TPS53627 [TI]

适用于 Intel VR13 CPU VCORE 和 DDR 存储器的两相 D-CAP+™ 降压控制器;


型号：	TPS53627
厂家：	TEXAS INSTRUMENTS
描述：	适用于 Intel VR13 CPU VCORE 和 DDR 存储器的两相 D-CAP+™ 降压控制器双倍数据速率控制器存储
文件：	总10页 (文件大小：993K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TPS53627

ZHCSG64 –MARCH 2017

TPS53627适用于 VR13 CPU V_CORE和 DDR 内存的两相 D-CAP+™ 降压

控制器

1 特性

3 说明

•

兼容 Intel^®VR13 串行 VID (SVID)

TPS53627 器件是兼容 VR13 SVID 的无驱动器同步降

压控制器。高级控制特性（例如具有重叠脉冲的 D-

CAP+ ™架构）支持下冲衰减 (USR) 和过冲衰减

(OSR)，可提供快速瞬态响应、最低输出电容和高效

率。该器件还支持在 CCM 和 DCM 运行情况下进行单

相运行，从而提高轻负载情况下的效率。该器件集成了

一整套 VR13 I/O 特性，包括 VR_READY

单相或两相运行

支持压降和非压降应用

8 位 DAC，具有 10mV 的步长

4.5V 至 28V 转换电压范围

输出电压范围：0.5V 到 2.3V

轻重负载情况下效率均得到优化

8 级独立的过冲衰减 (OSR) 和下冲衰减 (USR)

无驱动器配置，有助于实现高效的高频开关

(PGOOD)、ALERT 和 VR_HOT。SVID 接口地址允许

在 00h 到 07h 的时间范围内进行编程。输出电压转换

率的可调节控制可编程为高达 20mV/uS。

支持分立式、电源块、功率级™或 DrMOS

MOSFET 实施

与 TI NexFET™功率级配合使用时，该总体解决方案

可提供超高速度和低开关损耗。

•

精确可调电压定位

300kHz 至 1MHz 的频率选择

已获专利 AutoBalance™相位均衡

适用于负载瞬态升压的可编程 ON-Pulse 扩展

可编程自动 DCM 和 CCM 运行

可选 8 级电流限制

TPS53627 器件采用节省空间的热增强型 32 引脚

VQFN 封装，可在 –40°C 到 + 105°C 温度下运行。

器件信息⁽¹⁾

器件型号

封装

封装尺寸（标称值）

小型 32 引脚 4mm × 4mm VQFN 封装 PowerPad

™封装

TPS53627

VQFN (32)

4.00mm x 4.00mm

(1) 要了解所有可用封装，请参阅文档末尾的可订购产品附录。

2 应用范围

•

适用于 DDR 内存的 VDDQ

SoC 处理器 V_CORE电源

.. 简化电路原理图

PWM1

SKIP

CSD9537x

Power Stage

Microprocessor

(µP)

CSP1

CSN1

SVID

CSD9537x

Power Stage

PWM2

CSP2

CSN2

TPS53627

Pin Strapping

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLUSCX9

TPS53627

ZHCSG64 –MARCH 2017

www.ti.com.cn

5.2 接收文档更新通知 ..................................................... 3

5.3 社区资源.................................................................... 3

5.4 商标........................................................................... 3

5.5 静电放电警告............................................................. 3

5.6 Glossary.................................................................... 3

机械、封装和可订购信息 ......................................... 3

特性.......................................................................... 1

应用范围................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

器件和文档支持........................................................ 3

5.1 文档支持.................................................................... 3

4 修订历史记录

日期

修订版本

注释

2017 年 3 月

最初发布。

TPS53627

www.ti.com.cn

ZHCSG64 –MARCH 2017

5 器件和文档支持

5.1 文档支持

5.1.1 相关文档ꢀ

相关文档如下：

TPS51604 数据表

5.2 接收文档更新通知

如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册

后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

5.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

5.4 商标

功率级, AutoBalance, PowerPad, D-CAP+, NexFET, E2E are trademarks of Texas Instruments.

兼容 Intel is a registered trademark of Intel Corporation.

All other trademarks are the property of their respective owners.

5.5 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

5.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

6 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对

本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS53627RSMR

TPS53627RSMT

ACTIVE

VQFN

RSM

3000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 105

TPS

53627

ACTIVE

RSM

NIPDAU

TPS

53627

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

GENERIC PACKAGE VIEW

RSM 32

4 x 4, 0.4 mm pitch

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4224982/A

www.ti.com

PACKAGE OUTLINE

RSM0032B

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

4.1

3.9

0.45

0.25

0.15

PIN 1 INDEX AREA

DETAIL

OPTIONAL TERMINAL

TYPICAL

4.1

3.9

(0.1)

SIDE WALL DETAIL

OPTIONAL METAL THICKNESS

1 MAX

SEATING PLANE

0.08 C

0.05

0.00

2.8 0.05

2X 2.8

(0.2) TYP

4X (0.45)

28X 0.4

SEE SIDE WALL

DETAIL

EXPOSED

THERMAL PAD

SYMM

2.8

0.25

32X

SEE TERMINAL

DETAIL

0.15

0.1

C A B

PIN 1 ID

(OPTIONAL)

0.05

SYMM

0.45

0.25

32X

4219108/B 08/2019

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

RSM0032B

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

2.8)

SYMM

32X (0.55)

32X (0.2)

(

0.2) TYP

VIA

(1.15)

SYMM

(3.85)

28X (0.4)

(R0.05)

TYP

(1.15)

(3.85)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:20X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4219108/B 08/2019

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

RSM0032B

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(0.715)

4X ( 1.23)

(R0.05) TYP

32X (0.55)

32X (0.2)

(0.715)

(3.85)

SYMM

28X (0.4)

METAL

TYP

SYMM

(3.85)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 33:

77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

4219108/B 08/2019

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

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TPS53627 [TI]

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