TB62737FUG [TOSHIBA]
IC SWITCHING CONTROLLER, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 0.95 MM PITCH, LEAD FREE, PLASTIC, SSOP-6, Switching Regulator or Controller;型号: | TB62737FUG |
厂家: | TOSHIBA |
描述: | IC SWITCHING CONTROLLER, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 0.95 MM PITCH, LEAD FREE, PLASTIC, SSOP-6, Switching Regulator or Controller 开关 光电二极管 |
文件: | 总22页 (文件大小:470K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TB62737FUG
TOSHIBA BiCD Digital Integrated Circuit Silicon Monolithic
TB62737FUG
Step-up Type DC/DC Converter for White LED
The TB62737FUG is a high efficient step-up type DC/DC converter
specially designed for constant current driving of White LED.
This IC can drive 2-6 white LEDs connected series using a Li-ion
battery.
This IC contains N-ch MOS-FET Transistor for Coil-Switching, and
LED Current (I ) is set with an external resistor.
F
This IC is especially for driving back light white LEDs in LCD of
PDA, Cellular Phone, or Handy Terminal Equipment.
The suffix (G) appended to the part number represents a
Lead(Pb)-Free product.
Weight: 0.016 g (typ.)
Features
•
Brightness control function with changing drive current:
LED current I = 25% to 100% (analog input)
F
For the control in range of 25% or less, refer 6-page.
Can drive 2-6 white LEDs connected series
Built-in over voltage detection circuit:
•
•
Protection Voltage: OVD pin =22V (TYP.)
•
Variable LED current I is set with a external resistor:
F
20 mA (typ.) @R
= 16 Ω
SENS
•
•
•
•
Output power: Available for 400 mW LED loading
High efficiency: 87% @maximum (using recommended external parts)
IC package: SSOP6-P-0.95B
Switching frequency: 1.1 MHz (typ.)
1
2006-06-14
TB62737FUG
Block Diagram
SW
4
OVD
2
Over voltage
detection
V
3
IN
Off time
control
mono multi
Reference
mono multi
CTL
AMP.
Level
detect
6
FB
Error
AMP.
CTL
AMP.
SHDN
1
5
GND
Pin Assignment (top view)
SHDN
OVD
1
2
3
6
FB
5
4
GND
SW
V
IN
Note: This IC could be destroyed in some case if amounted in 180° inverse direction.
Please be careful about IC direction in mounting.
Pin Function
Pin No.
Symbol
SHDN
Function Description
Voltage-input terminal for IC-enable/setting LED-I .
F
0 V to 0.5 V: Shutdown (PS) mode, IC operation is disabled.
1
1.0 V to 2.5 V: I = 25% to 100%
F
Over 2.5 V: I = 100%
F
I
adjustment with PWM input signal is also available.
F
Over voltage detection terminal.
2
OVD
IC switching operation is disabled with detection over voltage.
If the voltage returns to detection level or less, operation is enabled again.
Supply voltage input terminal. (2.8 V to 5.5 V)
Switch terminal for DC/DC converter. Nch MOSFET built-in.
Ground terminal.
3
4
5
6
V
IN
SW
GND
FB
LED I setting resistor connecting terminal.
F
2
2006-06-14
TB62737FUG
I/O Equivalent Pin Circuits
1. SHDN Terminal
2. OVD Terminal
V
1 k
IN
OVD
2
50 k
SHDN
1
20 k
3. V Terminal to GND Terminal
4. SW Terminal
IN
V
SW
3
4
IN
GND
5
5. FB Terminal
V
IN
FB
6
20 k
5 k
3
2006-06-14
TB62737FUG
Setting of External Capacitor
In case not using PWM signal to SHDN terminal for brightness control, recommended values are
= Over 2.2 (µF), C = Over 1.0 (µF)
C
C
1
2
In case with PWM signal to SHDN terminal for brightness control, recommended values are
= Over 4.7 (µF), C = Under 0.1 (µF).
1
2
The recommended capacitor values depend on the Brightness Control Method.
<Please refer the next page or later>
The capacitor value must be considered for gain enough accuracy of brightness with reduction of noise from Input
current changing.
Setting of External Inductor Size
Please select the inductor size with referring this table corresponding to each number of LEDs.
Recommendation
LEDs
Indictor Size
Note
2
3
4
5
6
4.7 µH
LED current I = 20 mA
6.8 µH
8.1 µH
10 µH
F
LED Current IF Setting
The resistance between the FB pin and GND, RSENS (Ω) is the resistance for the setting the output current.
Depending on the resistance value, it is possible to set the average output current Io (mA).
The average output current Io (mA) can be approximated with the following equation:
I
= (325 [mV]/RSENS [Ω])
F
The current value error is ± 5%.
Protection in LED Opened Condition
The operation with OVD terminal is available for the protection in case LED Circuit opened.
Please see the example of application circuit.
If load of LED is detached, Nch MOS switching operation is disabled with detection of boost circuit voltage.
4
2006-06-14
TB62737FUG
Current Dimming Control
Recommended Brightness Control Circuits are 5 types.
1) Input analog voltage to SHDN terminal
I can be adjusted in range of 25% to 100% after set with external resistor connected RSENS terminal.
F
Linearity error in V-A Conversion is within +/−10%.
SHDN Voltage
Valuable Rate
VSHDN = 0 V to 0.5 V VSHDN = 1 V to 2.5 V
VSHDN > 2.5 V
Note
I
0
25 to 100
100
Unit: %
F
Current variable due to SHDN pin
Vin = 3.0 V
100
80
60
40
20
0
25
20
15
10
5
I
F
I
F
variable rate
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
VSHDN (V)
5
2006-06-14
TB62737FUG
2) Input PWM signal to SHDN terminal
I can be adjusted with PWM signal by inputting it to SHDN terminal.
F
[Notice]
<<Minimum ON-time of PWM signal input>>
•
•
Set the minimum ON-time or OFF-time 33 µs or more in inputting the PWM signal.
Set the Duty ratio satisfying the condition above.
Ex) In case PWM Frequency is 1 kHz,
1 kHz is 1 ms (PWM width = 100%) and it takes 10 µs per 1%.
To set the pulse width 33 µs or more, necessary ON-or-OFF-time is calculated below.
33 µs ÷ 10 µs = 3.3% (Under the condition that 10 µs equals 1%.)
Finally, the Duty Ratio can be set in range of 3.3% to 96.7%.
Set ON-time
33 µs or more = 3.3%
Available Duty Ratio
(3.3% to 96.7%)
1 ms (1 kHz) = 100%
Set OFF-time
33 µs or more = 3.3%
<<PWM signal frequency>>
•
The recommended PWM signal frequency is from 100 Hz to 10 kHz. There is a possibility to arise the
audible frequency in mounting to the board because it is within the auditory area.
<<Constant number of external condenser>>
•
To reduce the fluctuation of input current and increase the accuracy of brightness, the values that C =
1
4.7 (µF) or more , C = 0.1 (µF) or less are recommended.
2
•
When the PWM signal is off, the time to drain C of charge depends on the constant number. And so,
2
the actual value is little different from the theoretical value.
<<PWM input signal>>
•
Set the amplitude of PWM signal within the range of SHDN terminal specification.
<<Rush current in inputting>>
•
In case dimming by inputting the PWM signal to the SHDN terminal, this IC turns on and off
repeatedly.
And the rush current, which provides the charge to C , arises in turning on. Take care in selecting the
2
condenser.
<<Current value in Control with PWM: Ideal Equation>>
325[mV]× ON Duty[%]
[mA]=
I
F
RSENS[Ω]
6
2006-06-14
TB62737FUG
<Reference Data>
Condition: V = 3.6 V, L = 6.8 µH, 4LEDs, RSENS = 16 mΩ @Io = 20 mA
IN
(1) C = 4.7 µF, C = 0.1 µF
1
2
Wave Form
TB62737FUG
ON Duty width[%] V.S. Error with Ideal Value
25
20
15
10
5
SHDN
VOUT
500kHz
1kHz
2kHz
4kHz
8kHz
12kHz
I
IN
0
0
20
40
60
80
100
100
100
ON Duty width[%]
(2) C = 4.7 µF, C = 0.47 µF
1
2
Wave Form
TB62737FUG
ON Duty width[%] V.S. Error with Ideal Value
SHDN
VOUT
25
20
15
10
5
500kHz
1kHz
2kHz
4kHz
8kHz
12kHz
I
IN
0
0
20
40
60
80
ON Duty width[%]
(3) C = 4.7 µF, C = 1.0 µF
1
2
Wave Form
TB62737FUG
ON Duty width[%] V.S. Error with Ideal Value
SHDN
VOUT
25
20
15
10
5
500kHz
1kHz
2kHz
4kHz
8kHz
12kHz
I
IN
0
0
20
40
60
80
ON Duty width[%]
(4) C = 2.2 µF, C = 1.0 µF
1
2
Wave Form
TB62737FUG
ON Duty width[%] V.S. Error with Ideal Value
SHDN
VOUT
25
20
15
10
5
500kHz
1kHz
2kHz
4kHz
8kHz
I
12kHz
IN
0
0
20
40
60
80
100
ON Duty width[%]
7
2006-06-14
TB62737FUG
<Recommended application>
V
=
IN
2.8 to 5.5 V
6.8 µH
S-Di
V
SW
IN
SHDN
OVD
PWM signal
FB
GND
8
2006-06-14
TB62737FUG
3) Input analog voltage to FB terminal
I can be adjusted with Analog voltage input to FB terminal.
F
This method is without repeating IC ON/OFF, and no need to consider holding rash current.
[Notice]
•
LED current value goes over 100% of the current set with RSENS, if the input analog voltage is between 0
V to 325 mV (typ.).
(Reference data) Analog voltage = 0 to 2.2 V
About external parts value, please see recommended circuit.
Supply Voltage
(V)
Ratio with Setting
Current
No connect (OFF)
100%
116.0%
106.5%
95.4%
84.5%
73.6%
59.9%
48.4%
37.4%
26.6%
15.9%
5.8%
0
TB62737FUG
Analog Voltage Input to FB Terminal
0.2
0.4
0.6
0.8
1
140.0%
120.0%
100.0%
80.0%
60.0%
40.0%
20.0%
0.0%
1.2
1.4
1.6
1.8
2
0
0.5
1
1.5
Input Voltage
2
2.5
2.2
0.0%
<Recommended application>
V
=
IN
2.8 to 5.5 V
6.8 µH
S-Di
V
SW
IN
SHDN
OVD
16 kΩ
FB
GND
Analog DAC
9
2006-06-14
TB62737FUG
4) Input PWM signal with filtering to FB terminal
I can be adjusted with filtering PWM signal using RC filter indicated in recommended circuit, because the PWM
F
signal can be regard as analog voltage after filtering.
This method is without repeating IC ON/OFF, and no need to consider holding rash current.
[Notice]
•
LED current value goes over 100% of the current set with RSENS, if the input voltage after filtering is
between 0 V to 325 mV (typ.).
(Reference data) Voltage during PWM Signal-ON = 2 V
About external parts value, please see recommended circuit.
Supply Voltage
(V)
Ratio with Setting
Current
No connect (OFF)
100%
116.1%
105.3%
95.1%
84.8%
74.6%
64.0%
53.8%
43.7%
34.0%
24.2%
13.3%
0
TB62737FUG
Input PWM signal filtered with RC to the FB terminal
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
140.0%
120.0%
100.0%
80.0%
60.0%
40.0%
20.0%
0.0%
0%
20%
40%
60%
80%
100%
PWM Duty(%)
<Recommended application>
V
=
IN
2.8 to 5.5 V
6.8 µH
S-Di
V
SW
IN
SHDN
OVD
16 kΩ
FB
GND
PWM signal
10
2006-06-14
TB62737FUG
5) Input Logic signal
I can be adjusted with Logic signal input as indicated in recommended circuit.
F
The resistor connected the ON-State Nch MOS Drain and RSENS determines I .
F
Average of setting current Io (mA) is next, approximately.
I
= (325 [mV]/Sum of resistor value [Ω])
F
<Recommended application>
V
=
IN
2.8 to 5.5 V
6.8 µH
S-Di
V
SW
IN
SHDN
OVD
FB
GND
R1
R2
M1
M2
Logic signal
LED Current
M1
M2
325 [mV]
OFF
OFF
RSENS [Ω]
RSENS [Ω]×R1[Ω]
RSENS[Ω] + R1[Ω]
325 [mV] ×
325 [mV] ×
ON
OFF
ON
OFF
ON
RSENS [Ω]×R2[Ω]
RSENS [Ω] + R2[Ω]
RSENS [Ω]×R1[Ω]×R2[Ω]
RSENS [Ω]×R1[Ω] + RSENS [Ω]×R2[Ω] + R1[Ω]×R2[Ω]
325 [mV] ×
ON
11
2006-06-14
TB62737FUG
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Power supply voltage
Symbol
Rating
Unit
V
−0.3 to +6.0
V
V
V
IN
Input voltage
−0.3 to +V + 0.3
V
IN
SHDN
Switching terminal voltage
V
(SW)
−0.3 to 24
0.41 (device)
0.47 (on PCB) (Note)
300 (device)
260 (on PCB)
−40 to+85
o
Power dissipation
Thermal resistance
P
W
D
R
th (j-a)
°C/W
Operation temperature range
Storage temperature range
Maximum junction temperature
T
opr
°C
°C
°C
T
stg
−55 to+150
150
T
j
Note: Power Dissipation must be calculated with subtraction of 3.8 mW/°C from Absolute Maximum Rating with every
1°C if T is upper 25°C. (on PCB)
opr
Recommended Operating Condition (Ta = −40°C to 85°C if without notice)
Characteristics
Power supply voltage
Symbol
Test Condition
Min
Typ.
Max
5.5
Unit
V
⎯
⎯
⎯
2.8
2.7
0
⎯
⎯
⎯
⎯
V
V
IN
SHDN terminal “H” level input voltage
SHDN terminal “L” level input voltage
SHDN terminal input pulse width
V
V
V
IN
SHDNH
0.5
V
SHDNL
tpw
Both “H” and “L” pulse
33
⎯
µs
V
= 3.6 V, R
SENS
= 16 Ω
= 25°C
IN
4 White LEDs, T
LED current (average value)
I
⎯
20
⎯
mA
F1
opr
Electrical Characteristics (Ta = 25°C, VIN = 2.8 to 5.5V if without notice)
Characteristics
Power supply voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
⎯
2.8
⎯
⎯
2.7
0
⎯
0.9
0.5
⎯
5.5
1.5
1.0
V
mA
µA
V
IN
Operating consumption current
I
I
(On)
(Off)
V
V
= 3.6 V, RSENS = 16 Ω
IN
IN
IN
IN
Quiescent consumption current
= 3.6 V, VSHDN = 0 V
SHDN terminal “H” level input voltage
SHDN terminal “L” level input voltage
⎯
⎯
V
V
V
SHDNH
SHDNL
IN
⎯
0.5
V
Integrated MOS-Tr switching
frequency
f
V
= 3.6 V, VSHDN = 3.6 V
0.77
1.1
1.43
MHz
OSC
IN
Switching terminal protection voltage
Switching terminal current
V
(SW)
(SW)
(SW)
⎯
⎯
⎯
⎯
⎯
⎯
25
400
0.5
⎯
⎯
1
V
o
oz
oz
I
I
mA
µA
Switching terminal leakage current
V
= 3.6 V, RSENS = 16 Ω
= 25°C, L = 6.8 µH
IN
FB terminal feedback voltage (VFB)
FB terminal line regulation (VFB)
V
308
325
342
5
mV
%
FB
T
opr
V
V
= 3.6 V (typ.)
= 3.0 to 5.0 V
IN
IN
∆V
−5
⎯
FB
OVD terminal voltage
V
⎯
19
22
23.5
1
V
OVD
OVD terminal leakage current
I
V
= 16 V
⎯
0.5
µA
OVD
OVD
12
2006-06-14
TB62737FUG
1. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
S-Di
1
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
L
: CXLD120 series (NEO MAX CO.,Ltd.)
(Size: 2.5 mm × 3.0 mm × 1.2 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
1
V
SW
WLEDs
2 to 6
IN
SHDN
OVD
C
C
1
2
S-Di
FB
GND
WLEDs: NSCW215T (NICHIA Corp.)
RSENS: RK73B1ETBK (KOA Corp.)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7µH
5LED Drive, L=10µH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
Efficiency
I
I
F
F
Eff ciency
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8µH
6LED Drive, L=10µH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
Efficiency
F
F
Efficiency
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
IN
4LED Drive, L=6.8µH
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
82.60 to 88.46
82.69 to 87.78
80.73 to 86.22
80.73 to 87.28
79.78 to 85.55
86.29
85.95
83.05
83.45
81.15
I
Eicie
ff ncy
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.77
1.38
1.11
1.15
1.28
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.13
20.60
20.87
20.06
19.90
−3.50
−1.95
−1.75
−1.81
−1.95
* V
voltage in driving 5 or 6 LEDs must be lower
than OVD detection level. (V < 19 V)
OUT
OUT
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application's mass production design.
13
2006-06-14
TB62737FUG
2. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
S-Di
1
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: 1001AS series (TOKO, INC)
L
1
V
SW
WLEDs
2 to 6
IN
(Size: 3.6 mm × 3.6 mm × 1.2 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
OVD
C
C
1
2
S-Di
FB
GND
WLEDs: NSCW215T (NICHIA Corp.)
RSENS: RK73B1ETBK (KOA Corp.)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7µH
5LED Drive, L=10µH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
I
F
Eiiency
icie
ff ncy
F
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8µH
6LED Drive, L=10µH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
F
E
Efficiency
I
IOUT
F
E
Efficiency
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
4LED Drive, L=6.8µH
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
83.10 to 88.60
81.32 to 86.47
79.15 to 84.63
79.72 to 86.39
78.91 to 85.10
86.55
84.54
81.30
82.87
80.47
I
ic
ff iency
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.73
1.38
1.15
1.22
1.26
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.17
20.85
20.56
20.10
19.95
−3.32
−1.95
−1.79
−1.82
−1.94
* V
voltage in driving 5 or 6 LEDs must be lower
than OVD detection level. (V < 19 V)
OUT
OUT
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application's mass production design.
14
2006-06-14
TB62737FUG
3. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
S-Di
1
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: LQH2M series
L
1
V
SW
WLEDs
2 to 6
IN
(Murata Manufacturing Co.,Ltd.)
(Size: 2.0 mm × 1.6 mm × 0.95 mm)
: C2012JB1E105K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
OVD
C
C
1
2
FB
GND
S-Di
WLEDs: NSCW215T (NICHIA Corp.)
RSENS: RK73B1ETBK (KOA Corp.)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7µH
5LED Drive, L=10µH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
I
F
EEiciecy
I
I
F
Eficiency
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8µH
6LED Drive, L=10µH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
II
F
Efficiency
I
ffi ency
F
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
IN
4LED Drive, L=6.8µH
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
82.37 to 88.70
80.19 to 86.55
78.11 to 84.54
74.79 to 84.94
74.14 to 83.47
86.38
84.12
80.16
79.94
77.17
I
Efficiency
I
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.69
2.17
1.01
1.25
1.07
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.19
20.90
20.63
20.09
19.93
−3.26
−1.87
−1.78
−1.88
−1.99
* V
voltage in driving 5 or 6 LEDs must be lower
than OVD detection level. (V < 19 V)
OUT
OUT
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application's mass production design.
15
2006-06-14
TB62737FUG
4. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
S-Di
1
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: VLF3010A series (TDK Corp.)
L
1
V
SW
WLEDs
2 to 6
IN
(Size: 3.0 mm × 3.0 mm × 1.0 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
OVD
C
C
1
2
S-Di
FB
GND
WLEDs: NSCW215T (NICHIA Corp.)
RSENS: RK73B1ETBK (KOA Corp.)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7µH
5LED Drive, L=10µH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
II
F
Efficiency
I
I
F
Efficiency
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8µH
6LED Drive, L=10µH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
F
Efficiency
II
F
Efficiency
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
4LED Drive, L=6.8µH
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
79.85 to 86.97
80.19 to 85.32
78.77 to 83.60
79.72 to 86.39
78.91 to 85.10
84.02
83.39
80.69
82.87
80.49
I
Efficiency
I
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.67
1.33
1.11
1.22
1.26
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.19
20.89
20.64
20.10
19.95
−3.08
−1.86
−1.68
−1.82
−1.94
* V
voltage in driving 5 or 6 LEDs must be lower
than OVD detection level. (V < 19 V)
OUT
OUT
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application's mass production design.
16
2006-06-14
TB62737FUG
5. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
S-Di
1
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: 32R51 (KOA Corp.)
L
1
V
SW
WLEDs
2 to 4
IN
(Size: 3.2 mm × 2.5 mm × 0.6 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
OVD
C
C
1
2
S-Di
FB
GND
WLEDs: NSCW215T (NICHIA Corp.)
RSENS: RK73B1ETBK (KOA Corp.)
Input Voltage - Efficiency/Output Current
2LED Drive, L=5.1μH
Input Voltage - Efficiency/Output Current
3LED Drive, L=5.1μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
F
I
F
Efficiency
Efficiency
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
<Measurement Data>
Input Voltage - Efficiency/Output Current
4LED Drive, L=5.1μH
Efficiency in the range of V = 2.8 to 5.5 V
IN
Efficiency (%)
Average Efficiency (%)
35
30
25
20
15
10
100
90
80
70
60
50
2 LEDs
3 LEDs
4 LEDs
83.08 to 89.23
79.02 to 86.30
75.75 to 83.83
86.73
83.52
80.78
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
I
I
F
Efficiency
Tolerance (%)
Output Current (mA)
V
= 3.6 V
IN
Min
Max
4.02
2.94
2.65
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
2 LEDs
3 LEDs
4 LEDs
21.06
20.57
20.22
−2.46
−2.39
−2.28
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application's mass production design.
17
2006-06-14
TB62737FUG
Package Dimensions
Weight: 0.016 g (typ.)
18
2006-06-14
TB62737FUG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed
its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can
lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown,
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
19
2006-06-14
TB62737FUG
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load
(BTL) connection type IC that inputs output DC voltage to a speaker directly.
20
2006-06-14
TB62737FUG
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device
so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time
and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation
design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition,
please design the device taking into considerate the effect of IC heat radiation with peripheral
components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply
is small, the device’s motor power supply and output pins might be exposed to conditions beyond
absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in
system design.
21
2006-06-14
TB62737FUG
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time = 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE
060116EBA
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from
its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
22
2006-06-14
相关型号:
TB62752BFUG
IC SWITCHING REGULATOR, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 0.95 MM PITCH, LEAD FREE, PLASTIC, SSOP-6, Switching Regulator or Controller
TOSHIBA
TB62754AFNG
IC SWITCHING REGULATOR, 2280 kHz SWITCHING FREQ-MAX, PDSO20, 0.225 INCH, 0.65 MM PITCH, LEAD FREE, PLASTIC, SSOP-20, Switching Regulator or Controller
TOSHIBA
TB62755FPG
IC 1.5 A SWITCHING REGULATOR, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, 0.50 MM PITCH, PLASTIC, SON-6, Switching Regulator or Controller
TOSHIBA
TB62757FUG
IC SWITCHING REGULATOR, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 0.95 MM, PITCH, LEAD FREE, PLASTIC, SSOP-6, Switching Regulator or Controller
TOSHIBA
©2020 ICPDF网 联系我们和版权申明