TB62756FUG(EL) [TOSHIBA]
IC,LASER DIODE/LED DRIVER,TSOP,6PIN,PLASTIC;
| 型号： | TB62756FUG(EL) |
| 厂家： | 
TOSHIBA |
| 描述： | IC,LASER DIODE/LED DRIVER,TSOP,6PIN,PLASTIC 驱动 光电二极管 |
| 文件： | 总16页 (文件大小：297K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB62756FUG
TOSHIBA BiCD Digital Integrated Circuit Silicon Monolithic
TB62756FUG
Step-up Type DC-DC Converter for White LEDs
The TB62756FUG is a high efficiency step-up type DC-DC
converter that is designed especially for use as a constant current
driver of white LEDs.
It is possible to drive 2 to 6 white LEDs connected in series
using a lithium-ion battery.
This IC incorporates an N-ch MOSFET required for switching
of an external inductor.
The forward current of the LEDs can be controlled by an
external resistor.
This IC is best suited for use as a driver of white LED back
lighting in color LCDs in PDAs, cellular phones and handy
terminal devices.
Weight: 0.016 g (typ.)
Features
•
•
•
•
•
•
Can drive 2 to 6 white LEDs connected series
Variable LED current I is set with a external resistor: 20 mA (typ.) @R
F
= 16 Ω
SENS
Output power: Available for 400 mW LED loading
High efficiency: 87% @Maximum (Recommended parts)
IC package: SSOP6-P-0.95B (SOT23-6)
Switching frequency: 1.1 MHz (typ.)
1
2010-06-27
TB62756FUG
Block Diagram
SW
4
NC
2
V
3
IN
Monostable
multivibrator
for
Monostable
multivibrator
for
reference
off time control
CTL
AMP.
Circuit
on/off
6 FB
Error
AMP.
SHDN
1
5
GND
Pin Assignment (top view)
1
2
3
6
5
4
SHDN
(NC)
FB
GND
SW
V
IN
Note 1: The IC may break if mounted 180 degrees in reverse. Ensure the device is correctly orientated before
assembly.
Pin Functions
No.
1
Symbol
Function
Input pin for IC ON/OFF control.
SHDN
NC
SHDN = H → Operation Mode, SHDN = L → Shutdown Mode (IC shutdown)
Please do not open this terminal.
2
3
4
5
6
No connection or connected to GND.
(Note 2)
V
Supply voltage pin. Supply voltage range: 2.8 V to 5.5 V
DC-DC converter switching pin – switch incorporates N-ch MOSFET.
Ground pin.
IN
SW
GND
FB
LED I setting resistor connecting terminal.
F
Note 2: The NC terminal is not connected to the internal circuit, so placing it on another terminal pattern does not
represent a problem.
2
2010-06-27
TB62756FUG
I/O Equivalent Pin Circuits
1.
Pin
2. NC Pin
SHDN
V
NC
2
IN
SHDN
1
The NC pin is not connected to any internal
circuit, so placing it on another terminal
pattern does not present a problem.
3. SW Pin
4. FB Pin
SW
V
IN
4
FB
6
3
2010-06-27
TB62756FUG
Application Circuit Example
V
4.7 to 10 μH
IN
NC
2
SW
4
3
V
IN
Monostable
multivibrator
for
Monostable
multivibrator
for
reference
off time control
CTL
AMP.
500 Ω
Circuit
on/off
6
Error
FB
AMP.
SHDN
PWM
1
5
GND
Protection at the Time of LED Opening
The zener diode in the application circuit example is necessary for the provision of over-voltage protection in the
event the LED becomes open. As the IC does not incorporate a voltage protection circuit, it is strongly advised that
a zener diode be connected.
The zener diode should satisfy the following conditions:
i)
Less than maximum output voltage of 24 V
ii) Greater than the total series LED V
f
iii) Less than the maximum output capacitance C .
2
Moreover, by connecting a protection circuit such as R
in the figure below, it is possible to control the output
ZD
current I
when the LED becomes open, and to use a zener diode of lower tolerance.
ZD
An example of I
control by R
connection. (R
= 16 Ω)
ZD
ZD
SENS
S-Di
R
ZD
(Ω)
I
(mA)
1 μF
2
ZD
SW
I
I
F
ZD
C
500
100
0.6 (typ.)
2.8 (typ.)
R
ZD
FB
GND
R
SENS
In order to avoid adverse effects on driver characteristics,
Toshiba recommends a resistance of 500 Ω or less.
Protection Circuit Application
4
2010-06-27
TB62756FUG
Output-side Capacitor Setting
It is recommended that the value of C be equal to, or greater than 1.0 (μF).
2
External Inductor Size Setting
For each number of LEDs, the selected inductance should be greater than the value indicated in the table below.
Number of LEDs
Inductance (Unit: μH)
Note
2
3
4
5
6
4.7
6.8
10
I
F
= 20 mA
Control of I
F
The resistance R
is connected between the FB pin and the GND pin.
SENS
The average current is controlled by the R
value, and calculated using the following equation:
SENS
I (mA) = [325 mV/R
(Ω)]
F
SENS
Margin of error is ±5%.
Dimming using PWM Signal Input
A dimming function can also by applied using a PWM signal.
[Notes]
•
•
•
When using a PWM signal, the minimum pulse width of the PWM should be greater than 33 μs.
Duty ratio of PWM function should be set at 10% to 90%.
The recommended PWM frequency should be 100 Hz to 10 kHz.
<<Output current is calculated using the following equation>>
325 [mV]× ON Duty [%]
(mA) =
I
F
[Ω]
R
SENS
5
2010-06-27
TB62756FUG
Absolute Maximum Ratings (Ta = 25°C, unless otherwise specified)
Characteristics
Power supply voltage
Symbol
Ratings
Unit
V
−0.3 to 6.0
V
V
V
IN
Input voltage
−0.3 to V + 0.3 (Note 1)
V
SHDN
IN
Switching pin voltage
V
−0.3 to 24
0.41 (IC only)
O (SW)
Power dissipation
Thermal resistance
P
W
D
0.47 (IC mounted on PCB) (Note 2)
300 (IC only)
R
th (j-a)
°C/W
260 (IC mounted on PCB)
−40 to 85
Operating temperature range
Storage temperature
T
°C
°C
°C
opr
T
−55 to 150
stg
Maximum junction temperature
T
150
j
Note 1: However, do not exceed 6 V.
Note 2: Power dissipation is reduced by 3.8 mW/°C from the maximum rating for every 1°C exceeding the ambient
temperature of 25°C (when the IC is mounted on a PCB).
Recommended Operating Condition (Ta = −40 to 85°C, unless otherwise specified)
Characteristics
Power supply voltage
Symbol
Test Conditions
Min
Typ.
Max
Unit
V
⎯
2.8
33
⎯
⎯
5.5
V
IN
SHDN pin input pulse width
tpw
“H”, “L” duty width
⎯
μs
V
= 3.6 V, R
= 16 Ω
IN
SENS
LED current (Average value)
I
F1
⎯
20
⎯
mA
4 white LEDs, Ta = 25°C
Electrical Characteristics (Ta = 25°C, V = 2.8 to 5.5 V, unless otherwise specified)
IN
Characteristics
Symbol
Test Conditions
Min
Typ.
Max
Unit
Operating consumption current
Standby consumption current
SHDN pin H level input voltage
SHDN pin L level input voltage
SHDN pin current
I
V
V
= 3.6 V, R
SENS
= 16 Ω
= 0 V
⎯
⎯
0.9
0.5
⎯
⎯
0
1.5
1.0
mA
μA
V
IN (ON)
IN
IN
I
= 3.6 V,
V
IN (OFF)
SHDN
⎯
1.3
0
V
V
IN
SHDNH
SHDNL
⎯
0.4
10
V
V
I
V
V
= 3.6 V,
= 3.6 V,
= 3.6 V or 0 V
= 3.6 V
−10
μA
V
V
SHDN
IN
IN
SHDN
Integrated MOS-Tr switching
frequency
f
0.77
1.1
1.43
MHz
OSC
SHDN
Switching pin protection voltage
Switching pin current
V
⎯
⎯
⎯
⎯
⎯
⎯
25
400
0.5
⎯
⎯
1
V
O (SW)
OZ (SW)
OZ (SW)
I
I
mA
μA
Switching pin leakage current
V
= 3.6 V, R = 16 Ω
SENS
IN
FB pin feedback voltage
FB pin line regulation
V
308
325
342
5
mV
%
FB
L = 4.7 μH
V
V
= 3.6 V center
IN
IN
ΔV
−5
⎯
FB
= 3.0 V to 5.0 V
6
2010-06-27
TB62756FUG
1. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
1
S-Di
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
L
1
: CXLD120 series (NEO MAX CO., Ltd.)
(Size: 2.5 mm × 3.0 mm × 1.2 mm)
: C2012JB1E225K (TDK Corp.)
V
SW
FB
WLEDs
2 to 6
IN
SHDN
C
C
1
: C2012JB1E105K (TDK Corp.)
2
S-Di
: CUS02 1 A/30 V (TOSHIBA Corp.)
GND
WLEDs: NSCW215T (NICHIA Corp.)
Input Voltage - Efficiency/Output Current
Input Voltage - Efficiency/Output Current
2LED Drive, L=4.7μH
5LED Drive, L=10μH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
Efficiency
I
I
Efficiency
F
F
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage - Efficiency/Output Current
Input Voltage - Efficiency/Output Current
3LED Drive, L=6.8μH
6LED Drive, L=10μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
I
Efficiency
F
F
Efficiency
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage - Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
IN
4LED Drive, L=6.8μH
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
82.60 to 88.46
82.69 to 87.78
80.73 to 86.22
80.73 to 87.28
79.78 to 85.55
86.29
85.95
83.05
83.45
81.15
I
I
Efficiency
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.77
1.38
1.11
1.15
1.28
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.13
20.60
20.87
20.06
19.90
−3.50
−1.95
−1.75
−1.81
−1.95
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application’s mass production design.
7
2010-06-27
TB62756FUG
2. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
1
S-Di
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: 1001AS series (TOKO, INC)
L
1
V
SW
FB
WLEDs
2 to 6
IN
(Size: 3.6 mm × 3.6 mm × 1.2 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
C
C
1
2
S-Di
GND
WLEDs: NSCW215T (NICHIA Corp.)
Input Voltage - Efficiency/Output Current
Input Voltage - Efficiency/Output Current
2LED Drive, L=4.7μH
5LED Drive, L=10μH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
Efficiency
F
I
I
F
Efficiency
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage - Efficiency/Output Current
Input Voltage - Efficiency/Output Current
3LED Drive, L=6.8μH
6LED Drive, L=10μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
F
Efficiency
I
Efficiency
I
F
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage - Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
4LED Drive, L=6.8μH
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
83.10 to 88.60
81.32 to 86.47
79.15 to 84.63
79.72 to 86.39
78.91 to 85.10
86.55
84.54
81.30
82.87
80.47
I
I
F
Efficiency
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.73
1.38
1.15
1.22
1.26
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.17
20.85
20.56
20.10
19.95
−3.32
−1.95
−1.79
−1.82
−1.94
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application’s mass production design.
8
2010-06-27
TB62756FUG
3. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
1
S-Di
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: LQH2M series
L
1
V
SW
FB
WLEDs
2 to 6
IN
(Murata Manufacturing Co., Ltd.)
(Size: 2.0 mm × 1.6 mm × 0.95 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
C
C
1
2
GND
S-Di
WLEDs: NSCW215T (NICHIA Corp.)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7μH
5LED Drive, L=10μH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
I
F
E
Efficiency
II
F
E
Efficiency
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8μH
6LED Drive, L=10μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
I
F
E
Efficiency
I
I
Efficiency
F
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
4LED Drive, L=6.8μH
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
82.37 to 88.70
80.19 to 86.55
78.11 to 84.54
74.79 to 84.94
74.14 to 83.47
86.38
84.12
80.16
79.94
77.17
I
I
F
Efficiency
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.69
2.17
1.01
1.25
1.07
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.19
20.90
20.63
20.09
19.93
−3.26
−1.87
−1.78
−1.88
−1.99
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application’s mass production design.
9
2010-06-27
TB62756FUG
4. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
1
S-Di
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: VLF3010A series (TDK Corp.)
L
1
V
SW
FB
WLEDs
2 to 6
IN
(Size: 3.0 mm × 3.0 mm × 1.0 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
C
C
1
2
S-Di
GND
WLEDs: NSCW215T (NICHIA Corp.)
Input Voltage - Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
2LED Drive, L=4.7μH
5LED Drive, L=10μH
35
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
30
25
20
15
10
I
I
F
Efficiency
I
F
Efficiency
2.8
2.8
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
Input Voltage
-
Efficiency/Output Current
Input Voltage
- Efficiency/Output Current
3LED Drive, L=6.8μH
6LED Drive, L=10μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
II
F
Efficiency
I
F
Efficiency
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
VIN(V)
VIN(V)
<Measurement Data>
Input Voltage
- Efficiency/Output Current
Efficiency in the range of V = 2.8 to 5.5 V
4LED Drive, L=6.8μH
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
79.85 to 86.97
80.19 to 85.32
78.77 to 83.60
79.72 to 86.39
78.91 to 85.10
84.02
83.39
80.69
82.87
80.49
I
Efficiency
I
F
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
IN
IN
3.1
3.4
3.7
4
4.3
4.6
4.9
5.2
5.5
Tolerance (%)
Output Current (mA)
VIN(V)
V
= 3.6 V
IN
Min
Max
1.67
1.33
1.11
1.22
1.26
2 LEDs
3 LEDs
4 LEDs
5 LEDs
6 LEDs
21.19
20.89
20.64
20.10
19.95
−3.08
−1.86
−1.68
−1.82
−1.94
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application’s mass production design.
10
2010-06-27
TB62756FUG
5. Application Circuit Example and Measurement Data (reference data)
V
=
IN
L
1
S-Di
2.8 to 5.5 V
• Evaluation conditions (Ta = 25°C)
: 32R51 (KOA Corp.)
L
1
V
SW
FB
WLEDs
2 to 4
IN
(Size: 3.2 mm × 2.5 mm × 0.6 mm)
: C2012JB1E225K (TDK Corp.)
: C2012JB1E105K (TDK Corp.)
: CUS02 1 A/30 V (TOSHIBA Corp.)
SHDN
C
C
1
2
S-Di
GND
WLEDs: NSCW215T (NICHIA Corp.)
Input Voltage - Efficiency/Output Current
2LED Drive, L=5.1μH
Input Voltage - Efficiency/Output Current
3LED Drive, L=5.1μH
35
30
25
20
15
10
100
90
80
70
60
50
35
30
25
20
15
10
100
90
80
70
60
50
I
F
I
I
F
Eficiency
Efficiency
E
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
<Measurement Data>
Input Voltage - Efficiency/Output Current
4LED Drive, L=5.1μH
Efficiency in the range of V = 2.8 to 5.5 V
IN
35
30
25
20
15
10
100
90
80
70
60
50
Efficiency (%)
Average Efficiency (%)
2 LEDs
3 LEDs
4 LEDs
83.08 to 89.23
79.02 to 86.30
75.75 to 83.83
86.73
83.52
80.78
Output current in the range of V = 3.0 to 5.0 V (V = 3.6 V typ.)
I
IN
IN
F
Efficiency
Tolerance (%)
Output Current (mA)
V
= 3.6 V
IN
Min
Max
4.02
2.94
2.65
2.8
3.1
3.4
3.7
4
4.3
VIN(V)
4.6
4.9
5.2
5.5
2 LEDs
3 LEDs
4 LEDs
21.06
20.57
20.22
−2.46
−2.39
−2.28
Note: These application examples are provided for reference only. Thorough evaluation and testing should be
implemented when designing your application’s mass production design.
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Package Dimensions
Weight: 0.016 g (typ.)
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Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case
of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise
occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead
smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate
settings, such as fuse capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
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Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond
maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system
design.
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About solderability, following conditions were confirmed
Solderability
(1)
Use of Sn-37Pb solder Bath
solder bath temperature: 230°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
(2)
Use of Sn-3.0Ag-0.5Cu solder Bath
solder bath temperature: 245°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
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RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
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Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
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The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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