TPS62827DMQT [TI]
采用 1.5mm x 1.5mm VSON-HR 封装、具有 1% 精度的 2.5V 至 5.5V 输入、4A 降压转换器 | DMQ | 6 | -40 to 125;
| 型号： | TPS62827DMQT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 1.5mm x 1.5mm VSON-HR 封装、具有 1% 精度的 2.5V 至 5.5V 输入、4A 降压转换器 | DMQ | 6 | -40 to 125 开关 光电二极管 输出元件 转换器 |
| 文件： | 总36页 (文件大小：2376K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS62824, TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A
ZHCSHY6G –MARCH 2018 –REVISED MARCH 2022
TPS6282x 输出精度为1% 的2.4V 至5.5V 输入、1A/2A/3A/4A 降压转换器
1 特性
3 说明
• 可作为集成电感器的电源模块：TPSM82821 和
TPSM82822
• DCS-Control™ 拓扑
• 1% 反馈或输出电压精度（整个温度范围）
• 效率高达97%
• 26mΩ和25mΩ内部功率MOSFET
• 2.4V 至5.5V 输入电压范围
• 4μA 工作静态电流
TPS6282x 是易于使用的同步降压直流/直流转换器系
列，具有仅 4μA 的超低静态电流。该产品基于 DCS-
Control 拓扑，可提供快速瞬态响应。由于具有内部基
准，该产品可在 -40°C 至 125°C 的结温范围内以 1%
的高反馈电压精度将输出电压调节到 0.6V 以下。该系
列器件具有引脚对引脚和 BOM 对 BOM 兼容性。整个
解决方案需要一个小型 470nH 电感器、一个 4.7µF 输
入电容器和两个10µF 或一个22µF 的输出电容器。
• 2.2MHz 开关频率
TPS6282x 具有两种型号。第一种型号可自动进入省电
模式，在超轻负载条件下保持高效率，从而延长系统电
池的运行时间。第二种型号可实现强制PWM 运行，以
维持连续导通模式，从而确保超低的输出电压纹波和准
固定开关频率。该器件可提供电源正常信号和内部软启
动电路。它们能够以 100% 模式运行。在故障保护方
面，该系列器件加入了断续短路保护以及热关断功能。
该器件可采用 6 引脚 1.5 x 1.5mm QFN 封装，提供具
有最高功率密度的解决方案。
• 可调输出电压范围为0.6V 至4V
• 可实现轻负载效率的省电模式
• 可实现最低压降的100% 占空比
• 有源输出放电
• 电源正常输出
• 热关断保护
• 断续短路保护
• 强制PWM 版本可支持CCM 运行
• 使用TPS6282x 并借助WEBENCH® 电源设计器创
建定制设计方案
器件信息
封装(1)
封装尺寸（标称值）
器件型号
TPS62824x
2 应用
• 固态硬盘
TPS62825x
TPS62826x
TPS62827x
• 便携式电子产品
• 模拟安防摄像头和IP 网络摄像头
• 工业PC
1.5mm x 1.5mm
6 引脚VSON-HR
• 多功能打印机
• 通用负载点
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
100
95
90
85
80
75
70
65
60
55
50
Vout=3.3V
Vout=2.5V
Vout=1.8V
Vout=1.2V
Vout=0.6V
典型应用原理图
100m
1m
10m
Load (A)
100m
1
4
VIN = 5V 时的效率
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSEF9
TPS62824, TPS62825, TPS62826, TPS62827, TPS62824A, TPS62825A, TPS62826A, TPS62827A
ZHCSHY6G –MARCH 2018 –REVISED MARCH 2022
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Table of Contents
8.4 Device Functional Modes............................................9
9 Application and Implementation.................................. 11
9.1 Application Information..............................................11
9.2 Typical Application.................................................... 11
10 Power Supply Recommendations..............................22
11 Layout...........................................................................23
11.1 Layout Guidelines................................................... 23
11.2 Layout Example...................................................... 23
12 Device and Documentation Support..........................24
12.1 Device Support....................................................... 24
12.2 Documentation Support.......................................... 24
12.3 支持资源..................................................................24
12.4 Trademarks.............................................................24
12.5 Electrostatic Discharge Caution..............................24
12.6 术语表..................................................................... 24
13 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Options................................................................ 3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 4
7.1 Absolute Maximum Ratings ....................................... 4
7.2 ESD Ratings .............................................................. 4
7.3 Recommended Operating Conditions ........................4
7.4 Thermal Information ...................................................4
7.5 Electrical Characteristics ............................................5
7.6 Typical Characteristics................................................6
8 Detailed Description........................................................7
8.1 Overview.....................................................................7
8.2 Functional Block Diagram...........................................7
8.3 Feature Description.....................................................8
Information.................................................................... 25
4 Revision History
Changes from Revision F (September 2021) to Revision G (March 2022)
Page
• 从数据表标题中删除了“采用1.5mm × 1.5mm QFN 封装”..............................................................................1
Changes from Revision E (December 2020) to Revision F (September 2021)
Page
• Changed the status of the TPS62824DMQ to Production Data......................................................................... 3
• Added the TPS6282533..................................................................................................................................... 3
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5 Device Options
OPERATION
PART NUMBER
OUTPUT VOLTAGE
OUTPUT CURRENT
MODE
TPS62824DMQ
TPS62825DMQ
TPS6282518DMQ
TPS6282533DMQ
TPS62826DMQ
TPS6282618DMQ
TPS62827DMQ
TPS62824ADMQ
TPS62825ADMQ
TPS62826ADMQ
TPS62827ADMQ
Adjustable
Adjustable
1.8 V
1A
2 A
3.3 V
PSM/PWM
Adjustable
1.8 V
3 A
Adjustable
Adjustable
Adjustable
Adjustable
Adjustable
4 A
1 A
2 A
3 A
4A
Forced-PWM
6 Pin Configuration and Functions
FB
3
2
1
4
5
6
GND
SW
PG
EN
VIN
图6-1. DMQ Package 6-Pin VSON-HR Bottom View
表6-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Device enable pin. To enable the device, this pin needs to be pulled high. Pulling this pin low
disables the device. Do not leave floating.
EN
1
I
O
I
Power good open-drain output pin. The pullup resistor can be connected to voltages up to
5.5 V. If unused, leave it floating.
PG
FB
2
3
Feedback pin. For the fixed output voltage versions, this pin must be connected to the
output.
GND
SW
4
5
6
Ground pin
PWR
PWR
Switch pin of the power stage
Input voltage pin
VIN
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7 Specifications
7.1 Absolute Maximum Ratings
MIN
MAX
6
UNIT
VIN, FB, EN, PG
–0.3
–0.3
–1.0
–2.5
–40
–65
SW (DC)
VIN + 0.3
VIN + 0.3
10
Voltage at Pins (1)
Temperature
V
SW (DC, in current limit)
SW (AC, less than 10ns) (2)
Operating junction temperature, TJ
Storage temperature, Tstg
150
°C
150
(1) All voltage values are with respect to network ground terminal.
(2) While switching.
7.2 ESD Ratings
VALUE
UNIT
V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2)
±2000
±500
V(ESD)
Electrostatic discharge
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over operating junction temperature range (unless otherwise noted)
MIN
2.4
2.5
0.6
0
NOM
MAX
5.5
5.5
4.0
1
UNIT
V
VIN
Input voltage range, TPS62824x, TPS62825x and TPS62826x
Input voltage range, TPS62827x
Output voltage range
VIN
V
VOUT
IOUT
IOUT
IOUT
IOUT
ISINK_PG
VPG
TJ
V
Output current range, TPS62824x
Output current range, TPS62825x
Output current range, TPS62826x
Output current range, TPS62827x
Sink current at PG pin
A
0
2
A
0
3
A
0
4
A
1
mA
V
Pull-up resistor voltage
5.5
125
Operating junction temperature
-40
°C
7.4 Thermal Information
TPS6282xx
THERMAL METRIC(1)
TPS6282x, JEDEC
TPS62826EVM-794
UNIT
6 PINS
129.5
103.9
33.1
6 PINS
71.4
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
n/a (2)
n/a (2)
3.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
3.8
33.1
38.6
ψJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2) Not applicable to an EVM.
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7.5 Electrical Characteristics
TJ = –40°C to 125°C, and VIN = 2.4 V to 5.5 V. Typical values are at TJ = 25°C and VIN = 5 V , unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
IQ
Quiescent current
EN = High, no load, device not switching
4
8
10
µA
mA
µA
V
IQ
Quiescent current
EN = High, no load, FPWM devices
ISD
Shutdown current
0.05
2.2
160
150
20
0.5
2.3
EN = Low, TJ = -40 ℃to 85 ℃
VIN falling
Under voltage lock out threshold
Under voltage lock out hysteresis
Thermal shutdown threshold
Thermal shutdown hysteresis
2.1
VUVLO
VIN rising
mV
°C
°C
TJ rising
TJSD
TJ falling
LOGIC INTERFACE EN
VIH
High-level threshold voltage
1.0
V
V
VIL
Low-level threshold voltage
0.4
0.1
IEN,LKG
Input leakage current into EN pin
EN = High
0.01
µA
SOFT START, POWER GOOD
Time from EN high to 95% of VOUT nominal, TPS62827
1.75
1.25
ms
ms
tSS
Soft start time
Time from EN high to 95% of VOUT nominal,
TPS62824x/5x/6x/7A
VPG rising, VFB referenced to VFB nominal
VPG falling, VFB referenced to VFB nominal
VPG rising, VFB referenced to VFB nominal
VPG falling, VFB referenced to VFB nominal
Isink = 1 mA
94
90
96
92
98
94
%
%
%
%
V
Power good lower threshold
Power good upper threshold
VPG
103
108
105
110
107
112
0.4
0.1
VPG,OL
IPG,LKG
Low-level output voltage
Input leakage current into PG pin
VPG = 5.0 V
0.01
100
20
µA
PG rising edge
tPG,DLY
Power good deglitch delay
µs
PG falling edge
OUTPUT
VOUT
Output voltage accuracy
Output voltage accuracy
Feedback regulation voltage
TPS6282533, PWM mode
TPS6282x18, PWM mode
PWM mode
3.267
1.78
594
3.3
1.8
3.333
1.82
606
V
V
VOUT
VFB
600
mV
Feedback input leakage current for adjustable
output voltage
IFB,LKG
VFB = 0.6 V
0.01
7.5
0.05
µA
Internal resistor divider connected to FB pin, for
fixed output votlage
RFB
IDIS
TPS6282518, TPS6282618, TPS6282533
MΩ
Output discharge current
Load regulation
VSW = 0.4V; EN = LOW
75
400
0.1
mA
IOUT = 0.5 A to 3 A, VOUT = 1.8 V
%/A
POWER SWITCH
High-side FET on-resistance
26
25
mΩ
mΩ
A
RDS(on)
Low-side FET on-resistance
TPS62824A
1.7
2.7
3.7
4.8
2.1
3.3
4.3
5.6
-1.6
2.2
2.4
3.9
5.0
6.4
TPS62825x
A
ILIM
High-side FET switch current limit, DC
TPS62826x
A
TPS62827x
A
ILIM
fSW
Low-side FET negative current limit, DC
PWM switching frequency
TPS62824A/5A/6A/7A
IOUT = 1 A, VOUT = 1.8 V
A
MHz
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7.6 Typical Characteristics
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
TJ = 0 °C
TJ = 0 °C
TJ = 25 °C
TJ = 85 °C
TJ = 125 °C
TJ = 25 °C
TJ = 85 °C
TJ = 125 °C
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
D010
D011
图7-1. High-Side FET On-Resistance
图7-2. Low-Side FET On-Resistance
0.5
0.4
0.3
0.2
0.1
0.0
8.0
6.0
4.0
2.0
0.0
TJ = -40 °C
TJ = 25 °C
TJ = 85 °C
TJ = 125 °C
TJ = -40 °C
TJ = 25 °C
TJ = 85 °C
TJ = 125 °C
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
D000
D001
图7-3. Shutdown Current
图7-4. Quiescent Current
500
450
400
350
300
250
200
150
100
50
TJ = 0 °C
TJ = 25 °C
TJ = 85 °C
TJ = 125 °C
0
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
D012
图7-5. Output Discharge Current
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8 Detailed Description
8.1 Overview
The TPS6282x are synchronous step-down converters based on the DCS-Control topology with an adaptive
constant on-time control and a stabilized switching frequency. It operates in PWM (pulse width modulation) mode
for medium to heavy loads and in PSM (power save mode) at light load conditions, keeping the output voltage
ripple small. The nominal switching frequency is about 2.2 MHz with a small and controlled variation over the
input voltage range. As the load current decreases, the converter enters PSM, reducing the switching frequency
to keep efficiency high over the entire load current range. Since combining both PWM and PSM within a single
building block, the transition between modes is seamless and without effect on the output voltage. In forced-
PWM devices, the converter maintains a continuous conduction mode operation and keeps the output voltage
ripple very low across the whole load range and at a nominal switching frequency of 2.2 MHz. The devices offer
both excellent dc voltage and fast load transient regulation, combined with a very low output voltage ripple.
8.2 Functional Block Diagram
PG
Control Logic
EN
VFB
VREF
Thermal
Shutdown
Soft-Start
UVLO
VFB
VIN
VSW
FB
VIN
Ramp
Peak Current Detect
EA
VREF
HICCUP
Comp
VSW
Modulator
SW
Gate Drive
Ton
Output
Discharge
VIN
VSW
Zero Current Detect
0.6 V
Or
Fixed Output Voltages
VREF
GND
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8.3 Feature Description
8.3.1 Pulse Width Modulation (PWM) Operation
At load currents larger than half the inductor ripple current, the device operates in pulse width modulation in
continuous conduction mode (CCM). The PWM operation is based on an adaptive constant on-time control with
stabilized switching frequency. To achieve a stable switching frequency in a steady state condition, the on-time is
calculated as:
VOUT
TON
=
× 450ns
V
IN
(1)
In forced-PWM devices, the device always operates in pulse width modulation in continuous conduction mode
(CCM).
8.3.2 Power Save Mode (PSM) Operation
To maintain high efficiency at light loads, the device enters power save mode (PSM) at the boundary to
discontinuous conduction mode (DCM). This happens when the output current becomes smaller than half of the
ripple current of the inductor. The device operates now with a fixed on-time and the switching frequency further
decreases proportional to the load current. It can be calculated as:
2×IOUT
fPSM
=
V
V -V
é
ù
TO2N
×
IN
IN
OUT
ê
ú
VOUT
L
ë
û
(2)
In PSM, the output voltage rises slightly above the nominal target, which can be minimized using larger output
capacitance. At duty cycles larger than 90%, the device may not enter PSM. The device maintains output
regulation in PWM mode.
8.3.3 Minimum Duty Cycle and 100% Mode Operation
There is no limitation for small duty cycles since even at very low duty cycles, the switching frequency is reduced
as needed to always ensure a proper regulation.
If the output voltage level comes close to the input voltage, the device enters 100% mode. While the high-side
switch is constantly turned on, the low-side switch is switched off. The difference between VIN and VOUT is
determined by the voltage drop across the high-side FET and the DC resistance of the inductor. The minimum
VIN that is needed to maintain a specific VOUT value is estimated as:
V
= VOUT + IOUT,MAX ´(RDS(on) + RL )
IN,MIN
(3)
where
• VIN,MIN = Minimum input voltage to maintain an output voltage
• IOUT,MAX = Maximum output current
• RDS(on) = High-side FET ON-resistance
• RL = Inductor ohmic resistance (DCR)
8.3.4 Soft Start
About 250 μs after EN goes High, the internal soft-start circuitry controls the output voltage during start-up. This
avoids excessive inrush current and ensures a controlled output voltage ramp. It also prevents unwanted voltage
drops from high-impedance power sources or batteries. The TPS6282x can start into a pre-biased output.
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8.3.5 Switch Current Limit and HICCUP Short-Circuit Protection
The switch current limit prevents the device from drawing excessive current in case of externally-caused
overcurrent or short circuit condition. Due to an internal propagation delay (typically 60 ns), the actual AC peak
current can exceed the static current limit during that time.
If the current limit threshold is reached, the device delivers its maximum output current. Detecting this condition
for 32 switching cycles (about 13 μs), the device turns off the high-side MOSFET for about 100 μs which
allows the inductor current to decrease through the low-side MOSFET's body diode and then restarts again with
a soft start cycle. As long as the overload condition is present, the device hiccups that way, limiting the output
power.
In forced PWM devices, a negative current limit (ILIMN) is enabled to prevent excessive current flowing
backwards to the input. When the inductor current reaches ILIMN, the low-side MOSFET turns off and the high-
side MOSFET turns on and kept on until TON time expires.
8.3.6 Undervoltage Lockout
The undervoltage lockout (UVLO) function prevents misoperation of the device if the input voltage drops below
the UVLO threshold. It is set to about 2.2 V with a hysteresis of typically 160 mV.
8.3.7 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 150°C
(typ.), the device goes in thermal shutdown with a hysteresis of typically 20°C. Once TJ has decreased enough,
the device resumes normal operation.
8.4 Device Functional Modes
8.4.1 Enable, Disable, and Output Discharge
The device starts operation when Enable (EN) is set High. The input threshold levels are typically 0.9 V for rising
and 0.7 V for falling signals. Do not leave EN floating. Shutdown is forced if EN is pulled Low with a shutdown
current of typically 50 nA. During shutdown, the internal power MOSFETs as well as the entire control circuitry
are turned off and the output voltage is actively discharged through the SW pin by a current sink. Therefore VIN
must remain present for the discharge to function.
8.4.2 Power Good
The TPS6282x has a built-in power good (PG) function. The PG pin goes high impedance when the output
voltage has reached its nominal value. Otherwise, including when disabled, in UVLO or in thermal shutdown, PG
is Low (see 表8-1). The PG function is formed with a window comparator, which has an upper and lower voltage
threshold. The PG pin is an open-drain output and is specified to sink up to 1 mA. The power good output
requires a pullup resistor connecting to any voltage rail less than 5.5 V.
The PG signal can be used for sequencing of multiple rails by connecting it to the EN pin of other converters.
Leave the PG pin unconnected when not used. The PG rising edge has a 100-µs blanking time and the PG
falling edge has a deglitch delay of 20 µs.
表8-1. PG Pin Logic
LOGIC STATUS
DEVICE CONDITIONS
HIGH Z
LOW
EN = High, VFB ≥0.576 V
EN = High, VFB ≤0.552 V
EN = High, VFB ≤0.63 V
EN = High, VFB ≥0.66 V
EN = Low
√
√
Enable
√
√
√
√
√
Shutdown
Thermal Shutdown
UVLO
TJ > TJSD
0.7 V < VIN < VUVLO
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表8-1. PG Pin Logic (continued)
LOGIC STATUS
DEVICE CONDITIONS
HIGH Z
LOW
Power Supply Removal
VIN < 0.7 V
√
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9 Application and Implementation
备注
以下应用部分中的信息不属于TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design for
several input and output voltage options by using typical applications as a reference.
9.2 Typical Application
图9-1. Typical Application of TPS62826x
图9-2. Typical Application of TPS62827
9.2.1 Design Requirements
For this design example, use the parameters listed in 表9-1 as the input parameters.
表9-1. Design Parameters
DESIGN PARAMETER
Input voltage, TPS62826x
Input voltage, TPS62827x
Output voltage
EXAMPLE VALUE
2.4 V to 5.5 V
2.5 V to 5.5 V
1.8 V
Output ripple voltage
<20 mV
Maximum output current, TPS62826x
Maximum output current, TPS62827x
3 A
4 A
表9-2 lists the components used for the example.
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表9-2. List of Components
REFERENCE
DESCRIPTION
MANUFACTURER
C1
4.7 µF, Ceramic capacitor, 6.3 V, X7R, size 0603, JMK107BB7475MA
Taiyo Yuden
C2,
2 x 10 µF, Ceramic capacitor, 10 V, X7R, size 0603, GRM188Z71A106MA73D
Murata
TPS62824x/5x/6x/7A
C2, TPS62827
3 x 10 µF, Ceramic capacitor, 10 V, X7R, size 0603, GRM188Z71A106MA73D
120 pF, Ceramic capacitor, 50 V, size 0402
Murata
Std
C3
L1
0.47 µH, Power Inductor, XFL4015-471MEB
Coilcraft
Std
R1
R2
R3
Depending on the output voltage, 1%, size 0402
100 kΩ, Chip resistor, 1/16 W, 1%, size 0402
Std
Std
100 kΩ, Chip resistor, 1/16 W, 1%, size 0402
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS6282x device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Setting The Output Voltage
The output voltage is set by an external resistor divider according to 方程式4:
≈
∆
«
’
VOUT
VFB
V
OUT
≈
’
R1= R2ì
-1 = R2ì
-1
÷
÷
∆
«
0.6V
◊
◊
(4)
R2 must not be higher than 100 kΩ to achieve high efficiency at light load while providing acceptable noise
sensitivity. 方程式 5 shows how to compute the value of the feedforward capacitor for a given R2 value. For the
recommended 100k value for R2, a 120-pF feedforward capacitor is used.
12µ
C3 =
R2
(5)
For the fixed output voltage versions, connect the FB pin to the output. R1, R2, and C3 are not needed. The
fixed output voltage devices have an internal feedforward capacitor.
9.2.2.3 Output Filter Design
The inductor and the output capacitor together provide a low-pass filter. To simplify this process, 表 9-3 outlines
possible inductor and capacitor value combinations for most applications. Checked cells represent combinations
that are proven for stability by simulation and lab test. Further combinations should be checked for each
individual application.
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表9-3. Matrix of Output Capacitor and Inductor Combinations, TPS62824x, TPS62825x, TPS62826x and
TPS62827A
NOMINAL COUT [µF](3)
NOMINAL L [µH](2)
10
2 x 10 or 22
47
100
0.33
0.47
1.0
(1)
+
+
+
(1) This LC combination is the standard value and recommended for most applications.
(2) Inductor tolerance and current derating is anticipated. The effective inductance can vary by 20% and –30%.
(3) Capacitance tolerance and bias voltage derating is anticipated. The effective capacitance can vary by 20% and –35%.
表9-4. Matrix of Output Capacitor and Inductor Combinations, TPS62827
NOMINAL COUT [µF](3)
NOMINAL L [µH](2)
22
3 x 10
47
100
0.33
0.47
1.0
(1)
+
+
+
9.2.2.4 Inductor Selection
The main parameter for the inductor selection is the inductor value and then the saturation current of the
inductor. To calculate the maximum inductor current under static load conditions, 方程式6 is given.
DIL
IL,MAX = IOUT,MAX
+
2
VOUT
1-
V
IN
DIL = VOUT
´
L ´ fSW
(6)
where
• IOUT,MAX = Maximum output current
• ΔIL = Inductor current ripple
• fSW = Switching frequency
• L = Inductor value
It is recommended to choose a saturation current for the inductor that is approximately 20% to 30% higher than
IL,MAX. In addition, DC resistance and size should also be taken into account when selecting an appropriate
inductor. 表9-5 lists recommended inductors.
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表9-5. List of Recommended Inductors
MAX. DC
RESISTANCE [mΩ]
CURRENT RATING DIMENSIONS [L x W
INDUCTANCE [µH]
MFR PART NUMBER(1)
[A]
4.8
4.6
4.8
4.8
5.1
5.2
6.6
8.0
6.8
x H mm]
2.0 x 1.6 x 1.0
2.0 x 1.2 x 1.0
2.0 x 1.6 x 1.0
2.0 x 1.6 x 1.0
2.0 x 1.6 x 1.0
2.0 x 1.6 x 1.0
4.0 x 4.0 x 1.6
3.5 x 3.2 x 2.0
4.5 x 4 x 1.8
32
25
HTEN20161T-R47MDR, Cyntec
HTEH20121T-R47MSR, Cyntec
DFE201610E - R47M, MuRata
DFE201210S - R47M, MuRata
TFM201610ALM-R47MTAA, TDK
TFM201610ALC-R47MTAA, TDK
XFL4015-471ME, Coilcraft
32
32
0.47
34
25
8.36
10.85
11.2
XEL3520-471ME, Coilcraft
WE-LHMI-744373240047, Würth
(1) See the Third-party Products Disclaimer
9.2.2.5 Capacitor Selection
The input capacitor is the low-impedance energy source for the converters which helps provide stable operation.
A low-ESR multilayer ceramic capacitor is recommended for best filtering and must be placed between VIN and
GND as close as possible to those pins. For most applications, a minimum effective input capacitance of 3 µF
should be present, though a larger value reduces input current ripple.
The architecture of the device allows the use of tiny ceramic output capacitors with low equivalent series
resistance (ESR). These capacitors provide low output voltage ripple and are recommended. To keep its low
resistance up to high frequencies and to get narrow capacitance variation with temperature, TI recommends
using X7R or X5R dielectrics. Considering the DC-bias derating the capacitance, the minimum effective output
capacitance is 10 µF for TPS62824x, TPS62825x, TPS62826x and TPS62827A and 20 µF for TPS62827.
A feed forward capacitor is required for the adjustable version, as described in 节 9.2.2.2. This capacitor is not
required for the fixed output voltage versions.
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9.2.3 Application Curves
VIN = 5.0 V, VOUT = 1.8 V, TA = 25°C, BOM = 表9-2, unless otherwise noted.
0.612
0.609
0.606
0.603
0.6
95
90
85
80
75
70
65
60
55
50
45
0.597
0.594
0.591
0.588
VIN = 2.5 V
VIN = 3.3 V
VIN = 4.2 V
VIN = 5.0 V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 5.0V
100m
1m
10m
Load (A)
100m
1
4
100m
1m
10m
Load (A)
100m
1
4
D021
D002
VOUT = 0.6 V
VOUT = 0.6 V
图9-4. Load Regulation
图9-3. Efficiency
100
95
90
85
80
75
70
65
60
55
50
45
40
0.609
0.606
0.603
0.6
VIN=2.5V
VIN=3.3V
VIN=4.2V
VIN=5.0V
0.597
0.594
0.591
VIN=2.5V
VIN=3.3V
VIN=4.2V
VIN=5.0V
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
VOUT = 0.6 V
F-PWM devices
VOUT = 0.6 V
F-PWM devices
图9-6. Load Regulation
图9-5. PWM Efficiency
100
95
90
85
80
75
70
65
60
55
1.212
1.209
1.206
1.203
1.2
1.197
1.194
1.191
1.188
VIN = 2.4 V
VIN = 3.3 V
VIN = 4.5 V
VIN = 5.0 V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 5.0V
100m
1m
10m
Load (A)
100m
1
4
100m
1m
10m
Load (A)
100m
1
4
D031
D003
VOUT = 1.2 V
VOUT = 1.2 V
图9-8. Load Regulation
图9-7. Efficiency
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100
95
90
85
80
75
70
65
60
55
50
45
40
1.218
1.212
1.206
1.2
VIN=2.5V
VIN=3.3V
VIN=4.2V
VIN=5.0V
1.194
1.188
1.182
VIN=2.5V
VIN=3.3V
VIN=4.2V
VIN=5.0V
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
VOUT = 1.2 V
F-PWM devices
VOUT = 1.2 V
F-PWM devices
图9-10. Load Regulation
图9-9. PWM Efficiency
100
95
90
85
80
75
70
65
60
1.818
1.812
1.806
1.8
VIN = 2.5 V
VIN = 3.3 V
VIN = 4.2 V
VIN = 5.0 V
1.794
1.788
1.782
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN = 5.0V
100m
1m
10m
Load (A)
100m
1
4
100m
1m
10m
Load (A)
100m
1
4
D041
D004
VOUT = 1.8 V
VOUT = 1.8 V
图9-12. Load Regulation
图9-11. Efficiency
100
1.827
VIN=2.5V
95
90
85
80
75
70
65
60
55
50
45
40
1.821
1.815
1.809
1.803
1.797
1.791
1.785
1.779
1.773
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=2.5V
VIN=3.3V
VIN=4.2V
VIN=5.0V
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
VOUT = 1.8 V
F-PWM devices
VOUT = 1.8 V
F-PWM devices
图9-14. Load Regulation
图9-13. PWM Efficiency
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100
95
90
85
80
75
70
65
2.525
VIN = 3.3 V
VIN = 4.2 V
VIN = 5.0 V
2.515
2.505
2.495
2.485
VIN = 3.3V
VIN = 4.2V
VIN = 5.0V
2.475
60
100m
100m
1m
10m
Load (A)
100m
1
4
1m
10m
Load (A)
100m
1
4
D061
D006
VOUT = 2.5 V
VOUT = 2.5 V
图9-16. Load Regulation
图9-15. Efficiency
2.5375
100
95
90
85
80
75
70
65
60
55
50
45
VIN=3.3V
VIN=4.2V
VIN=5.0V
2.53
2.5225
2.515
2.5075
2.5
2.4925
2.485
2.4775
2.47
VIN=3.3V
VIN=4.2V
VIN=5.0V
2.4625
40
0
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
VOUT = 2.5 V
F-PWM devices
VOUT = 2.5 V
F-PWM devices
图9-18. Load Regulation
图9-17. PWM Efficiency
100
95
90
85
80
75
3.340
3.320
3.300
3.280
3.260
VIN = 4.2V
VIN = 5.0V
VIN = 4.2V
VIN = 5.0V
70
100m
100m
1m
10m
Load (A)
100m
1
4
1m
10m
Load (A)
100m
1
4
D051
D005
VOUT = 3.3 V
VOUT = 3.3 V
图9-20. Load Regulation
图9-19. Efficiency
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3.3495
3.3396
3.3297
3.3198
3.3099
3.3
100
95
90
85
80
75
70
65
60
55
50
45
40
VIN=4.2V
VIN=5.0V
3.2901
3.2802
3.2703
3.2604
3.2505
VIN=4.2V
VIN=5.0V
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
VOUT = 3.3 V
F-PWM devices
VOUT = 3.3 V
F-PWM devices
图9-22. Load Regulation
图9-21. PWM Efficiency
3000
2750
2500
2250
2000
1750
1500
1250
1000
750
3000
2750
2500
2250
2000
1750
1500
1250
1000
750
VOUT = 0.6V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
VOUT = 0.6V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
500
500
250
250
0
0
0.0
0.5
1.0
1.5
Load (A)
2.0
2.5
3.0
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
D008
D009
VIN = 3.3 V
TPS62824/5/6
IOUT = 1.0 A
TPS62824/5/6
图9-23. Switching Frequency
图9-24. Switching Frequency
3.00x106
2.75x106
2.50x106
2.25x106
2.00x106
1.75x106
1.50x106
1.25x106
1.00x106
750.00x103
500.00x103
250.00x103
0.00x100
2.70x106
2.40x106
2.10x106
1.80x106
1.50x106
1.20x106
900.00x103
600.00x103
300.00x103
0.00x100
VOUT=0.6V
VOUT=1.2V
VOUT=1.8V
VOUT=2.5V
VOUT=3.3V
VOUT=0.6V
VOUT=1.2V
VOUT=1.8V
VOUT=2.5V
2.4
2.8
3.2
3.6
4
Input Voltgae (V)
4.4
4.8
5.2 5.5
0
0.5
1
1.5
2
Load (A)
2.5
3
3.5
4
IOUT = 1.0 A
TPS62824A/5A/6A/7A
VIN = 3.3 V
TPS62824A/5A/6A/7A
图9-26. Switching Frequency
图9-25. Switching Frequency
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3000
2750
2500
2250
2000
1750
1500
1250
1000
750
3000
2750
2500
2250
2000
1750
1500
1250
1000
VOUT = 0.6V
750
VOUT = 0.6V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 1.2V
VOUT = 1.8V
VOUT = 2.5V
VOUT = 3.3V
500
500
250
0
250
0
0.0
0.5
1.0
1.5
2.0
Load (A)
2.5
3.0
3.5
4.0
2.5
3.0
3.5
4.0
Input Voltage (V)
4.5
5.0
5.5
D013
D014
VIN = 3.3 V
TPS62827
IOUT = 1.0 A
TPS62827
图9-27. Switching Frequency
图9-28. Switching Frequency
5
4
3
2
1
0
5
4
3
2
1
0
VIN = 2.5 V
VIN = 3.3 V
VIN = 5.0 V
VIN = 2.5 V
VIN = 3.3 V
VIN = 5.0 V
45
55
65
75
Ambient Temperature (°C)
85
95
105
115
125
45
55
65
75
Ambient Temperature (°C)
85
95
105
115
125
D020
D015
VOUT = 1.2 V
VOUT = 1.8 V
θJA= 71.4°C/W
θJA= 71.4°C/W
图9-29. Thermal Derating
图9-30. Thermal Derating
5
5
4
3
2
1
0
4
3
2
1
0
VIN = 3.3 V
VIN = 5.0 V
VIN = 5.0 V
55 65
45
55
65
75
Ambient Temperature (°C)
85
95
105
115
125
45
75
Ambient Temperature (°C)
85
95
105
115
125
D017
D016
VOUT = 2.5 V
VOUT = 3.3 V
θJA= 71.4°C/W
θJA= 71.4°C/W
图9-31. Thermal Derating
图9-32. Thermal Derating
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IOUT = 1.0 A
TPS62824/5/6/7
IOUT = 0.1 A
TPS62824/5/6/7
图9-33. PWM Operation
图9-34. PSM Operation
IOUT = 1.0 A
TPS62824A/5A/6A/7A
No load
TPS62824A/5A/6A/7A
图9-35. PWM Operation at F-PWM
图9-36. PWM Operation at F-PWM
TPS62825/6/7
TPS62824/5/6/7
Load = 0.6 Ω
图9-38. Start-up with No Load
图9-37. Start-up with Load
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ZHCSHY6G –MARCH 2018 –REVISED MARCH 2022
TPS62825A/6A/7A
TPS62824A/5A/6A/7A
Load = 0.6 Ω
图9-40. Start-up with No Load
图9-39. Start-up with Load
TPS6282x
TPS6282x
Load = 1.8 Ω
图9-42. Disable, Active Output Discharge at No
图9-41. Disable, Active Output Discharge
Load
IOUT = 0.05 A to 1A
TPS62824/5/6/7
IOUT = 1 A to 2 A
TPS62825/6/7
图9-43. Load Transient
图9-44. Load Transient
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IOUT = 0.05 A to 1A
TPS62824A/5A/6A/7A
IOUT = 1 A to 2 A
TPS62825A/6A/7A
图9-45. Load Transient
图9-46. Load Transient
VPG
VPG
5V/DIV
5V/DIV
ICOIL
ICOIL
2A/DIV
2A/DIV
VOUT
VOUT
1V/DIV
1V/DIV
Time - 200ꢀs/DIV
Time - 2ꢀs/DIV
D018
D019
IOUT = 1 A
TPS6282x
IOUT = 1 A
TPS6282x
图9-47. HICCUP Short Circuit Protection
图9-48. HICCUP Short Circuit Protection (Zoom In)
10 Power Supply Recommendations
The device is designed to operate from an input voltage supply range from 2.4 V to 5.5 V. Ensure that the input
power supply has a sufficient current rating for the application.
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ZHCSHY6G –MARCH 2018 –REVISED MARCH 2022
11 Layout
11.1 Layout Guidelines
The printed-circuit-board (PCB) layout is an important step to maintain the high performance of the device. See
节11.2 for the recommended PCB layout.
• The input/output capacitors and the inductor should be placed as close as possible to the IC. This keeps the
power traces short. Routing these power traces direct and wide results in low trace resistance and low
parasitic inductance.
• The low side of the input and output capacitors must be connected properly to the GND pin to avoid a ground
potential shift.
• The sense traces connected to FB is a signal trace. Special care should be taken to avoid noise being
induced. Keep these traces away from SW nodes. The connection of the output voltage trace for the FB
resistors should be made at the output capacitor.
• Refer to 节11.2 for an example of component placement, routing and thermal design.
11.2 Layout Example
L1
VOUT
VIN
C2
C1
Solution size = 31mm2
R2
R1
GND
C3
图11-1. PCB Layout Recommendation
11.2.1 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power
dissipation limits of a given component.
Two basic approaches for enhancing thermal performance are:
• Improving the power dissipation capability of the PCB design
• Introducing airflow in the system
The Thermal Data section in 节 7.4 provides the thermal metric of the device on the EVM after considering the
PCB design of real applications. The big copper planes connecting to the pads of the IC on the PCB improve the
thermal performance of the device. For more details on how to use the thermal parameters, see the Thermal
Characteristics Application Notes, SZZA017 and SPRA953.
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12 Device and Documentation Support
12.1 Device Support
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
12.1.2 Development Support
12.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS6282x device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
• Run electrical simulations to see important waveforms and circuit performance
• Run thermal simulations to understand board thermal performance
• Export customized schematic and layout into popular CAD formats
• Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation, see the following:
• Thermal Characteristics Application Note, SZZA017
• Thermal Characteristics Application Note, SPRA953
12.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
12.4 Trademarks
DCS-Control™ and TI E2E™ are trademarks of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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ZHCSHY6G –MARCH 2018 –REVISED MARCH 2022
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI
提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2021，德州仪器(TI) 公司
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS62824ADMQR
TPS62824DMQR
TPS6282518DMQR
TPS6282518DMQT
TPS6282533DMQR
TPS62825ADMQR
TPS62825DMQR
TPS62825DMQT
TPS6282618DMQR
TPS6282618DMQT
TPS62826ADMQR
TPS62826DMQR
TPS62826DMQT
TPS62827ADMQR
TPS62827DMQR
TPS62827DMQT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 RoHS & Green
NIPDAU | SN
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
JM
JL
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
3000 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
3000 RoHS & Green Call TI | SN Level-1-260C-UNLIM
250 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
3000 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM
3000 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
250 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
3000 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
250 RoHS & Green Call TI | SN | NIPDAU Level-1-260C-UNLIM
CJ
CJ
L1
JN
CI
CI
CK
CK
JO
CL
CL
JP
EH
EH
3000 RoHS & Green
3000 RoHS & Green
NIPDAU | SN
Call TI | SN
Call TI | SN
NIPDAU | SN
Call TI | SN
Call TI | SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
250
RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
250
RoHS & Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-May-2023
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62824ADMQR
TPS62824DMQR
VSON-
HR
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
6
6
6
6
6
6
6
6
6
3000
3000
3000
3000
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
1.75
1.75
1.0
1.14
1.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
VSON-
HR
1.7
1.7
TPS62824DMQR
VSON-
HR
1.75
1.75
1.7
1.75
1.75
1.7
TPS6282518DMQR
TPS6282518DMQR
TPS6282518DMQT
TPS6282518DMQT
TPS6282533DMQR
TPS6282533DMQR
VSON-
HR
1.0
VSON-
HR
1.14
1.14
1.0
VSON-
HR
1.7
1.7
VSON-
HR
250
1.75
1.75
1.7
1.75
1.75
1.7
VSON-
HR
3000
3000
1.0
VSON-
HR
1.14
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2023
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62825ADMQR
TPS62825DMQR
TPS62825DMQR
TPS62825DMQT
TPS62825DMQT
TPS6282618DMQR
TPS6282618DMQR
TPS6282618DMQT
TPS6282618DMQT
TPS62826ADMQR
TPS62826DMQR
TPS62826DMQR
TPS62826DMQT
TPS62826DMQT
TPS62827ADMQR
TPS62827DMQR
TPS62827DMQT
VSON-
HR
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
3000
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
1.75
1.75
1.7
1.75
1.75
1.7
1.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
VSON-
HR
1.0
VSON-
HR
1.14
1.14
1.0
VSON-
HR
1.7
1.7
VSON-
HR
250
1.75
1.75
1.7
1.75
1.75
1.7
VSON-
HR
3000
3000
250
1.0
VSON-
HR
1.14
1.14
1.0
VSON-
HR
1.7
1.7
VSON-
HR
250
1.75
1.75
1.7
1.75
1.75
1.7
VSON-
HR
3000
3000
3000
250
1.0
VSON-
HR
1.14
1.0
VSON-
HR
1.75
1.75
1.7
1.75
1.75
1.7
VSON-
HR
1.0
VSON-
HR
250
1.14
1.0
VSON-
HR
3000
3000
250
1.75
1.7
1.75
1.7
VSON-
HR
1.14
1.14
VSON-
HR
1.7
1.7
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62824ADMQR
TPS62824DMQR
TPS62824DMQR
TPS6282518DMQR
TPS6282518DMQR
TPS6282518DMQT
TPS6282518DMQT
TPS6282533DMQR
TPS6282533DMQR
TPS62825ADMQR
TPS62825DMQR
TPS62825DMQR
TPS62825DMQT
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
3000
3000
3000
3000
250
210.0
182.0
210.0
210.0
182.0
182.0
210.0
210.0
182.0
210.0
210.0
182.0
182.0
210.0
210.0
182.0
182.0
210.0
185.0
182.0
185.0
185.0
182.0
182.0
185.0
185.0
182.0
185.0
185.0
182.0
182.0
185.0
185.0
182.0
182.0
185.0
35.0
20.0
35.0
35.0
20.0
20.0
35.0
35.0
20.0
35.0
35.0
20.0
20.0
35.0
35.0
20.0
20.0
35.0
250
3000
3000
3000
3000
3000
250
TPS62825DMQT
250
TPS6282618DMQR
TPS6282618DMQR
TPS6282618DMQT
TPS6282618DMQT
3000
3000
250
250
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2023
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62826ADMQR
TPS62826DMQR
TPS62826DMQR
TPS62826DMQT
TPS62826DMQT
TPS62827ADMQR
TPS62827DMQR
TPS62827DMQT
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
VSON-HR
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
DMQ
6
6
6
6
6
6
6
6
3000
3000
3000
250
210.0
182.0
210.0
210.0
182.0
210.0
182.0
182.0
185.0
182.0
185.0
185.0
182.0
185.0
182.0
182.0
35.0
20.0
35.0
35.0
20.0
35.0
20.0
20.0
250
3000
3000
250
Pack Materials-Page 4
PACKAGE OUTLINE
DMQ0006A
VSON - 1 mm max height
SCALE 6.000
PLASTIC SMALL OUTLINE - NO LEAD
1.55
1.45
A
B
PIN 1 INDEX AREA
1.55
1.45
1.0
0.8
C
SEATING PLANE
0.08 C
(0.2) MIN
(0.2) TYP
0.05
0.00
0.5
3X
0.3
3
4
4X 0.5
2X
1
6
1
0.3
3X
0.25
0.15
3X
0.2
0.9
3X
0.1
C A B
C
0.1
C A B
C
0.7
0.05
0.05
4222645/D 05/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
DMQ0006A
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
3X (1)
3X (0.6)
3X (0.2)
SYMM
1
6
3X (0.25)
4X (0.5)
4
3
(R0.05) TYP
(0.65)
(0.45)
PKG
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
PADS 4-6
NON SOLDER MASK
DEFINED
PADS 1-3
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4222645/D 05/2022
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
DMQ0006A
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
3X
EXPOSED METAL
3X (0.85)
3X (0.6)
3X (0.25)
3X (0.2)
1
6
SYMM
4X (0.5)
4
3
(R0.05) TYP
SOLDER MASK
OPENING
TYP
(0.65)
(0.525)
METAL UNDER
SOLDER MASK
TYP
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
PADS 4, 5 & 6:
81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222645/D 05/2022
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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Copyright © 2023，德州仪器 (TI) 公司
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