TPS53688 [TI]
Dual-channel, 8-phase step-down, digital multiphase D-CAP+™ controller with VR13.HC SVID and PMBus;
| 型号： | TPS53688 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Dual-channel, 8-phase step-down, digital multiphase D-CAP+™ controller with VR13.HC SVID and PMBus |
| 文件： | 总8页 (文件大小：326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS53688
SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020
TPS53688 Dual-Channel (N + M ≤ 8 phase) D-CAP+™, Step-Down,
Digital Multiphase Controller with VR13.HC SVID
1 Features
3 Description
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•
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Input Voltage Range: 4.5 V to 17 V
The TPS53688 is a fully VR13.HC SVID compliant
step-down controller with two channels, built-in non-
volatile memory (NVM), and PMBus™ interface, and is
fully compatible with TI NexFET™ smart power
Output Voltage Range: 0.25 V to 5.5 V
Intel® VR13.HC SVID Compliant
Dual Output Supporting N+M Phase
Configurations (N+M ≤ 8, M ≤ 4)
Enhanced D-CAP+™ Control to Provide Super
Transient Performance with Excellent Dynamic
Current Sharing
Programmable Loop Compensation
Programmable Phase-Firing Order
Individual Phase Current Calibrations and
Reporting
Dynamic Phase Shedding with Programmable
Thresholds for Optimizing Efficiency at Light and
Heavy Loads
Fast Phase-Adding for Undershoot Reduction
(USR)
Driverless PWM Architecture for Efficient High-
Frequency Switching
Fully Compatible with TI NextFET™ Power Stage
for High-Density Solutions
Accurate, Adjustable, Adaptive Voltage Positioning
(AVP)
Patented AutoBalance™ Phase Current Balancing
Cycle-by-cycle Per-Phase Current Limit
PMBus™ v1.3.1 System Interface for Telemetry of
Voltage, Current, Power, Temperature, and Fault
Conditions
stages. Advanced control features such as the D-CAP
™
+
architecture with undershoot reduction (USR)
•
provide fast transient response, low output
capacitance, and good dynamic current sharing. The
device also provides a novel phase interleaving
strategy and dynamic phase shedding, for efficiency
improvement across loading conditions. Adjustable
control of output voltage slew rate and adaptive
voltage positioning are natively supported. In addition,
the device supports the PMBus communication
interface, for reporting the telemetry of voltage,
current, power, temperature, and fault conditions to
the host system. All programmable parameters can be
configured through the PMBus interface and stored in
NVM as new default values, to minimize the external
component count.
•
•
•
•
•
•
•
•
The TPS53688 device is offered in a thermally
enhanced 40-pin QFN packaged and is rated to
operate from –40°C to 125°C.
Device Information
•
•
•
PART NUMBER
PACKAGE(1)
BODY SIZE (NOM)
TPS53688
QFN (40)
5 mm × 5 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
•
5 mm × 5 mm, 40-Pin, QFN Package
TPS536xx
2 Applications
PWM1
Power
Stage
CSP1
•
•
•
•
Data center & enterprise computing rack server
Hardware accelerator
Network interface card (NIC)
PWM2
CSP2
PMBus
Power
Stage
ASIC and high-performance client
PWM8
CSP8
Power
Stage
Simplified Schematic
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS53688
www.ti.com
SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 Receiving Notification of Documentation Updates......3
5.2 Support Resources..................................................... 3
5.3 Trademarks.................................................................3
5.4 Electrostatic Discharge Caution..................................3
5.5 Glossary......................................................................3
6 Mechanical, Packaging, and Orderable Information....4
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision (May 2020) to Revision A (September 2020)
Page
•
•
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Changed document status from Advance Information to Production Data ........................................................1
Copyright © 2020 Texas Instruments Incorporated
2
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Product Folder Links: TPS53688
TPS53688
www.ti.com
SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020
5 Device and Documentation Support
5.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
5.2 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
5.3 Trademarks
D-CAP+™, NextFET™, AutoBalance™, NexFET™, the D-CAP+™, and TI E2E™ are trademarks of Texas
Instruments.
PMBus™ is a trademark of SMIF, Inc..
Intel® is a registered trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
5.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
5.5 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
Copyright © 2020 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS53688
TPS53688
www.ti.com
SLUSE79A – APRIL 2020 – REVISED SEPTEMBER 2020
6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2020 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TPS53688
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS53688RSBR
TPS53688RSBT
ACTIVE
WQFN
WQFN
RSB
40
40
3000 RoHS & Green Call TI | NIPDAUAG
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 125
-40 to 125
TPS
53688
ACTIVE
RSB
250 RoHS & Green Call TI | NIPDAUAG
TPS
53688
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2021
Addendum-Page 2
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party
intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages,
costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either
on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s
applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021, Texas Instruments Incorporated
相关型号：
TPS53688RSBR
Dual-channel, 8-phase step-down, digital multiphase D-CAP+™ controller with VR13.HC SVID and PMBus | RSB | 40 | -40 to 125
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TPS53688RSBT
Dual-channel, 8-phase step-down, digital multiphase D-CAP+™ controller with VR13.HC SVID and PMBus | RSB | 40 | -40 to 125
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