................................................................................................................... SLVS817A–MAY 2008–REVISED OCTOBER 2008
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
0
MAX
6
UNIT
V
VCC
VIO
Tstg
TA
Supply voltage range
IO signal voltage range
VCC
125
85
V
Storage temperature range
–65
–40
°C
°C
°C
kV
kV
W
Characterized free-air operating temperature range
Lead temperature, 1.6 mm (1/16 in) from case for 10 s)
IEC 61000-4-2 Contact Discharge
IEC 61000-4-2 Air-Gap Discharge
Peak pulse power (tp = 8/20 µs)
Peak pulse current (tp = 8/20 µs)
260
±8
±9
25
2.5
A
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Reverse standoff voltage
Breakdown voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VRWM
VBR
IIO
Any IO pin to ground
IIO = 1 mA
5.5
V
V
Any IO pin to ground
Any IO pin
9
IO port current
VIO = 3.3 V, VCC = 5 V
VIO = 3.3 V, VCC = 5 V
IIO = 8 mA
0.01
0.1
0.1
µA
µA
V
Ioff
Current from IO port to supply pins
Diode forward voltage
Dynamic resistance
Any IO pin
0.01
0.8
1.1
0.8
0.1
VD
Lower clamp diode
Any IO pin
0.6
0.95
RDYN
CIO
ICC
I = 1 A
Ω
IO capacitance
VCC = 5 V, VIO = 2.5 V
VIO = Open, VCC = 5 V
Any IO pin
pF
µA
Operating supply current
VCC pin
1
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
SLVS817A–MAY 2008–REVISED OCTOBER 2008....................................................................................................................................................... www.ti.com
TYPICAL CHARACTERISTICS
2
70
60
50
40
30
20
10
0
D1+
0
-2
D2+
-4
-6
-8
-10
100k
1M
10M
100M
1G
10G
–40
25
55
85
Frequency (Hz)
Temperature,T (°C)
A
Figure 1. Insertion Loss S21 – I/O to GND
Figure 2. Leakage Current vs Temperature (VIO = 2.5 V)
220
200
180
160
140
120
100
80
5.0
4.0
3.0
2.0
1.0
0.0
60
40
20
0
–20
1
2
3
4
5
0
25 50
75 100 125 150 175 200 225 250
Time (nS)
IO Voltage (V)
Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V)
Figure 4. IEC Clamping Waveforms
(8-kV Contact, Average of Ten Waveforms)
3.0
30
2.5
2.0
1.5
1.0
0.5
0.0
25
20
Current (A)
15
10
Power (W)
5
0
0
5
10 15 20 25 30 35 40 45 50
Time (µs)
Figure 5. Pulse Waveform (8/20 µs Pulse)
4
Submit Documentation Feedback
Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009 TPD4S010
TPD4S009
TPD4S010
www.ti.com ....................................................................................................................................................... SLVS817A–MAY 2008–REVISED OCTOBER 2008
TYPICAL CHARACTERISTICS (continued)
Figure 6. Eye Diagram Without TPD4S009
Figure 7. Eye Diagram With TPD4S009
Copyright © 2008, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPD4S009 TPD4S010
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2008
PACKAGING INFORMATION
Orderable Device
TPD4S009DBVR
TPD4S009DBVRG4
TPD4S009DCKR
TPD4S009DCKRG4
TPD4S009DRYR
TPD4S010DQAR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SC70
SC70
SON
DBV
DCK
DCK
DRY
DQA
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6
5000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SON
10
3000
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPD4S009DBVR
TPD4S009DCKR
TPD4S009DRYR
SOT-23
SC70
SON
DBV
DCK
DRY
6
6
6
3000
3000
5000
180.0
180.0
179.0
9.2
9.2
8.4
3.23
2.55
1.2
3.17
2.34
1.65
1.37
1.22
0.7
4.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Sep-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPD4S009DBVR
TPD4S009DCKR
TPD4S009DRYR
SOT-23
SC70
SON
DBV
DCK
DRY
6
6
6
3000
3000
5000
205.0
202.0
220.0
200.0
201.0
205.0
33.0
28.0
50.0
Pack Materials-Page 2
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