TRSF3221EIDBR [TI]
具有 +/-15kV IEC-ESD 保护的 3V 至 5.5V 单通道 1Mbps RS-232 线路驱动器/接收器 | DB | 16 | -40 to 85;
| 型号： | TRSF3221EIDBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 +/-15kV IEC-ESD 保护的 3V 至 5.5V 单通道 1Mbps RS-232 线路驱动器/接收器 | DB | 16 | -40 to 85 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总17页 (文件大小：490K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
FEATURES
D, DB, DW, OR PW PACKAGE
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
(TOP VIEW)
Operates up to 1 Mbit/s
C1+
V+
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
Low Supply Current . . . 300 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accept 5-V Logic Input With 3.3-V Supply
GND
C1−
DOUT1
RIN1
C2+
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
C2−
ROUT1
DIN1
V−
•
ESD Protection for RS-232 Pins
DOUT2
RIN2
DIN2
ROUT2
–
–
–
±15-kV Human-Body Model (HBM)
±15-kV IEC 61000-4-2 Air-Gap Discharge
±8-kV IEC 61000-4-2 Contact Discharge
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRSF3232E consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). This device provides the electrical
interface between an asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232E operates
at data signaling rates up to 1 Mbit/s and a driver output slew rate of 14 V/μs to 150 V/μs.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRSF3232ECD
TOP-SIDE MARKING
TRSF3232EC
Tube of 40
SOIC – D
Reel of 2500
Tube of 40
TRSF3232ECDR
TRSF3232ECDW
TRSF3232ECDWR
TRSF3232ECDBR
TRSF3232ECPW
TRSF3232ECPWR
TRSF3232EID
SOIC – DW
SSOP – DB
TSSOP – PW
TRSF3232EC
RT32EC
0°C to 70°C
Reel of 2000
Reel of 2000
Tube of 90
RT32EC
Reel of 2000
Tube of 40
SOIC – D
TRSF3232EI
SOIC – DW
Tube of 40
TRSF3232EIDR
TRSF3232EIDW
TRSF3232EIDWR
TRSF3232EIDBR
TRSF3232EIPW
SOIC – DW
SSOP – DB
TSSOP – PW
TRSF3232EI
RT32EI
–40°C to 85°C
TSSOP – PW
Reel of 2000
Tube of 90
RT32EI
Reel of 2000
TRSF3232EIPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
Table 1. 1-Mbit/s RS-232 Parts
SUPPLY
VCC
(V)
TEMPERATURE
RANGE
PART
NO.
NO. OF
DRIVERS RECEIVERS
NO. OF
PIN/
PACKAGE
ESD
FEATURE
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
16-pin
TRSF3221E
TRSF3232E
TRS3227
1
2
1
1
2
2
2
5
3
1
2
1
1
2
2
2
5
3
1
2
1
1
2
2
2
3
5
1
2
1
1
2
2
2
3
5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.5 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
3.3 or 5
Auto-powerdown SOIC, SSOP,
TSSOP
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
16-pin
SOIC, SSOP,
TSSOP
Low pin count
±8-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
Auto-powerdown
plus, ready signal
16-pin
SSOP
16-pin
TRSF3221
TRSF3222
TRSF3223
TRSF3232
TRSF3238
TRSF3243
TRSF3221E
TRSF3232E
TRS3227
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
Auto-powerdown SOIC, SSOP,
TSSOP
Enable,
powerdown
signal
20-pin
SOIC, SSOP,
TSSOP
0°C to 70°C
20-pin
SOIC, SSOP,
TSSOP
Auto-powerdown,
enable signal
16-pin
SOIC, SSOP,
TSSOP
Low pin count
28-pin
SOIC, SSOP,
TSSOP
Auto-powerdown
plus
28-pin
Auto-powerdown SOIC, SSOP,
TSSOP
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
16-pin
Auto-powerdown SOIC, SSOP,
TSSOP
±15-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
16-pin
SOIC, SSOP,
TSSOP
Low pin count
±8-kV Air-Gap Discharge,
±8-kV Contact Discharge,
±15-kV HBM
Auto-powerdown
plus, ready signal
16-pin
SSOP
16-pin
TRSF3221
TRSF3222
TRSF3223
TRSF3232
TRSF3238
TRSF3243
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
±15-kV HBM
Auto-powerdown SOIC, SSOP,
TSSOP
Enable,
powerdown
signal
20-pin
SOIC, SSOP,
TSSOP
–40°C to 85°C
20-pin
SOIC, SSOP,
TSSOP
Auto-powerdown,
enable signal
16-pin
SOIC, SSOP,
TSSOP
Low pin count
28-pin
SOIC, SSOP,
TSSOP
Auto-powerdown
plus
28-pin
Auto-powerdown SOIC, SSOP,
TSSOP
2
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
FUNCTION TABLES
xxx
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
5 kW
8
ROUT1
9
ROUT2
RIN2
5 kW
3
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
6
V
7
V
V
V
V–
–7
V+ – V– Supply voltage difference(2)
13
6
Drivers
–0.3
–25
VI
Input voltage range
Output voltage range
V
V
Receivers
Drivers
25
–13.2
–0.3
13.2
VCC + 0.3
82
VO
Receivers
D package
DB package
DW package
PW package
46
θJA
Package thermal impedance(3)(4)
°C/W
57
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
3
NOM
3.3
5
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
DIN
3.6
V
Supply voltage
4.5
2
5.5
VIH
VIL
VI
Driver high-level input voltage
DIN
V
2.4
Driver low-level input voltage
Driver input voltage
0.8
5.5
25
85
70
V
V
DIN
0
–25
–40
0
Receiver input voltage
TRSF3232EI
TRSF3232EC
TA
Operating free-air temperature
°C
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Supply current
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
ICC
No load,
VCC = 3.3 V or 5 V
0.3
1
mA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
4
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VOH High-level output voltage
VOL Low-level output voltage
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND,
MIN TYP(2)
MAX UNIT
DIN = GND
DIN = VCC
5
5.5
–5.4
±0.01
±0.01
±35
V
V
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
IIH
IIL
High-level input current
Low-level input current
±1
±1
μA
μA
VI at GND
VCC = 3.6 V,
VO = 0 V
VO = 0 V
VO = ±2 V
±60
±90
(3)
IOS
ro
Short-circuit output current
Output resistance
mA
VCC = 5.5 V,
±35
VCC, V+, and V– = 0 V,
300
10M
Ω
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL = 250 pF,
MIN TYP(2) MAX UNIT
VCC = 3 V to 4.5 V
1000
kbit/s
1000
Maximum data rate
(see Figure 1)
RL = 3 kΩ,
One DOUT switching
CL = 1000 pF,
VCC = 3.5 V to 5.5 V
tsk(p)
Pulse skew(3)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2
300
ns
Slew rate,
SR(tr)
transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ, CL = 150 pF to 1000 pF, VCC = 3.3 V
14
150 V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME NO.
HBM
±15
±15
±8
DOUT 7, 14 IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
kV
5
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VOH High-level output voltage
TEST CONDITIONS
IOH = –1 mA
IOL = 1.6 mA
VCC = 3.3 V
MIN
TYP(2)
MAX
UNIT
VCC – 0.6
VCC – 0.1
V
V
VOL Low-level output voltage
0.4
2.4
2.4
1.5
1.8
1.2
1.5
0.3
5
VIT+ Positive-going input threshold voltage
V
V
VCC = 5 V
VCC = 3.3 V
0.6
0.8
VIT– Negative-going input threshold voltage
VCC = 5 V
Vhys Input hysteresis (VIT+ – VIT–
)
V
ri Input resistance
VI = ±3 V to ±25 V
3
7
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
TEST CONDITIONS
CL = 150 pF
CL = 150 pF
TYP(2)
300
UNIT
ns
tPLH
tPHL
tsk(p)
300
ns
300
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V (see Figure 4).
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
TERMINAL
TEST CONDITIONS
TYP UNIT
NAME NO.
HBM
±15
±15
±8
RIN
8, 13 IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
kV
6
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
RS-232
Output
0 V
Generator
(see Note B)
50 Ω
t
t
C
L
THL
TLH
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
−3 V
Output
TLH
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
Generator
(see Note B)
50 Ω
C
L
t
t
PHL
PLH
R
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PHL
PLH
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
7
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH ±15-kV IEC ESD PROTECTION
www.ti.com
SLLS825–AUGUST 2007
APPLICATION INFORMATION
1
2
3
4
16
V
CC
C1+
V+
+
−
C
= 0.1 µF
BYPASS
+
−
15
14
GND
C1
+
−
C3
DOUT1
RIN1
C1−
C2+
C2−
13
+
−
5 kΩ
C2
5
6
12
11
ROUT1
DIN1
V−
−
+
C4
7
8
10
9
DOUT2
RIN2
DIN2
ROUT2
5 kΩ
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
A. C3 can be connected to VCC or GND.
Figure 4. Typical Operating Circuit and Capacitor Values
8
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRSF3232ECD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3232ECDB
TRSF3232ECDBG4
TRSF3232ECDBR
TRSF3232ECDBRG4
TRSF3232ECDG4
TRSF3232ECDR
TRSF3232ECDRG4
TRSF3232ECDW
TRSF3232ECDWG4
TRSF3232ECDWR
TRSF3232ECDWRG4
TRSF3232ECPW
TRSF3232ECPWG4
TRSF3232ECPWR
TRSF3232ECPWRG4
TRSF3232EID
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3232EIDB
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3232EIDBG4
TRSF3232EIDBR
TRSF3232EIDBRG4
TRSF3232EIDG4
TRSF3232EIDR
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3232EIDRG4
TRSF3232EIDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
Orderable Device
TRSF3232EIDWG4
TRSF3232EIDWR
TRSF3232EIDWRG4
TRSF3232EIPW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
DW
DW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3232EIPWG4
TRSF3232EIPWR
TRSF3232EIPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRSF3232ECDBR
TRSF3232ECDR
TRSF3232ECDWR
TRSF3232ECPWR
TRSF3232EIDBR
TRSF3232EIDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
8.2
6.5
6.6
10.3
10.7
5.6
2.5
2.1
2.7
1.6
2.5
2.1
2.7
1.6
12.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
SOIC
DW
PW
DB
D
10.75
7.0
12.0
8.0
TSSOP
SSOP
SOIC
8.2
6.6
12.0
8.0
6.5
10.3
10.7
5.6
TRSF3232EIDWR
TRSF3232EIPWR
SOIC
DW
PW
10.75
7.0
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRSF3232ECDBR
TRSF3232ECDR
TRSF3232ECDWR
TRSF3232ECPWR
TRSF3232EIDBR
TRSF3232EIDR
SSOP
SOIC
DB
D
16
16
16
16
16
16
16
16
2000
2500
2000
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
33.0
29.0
33.0
33.0
33.0
29.0
SOIC
DW
PW
DB
D
TSSOP
SSOP
SOIC
TRSF3232EIDWR
TRSF3232EIPWR
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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