CUS02(TE85L,Q,M) [TOSHIBA]

X35 PB-FREE, RECTIFIER; US-FLAT; MOQ=4000; P=0.6W F=1MHZ;


型号：	CUS02(TE85L,Q,M)
厂家：	TOSHIBA
描述：	X35 PB-FREE, RECTIFIER; US-FLAT; MOQ=4000; P=0.6W F=1MHZ 二极管
文件：	总5页 (文件大小：259K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

CUS02

TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type

CUS02

Switching Mode Power Supply Applications

Unit: mm

+ 0.2

− 0.1

Portable Equipment Battery Applications

1.25

+ 0.05

0.13

0.88 ± 0.1

− 0.03

•

Peak forward voltage: V = 0.45 V@I = 0.7 A

FM F

②

Average forward current: I

= 1.0 A

F (AV)

Repetitive peak reverse voltage: V

= 30 V

RRM

Suitable for high-density board assembly due to the use of a small

surface-mount package, US−FLAT^TM

①

Absolute Maximum Ratings (Ta = 25°C)

0.6 ± 0.1

Characteristics

Symbol

Rating

Unit

0.88 ± 0.1

Repetitive peak reverse voltage

Average forward current

RRM

0.6 ± 0.1

F (AV)

1.0 (Note 1)

20 (50 Hz)

Peak one cycle surge forward current

(non-repetitive)

FSM

Junction temperature

−40 to 150

°C

0.78 ± 0.1

① ANODE

② CATHODE

Storage temperature range

stg

0.6 ± 0.1

Note 1: Ta = 25°C: Device mounted on a glass-epoxy board

Board size: 50 mm × 50 mm,

Land size: 6 mm × 6 mm

Rectangular waveform (α = 180°), V = 15 V

JEDEC

―

JEITA

Note 2: Using continuously under heavy loads (e.g. the application of

high temperature/current/voltage and the significant change in

temperature, etc.) may cause this product to decrease in the

reliability significantly even if the operating conditions (i.e.

TOSHIBA

3-2B1A

Weight: 0.004 g (typ.)

operating temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

= 0.1 A

= 0.7 A

= 1.0 A

―

0.35

0.42

0.47

0.7

―

0.45

―

FM (1)

FM (2)

FM (3)

Peak forward voltage

= 5 V

―

RRM (1)

RRM (2)

RRM

Repetitive peak reverse current

Junction capacitance

μA

= 30 V

100

―

= 10 V, f = 1.0 MHz

Device mounted on a ceramic board

(Board size: 50 mm × 50 mm ,

Land size: 2 mm × 2 mm)

―

Thermal resistance

(junction to ambient)

°C/W

th (j-a)

Device mounted on a glass-epoxy

board

(Board size: 50 mm × 50 mm ,

Land size: 6 mm × 6 mm)

―

150

Thermal resistance (junction to lead)

Junction to lead of cathode side

th (j-ℓ)

Start of commercial production

2001-12

2015-07-16

CUS02

Marking

Abbreviation Code

Part No.

CUS02

Land pattern dimensions for reference only

Unit: mm

2.0

0.5

0.8

1.1

0.8

Handling Precaution

1) Schottky barrier diodes have reverse current characteristics compared to other diodes.

There is a possibility SBD may cause thermal runaway when it is used under high temperature or high voltage.

Please take forward and reverse loss into consideration during design.

2) The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be

exceeded during operation, even for an instant. The following are the general derating methods that we

recommend for designing a circuit using this device.

RRM

Use this rating with reference to the 1). V has a temperature coefficient of 0.1%/°C. Take this

RRM

temperature coefficient into account designing a device at low temperature.

The worst-case current is no greater than 80% of the absolute maximum rating of I

and T be

F(AV) j

F(AV)

below 120°C. When using this device, take the margin into consideration by using an allowable Ta

max-I curve.

F(AV)

This rating specifies the non-repetitive peak current. This is only applied for an abnormal operation,

which seldom occurs during the lifespan of the device.

FSM

T :

Derate this rating when using a device in order to ensure high reliability. The device is used at T

below 120°C.

3) Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition.

When using a device, design a circuit board and a soldering land size to match the appropriate thermal

resistance value.

4) Refer to the Rectifiers databook for further information.

2015-07-16

CUS02

– v

– I

F (AV)

180°

0.6

0.5

0.4

0.3

0.2

0.1

T = 150°C

120°

75°C

100°C

α = 60°

25°C

Rectangular

waveform

0.1

0.01

0° α 360°

Conduction

angle: α

0.0

0.2

0.4

0.6

0.8

1.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

F (AV)

1.4

(A)

1.6

Instantaneous forward voltage

(V)

Average forward current

Ta max – I

F (AV)

160

140

120

100

160

140

120

100

Device mounted on a ceramic board

(board size: 50 mm × 50 mm

land size: 2 mm × 2 mm)

Device mounted on a glass-epoxy

board

(board size: 50 mm × 50 mm,

land size: 6 mm × 6 mm)

α = 60°

Rectangular

120°

180°

α = 60°

Rectangular

waveform

120°

180°

0° α 360°

Conduction

angle: α

= 15 V

V = 15 V

0.0

0.2

0.4

0.6

0.8

1.0

1.2

F (AV)

1.4

(A)

1.6

0.2

0.4

0.6

0.8

1.0

1.2

F (AV)

1.4

(A)

1.6

Average forward current

– t

th (j-a)

T max – I

ℓ

F (AV)

10000

1000

100

160

140

120

100

(2) Device mounted on a glass-epoxy board:

board size: 50 mm × 50 mm

land size: 6.0 mm × 6.0 mm

board thickness: 1.6 mm

(3) Device mounted on a glass-epoxy board:

Board size: 50 mm × 50 mm

Reference land size

(3)

board thickness: 1.6 mm

(2)

(1)

α = 60°

120°

180°

Rectangular

waveform

(1) Device mounted on a ceramic board:

board size: 50 mm × 50 mm

land size: 2.0 mm × 2.0 mm

board thickness : 0.64 mm

0° α 360°

Conduction

angle: α

= 15 V

0.001

0.01

100

1000

0.1

0.0

0.2

0.4

0.6

0.8

1.0

1.2

F (AV)

1.4

(A)

1.6

Time

t (s)

Average forward current

2015-07-16

CUS02

Surge forward current (non-repetitive)

C – V

(typ.)

1000

100

Ta = 25°C

f = 50 Hz

f = 1 MHz

Ta = 25°C

100

Number of cycles

100

Reverse voltage

(V)

– T

(typ.)

P – V

R (AV)

(typ.)

100

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Rectangular

waveform

Pulse test

= 30 V

0° α 360°

Conduction

20 V

angle: α

300°

T = 150°C

15 V

240°

10 V

0.1

5 V

180°

3 V

0.01

0.001

0.0001

120°

60°

100

120

(°C)

140

160

Junction temperature

Reverse voltage

(V)

2015-07-16

CUS02

RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

•

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

2015-07-16

CUS02(TE85L,Q,M) [TOSHIBA]

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