TPSM84212 [TI]
1.5A、28V 输入、12V 输出 TO-220 电源模块;
| 型号： | TPSM84212 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.5A、28V 输入、12V 输出 TO-220 电源模块 电源电路 |
| 文件： | 总26页 (文件大小：1052K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
TPSM84203、TPSM84205、TPSM84212 1.5A、28V 输入、TO-220 电源
模块
1 特性
3 说明
1
•
•
•
•
完全集成的电源解决方案
TPSM842xx 电源模块是一种简单易用的集成式电源解
决方案，它将 1.5A 直流/直流转换器与功率
MOSFET、电感器和无源器件整合在一个 3 引脚的穿
孔插入式封装内。这套完备的电源解决方案只需要增加
输入和输出电容器，省去了设计过程中的环路补偿和磁
性元件选择。
3 引脚 TO-220 封装
效率高达 95%
固定输出电压选项：
3.3V、5V 和 12V
•
•
•
•
•
•
•
•
•
•
400kHz 开关频率
高级 Eco-mode™ 脉冲跨周期
预偏置输出启动
借助标准 TO-220 引脚，可在这一业界标准封装中更换
为明显改善的线性稳压器。TPSM842xx 器件提供更高
的效率而无需散热片。
过流保护
输出过压保护
过热保护
Device Information(1)
PART NUMBER
TPSM84203
TPSM84205
TPSM84212
PACKAGE
BODY SIZE (NOM)
工作结温范围：–40°C 至 +125°C
工作环境温度范围：-40°C 至 +85°C
符合 EN55022 B 类辐射标准
EAB
10mm x 11mm
使用 TPSM84203 并借助 WEBENCH® 电源设计器
(1) 要了解所有可用封装，请参阅数据表末尾的可订购产品附录。
创建定制设计方案
器件比较
2 应用
器件编号
输出电压
3.3V
•
•
•
12V 和 24V 分布式电源总线供电
TPSM84203
TPSM84205
TPSM84212
工业白色家电
消费类
5.0V
12.0V
–
–
–
音频
机顶盒 (STB)、数字电视 (DTV)
打印机
简化应用
TPSM842xx
VIN
GND
VOUT
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLUSCV7
TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
www.ti.com.cn
目录
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 13
Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application ................................................. 14
Power Supply Recommendations...................... 19
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Recommended Operating Conditions....................... 4
6.3 ESD Ratings ............................................................ 4
6.4 Thermal Information.................................................. 5
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
6.7 Typical Characteristics (VOUT = 3.3 V)...................... 7
6.8 Typical Characteristics (VOUT = 5 V)......................... 8
6.9 Typical Characteristics (VOUT = 12 V)....................... 9
Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
8
9
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 器件和文档支持 ..................................................... 20
11.1 器件支持 ............................................................... 20
11.2 相关链接................................................................ 20
11.3 Receiving Notification of Documentation Updates 20
11.4 Community Resources.......................................... 20
11.5 商标....................................................................... 20
11.6 静电放电警告......................................................... 20
11.7 Glossary................................................................ 21
12 机械、封装和可订购信息....................................... 21
7
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Original (July 2017) to Revision A
Page
•
•
添加了特性：符合 EN55022 B 类辐射发射标准 ..................................................................................................................... 1
Added the EMI section ......................................................................................................................................................... 16
2
Copyright © 2017, Texas Instruments Incorporated
TPSM84203, TPSM84205, TPSM84212
www.ti.com.cn
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
5 Pin Configuration and Functions
EAB Package
3-Pin Through-Hole
Top View
1
2
3
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Ground. This is the return current path for the power stage of the device. Connect this pin to
the bypass capacitors associated with VIN and VOUT.
GND
2
Input Voltage. This pin supplies voltage to the control circuitry and power switches of the
converter. Connect external bypass capacitors between this pin and GND.
VIN
1
3
I
Output Voltage. This pin is connected to the internal output inductor. Connect this pin to the
output load and connect external bypass capacitors between this pin and GND.
VOUT
O
Copyright © 2017, Texas Instruments Incorporated
3
TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER
MIN
–0.3
–0.3
–0.3
–0.3
MAX
30
UNIT
V
Input Voltage
TPSM84203
3.9
V
Output Voltage
TPSM84205
5.7
V
TPSM84212
13.0
1500
10
V
Mechanical Shock
Mil-STD-883D, Method 2002.3, 1msec, 1/2 sine, mounted
G
Mechanical Vibration
Mil-STD-883D, Method 2007.2, 20-2000Hz
G
(2)
Operating IC Junction Temperature range, TJ
–40
–40
–60
125
85
°C
°C
°C
(2)
Operating Ambient Temperature range, TA
Storage temperature, Tstg
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the
internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area
(SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded.
6.2 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
4.5
7
MAX
28
UNIT
V
TPSM84203
TPSM84205
TPSM84212
VIN
Input voltage
28
V
14.5
0
28
V
IOUT
TA
Output current
1.5
85
A
Operating ambient temperature range(1)
Operating junction temperature range(1)
–40
–40
°C
°C
TJ
125
(1) The ambient temperature is the air temperature of the surrounding environment. The junction temperature is the temperature of the
internal power IC when the device is powered. Operating below the maximum ambient temperature, as shown in the safe operating area
(SOA) curves, ensures that the maximum junction temperature of any component inside the module is never exceeded.
6.3 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4
Copyright © 2017, Texas Instruments Incorporated
TPSM84203, TPSM84205, TPSM84212
www.ti.com.cn
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
6.4 Thermal Information
TPSM842xx
THERMAL METRIC(1)
EAB
3 PINS
56
UNIT
(2)
RθJA
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
(3)
Junction-to-top characterization parameter
0.9
(4)
ψJB
Junction-to-board characterization parameter
1.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics paper.
(2) The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 50 mm × 50 mm double-sided PCB with 2 oz.
copper and natural convection cooling. Additional airflow reduces RθJA
.
(3) The junction-to-top characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the controller IC.
(4) The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the module board 1 mm from the controller IC.
6.5 Electrical Characteristics
Over -40°C to +85°C free-air temperature range, VIN = 24 V, IOUT = IOUT max, FSW = 400 kHz, CIN = 0.1µF, 50V ceramic; 10µF,
50V ceramic; 100µF, 35V electrolytic, and COUT = 2 x 47µF, 16V 1210 ceramic (unless otherwise noted)
PARAMETER
INPUT VOLTAGE (VIN)
TEST CONDITIONS
MIN
TYP
MAX UNIT
TPSM84203
4.5(1)
7(1)
14.5(1)
28
28
V
V
V
V
V
VIN
Input voltage range
Over VOUT range
TPSM84205
TPSM84212
28
VIN increasing
VIN decreasing
4.1
3.6
4.4
VIN_UVLO
VIN under voltage lock out
3.3
OUTPUT VOLTAGE (VOUT)
TPSM84203
TPSM84205
TPSM84212
3.3
5.0
V
V
V
Output voltage
Over IOUT range
12.0
VOUT
Set-point voltage tolerance
Temperature variation(2)
TA = 25°C, IOUT = 0 A
–40°C ≤ TA ≤ 85°C, IOUT = 0 A
Over VIN range, IOUT = 1 A
Over IOUT range
–3%
+3%
0.4%
0.4%
0.5%
15
Line regulation
Load regulation
Output voltage ripple
20 MHz bandwidth, peak-to-peak, IOUT > 500 mA
mV
OUTPUT CURRENT
Output current
Overcurrent threshold
PERFORMANCE
See SOA graph for derating over temperature.
0
1.5
A
A
IOUT
3.1
VIN = 5 V, IOUT = 1 A
VIN = 12 V, IOUT = 1 A
VOUT = 3.3 V
VOUT = 3.3 V
VOUT = 5.0 V
VOUT = 3.3 V
VOUT = 5.0 V
VOUT = 12.0 V
92%
91%
92%
87%
90%
94%
ƞ
Efficiency(3)
VIN = 24 V, IOUT = 1 A
VOUT
over/undershoot
1 A/µs load step,
25% to 75% IOUT(max),
COUT= 94 µF
4%
VOUT
µs
Transient response(2)
Recovery time
100
(1) The minimum input voltage is the lowest ensured voltage that will produce the nominal output voltage. See the Drop-Out Voltage section
for information on drop-out voltage.
(2) Specified by design. Not production tested.
(3) See the efficiency graphs in the Typical Characteristics section for efficiency over the entire load range.
Copyright © 2017, Texas Instruments Incorporated
5
TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
www.ti.com.cn
Electrical Characteristics (continued)
Over -40°C to +85°C free-air temperature range, VIN = 24 V, IOUT = IOUT max, FSW = 400 kHz, CIN = 0.1µF, 50V ceramic; 10µF,
50V ceramic; 100µF, 35V electrolytic, and COUT = 2 x 47µF, 16V 1210 ceramic (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SOFT START
TSS
Internal soft start time(2)
THERMAL SHUTDOWN
Rising threshold(2)
Hysteresis(2)
CAPACITANCE
5
ms
165
10
°C
°C
Ceramic type
10
0
µF
µF
CIN
External input capacitance
Non-ceramic type
100
TPSM84203
TPSM84205
TPSM84212
94
470
µF
Ceramic type
COUT
External output capacitance
47
0
470
500(4)
µF
µF
Total output capacitance
Equivalent series resistance (ESR)
35 mΩ
(4) The maximum output capacitance of 500 μF includes the combination of both ceramic and non-ceramic capacitors.
6.6 Switching Characteristics
Over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FSW
Switching frequency
290
400
510
kHz
6
版权 © 2017, Texas Instruments Incorporated
TPSM84203, TPSM84205, TPSM84212
www.ti.com.cn
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
6.7 Typical Characteristics (VOUT = 3.3 V)
Typical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
device. Safe operating area curves were measured using a Texas Instruments evaluation module (EVM).
100
95
90
85
80
75
70
65
60
55
50
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VIN
5.0 V
12 V
24 V
VIN
24 V
12 V
5 V
0.0
0.3
0.6
0.9
1.2
1.5
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D001
D004
VOUT = 3.3 V
图 1. Efficiency vs Output Current
VOUT = 3.3 V
图 2. Power Dissipation vs Output Current
30
25
20
15
10
5
95
85
75
65
55
45
35
25
VIN
24 V
12 V
5 V
Airflow
Nat Conv
0
0.0
0.0
0.3
0.6
0.9
1.2
1.5
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D007
D010
VOUT = 3.3 V
COUT = 2x 47 µF
VOUT = 3.3 V
VIN ≤ 15 V
图 3. Ripple Voltage vs Output Current
图 4. Safe Operating Area
95
85
75
65
55
45
Airflow
100LFM
35
Nat Conv
25
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
D011
VOUT = 3.3 V
VIN = 24 V
图 5. Safe Operating Area
版权 © 2017, Texas Instruments Incorporated
7
TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
www.ti.com.cn
6.8 Typical Characteristics (VOUT = 5 V)
Typical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
device. Safe operating area curves were measured using a Texas Instruments evaluation module (EVM).
100
95
90
85
80
75
70
65
60
55
50
1.2
1.0
0.8
0.6
0.4
0.2
0.0
VIN
12 V
24 V
VIN
24 V
12 V
0.0
0.3
0.6
0.9
1.2
1.5
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D002
D005
VOUT = 5 V
图 6. Efficiency vs Output Current
VOUT = 5 V
图 7. Power Dissipation vs Output Current
30
25
20
15
10
5
95
85
75
65
55
45
35
25
VIN
24 V
12 V
Airflow
Nat Conv
0
0.0
0.0
0.3
0.6
0.9
1.2
1.5
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D008
D012
VOUT = 5 V
COUT = 2x 47 µF
VOUT = 5 V
VIN ≤ 15 V
图 8. Ripple Voltage vs Output Current
图 9. Safe Operating Area
95
85
75
65
55
45
Airflow
200LFM
100 LFM
35
Nat Conv
25
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
D013
VOUT = 5 V
VIN = 24 V
图 10. Safe Operating Area
8
版权 © 2017, Texas Instruments Incorporated
TPSM84203, TPSM84205, TPSM84212
www.ti.com.cn
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
6.9 Typical Characteristics (VOUT = 12 V)
Typical characteristic data has been developed from actual products tested at 25°C. This data is considered typical for the
device. Safe operating area curves were measured using a Texas Instruments evaluation module (EVM).
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
100
95
90
85
80
75
70
65
60
55
50
VIN
15 V
24 V
VIN
24 V
15 V
0.0
0.3
0.6
0.9
1.2
1.5
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D003
D006
VOUT = 12 V
图 11. Efficiency vs Output Current
VOUT = 12 V
图 12. Power Dissipation vs Output Current
50
45
40
35
30
25
20
15
10
95
85
75
65
55
45
35
25
VIN
24 V
15 V
Airflow
200LFM
100 LFM
Nat Conv
0.0
0.3
0.6
0.9
1.2
1.5
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
Output Current (A)
D009
D014
VOUT = 12 V
COUT = 1x 47 µF
VOUT = 12 V
VIN ≤ 15 V
图 13. Ripple Voltage vs Output Current
图 14. Safe Operating Area
95
85
75
65
55
Airflow
400LFM
200 LFM
100 LFM
Nat conv
45
35
25
0.0
0.3
0.6
0.9
1.2
1.5
Output Current (A)
D015
VOUT = 12 V
VIN = 24 V
图 15. Safe Operating Area
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TPSM84203, TPSM84205, TPSM84212
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
www.ti.com.cn
7 Detailed Description
7.1 Overview
The TPSM84203, TPSM84205, and TPSM84212 devices are 28 V input, 1.5 A, synchronous step down
converters with PWM, MOSFETs, inductor, and control circuitry integrated into a TO-220 footprint package. The
device integration enables small designs, while improving efficiency over a traditional linear regulator design. The
TPSM842xx family provides fixed output voltages of 3.3 V, 5.0 V and 12.0 V. The fixed 400 kHz (typ) switching
frequency allows small size and low output voltage ripple. Under light load conditions, these devices are
designed to operate in high-efficiency pulse-skipping mode. These devices provide accurate voltage regulation
for a variety of loads by using a precision internal voltage reference. These devices have been designed to safely
start up into a pre-biased output voltage. Thermal shutdown and current limit features protect the device during
an overload condition. The 3-pin, TO-220 footprint package offers improved performance over traditional linear
regulators packaged in the standard footprint.
7.2 Functional Block Diagram
Thermal
Shutdown
Shutdown
Logic
VIN
UVLO
VIN
VOUT
+
Power
Stage
and
Control
Logic
VOUT
GND
+
Comp
VREF
Soft
Start
Oscillator
OCP
Copyright © 2017, Texas Instruments Incorporated
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TPSM84203, TPSM84205, TPSM84212
www.ti.com.cn
ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
7.3 Feature Description
7.3.1 Input Capacitors
The TPSM842xx devices require a minimum input capacitance of 10 μF of ceramic type. High-quality ceramic
type X5R or X7R capacitors with sufficient voltage rating are recommended. An additional 100 μF of non-ceramic
capacitance is recommended for applications with transient load requirements. The voltage rating of input
capacitors must be greater than the maximum input voltage.
表 1. Recommended Input Capacitors(1)
CAPACITOR CHARACTERISTICS
WORKING
VOLTAGE
(V)
(2)
VENDOR
SERIES
PART NUMBER
CAPACITANCE
(µF)
ESR(3)
(mΩ)
Murata
X7R
X5R
X7R
X7R
ZA
GRM32ER71H475KA88L
50
50
50
50
50
4.7
10
2
3
TDK
C3225X5R1H106K250AB
GRM32ER71H106KA12
C3225X7R1H106M250AB
EEHZA1H101P
Murata
TDK
10
2
10
3
Panasonic
100
28
(1) Consult capacitor suppliers regarding availability, material composition, RoHS and lead-free status, and manufacturing process
requirements for any capacitors identified in this table.
(2) Standard capacitance values
(3) Maximum ESR @ 100kHz, 25°C.
7.3.2 Output Capacitors
The TPSM84203 and TPSM84205 devices require a minimum output capacitance of 94 μF (2x 47 μF) of ceramic
type. The TPSM84212 device requires a minimum output capacitance of 47 μF of ceramic type. High-quality X5R
or X7R ceramic capacitors with sufficient voltage rating are recommended. Additional output capacitance is
recommended for applications with transient load requirements. The voltage rating of output capacitors must be
greater than the maximum output voltage.
表 2. Recommended Output Capacitors(1)
CAPACITOR CHARACTERISTICS
WORKING
VOLTAGE
(V)
(2)
VENDOR
SERIES
PART NUMBER
CAPACITANCE
(µF)
ESR(3)
(mΩ)
TDK
X5R
X5R
C3225X5R0J476K
6.3
16
47
2
3
Murata
GRM32ER61C476K
C3225X5R0J107M
GRM32ER60J107M
GRM32ER61A107M
C1210C107M4PAC7800
6TPE100MI
47
TDK
X5R
6.3
6.3
10
100
100
100
100
100
220
220
330
47
2
Murata
X5R
2
Murata
X5R
2
Kemet
X5R
16
2
Panasonic
Panasonic
Panasonic
Panasonic
Panasonic
POSCAP
POSCAP
POSCAP
POSCAP
POSCAP
6.3
6.3
6.3
6.3
16
18
9
6TPF220M9L
6TPE220ML
12
9
6TPF330M9L
16TQC47MYFD
55
(1) Consult capacitor suppliers regarding availability, material composition, RoHS and lead-free status, and manufacturing process
requirements for any capacitors identified in this table.
(2) Standard capacitance values.
(3) Maximum ESR @ 100kHz, 25°C.
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7.3.3 Drop-Out Voltage
The drop-out voltage of a voltage regulator is the difference between the input voltage and the output voltage
that is required to maintain regulation. 图 16 and 图 17 show typical drop-out voltage graphs for TPSM84205 at
ambient temperatures of 25°C and 85°C. 图 18 and 图 19 show typical drop-out voltage graphs for TPSM84212
at ambient temperatures of 25°C and 85°C.
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
5.4
5.2
5.0
4.8
4.6
4.4
4.2
4.0
IOUT
10 mA
IOUT
10 mA
100 mA
500 mA
1.0 A
100 mA
500 mA
1.0 A
1.5 A
1.5 A
4.5
4.6
4.8
5.0
5.1
5.2
5.4
5.6
5.7
4.5
4.6
4.8
5.0
5.1
5.2
5.4
5.6
5.7
Input Voltage (V)
Input Voltage (V)
D017
D016
VOUT = 5.0 V
TA = 85°C
VOUT = 5.0 V
TA = 25°C
图 17. Drop-Out Voltage
图 16. Drop-Out Voltage
12.4
12.4
12.2
12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
12.2
12.0
11.8
11.6
11.4
11.2
11.0
10.8
10.6
IOUT
10 mA
IOUT
10 mA
100 mA
500 mA
1.0 A
100 mA
500 mA
1.0 A
1.5 A
1.5 A
10.4 10.8 11.2 11.6 12.0 12.4 12.8 13.2 13.6
Input Voltage (V)
10.4 10.8 11.2 11.6 12.0 12.4 12.8 13.2 13.6
Input Voltage (V)
D018
D019
VOUT = 12 V
TA = 25°C
VOUT = 12 V
TA = 85°C
图 18. Drop-Out Voltage
图 19. Drop-Out Voltage
12
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7.3.4 Internal Soft-Start
The device starts up under control of the internal soft-start function. The internal soft start time is set to 5 ms
typically.
7.3.5 Safe Startup into Pre-Biased Outputs
The device has been designed to prevent the low-side MOSFET from discharging a pre-biased output. During
monotonic pre-biased startup, both high-side and low-side MOSFETs are not allowed to be turned on until the
internal soft-start voltage is higher than the internal feedback voltage.
7.3.6 Over-Current Protection
The device is protected from overcurrent conditions by cycle-by-cycle current limiting. If an output overload
condition occurs for more than 1.28 ms, the device shuts down and restarts after approximately 40 ms. The
hiccup mode helps to reduce the device power dissipation under severe overcurrent conditions.
7.3.7 Output Over-Voltage Protection
An output over voltage protection circuit is incorporated to minimize output voltage overshoot when recovering
from output fault conditions or strong unload transients. When the output voltage goes above 108% × VOUT, the
high-side MOSFET is forced off. When the output voltage falls below 104% × VOUT, the high-side MOSFET is
enabled again.
7.3.8 Thermal Shutdown
The internal thermal-shutdown circuitry forces the device to stop switching if the junction temperature exceeds
165°C typically. The device reinitiates the power-up sequence when the junction temperature drops below 155°C
typically.
7.4 Device Functional Modes
7.4.1 Normal Operation
The TPSM842xx devices operate in Normal operation mode when the input voltage is above the minimum input
voltage. In Normal operation mode, the device operates in continuous conduction mode (CCM) which occurs
when inductor peak current is above 840 mA typically. In CCM, the TPSM842xx devices operate at a fixed
frequency of 400 kHz (typ). In addition, to reduce EMI, the devices introduce frequency spread spectrum. The
jittering frequency range is ±6% of the switching frequency with a 780 Hz modulation rate.
7.4.2 Eco-mode™ Operation
The TPSM842xx devices operate in Eco-mode operation in light load conditions. Eco-mode is a high-efficiency,
pulse-skipping mode under light load conditions. Pulse skipping initiates when the switch current falls to 840 mA
typically. During pulse skipping, the low-side FET turns off when the switch current falls to 0 A. The device takes
on the characteristics of discontinuous conduction mode (DCM) operation and the apparent switching frequency
decreases. As the output current decreases, the perceived time between switching pulses increases.
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8 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TPSM842xx devices are step down DC-DC power modules. They convert a higher DC voltage to a lower
DC voltage of 3.3 V, 5 V, or 12 V with a maximum output current of 1.5 A. The following design procedure can
be used to select components for the TPSM842xx devices. Alternately, the WEBENCH® software may be used
to generate complete designs. When generating a design, the WEBENCH software utilizes an iterative design
procedure and accesses comprehensive databases of components. Please visit www.ti.com/WEBENCH for more
details.
8.2 Typical Application
VIN = 24V
TPSM84205
VIN VOUT
VOUT = 5 V
10 µF
50 V
47 µF
16 V
47 µF
16 V
GND
Copyright © 2017, Texas Instruments Incorporated
图 20. Typical Application
8.2.1 Design Requirements
For this design example, use the parameters listed in 表 3 and follow the design procedures below.
表 3. Design Parameters
DESIGN PARAMETER
Input Voltage VIN
VALUE
24-V typical
Output Voltage VOUT
Output Current Rating
Key care-abouts
5.0 V
1.5 A
TO-220 footprint, high efficiency
14
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8.2.2 Detailed Design Procedure
8.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPSM84203 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
8.2.2.2 Input and Output Capacitors
The TPSM842xx devices require both input and output capacitance for proper operation. The minimum required
input capacitance for all of the TPSM842xx devices is 10 µF of ceramic capacitance placed directly at the device
pins. The minimum required output capacitance for the TPSM84203 and TPSM84205 is 2× 47 µF of ceramic
type. The TPSM84212 requires only one 47 µF ceramic output capacitor. Additional capacitance can be added to
improve ripple or transient response.
For this application, the minimum required input capacitance of 10 µF, ceramic was added and 2× 47 µF ceramic
capacitance was added to the output.
8.2.3 Application Curves
VIN = 24 V
VOUT = 5 V
IOUT = 1.5 A
VIN = 24 V
VOUT = 5 V
IOUT = 1.5 A
图 22. Shut-down Waveforms
图 21. Start-up Waveforms
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8.2.3.1 EMI
The TPSM842xx devices are all compliant with EN55022 Class B radiated emissions. 图 23 to 图 27 show typical
examples of radiated emissions plots for the TPSM842xx devices. The EMI plots were taken using a web-
orderable EVM with a resistive load. Input power was provided using a lead acid battery. All graphs show plots of
the antenna in the horizontal and vertical positions.
图 23. Radiated Emissions 12-V Input, 3.3-V Output,
1.5-A Load, Horizontal and Vertical Antenna
16
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ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
图 24. Radiated Emissions 12-V Input, 5.0-V Output,
1.5-A Load, Horizontal and Vertical Antenna
图 25. Radiated Emissions 24-V Input, 3.3-V Output,
1.5-A Load, Horizontal and Vertical Antenna
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TPSM84203, TPSM84205, TPSM84212
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图 26. Radiated Emissions 12-V Input, 5.0-V Output,
1.5-A Load, Horizontal and Vertical Antenna
图 27. Radiated Emissions 24-V Input, 12-V Output,
1.5-A Load, Horizontal and Vertical Antenna
18
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TPSM84203, TPSM84205, TPSM84212
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ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
9 Power Supply Recommendations
The TPSM842xx devices are designed to operate from an input voltage supply between 4.5 V and 28 V. This
supply must be well regulated. Proper bypassing of input supply is critical for noise performance, as is PCB
layout and grounding scheme. See the recommendations in the Layout section.
10 Layout
10.1 Layout Guidelines
To achieve optimal electrical and thermal performance, an optimized PCB layout is required. 图 28 shows a
typical PCB layout. Some considerations for an optimized layout are:
•
Use large copper areas for power planes (VIN, VOUT, and GND) to minimize conduction loss and thermal
stress.
•
•
•
Place ceramic input and output capacitors close to the device pins to minimize high frequency noise.
Locate additional output capacitors between the ceramic capacitor and the load.
Use multiple vias to connect the power planes to internal layers.
10.2 Layout Example
图 28.
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11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 使用 WEBENCH® 工具创建定制设计
请单击此处，借助 WEBENCH® Power Designer 并使用 TPSM84203 器件创建定制设计方案。
1. 首先键入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化关键参数设计，如效率、封装和成本。
3. 将生成的设计与德州仪器 (TI) 的其他解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下，可执行以下操作：
•
•
•
•
运行电气仿真，观察重要波形以及电路性能
运行热性能仿真，了解电路板热性能
将定制原理图和布局方案导出至常用 CAD 格式
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息，请访问 www.ti.com/WEBENCH。
11.2 相关链接
下面的表格列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件，以及申请样片或购买产品的
快速链接。
表 4. 相关链接
器件
产品文件夹
请单击此处
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
请单击此处
工具和软件
请单击此处
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
请单击此处
TPSM84203
TPSM84205
TPSM84212
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. 有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
11.4 Community Resources
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
11.5 商标
Eco-mode, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
20
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ZHCSGE1A –JULY 2017–REVISED AUGUST 2017
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知和修
订此文档。如欲获取此数据表的浏览器版本，请参阅左侧的导航。
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21
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jul-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPSM84203EAB
TPSM84205EAB
TPSM84212EAB
ACTIVE SIP MODULE
EAB
3
3
3
80
RoHS Exempt
& Green
SN
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-40 to 125
-40 to 125
-40 to 125
ACTIVE SIP MODULE
ACTIVE SIP MODULE
EAB
80
RoHS Exempt
& Green
SN
SN
EAB
80
RoHS Exempt
& Green
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jul-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE OUTLINE
EAB0003A
SIPMODULE - 11.1 mm max height
S
C
A
L
E
1
.
0
0
0
SYSTEM IN PACKAGE MODULE
10.1
9.9
1.72
1.42
A
B
11.1 MAX
C
(1)
4.35
3.85
1
3
0.635 0.02
3X 0.635 0.02
0.25 C A B
2X 2.54
1.27 0.025
5.08
7.80
5.66
(1.57)
3
1
4223521/C 11/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Location, size and quantity of each component are for reference only and may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
EAB0003A
SIPMODULE - 11.1 mm max height
SYSTEM IN PACKAGE MODULE
(11)
2X SOLDER MASK
OPENING
SOLDER MASK
OPENING
2X 0.07 MAX
ALL AROUND
0.07 MAX
ALL AROUND
(
1.71)
(7.37)
2X ( 1.71)
METAL
R0.05
TYP
3X
1.01 MIN
VIA
2
3
1
(3.9)
(2.96)
(2.54)
RECOMMENDED
KEEP OUT AREA
(5.08)
FOR USER COMPONENTS
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE:10X
4223521/C 11/2017
www.ti.com
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相关型号：
TPSM843A26
4-V to 18-V input, advanced current mode, 16-A synchronous SWIFT™ step-down power module
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