TS3L110PWRG4 [TI]
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER; QUAD SPDT高带宽10/100 BASE - T LAN SWITCH差分8通道为4声道复用器/解复用器
| 型号： | TS3L110PWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER |
| 文件： | 总26页 (文件大小：817K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
D
D
D
Wide Bandwidth (BW = 500 MHz Typ)
Low Crosstalk (X = −30 dB Typ)
D
D
D
Data and Control Inputs Have Undershoot
Clamp Diodes
TALK
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Bidirectional Data Flow, With Near-Zero
Propagation Delay
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
D
Low and Flat ON-State Resistance
(r = 4 W Typ, r
= 1 W)
on
on(flat)
D
D
D
Switching on Data I/O Ports (0 to 5 V)
Operating Range From 3 V to 3.6 V
− 1000-V Charged-Device Model (C101)
V
CC
D
Suitable for Both 10 Base-T/100 Base-T
Signaling
I
off
Supports Partial-Power-Down Mode
Operation
RGY PACKAGE
(TOP VIEW)
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC
E
S
IA0
IA1
YA
IB0
IB1
YB
GND
1
16
ID0
ID1
YD
IC0
IC1
YC
IA0
15
14
13
12
11
10
2
3
4
5
6
7
E
IA1
YA
IB0
IB1
YB
ID0
ID1
YD
IC0
IC1
8
9
description/ordering information
The TI TS3L110 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input.
When E is low, the switch is enabled, and the I port is connected to the Y port. When E is high, the switch is
disabled, and the high-impedance state exists between the I and Y ports. The select (S) input controls the data
path of the multiplexer/demultiplexer.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
QFN − RGY
SOIC − D
Tape and reel
Tube
TS3L110RGYR
TK110
TS3L110D
TS3L110
TK110
Tape and reel
TS3L110DR
TS3L110DBQR
TS3L110PW
TS3L110PWR
TS3L110DGVR
SSOP (QSOP) − DBQ Tape and reel
Tube
TSSOP − PW
−40°C to 85°C
TK110
TK110
Tape and reel
TVSOP − DGV
Tape and reel
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
description/ordering information (continued)
This device can be used to replace mechanical relays in LAN applications. This device has low and flat r , wide
on
bandwidth, and low crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.
The device can be used to route signals from a 10/100 Base-T ethernet transceiver to the RJ-45 LAN connectors
in laptops or in docking stations. The device is designed for low channel-to-channel skew and low crosstalk.
This device is fully specified for partial-power-down applications using I . The I feature ensures that
off
off
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, E should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
INPUTS
INPUT/OUTPUT
YX
FUNCTION
E
S
L
L
L
IX
IX
YX = IX
YX = IX
0
0
H
X
1
1
H
Z
Disconnect
PIN DESCRIPTIONS
PIN NAME
IAn−IDn
S
DESCRIPTION
Data I/Os
Select input
Enable input
Data I/Os
E
YA−YD
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
logic diagram (positive logic)
4
7
9
2
3
IA
IA
YA
0
1
5
6
YB
YC
YD
IB
IB
0
1
11
10
IC
0
IC
1
12
14
13
ID
ID
0
1
1
S
E
Control
Logic
15
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
CC
Control input voltage range, V (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
IN
Switch I/O voltage range, V (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I/O
Control input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
IK
IN
I/O port clamp current, I
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O
I/OK
ON-state switch current, I (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
I/O
Continuous current through V or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
CC
Package thermal impedance, θ (see Note 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
JA
(see Note 5): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
(see Note 5): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120°C/W
(see Note 5): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
(see Note 6): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39°C/W
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground, unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. V and V are used to denote specific conditions for V .
I
O
I/O
4. I and I are used to denote specific conditions for I .
I
O
I/O
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 7)
MIN
3
MAX
3.6
5.5
0.8
5.5
85
UNIT
V
V
V
V
V
T
Supply voltage
CC
High-level control input voltage (E, S)
Low-level control input voltage (E, S)
Input/output voltage
2
V
IH
0
V
IL
0
V
I/O
Operating free-air temperature
−40
°C
A
NOTE 7: All unused control inputs of the device must be held at V or GND to ensure proper device operation. Refer to the TI application report,
CC
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
electrical characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V (unless otherwise noted)
†
PARAMETER
E, S
TEST CONDITIONS
MIN TYP
MAX
−1.8
1
UNIT
V
V
IK
V
V
V
V
V
= 3.6 V,
= 3.6 V,
= 3.6 V,
= 0,
I
= −18 mA
= 5.5 V
IN
CC
CC
CC
CC
CC
IN
I
I
I
I
E, S
V
V
V
μA
μA
μA
mA
pF
IH
E, S
= GND
= 0 to 5.5 V ,
= 0,
1
IL
IN
O
V = 0
1
off
CC
I
= 3.6 V,
I
I/O
Switch ON or OFF
0.7
2.5
1.5
3.5
C
E, S
f = 1 MHz,
V
= 0
in
IN
f = 1 MHz,
Outputs open,
I port
V = 0,
Switch OFF
Switch OFF
Switch ON
3.5
5.5
5
7
I
C
pF
io(OFF)
io(ON)
f = 1 MHz,
Outputs open,
Y port
V = 0,
I
f = 1 MHz,
Outputs open,
C
I or Y port
V = 0,
I
10.5
13
8
pF
V
CC
V
CC
V
CC
= 3 V
1.25 V ≤ V ≤ V
,
I = −10 mA to −30 mA
I
4
1
Ω
Ω
Ω
r
r
I
CC
on
on(flat)
‡
= 3 V
= 3 V,
V = 1.25 V and V
I
,
I = −10 mA to −30 mA
I
CC
§
1.25 V ≤ V ≤ V
,
I = −10 mA to −30 mA
I
0.9
2
Δr
I
CC
on
V , V , I , and I refer to I/O pins. V refers to the control inputs.
I
O
I
O
IN
†
‡
§
All typical values are at V = 3.3 V (unless otherwise noted), T = 25°C.
r
Δr is the difference of r in a given device.
CC
A
is the difference of r in a given channel at specified voltages.
on(flat)
on
on
on
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figures 5 and 6)
FROM
(INPUT)
TO
(OUTPUT)
†
PARAMETER
MIN TYP
MAX
UNIT
¶
t
t
t
t
Y or I
I or Y
I or Y
Y or I
0.25
ns
ns
ns
ns
I or Y
E or S
E or S
I or Y
pd
, t
0.5
0.5
7
5
PZH PZL
, t
PHZ PLZ
#
0.1
0.2
sk(p)
†
¶
All typical values are at V = 3.3 V (unless otherwise noted), T = 25°C.
The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when
driven by an ideal voltage source (zero output impedance).
CC
A
#
Skew between opposite transitions of the same output |t
− t
PLH
|. This parameter is not production tested.
PHL
dynamic characteristics over recommended operating free-air temperature range,
VCC = 3.3 V + 0.3 V (unless otherwise noted)
†
PARAMETER
TEST CONDITIONS
f = 250 MHz, see Figure 7
f = 250 MHz, see Figure 8
MIN TYP
MAX
UNIT
dB
X
R = 100 Ω,
−26
TALK
L
O
R = 100 Ω,
L
−28
500
dB
IRR
BW
R = 100 Ω, see Figure 6
L
MHz
†
All typical values are at V = 3.3 V (unless otherwise noted), T = 25°C.
CC
A
5
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TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
OPERATING CHARACTERISTICS
0
0
Phase
−10
−1
−20
−30
−2
−3
−4
−5
−6
−7
Gain
J
Y
−40
−50
−60
−70
1
10
100
700
Frequency (MHz)
J
Phase at 627 MHz, −36 Degrees
Gain −3 dB at 627 MHz
Y
Figure 1. Gain/Phase vs Frequency
20
0
120
100
80
60
40
20
0
Phase
J
Y
−20
−40
−60
−80
−100
Gain
1
10
100
700
Frequency (MHz)
J
Y
Phase at 250 MHz, 88.2 Degrees
Gain −28.5 dB at 250 MHz
Figure 2. OFF Isolation vs Frequency
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
OPERATING CHARACTERISTICS
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
180
160
140
J
Y
120
100
80
60
40
20
0
Phase
Gain
1
10
100
700
Frequency (MHz)
J
Y
Phase at 250 MHz, 137.92 Degrees
Gain −26 dB at 250 MHz
Figure 3. Crosstalk vs Frequency
5
4
3
2
1
0
20
16
12
8
V
O
r
ON
4
0
0
1
2
3
4
5
Input Voltage (V)
Figure 4. Output Voltage/ON-State Resistance vs Input Voltage
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
FOR ENABLE AND DISABLE TIMES
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
GND
R
V
V
O
L
I
50 Ω
V
G2
C
R
L
L
(see Note A)
S1
2 × V
V
V
Δ
C
R
V
TEST
I
L
L
CC
t
/t
3.3 V 0.3 V
3.3 V 0.3 V
200 Ω
200 Ω
GND
10 pF
10 pF
0.3 V
0.3 V
PLZ PZL
CC
t
/t
GND
V
CC
PHZ PZH
Output Control
2.5 V
0 V
(V
IN
)
1.25 V
1.25 V
Output
Waveform 1
t
t
PLZ
PZL
S1 at 2 y V
CC
V
V
OH
(see Note B)
V
CC
/2
V
V
+0.3 V
OL
OL
t
t
PZH
PHZ
Output
Waveform 2
S1 at GND
V
V
OH
−0.3 V
OH
V
CC
/2
OL
(see Note B)
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
t
t
and t
and t
are the same as t
.
.
PLZ
PZL
PHZ
PZH
dis
are the same as t
en
Figure 5. Test Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
FOR SKEW
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
GND
R
V
V
O
L
I
50 Ω
V
G2
C
R
L
L
(see Note A)
V
IN
S1
GND
C
R
V
TEST
L
L
CC
(see Note B)
t
3.3 V 0.3 V
200 Ω
V
or GND
10 pF
sk(p)
CC
3.5 V
Data Input
2.5 V
1.5 V
t
t
PHL
PLH
V
OH
Data Output
0.5 V (V − V
)
OL
OH
V
OL
tsk(p) = |t
− t
PLH
|
PHL
VOLTAGE WAVEFORMS
PULSE SKEW (t
)
sk(p)
NOTES: A. C includes probe and jig capacitance.
L
B. Switch is ON during the measurement of t , i.e., voltage at E = 0 and S = V or GND
sk(p) CC
Figure 6. Test Circuit and Voltage Waveforms
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
YA
S
IA
0
C = 10 pF
(see Note A)
R = 100 Ω
L
L
DUT
V
V
S
E
E
NOTE A: C includes probe and jig capacitance.
L
Figure 7. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when V = 0, V = 0, and YA is the
S
E
input, the output is measured at IA . All unused analog I/O ports are left open.
0
HP8753ES setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBm
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
V
BIAS
(HP8753ES)
P1
P2
V
CC
YA
S
IA
0
R = 100 Ω
L
C = 10 pF
L
50 Ω
(see Note A)
(see Note B)
V
V
S
DUT
E
E
YB
IB
0
R = 100 Ω
L
C = 10 pF
(see Note A)
L
NOTES: A. C includes probe and jig capacitance.
L
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 8. Test Circuit for Crosstalk (X
)
TALK
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when V = 0,
S
V = 0, and YA is the input, the output is measured at IB . All unused analog input (Y) ports are connected to GND,
E
0
and output (I) ports are connected to GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBm
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TS3L110
QUAD SPDT HIGH-BANDWIDTH 10/100 BASE-T LAN SWITCH
DIFFERENTIAL 8-CHANNEL TO 4-CHANNEL MULTIPLEXER/DEMULTIPLEXER
SCDS176 − SEPTEMBER 2004
PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
YA
S
IA
0
1
R = 100 Ω
L
C = 10 pF
(see Note A)
L
DUT
V
V
S
IA
E
R = 100 Ω
L
C = 10 pF
(see Note A)
50 Ω
(see Note B)
L
E
NOTES: A. C includes probe and jig capacitance.
L
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 9. Test Circuit for OFF Isolation (O
)
IRR
OFF isolation is measured at the output of the OFF channel. For example, when V = V , V = 0, and YA is the input,
S
CC
E
the output is measured at IA . All unused analog input (Y) ports are left open, and output (I) ports are connected to
0
GND through 50-Ω pulldown resistors.
HP8753ES setup
Average = 4
RBW = 3 kHz
V
BIAS
= 0.35 V
ST = 2 s
P1 = 0 dBm
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
TS3L110D
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS3L110DBQR
TS3L110DBQRE4
TS3L110DBQRG4
TS3L110DE4
SSOP/
QSOP
DBQ
DBQ
DBQ
D
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS3L110DG4
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS3L110DGVR
TS3L110DGVRE4
TS3L110DGVRG4
TS3L110DR
TVSOP
TVSOP
TVSOP
SOIC
DGV
DGV
DGV
D
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS3L110DRE4
TS3L110DRG4
TS3L110PW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
VQFN
VQFN
PW
PW
PW
PW
PW
PW
RGY
RGY
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS3L110PWE4
TS3L110PWG4
TS3L110PWR
TS3L110PWRE4
TS3L110PWRG4
TS3L110RGYR
TS3L110RGYRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS3L110DGVR
TS3L110DR
TVSOP
SOIC
DGV
D
16
16
16
16
2000
2500
2000
3000
330.0
330.0
330.0
330.0
12.4
16.4
12.4
12.4
6.8
6.5
6.9
3.8
4.0
10.3
5.6
1.6
2.1
1.6
1.5
8.0
8.0
8.0
8.0
12.0
16.0
12.0
12.0
Q1
Q1
Q1
Q1
TS3L110PWR
TS3L110RGYR
TSSOP
VQFN
PW
RGY
4.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS3L110DGVR
TS3L110DR
TVSOP
SOIC
DGV
D
16
16
16
16
2000
2500
2000
3000
346.0
333.2
346.0
346.0
346.0
345.9
346.0
346.0
29.0
28.6
29.0
29.0
TS3L110PWR
TS3L110RGYR
TSSOP
VQFN
PW
RGY
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,23
0,13
M
0,07
0,40
24
13
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–ā8°
0,75
1
12
0,50
A
Seating Plane
0,08
0,15
0,05
1,20 MAX
PINS **
14
16
20
24
38
48
56
DIM
A MAX
A MIN
3,70
3,50
3,70
3,50
5,10
4,90
5,10
4,90
7,90
7,70
9,80
9,60
11,40
11,20
4073251/E 08/00
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
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