TPS92665-Q1 [TI]
具有内部时钟的 16 通道低噪声 LED 矩阵管理器;型号: | TPS92665-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有内部时钟的 16 通道低噪声 LED 矩阵管理器 时钟 |
文件: | 总9页 (文件大小:1186K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS92665-Q1
ZHCSR12 –SEPTEMBER 2022
TPS92665-Q1 具有高级诊断功能和集成振荡器的
汽车类低噪声16 通道LED 矩阵管理器
1 特性
3 说明
• 符合面向汽车应用的AEC-Q100 标准
TPS92665 LED 矩阵管理器器件通过提供单个像素级
LED 控制来实现完全动态的自适应照明解决方案。该
器件的 4 个串联集成开关各有 4 个子灯串,可绕过单
个 LED。各个子灯串允许器件接受单个或多个电流
源。
– 1 级:–40°C 至+125°C 环境温度
– 器件HBM 分类等级H1C
– 器件CDM 分类等级C5
• 功能安全型
– 可提供用于功能安全系统设计的文档
• 16 个集成旁路开关
TPS92665 具有一个内部振荡器。内部振荡器可通过内
部低噪声 LVDS 发送器和接收器块共享给其他系统器
件。多点通用异步接收器发送器 (UART) 串行接口与
TPS92664、TPS92667、TPS92662x 和 TPS92663x
器件兼容。具有多路复用输入的板载 ADC 可对所有
LED 通道以及 IC 内核温度进行采样。该 ADC 还对专
用ADC 输入进行采样,可用于系统温度补偿、LED 分
级和编码。
– 可编程10 位PWM 调光
– 可编程压摆率控制
– LED 开路检测和保护
– 单LED 短路检测
• UART 串行通信
– 用于系统时钟的内部振荡器
– 用于同步器件的LVDS 时钟驱动器
– 兼容上一代LMM
TPS92665 包含寄存器,可用于对灯串中单个 LED 的
相移和脉冲宽度进行编程以及报告 LED 开路、短路故
障和功能参数。
– 兼容CAN 收发器
• 集成ADC
封装信息
封装(1)
– 每个开关的LED 电压
– 内核温度
封装尺寸(标称值)
器件型号
– 2x 通用ADC 输入(兼容热敏电阻)
PHP(HTQFP、
48)
TPS92665-Q1
7.00mm × 7.00mm
2 应用
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
• 汽车前照灯系统
• ADB 或无眩光远光灯
• 连续转向、动画日间行车灯
VBAT
BOOST
BUCK
TPS92665
NTC
ADCx
CP_TOP
CP_BOT
SYNC
CLK_H
CLK_L
Other 66x
devices
MCU
….. ….. …..
UART
RX
CAN
CAN
5V
MTP
UART
TX
ECU
4 x 4
series
switches
VDD
GND
简化版应用
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSF31
TPS92665-Q1
ZHCSR12 –SEPTEMBER 2022
www.ti.com.cn
4 Device and Documentation Support
4.1 接收文档更新通知
要接收文档更新通知,请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册,即可每周接收产品信息更
改摘要。有关更改的详细信息,请查看任何已修订文档中包含的修订历史记录。
4.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
4.3 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TPS92665-Q1
TPS92665-Q1
ZHCSR12 –SEPTEMBER 2022
www.ti.com.cn
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS92665-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS92665QPHPRQ1
ACTIVE
HTQFP
PHP
48
1000 RoHS & Green
NIPDAU
Level-3-260C-168 HR
125 to -40
TPS92665Q
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
PHP 48
7 x 7, 0.5 mm pitch
TQFP - 1.2 mm max height
QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
PACKAGE OUTLINE
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
SCALE 1.900
PLASTIC QUAD FLATPACK
7.2
6.8
B
NOTE 3
37
48
PIN 1 ID
1
36
7.2
6.8
9.2
TYP
8.8
NOTE 3
12
25
13
24
A
0.27
48X
44X 0.5
0.17
0.08
C A B
4X 5.5
1.2 MAX
C
SEATING PLANE
SEE DETAIL A
(0.13)
TYP
0.08
13
24
12
25
0.25
(1)
GAGE PLANE
5.00
4.23
49
0.75
0.45
0.15
0.05
0 -7
A
16
1
36
DETAIL A
TYPICAL
48
37
5.00
4.23
4X (0.25) NOTE 5
4226599/A 05/2021
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MS-026.
5. Feature may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(
6.5)
NOTE 10
(5)
SYMM
48
37
SOLDER MASK
DEFINED PAD
48X (1.6)
1
36
48X (0.3)
(5)
SYMM
49
(1.1 TYP)
(8.5)
44X (0.5)
12
25
(R0.05) TYP
(
0.2) TYP
VIA
METAL COVERED
BY SOLDER MASK
13
24
(1.1 TYP)
SEE DETAILS
(8.5)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226599/A 05/2021
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. See technical brief, Powerpad thermally enhanced package,
Texas Instruments Literature No. SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged
or tented.
10. Size of metal pad may vary due to creepage requirement.
www.ti.com
EXAMPLE STENCIL DESIGN
PHP0048L
PowerPADTM HTQFP - 1.2 mm max height
PLASTIC QUAD FLATPACK
(5)
BASED ON
0.125 THICK STENCIL
SEE TABLE FOR
SYMM
DIFFERENT OPENINGS
FOR OTHER STENCIL
THICKNESSES
48
37
48X (1.6)
1
36
48X (0.3)
(8.5)
(5)
BASED ON
0.125 THICK
STENCIL
SYMM
49
44X (0.5)
12
25
(R0.05) TYP
METAL COVERED
BY SOLDER MASK
24
13
(8.5)
SOLDER PASTE EXAMPLE
EXPOSED PAD
100% PRINTED SOLDER COVERAGE BY AREA
SCALE:8X
STENCIL
THICKNESS
SOLDER STENCIL
OPENING
0.1
5.59 X 5.59
5.00 X 5.00 (SHOWN)
4.56 X 4.56
0.125
0.150
0.175
4.23 X 4.23
4226599/A 05/2021
NOTES: (continued)
11. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
12. Board assembly site may have different recommendations for stencil design.
www.ti.com
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Copyright © 2022,德州仪器 (TI) 公司
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