TB2921HQ [TOSHIBA]

IC 29 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM25, 1 MM PITCH, PLASTIC, HZIP-25, Audio/Video Amplifier;
TB2921HQ
型号: TB2921HQ
厂家: TOSHIBA    TOSHIBA
描述:

IC 29 W, 4 CHANNEL, AUDIO AMPLIFIER, PZFM25, 1 MM PITCH, PLASTIC, HZIP-25, Audio/Video Amplifier

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TB2921HQ  
TOSHIBA Bi-CMOS Linear Integrated Circuit Silicon Monolithic  
TB2921HQ (preliminary)  
Maximum Power 50 W BTL × 4-ch Audio Power IC  
The TB2921HQ is 4-ch BTL audio amplifier for car audio  
applications.  
This IC can generate higher power: P  
MAX =50 W as it  
OUT  
includes the pure complementary P-ch and N-ch DMOS output  
stage.  
It is designed to yield low distortion ratio for 4-ch BTL audio  
power amplifier, built-in standby function, muting function, and  
various kinds of protectors.  
Additionally, high-side switch is built in.  
Weight: 7.7 g (typ.)  
Features  
High power output  
MAX (1) = 50 W (typ.)  
:
P
OUT  
(V  
CC  
= 15.2 V, f = 1 kHz, JEITA max, R = 4 )  
L
:
P
OUT  
MAX (2) = 43 W (typ.)  
(V  
CC  
= 13.7 V, f = 1 kHz, JEITA max, R = 4 )  
L
P
OUT  
MAX (3) = 80 W (typ.)  
(V  
CC  
= 14.4 V, f = 1 kHz, JEITA max, R = 2 )  
L
:
P
OUT  
(1) = 29 W (typ.)  
(V  
CC  
= 14.4 V, f = 1 kHz, THD = 10%, R = 4 )  
L
:
P
OUT  
(2) = 25 W (typ.)  
(V  
CC  
= 13.2 V, f = 1 kHz, THD = 10%, R = 4 )  
L
Low distortion ratio: THD = 0.015% (typ.)  
(V = 13.2 V, f = 1 kHz, P  
= 5 W, R = 4 )  
CC  
OUT  
L
Low noise: V  
= 50 µVrms (typ.)  
NO  
(V  
CC  
= 13.2 V, R = 0 , BW = 20 Hz~20 kHz, R = 4 )  
g L  
Built-in standby switch function (pin 4)  
Built-in muting function (pin 22)  
Built-in high-side switch function (pin 25)  
Built-in various protection circuits:  
Thermal shut down, overvoltage, out to GND, out to V , out to out short  
CC  
Operating supply voltage: V = 8.0~18 V (R = 4 )  
CC (opr) L  
Note 1: Since this device’s pins have a low withstanding voltage, please handle it with care.  
Note 2: Install the product correctly. Otherwise, it may result in break down, damage and/or degradation to the  
product or equipment.  
Note 3: These protection functions are intended to avoid some output short circuits or other abnormal conditions  
temporarily. These protect functions do not warrant to prevent the IC from being damaged.  
In case of the product would be operated with exceeded guaranteed operating ranges, these protection  
features may not operate and some output short circuits may result in the IC being damaged.  
Note 4: The protection circuit may operate not correctly in case of the use of large phase-shift type speaker.  
Therefore, it should be confirmed that there is no problem on actual evaluation or mass-production board.  
Especially, it is necessary to be ware such a behavior when the large phase-shift type 2ohm load, which is  
a kind of sub-woofer for example, is connected to this IC, though such kind of speaker use is not  
recommended.  
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TB2921HQ  
Block Diagram  
+B  
C3  
C5  
C2  
C1  
10  
1
6
20  
Ripple TAB  
Vcc2 Vcc1  
11  
Out1(+)  
PW-GND1  
Out1(-)  
9
8
7
RL  
IN1  
IN2  
C1  
C1  
12  
Out2(+)  
PW-GND2  
Out2(-)  
5
2
3
RL  
RL  
RL  
Pre-GND  
IN3  
13  
15  
16  
Out3(+)  
PW-GND3  
Out3(-)  
17  
18  
19  
AC  
GND  
C6  
IN4  
14  
Out4(+)  
PW-GND4  
Out4(-)  
21  
24  
23  
C1  
5V  
Play  
4 Stby  
R1  
C4  
.
25  
Mute  
22  
H-SW/Off-set
Mute  
Note5: Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for  
explanatory purpose.  
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TB2921HQ  
Caution and Application Method  
(Description is made only on the single channel.)  
1. Standby SW Function (pin 4)  
By means of controlling pin 4 (standby pin) to  
High and Low, the power supply can be set to ON  
and OFF. The threshold voltage of pin 4 is set at  
V
CC  
about 3V  
(typ.), and the power supply current is  
BE  
ON  
Power  
10 kΩ  
4
about 2 µA (typ.) in the standby state.  
2 V  
BE  
OFF  
to BIAS  
CUTTING CIRCUIT  
Control Voltage of Pin 4: V  
SB  
Standby  
Power  
V
(V)  
SB  
ON  
OFF  
ON  
0~0.5  
OFF  
2.5~6 V  
Figure 1 With pin 4 set to High,  
Power is turned ON  
When changing the time constant of pin 4, check the  
pop noise.  
Advantage of Standby SW  
(1) Since V  
CC  
can directly be controlled to ON or OFF by the microcomputer, the switching relay can be  
omitted.  
(2) Since the control current is microscopic, the switching relay of small current capacity is satisfactory  
for switching.  
Relay  
Large current capacity switch  
Battery  
Battery  
From  
microcomputer  
V
V
CC  
CC  
– Conventional Method –  
From microcomputer  
Small current capacity switch  
Battery  
Battery  
Stand-By  
V
Stand-By V  
CC  
CC  
– Standby Switch Method –  
Figure 2  
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TB2921HQ  
2. Muting Function (pin 22)  
Audio muting function is enabled when pin 22 is Low. When the time constant of the muting function is  
determined by R and C it should take into account the pop noise. The pop noise, which is generated when  
,
1
4
the power or muting function is turned ON/OFF, will vary according to the time constant. (Refer to Figure 3  
and Figure 4.)  
The pin 22 is designed to operate off 5 V so that the outside pull-up resistor R is determined on the basic  
1
of this value:  
ex) When control voltage is changed in to 3.3 V from 5 V.  
3.3 V/5 V × 47 k = 31 k  
Additionally, as the V  
is rapidly falling, the IC internal low voltage muting operates to eliminate the  
CC  
large pop noise basically. The low voltage muting circuit pull 200 µA current into the IC so that the effect of  
the internal low voltage muting does not become enough if the R is too small value.  
1
To obtain enough operation of the internal low voltage muting, a series resistor, R at pin 22 should be 47  
1
kor more.  
20  
V
= 13.2 V  
CC  
f = 1kHz  
= 4 Ω  
ATT – V  
MUTE  
0
R
L
V
= 20dBm  
OUT  
20  
40  
60  
5 V  
80  
100  
120  
1 kΩ  
22  
R
1
C
4
Mute ON/OFF  
control  
0
0.5  
1
1.5  
2
2.5  
3
Pin 22 control voltage: V  
(V)  
MUTE  
Figure 3 Muting Function  
Figure 4 Mute Attenuation V  
(V)  
MUTE  
3. High-Side Switch  
Pin 25 of this device is used in concerned with VCC as a high-side switch which operates with the standby  
pin. Thus, both the power amp IC and the connected external unit (the hideaway unit) can be turned  
ON/OFF by using of the standby switch.  
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TB2921HQ  
4. Off-set detection function  
It is possible to use this function by setting the voltage of Pin 22 higher than 8V.  
In case of Appearing output offset voltage by Generating a Large Leakage Current on the input Capacitor etc.  
V
DC Voltage (+) Amp (at leak) (R  
)
S1  
V
(normal DC voltage)  
CC/2  
Leak or short  
V
ref  
DC Voltage () Amp (at short) (R  
)
S2  
+
R
S1  
Offset voltage (at leak or short)  
Elec. vol  
5 V  
V
V
bias  
ref/2  
25  
L.P.F.  
To CPU  
A
B
Figure 6 Application and Detection Mechanism  
Threshold level (R  
)
)
S1  
(+) Amp output  
V
CC/2  
Threshold level (R  
S2  
GND  
t
t
t
Voltage of  
point (A)  
GND  
Voltage of  
point (B)  
GND  
R
S2  
Figure 7 Wave Form  
5. Pop Noise Suppression  
Since the AC-GND pin (pin 16) is used as the NF pin for all amps, the ratio between the input  
capacitance (C1) and the AC-to-GND capacitance (C6) should be 1:4.  
Also, if the power is turned OFF before the C1 and C6 batteries have been completely charged, pop noise  
will be generated because of the DC input unbalance.  
To counteract the noise, it is recommended that a longer charging time be used for C2 as well as for C1  
and C6. Note that the time which audio output takes to start will be longer, since the C2 makes the muting  
time (the time from when the power is turned ON to when audio output starts) is fix.  
The pop noise which is generated when the muting function is turned ON/OFF will vary according to the  
time constant of C4.The greater the capacitance, the lower the pop noise. Note that the time from when the  
mute control signal is applied to C4 to when the muting function is turned ON/OFF will be longer.  
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TB2921HQ  
6. External Component Constants  
Effect  
Lower than recommended  
Component Recommended  
Purpose  
Notes  
Higher than recommended  
value  
Name  
Value  
value  
Pop noise is  
Cut-off frequency is  
increased  
C1  
C2  
C3  
0.22 µF  
10 µF  
To eliminate DC  
To reduce ripple  
Cut-off frequency is reduced generated when  
is ON  
V
CC  
Powering ON/OFF takes  
longer  
Powering ON/OFF is faster  
To provide  
sufficient  
0.1 µF  
Reduces noise and provides sufficient oscillation margin  
oscillation margin  
High pop noise. Duration until Low pop noise. Duration until  
To reduce pop  
noise  
C4  
C5  
C6  
1 µF  
3900 µF  
1 µF  
muting function is turned  
ON/OFF is short  
muting function is turned  
ON/OFF is long  
Ripple filter  
Power supply ripple filtering  
Pop noise is  
generated when  
NF for all outputs Pop noise is suppressed when C1:C6 = 1:4  
V
is ON  
CC  
Note6: If recommended value is not used.  
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TB2921HQ  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Symbol  
Rating  
Unit  
Peak supply voltage (0.2 s)  
DC supply voltage  
V
50  
25  
V
V
V
CC (surge)  
V
CC (DC)  
CC (opr)  
O (peak)  
Operation supply voltage  
Output current (peak) RL=4Ω  
Output current (peak) RL=2Ω  
Power dissipation  
V
18  
I
9
A
I
6.3  
O (peak)-2  
(Note 6)  
P
125  
W
°C  
°C  
D
Operation temperature  
Storage temperature  
T
opr  
40~85  
55~150  
T
stg  
Note 7: Package thermal resistance θ = 1°C/W (typ.) (Ta = 25°C, with infinite heat sink)  
j-T  
The absolute maximum ratings of a semiconductor device are a set of specified parameter values, which must not  
be exceeded during operation, even for an instant. If any of these rating would be exceeded during operation, the  
device electrical characteristics may be irreparably altered and the reliability and lifetime of the device can no  
longer be guaranteed. Moreover, these operations with exceeded ratings may cause break down, damage and/or  
degradation to any other equipment. Applications using the device should be designed such that each maximum  
rating will never be exceeded in any operating conditions. Before using, creating and/or producing designs, refer to  
and comply with the precautions and conditions set forth in this documents.  
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TB2921HQ  
Electrical Characteristics  
(unless otherwise specified, V = 13.2 V, f = 1 kHz, R = 4 , Ta = 25°C)  
CC  
L
Test  
Circuit  
Characteristics  
Quiescent current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
mA  
I
V
V
V
V
= 0  
200  
50  
400  
CCQ  
IN  
P
P
MAX (1)  
MAX (2)  
= 15.2 V, max POWER  
= 13.7 V, max POWER  
= 14.4 V, RL =2Ω  
OUT  
OUT  
CC  
CC  
CC  
43  
Output power  
P
MAX (3)  
80  
OUT  
max POWER  
P
P
(1)  
(2)  
V
= 14.4 V, THD = 10%  
23  
29  
25  
OUT  
OUT  
CC  
THD = 10%  
Total harmonic distortion  
Voltage gain  
THD  
P
V
V
= 5 W  
0.015  
26  
0.15  
27  
%
OUT  
OUT  
OUT  
G
V
= 0.775 Vrms  
= 0.775 Vrms  
25  
dB  
dB  
Voltage gain ratio  
G  
1.0  
0
1.0  
V
V
(1)  
Rg = 0 , DIN45405  
60  
NO  
NO  
Output noise voltage  
µVrms  
V
(2)  
Rg = 0 , BW = 20 Hz~20 kHz  
50  
70  
f
V
= 100 Hz, R = 620 Ω  
g
rip  
Ripple rejection ratio  
Cross talk  
R.R.  
C.T.  
50  
60  
70  
dB  
dB  
= 0.775 Vrms  
rip  
R
V
= 620 Ω  
g
= 0.775 Vrms  
OUT  
Output offset voltage  
Input resistance  
V
100  
0
100  
mV  
kΩ  
µA  
OFFSET  
R
90  
2
IN  
Standby current  
I
Standby condition  
POWER: ON  
POWER: OFF  
MUTE: OFF  
10  
SB  
V
H
L
2.5  
0
6.0  
0.5  
6.0  
0.5  
SB  
Standby control voltage  
V
V
SB  
V
H
2.5  
0
M
Mute control voltage  
Mute attenuation  
V
V
L
MUTE: ON, R = 47 kΩ  
M
1
MUTE: ON  
ATT M  
80  
90  
dB  
V
= 7.75 VrmsMute: OFF  
OUT  
High-Side Switch and Offset detection  
Output current  
I
400  
mA  
V
O
Difference voltage between V  
output  
and  
CC  
V  
I
= 400 mA, +B = 9.6 V  
O
0.25  
0.6  
o
Rpull-up = 47 k, +V = 5.0V  
Based on output DC voltage  
Detection threshold voltage  
Voff-set  
±2.5  
±3.0  
±3.5  
V
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2006-05-25  
TB2921HQ  
Test Circuit  
+B  
C3:0.1uF  
C5:3900uF  
20  
C2:10uF  
C1:0.22uF  
10  
1
6
Ripple TAB  
Vcc2 Vcc1  
11  
Out1(+)  
PW-GND1  
Out1(-)  
9
8
7
RL=4ohm  
IN1  
IN2  
C1:0.22uF  
12  
Out2(+)  
PW-GND2  
Out2(-)  
5
2
3
RL=4ohm  
RL=4ohm  
RL=4ohm  
Pre-GND  
IN3  
13  
15  
16  
Out3(+)  
PW-GND3  
Out3(-)  
17  
18  
19  
C1:0.22uF  
C6:1uF  
AC  
GND  
IN4  
14  
Out4(+)  
PW-GND4  
Out4(-)  
21  
24  
23  
C1:0.22uF  
5V  
Play  
4 Stby  
R1:47k  
Ω
.
25  
Mute  
22  
H-SW/Offset
Mute  
C4:1uF  
Components in the test circuits are only used to obtain and confirm the device characteristics.  
These components and circuits do not warrant to prevent the application equipment from malfunction or failure.  
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2006-05-25  
TB2921HQ  
Package Dimensions  
Weight: 7.7 g (typ.)  
10  
2006-05-25  
TB2921HQ  
About solderability, following conditions were confirmed  
Solderability  
(1) Use of Sn-37Pb solder Bath  
·
·
·
·
solder bath temperature = 230°C  
dipping time = 5 seconds  
the number of times = once  
use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
·
·
·
·
solder bath temperature = 245°C  
dipping time = 5 seconds  
the number of times = once  
use of R-type flux  
RESTRICTIONS ON PRODUCT USE  
030619EBF  
The information contained herein is subject to change without notice.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc..  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk.  
The products described in this document are subject to the foreign exchange and foreign trade laws.  
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced  
and sold, under any law and regulations.  
This product generates heat during normal operation. However, substandard performance or malfunction may  
cause the product and its peripherals to reach abnormally high temperatures.  
The product is often the final stage (the external output stage) of a circuit. Substandard performance or  
malfunction of the destination device to which the circuit supplies output may cause damage to the circuit or to the  
product.  
11  
2006-05-25  

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