TPS92663AQPWPRQ1 [TI]
适用于汽车前照灯系统的高亮度 LED 矩阵管理器 | PWP | 24 | -40 to 125;
| 型号： | TPS92663AQPWPRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于汽车前照灯系统的高亮度 LED 矩阵管理器 | PWP | 24 | -40 to 125 |
| 文件： | 总10页 (文件大小：1381K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS92663A-Q1
ZHCSMB0 –OCTOBER 2020
TPS92663A-Q1 适用于汽车前灯系统的高亮度LED 矩阵管理器
该器件的 3 个串联集成开关各有 2 个子灯串，可绕过
单个 LED。各个子灯串允许器件接受单个或多个电流
源。它还能并联2 个开关，用于绕过高电流LED。
1 特性
• 符合面向汽车应用的AEC-Q100 标准
– 器件温度等级1：–40°C 至125°C TA
– 器件HBM 分级等级：H1C
– 器件CDM 分级等级：C5
• 输入电压范围：4.5 V 至60 V
• 6 个集成旁路开关
主微控制器通过多点通用异步收发器 (UART) 串行接
口，控制和管理 TPS92663A-Q1 器件。串行接口支持
使用 CAN 收发器，实现更可靠稳健的物理层。应用可
使用 TPS92663A-Q1 器件，也可以使用与该器件在同
一总线上的TPS92662A-Q1 器件。
– 3 个串联开关各有2 个子灯串
– 20V 最大跨开关电压
– 62V 最大开关到接地电压
• 多点UART 通信接口
具有两个多路复用输入的内置 8 位 ADC 可用于系统温
度补偿和测量分箱值，从而实现LED 分箱和编码。
内部电荷泵轨为 LED 旁路开关提供栅极驱动电压。旁
路开关的低电阻 (RDS(on)) 可最大程度地减少传导损耗
和功率耗散。
– 多达16 个可寻址器件
– 在同一总线上集成TPS92662A-Q1
• 与CAN 物理层兼容
灯串中每个 LED 的相移和脉冲宽度是可编程的。该器
件使用内部寄存器来调节PWM 频率。可以对多个器件
进行同步。在PWM 调光操作过程中，开关转换具有可
编程的压摆率，用于缓解 EMI 问题。该器件具有开路
LED 保护功能（阈值可编程）。串行接口会报告开路
LED 或短路LED 故障。
– 电缆线束中具有最少的导线数
• 具有2 个多路复用器输入的8 位ADC
• 晶体振荡器驱动器
• 可编程10 位PWM 调光
– 单个相移和脉宽
– 器件间同步
• LED 开路/短路检测和保护
器件信息
器件型号(1)
封装尺寸（标称值）
封装
2 应用
TPS92663A-Q1
PWP (24)
7.70mm × 4.40mm
• 汽车前照灯系统
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
• 高亮度LED 矩阵系统
• ADB 或无眩光远光灯
• 连续转向和动画日间行车灯
3 说明
TPS92663A-Q1 LED 矩阵管理器器件通过提供单个像
素级 LED 控制来实现完全动态的自适应照明解决方
案。
简化版应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSDN3
TPS92663A-Q1
ZHCSMB0 –OCTOBER 2020
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device and Documentation Support..............................3
5.1 接收文档更新通知....................................................... 3
5.2 支持资源......................................................................3
5.3 Trademarks.................................................................3
5.4 静电放电警告.............................................................. 3
5.5 术语表......................................................................... 3
6 Mechanical, Packaging, and Orderable Information....4
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
DATE
REVISION
NOTES
October 2020
*
Initial release
Copyright © 2021 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TPS92663A-Q1
TPS92663A-Q1
ZHCSMB0 –OCTOBER 2020
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5 Device and Documentation Support
5.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
5.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
5.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
5.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
5.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2021 Texas Instruments Incorporated
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TPS92663A-Q1
ZHCSMB0 –OCTOBER 2020
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2021 Texas Instruments Incorporated
4
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PACKAGE OPTION ADDENDUM
www.ti.com
9-Jul-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92663AQPWPRQ1
ACTIVE
HTSSOP
PWP
24
2000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
-40 to 125
92663AQ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PWP 24
4.4 x 7.6, 0.65 mm pitch
PowerPADTM TSSOP - 1.2 mm max height
PLASTIC SMALL OUTLINE
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224742/B
www.ti.com
PACKAGE OUTLINE
PWP0024M
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
0
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX
AREA
SEATING
22X 0.65
PLANE
24
1
2X
7.9
7.7
7.15
NOTE 3
12
B
13
0.30
24X
4.5
4.3
0.19
0.1
C A B
SEE DETAIL A
(0.15) TYP
2X 1.07 MAX
NOTE 5
(0.36)
12
13
2X 0.3 MAX
NOTE 5
0.25
GAGE PLANE
1.2 MAX
3.93
3.32
25
THERMAL
PAD
0.15
0.05
0.75
0.50
0 -8
A
20
DETAIL A
TYPICAL
1
24
2.93
2.16
4224354/A 06/2018
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PWP0024M
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(3.4)
NOTE 9
(2.93)
METAL COVERED
BY SOLDER MASK
SYMM
24X (1.5)
1
24
24X (0.45)
SEE DETAILS
(R0.05) TYP
(3.93)
22X (0.65)
SYMM
25
(7.8)
NOTE 9
(1.2) TYP
SOLDER MASK
DEFINED PAD
(
0.2) TYP
VIA
13
12
(1.2) TYP
(5.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MAX
ALL AROUND
0.07 MIN
ALL AROUND
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
15.000
SOLDER MASK DETAILS
4224354/A 06/2018
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
10. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
PWP0024M
PowerPADTM TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
(2.93)
BASED ON
0.125 THICK
STENCIL
METAL COVERED
BY SOLDER MASK
24X (1.5)
1
24
24X (0.45)
(R0.05) TYP
22X (0.65)
SYMM
(3.93)
25
BASED ON
0.125 THICK
STENCIL
12
13
SYMM
(5.8)
SEE TABLE FOR
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
3.28 X 4.39
2.93 X 3.93 (SHOWN)
2.67 X 3.59
0.125
0.15
0.175
2.48 X 3.32
4224354/A 06/2018
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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