TPS7B6933DBVR [TI]
150mA、40V、低 IQ、低压降稳压器 | DBV | 5 | -40 to 105;
| 型号： | TPS7B6933DBVR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 150mA、40V、低 IQ、低压降稳压器 | DBV | 5 | -40 to 105 稳压器 |
| 文件： | 总22页 (文件大小：1379K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Sample &
Buy
Support &
Community
Product
Folder
Tools &
Software
Technical
Documents
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
TPS7B69xx 150-mA, 40-V Ultralow-Quiescent-Current LDO
1 Features
2 Applications
1
•
4-V to 40-V Wide VI Input Voltage Range With up
to 45-V Transient
•
•
•
•
E-meters, Water Meters and Gas Meters
Appliances and White Goods
•
•
Maximum Output Current: 150 mA
Low Quiescent Current (IQ):
Fire Alarm, Smoke Detector
Medical, Health, and Fitness Applications
–
–
15 µA Typical at Light Loads
3 Description
25 µA Maximum Under Full Temperature
The TPS7B69xx device is a low-dropout linear
regulator that operates at up to 40-V VI. With only
15-µA (typical) quiescent current at light load, the
device is applicable for standby microcontrol-unit
systems, especially for always-on applications like e-
meters, fire alarms, and smoke detectors.
•
450-mV Typical Low Dropout Voltage at 100 mA
Load Current
•
•
•
10-mV Line Regulation Maximum
20-mV Load Regulation Maximum
Stable With Low-ESR Ceramic Output Capacitor
(2.2 µF to 100 µF)
The devices have integrated short-circuit and
overcurrent protection. The TPS7B69xx device
operates over a –40°C to 105°C temperature range.
•
•
Fixed 3.3-V and 5-V Output Voltage Options
Integrated Fault Protection:
Device Information(1)
–
–
Thermal Shutdown
Short-Circuit Protection
PART NUMBER
TPS7B6933
PACKAGE
SOT-223 (4)
SOT-23 (5)
BODY SIZE (NOM)
6.50 mm × 3.50 mm
2.90 mm × 1.60 mm
•
Packages:
TPS7B6950
–
–
5-Pin SOT-23 Package
4-Pin SOT-223 Package
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Schematic
TPS7B69xx
IN
OUT
VI
VO
Vreg
Vbat
10 µF
4.7 µF
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 10
Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application .................................................. 11
Power Supply Recommendations...................... 13
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 5
Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
8
9
10 Layout................................................................... 13
10.1 Layout Guidelines ................................................. 13
10.2 Layout Example .................................................... 13
11 Device and Documentation Support ................. 14
11.1 Documentation Support ........................................ 14
11.2 Related Links ........................................................ 14
11.3 Trademarks........................................................... 14
11.4 Electrostatic Discharge Caution............................ 14
11.5 Glossary................................................................ 14
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
DATE
REVISION
NOTE
April 2016
*
Initial release
2
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
5 Pin Configuration and Functions
DCY Package
4-Pin SOT-223
Top View
DBV Package
5-Pin SOT-23
Top View
IN
GND
OUT
1
2
3
IN
NC
1
2
3
5
4
OUT
GND
4
GND
GND
NC - No internal connection
Pin Functions
PIN
NO.
TYPE
DESCRIPTION
NAME
GND
SOT-223
SOT-23
2, 4
1
3, 4
1
G
P
Ground reference
Input power-supply voltage
Not connected pin
Output voltage
IN
NC
OUT
—
3
2
—
P
5
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–40
–65
MAX
45
UNIT
V
Unregulated input voltage
IN(2)(3)
OUT(2)
Regulated output voltage
7
V
Operating junction temperature range, TJ
Storage temperature, Tstg
125
150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND terminal.
(3) Absolute maximum voltage, withstands 45 V for 200 ms.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
MAX
40
UNIT
VI
Unregulated input voltage
Output voltage
4
0
V
V
VO
5.5
100
2
CO
Output capacitor requirements(1)
Output ESR requirements(2)
Operating ambient temperature range
2.2
µF
Ω
ESRCO
TA
0.001
–40
105
°C
(1) The output capacitance range specified in this table is the effective value.
(2) Relevant ESR value at f = 10 kHz
6.4 Thermal Information
TPS7B69xx
THERMAL METRIC(1)(2)
DCY (SOT-223) DBV (SOT-23)
UNIT
4 PINS
64.2
46.8
13.3
6.3
5 PINS
210.4
126.1
38.4
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
16
ψJB
13.2
37.5
(1) The thermal data is based on the JEDEC standard high-K profile, JESD 51-7, 2s2p four layer board with 2-oz copper. The copper pad is
soldered to the thermal land pattern. Also correct attachment procedure must be incorporated.
(2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
6.5 Electrical Characteristics
VIN = 14 V, 1 mΩ < ESR < 2 Ω, TJ = –40°C to 125 °C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY VOLTAGE AND CURRENT (IN)
Fixed 3.3-V output, IO = 1 mA
4
40
V
VI
Input voltage
Fixed 5-V output, IO = 1 mA
5.5
40
Fixed 3.3-V version, VI = 4 to 40 V, , IO = 0.2 mA
Fixed 5-V version, VI = 5.5 to 40 V, IO = 0.2 mA
IQ
Quiescent current
IN undervoltage detection
15
25
3
µA
V
Ramp VI up until the output turns on
3.65
VIN(UVLO)
Ramp VI down until the output turns OFF
REGULATED OUTPUT (OUT)
Fixed 3.3-V version, VI = 5 to 40 V, IO = 1 to 150 mA
Fixed 5-V version, VI = 6.5 to 40 V, IO = 1 to 150 mA
VI = 6 to 40 V, ∆VO, IO = 10 mA
–3%
–3%
3%
3%
10
VO
Regulated output
ΔVO(ΔVI)
ΔVO(ΔIL)
Line regulation
Load regulation
mV
mV
IO = 1 to 150 mA, ∆VO
20
Fixed 3.3-V version, VI – VO, IO = 50 mA
Fixed 3.3-V version, VI – VO, IO = 100 mA
Fixed 5-V version, VI – VO, IO = 50 mA
Fixed 5-V version, VI – VO, IO = 100 mA
VO in regulation
799
800
400
800
150
500
VDROP
Dropout voltage
mV
220
450
IO
Output current
0
mA
mA
IOCL
Output current-limit
OUT short to ground
150
Power supply ripple
rejection(1)
PSRR
Vrip = 0.5 Vpp, Load = 10 mA, ƒ = 100 Hz, CO = 2.2 µF
60
dB
OPERATING TEMPERATURE RANGE
Junction shutdown
temperature
Tsd
175
25
°C
°C
Hysteresis of thermal
shutdown
Thys
(1) Design Information—Not tested, ensured by characterization.
6.6 Typical Characteristics
6
3.8
3.6
3.4
3.2
3
IO = 1 mA
IO = 80 mA
IO = 1 mA
IO = 80 mA
5.8
5.6
5.4
5.2
5
4.8
4.6
4.4
4.2
4
2.8
-40
-20
0
20
40
60
80
100
120
-40
-20
0
20
40
60
80
100
120
Ambient Temperature (èC)
Ambient Temperature (èC)
D001
D002
VI = 14 V
Figure 1. 5-V Output Voltage vs Ambient Temperature
Figure 2. 3.3-V Output Voltage vs t Temperature
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
Typical Characteristics (continued)
6
4
3.5
3
5
4
3
2
1
0
2.5
2
1.5
1
0.5
0
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Supply Voltage (V)
Supply Voltage (V)
D003
D008
IO = 0 mA
IO = 0 mA
Figure 3. 5-V Output Voltage vs Supply Voltage
Figure 4. 3.3-V Output Voltage vs Supply Voltage
160
30
25
20
15
10
5
-40èC
25èC
105èC
140
120
100
80
60
40
-40èC
25èC
105èC
20
0
0
0
30
60
90
120
150
0
5
10
15
20
25
30
35
40
Output Current (mA)
Supply Voltage (V)
D009
D010
VI = 14 V
IO = 0.2 mA
Figure 5. Quiescent Current vs Output Current
Figure 6. Quiescent Current vs Supply Voltage
1100
1000
900
800
700
600
500
400
300
200
100
0
80
70
60
50
40
30
20
10
0
-40èC
25èC
105èC
0
20
40
60
80
100
120
140 160
1E+1
1E+2
1E+3
1E+4
1E+5
1E+6
1E+7 5E+7
Output Current (mA)
Frequency (Hz)
D004
D005
IO = 100 mA
CO = 2.2 µF
VI = 14 V
TA = 25°C
Figure 7. Dropout Voltage vs Output Current
Figure 8. Power Supply Rejection Ratio
6
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
Typical Characteristics (continued)
100
80
90
80
70
60
50
40
30
20
10
0
60
Stable Region
40
20
2.2
1E+1
1E+2
1E+3
1E+4
Frequency (Hz)
1E+5
1E+6
1E+7 5E+7
0.001
0.5
1
ESR of Output Capacitance (Ω)
1.5
2
D006
D007
IO = 10 mA
CO = 2.2 µF
VI = 14 V
TA = 25°C
Figure 9. Power Supply Rejection Ratio
Figure 10. ESR Stability vs Output Capacitance
VO (AC)
100 mV/div
VO (AC)
100 mV/div
IO (DC)
50 mA/div
IO (DC)
50 mA/div
VI = 14 V
VO = 5 V
CO = 2.2 µF
1 ms/div
VI = 14 V
CO = 2.2 µF
1 ms/div
VO = 3.3 V
Figure 11. Load Transient (1 to 100 mA, 5 V)
Figure 12. Load Transient (1 to 100 mA, 3.3 V)
VO (AC)
100 mV/div
VO (AC)
100 mV/div
IO (DC)
50 mA/div
IO (DC)
50 mA/div
VI = 14 V
VO = 5 V
CO = 2.2 µF
1 ms/div
VI = 14 V
CO = 2.2 µF
1 ms/div
VO = 3.3 V
Figure 14. Load Transient (1 to 150 mA, 3.3 V)
Figure 13. Load Transient (1 to 150 mA, 5 V)
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
Typical Characteristics (continued)
VO
VO
20 mV/div
20 mV/div
VI
VI
5 V/div
5 V/div
VI = 9 to 16 V
IO = 10 mA
CO = 2.2 µF
1 ms/div
VI = 9 to 16 V
IO = 10 mA
CO = 2.2 µF
1 ms/div
Figure 16. Line Transient (VO = 3.3 V)
Figure 15. Line Transient (VO = 5 V)
VI
5 V/div
VI
5 V/div
VO
1 V/div
VO
2 V/div
CO = 2.2 µF, 400 µs/div
CO = 2.2 µF, 400 µs/div
Figure 18. 3.3-V Power Up
Figure 17. 5-V Power Up
8
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
7 Detailed Description
7.1 Overview
The TPS7B69xx high-voltage linear regulator operates across a 4-V to 40-V input-voltage range. The device has
an output current capacity of 150 mA and fixed output voltages of 3.3 V (TPS7B6933) or 5 V (TPS7B6950). The
device features thermal shutdown and short-circuit protection to prevent damage during overtemperature and
overcurrent conditions.
7.2 Functional Block Diagram
IN
OUT
Overcurrent
detection
UVLO
Thermal
shutdown
Regulator
control
Band gap
+
V
ref
GND
Copyright © 2016, Texas Instruments Incorporated
7.3 Feature Description
7.3.1 Input (IN)
The IN pin is a high-voltage-tolerant pin. TI recommends that a capacitor with a value higher than 0.1 µF be
connected near this pin to improve the transient performance.
7.3.2 Output (OUT)
The OUT pin is the regulated output based on the required voltage. The output has current limitation. During the
initial power up, the regulator has a soft start incorporated to control the initial current through the pass element
and the output capacitor.
In the event that the regulator drops out of regulation, the output tracks the input minus a drop based on the load
current. When the input voltage drops below the UVLO threshold, the regulator shuts down until the input voltage
recovers above the minimum start-up level.
7.3.3 Output Capacitor Selection
For stable operation over the full temperature range and with load currents up to 150 mA, use a capacitor with an
effective value between 2.2 µF and 100 µF and ESR smaller than 2 Ω. To improve the load-transient
performance, an output capacitor, such as a ceramic capacitor with low ESR, is recommended.
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
Feature Description (continued)
7.3.4 Low-Voltage Tracking
At low input voltages, the regulator drops out of regulation and the output voltage tracks input minus a voltage
based on the load current (IL) and switch resistor. This tracking allows for a smaller input capacitor and can
possibly eliminate the need for a boost converter during cold-crank conditions.
7.3.5 Thermal Shutdown
The TPS7B69xx family of devices incorporates a thermal-shutdown (TSD) circuit as a protection from
overheating. For continuous normal operation, the junction temperature should not exceed the TSD trip point. If
the junction temperature exceeds the TSD trip point, the output turns off. When the junction temperature falls
below the TSD trip point minus the hysteresis of TSD, the output turns on again. This cycling limits the
dissipation of the regulator, protecting it from damage as a result of overheating.
The purpose of the design of the internal protection circuitry of the TPS7B69xx family of devices is for protection
against overload conditions, not as a replacement for proper heat-sinking. Continuously running the TPS7B69xx
family of devices into thermal shutdown degrades device reliability.
7.4 Device Functional Modes
7.4.1 Operation With VI Less Than 4 V
The TPS7B69xx family of devices operates with input voltages above 4 V. The maximum UVLO voltage is 3 V
and the device operates at an input voltage above 4 V. The device can also operate at lower input voltages; no
minimum UVLO voltage is specified. At input voltages below the actual UVLO, the device shuts down.
7.4.2 Operation With VI Greater Than 4 V
When VI is greater than 4 V, if the input voltage is higher than VO plus the dropout voltage, the output voltage is
equal to the set value. Otherwise, the output voltage is equal to VI minus the dropout voltage.
10
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPS7B69xx family of devices is a 150-mA low-dropout linear regulator designed for up to 40-V VI operation
with only 15-µA quiescent current at light loads. Use the PSpice transient model to evaluate the base function of
the device. To download the PSpice transient model, go to the device product folder on www.TI.com. In addition
to this model, specific evaluation modules (EVM) are available for these devices. For the EVM and the EVM user
guide, go to the device product folder.
8.2 Typical Application
Figure 19 shows the typical application circuit for the TPS7B69xx family of devices. Based on the end-
application, different values of external components can be used. An application can require a larger output
capacitor during fast load steps to achieve better load transient response. TI recommends a low-ESR ceramic
capacitor with a dielectric of type X5R or X7R for better load transient response.
TPS7B69xx
IN
OUT
VI
VO
Vreg
Vbat
10 µF
4.7 µF
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 19. Typical Application Schematic for TPS7B69xx
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUES
Input voltage range
Output voltage
4 V to 40 V
3.3 V, 5 V
Output current rating
Output capacitor range
150 mA
2.2 µF to 100 µF
1 mΩ to 2 Ω
Output capacitor ESR range
8.2.2 Detailed Design Procedure
To begin the design process, determine the following:
•
•
•
Input voltage range
Output voltage
Output current rating
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
8.2.2.1 Input Capacitor
The device requires an input decoupling capacitor, the value of which depends on the application. The typical
recommend value for the decoupling capacitor is higher than 0.1 µF. The voltage rating must be greater than the
maximum input voltage.
8.2.2.2 Output Capacitor
The device requires an output capacitor to stabilize the output voltage. The output capacitor value should be
between 2.2 µF and 100 µF. The ESR value range should be between 1 mΩ and 2 Ω. TI recommends a ceramic
capacitor with low ESR to improve the load-transient response.
8.2.2.3 Power Dissipation and Thermal Considerations
Use Equation 1 to calculate the power dissipated in the device.
PD = IO ´ (VI - VO ) +IQ ´ VI
where
•
•
•
•
PD = continuous power dissipation
IO = output current
VI = input voltage
VO = output voltage
(1)
Because IQ « IO, the term IQ × VI in Equation 1 can be ignored.
For a device under operation at a given ambient air temperature (TA), use Equation 2 to calculate the junction
temperature (TJ).
TJ = TA + (ZqJA ´ PD )
where
Z
θJA = junction-to-ambient air thermal impedance
(2)
(3)
Use Equation 3 to calculate the rise in junction temperature because of power dissipation.
DT = TJ - TA = (ZqJA ´ PD )
For a given maximum junction temperature (TJmax), use Equation 4 to calculate the maximum ambient air
temperature (TAmax) at which the device can operate.
TAmax = TJmax - (ZqJA ´ PD )
(4)
8.2.3 Application Curve
VI
5 V/div
VO
2 V/div
CO = 2.2 µF, 400 µs/div
Figure 20. Power Up (5 V)
12
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
www.ti.com
SLVSDI2 –APRIL 2016
9 Power Supply Recommendations
The device is designed to operate from an input-voltage supply range between 4 V and 40 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the TPS7B69xx device, TI
recommends adding an electrolytic capacitor with a value of 10 µF and a ceramic bypass capacitor at the input.
10 Layout
10.1 Layout Guidelines
For the layout of TPS7B69xx family of devices, place the input and output capacitors near the devices as shown
in Figure 21 and Figure 22. To enhance the thermal performance, TI recommends surrounding the device with
some vias.
Minimize equivalent series inductance (ESL) and ESR to maximize performance and ensure stability. Place
every capacitor as close as possible to the device and on the same side of the PCB as the regulator.
Do not place any of the capacitors on the opposite side of the PCB from where the regulator is installed. TI
strongly discourages the use of long traces because they can impact system performance negatively and even
cause instability.
If possible, and to ensure the maximum performance specified in this product data sheet, use the same layout
pattern used for the TPS7B69xx evaluation board.
10.2 Layout Example
GND
4
1
2
3
IN
GND
OUT
Figure 21. Layout Example for SOT-223 Package
Copyright © 2016, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: TPS7B6933 TPS7B6950
TPS7B6933, TPS7B6950
SLVSDI2 –APRIL 2016
www.ti.com
Layout Example (continued)
1
5
4
OUT
GND
IN
2
3
NC
GND
Figure 22. Layout Example for SOT-23 Package
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
TPS7B6950EVM User's Guide, SLVUAC0.
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 2. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TPS7B6933
TPS7B6950
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
11.3 Trademarks
All trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most-
current data available for the designated devices. This data is subject to change without notice and without
revision of this document. For browser-based versions of this data sheet, see the left-hand navigation pane.
14
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TPS7B6933 TPS7B6950
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS7B6933DBVR
TPS7B6950DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
3000 RoHS & Green
3000 RoHS & Green
SN
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 105
-40 to 105
ZBFY
ZAZT
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
OTHER QUALIFIED VERSIONS OF TPS7B69 :
Automotive: TPS7B69-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS7B6933DBVR
TPS7B6950DBVR
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
178.0
178.0
9.0
9.0
3.3
3.3
3.2
3.2
1.4
1.4
4.0
4.0
8.0
8.0
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS7B6933DBVR
TPS7B6950DBVR
SOT-23
SOT-23
DBV
DBV
5
5
3000
3000
190.0
180.0
190.0
180.0
30.0
18.0
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明