TB62755FPG [TOSHIBA]
IC 1.5 A SWITCHING REGULATOR, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, 0.50 MM PITCH, PLASTIC, SON-6, Switching Regulator or Controller;
| 型号： | TB62755FPG |
| 厂家： | 
TOSHIBA |
| 描述： | IC 1.5 A SWITCHING REGULATOR, 1430 kHz SWITCHING FREQ-MAX, PDSO6, 2 X 2 MM, 0.50 MM PITCH, PLASTIC, SON-6, Switching Regulator or Controller CD 开关 光电二极管 |
| 文件： | 总15页 (文件大小：309K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TB62755FPG
TOSHIBA BiCD Integrated Circuit Silicon Monolithic
TB62755FPG
Step Up Type DC-DC Converter for White LED
The TB62755FPG is a high efficient Step-Up Type DC-DC
Converter specially designed for constant current driving of White
LED.
This IC can drive 2-8 white LEDs connected series using a
Li-ion battery.
This IC contains N-ch MOSFET Transistor for Coil-Switching,
and LED current (IF) is set with an external resistor.
This IC is especially for driving back light white LEDs in LCD
of PDA, Cellular Phone, or Handy Terminal Equipment.
SON6-P-0202-0.50
Weight: 0.005 g (typ.)
Features
•
•
•
•
•
2-8 white LEDs connected series (typ. 7LEDs)
Variable LED current IF is set with a external resistor: 20 mA (typ.) @RSENS = 15 Ω
Output power: Available for 800 mW LED loading (7LEDs, I = Over 25 mA)
F
High efficiency: 80% over (using recommended external parts)
Output over voltage shutdown function
: Switching operation is shut downed when OVD terminal voltage is over 37 V (typ.).
•
•
IC package: SON6-P-0202-0.50
Switching frequency: 1.0 MHz (typ.)
Pin Assignment (top view)
VIN
OVD
1
2
3
6
5
4
SW
GND
FB
VIN
OVD
1
2
3
6
5
4
SW
GND
FB
SHDN
SHDN
Week 1 to 26
Week 27 to 53
Note: This IC could be destroyed in some case if amounted in 180° inverse direction.
Please be careful about IC direction in mounting.
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TB62755FPG
Block Diagram
VIN
22 μH
SW
OVD
VIN
Driver
I
sens
Over voltage
detection
R
Q
COMP
S
∑
Ramp
generator
1.0 MHz
oscillator
FB
Error
AMP.
Shutdown
function
SHDN
GND
Pin Function
Pin No.
1
Symbol
VIN
Function Description
Supply voltage input terminal. (2.8 V to 5.5 V)
Over voltage detection terminal.
2
3
OVD
IC switching operation is disabled with detection over voltage.
If the voltage returns to detection level or less, operation is enabled again.
Voltage-input terminal for IC-enable/disable LED-I .
F
A high input on this pin enables the IC to operate while a low input causes it to shut down. The behavior
of the IC is unpredictable if the input on the pin is undefined. Ensure that the pin is tied to either a high or
low level.
SHDN
4
5
6
FB
GND
SW
LED I setting resistor connecting terminal.
F
Ground terminal.
Switch terminal for DC-DC converter. Nch MOSFET built-In.
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TB62755FPG
I/O Equivalent Pin Circuits
1. VIN to GND
2. OVD
OVD
2
VIN
1
5
GND
3. SHDN
4. FB
VIN
VIN
FB
4
SHDN
3
5. SW
SW
6
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TB62755FPG
Usage Precautions
Protection in LED Opened Condition
The operation with OVD terminal is available for the protection in case LED circuit opened.
When the voltage of OVD terminal is over 37 V (typ.), Nch MOSFET switching operation is disabled in the IC.
When the voltage of OVD terminal drops below 37 V (typ.), Nch MOSFET switching operation becomes available
again.
If load of LED is detached, Nch MOSFET switching operation is disabled with detection of boost circuit voltage
and the IC is protected from unexpected over voltage.
Setting of Capacitor
The recommended values are
C = 2.2 (μF) or more,
1
C = 1.0 (μF) or more
2
The capacitor of ceramic condenser tends to decrease when voltage is applied.
So, please select the appropriate capacitor in consideration of IC characteristics of withstand voltage and size.
Setting of I
F
Resistance connects between FB pin and GND.
The average current is set by this RSENS value and average current are obtained by the following equation.
300[mV]
RSENS[Ω]
I
(mA) =
F
Current value error is within ±5%.
Setting of External Inductor Size
Please select the inductor size with referring this table corresponding to each number of LEDs.
[Recommended inductor values]
LEDs
Inductor Size
Note
2 to 5
10 μH
22 μH
LED current I = 20 mA
F
Over 6
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TB62755FPG
Current Dimming Control
Recommended brightness control circuits are 4 types.
(1) Input PWM signal to SHDN terminal
I can be adjusted with PWM signal by inputting it to SHDN terminal.
F
<<PWM signal frequency>>
•
The recommended PWM signal frequency is from 100 Hz to 10 kHz. There is a possibility to arise the
audible frequency in mounting to the board because it is within the auditory area. The greater the
oscillation frequency is, the greater the error between the actual value and the theoretical value
becomes.
<<Constant number of external condenser>>
•
When the PWM signal is off, the time to drain C of charge depends on the constant number. And so,
2
the actual value is little different from the theoretical value.
<<PWM input signal>>
Set the amplitude of PWM signal within the range of SHDN terminal specification.
•
<<Rush current in inputting>>
•
In case dimming by inputting the PWM signal to the SHDN terminal, this IC turns on and off
repeatedly.
And the rush current, which provides the charge to C , arises in turning on. Take care in selecting the
2
condenser.
<<Current value in control with PWM: Ideal equation>>
300[mV]×ON Duty[%]
IF [mA]=
RSENS[Ω]
<<Recommended application>>
VIN =
2.8 to 5.5 V
S-Di
22 μH
VIN
SW
PWM signal
SHDN
OVD
FB
GND
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TB62755FPG
(2) Input analog voltage to FB terminal
I can be adjusted with analog voltage input to FB terminal.
F
This method is without repeating IC ON/OFF, and no need to consider holding rash current.
[Notice]
•
LED current value goes over 100% of the current set with RSENS, if the input analog voltage is
between 0 V to 300 mV (typ.).
<<Recommended application>>
VIN =
2.8 to 5.5 V
S-Di
22 μH
VIN
SHDN
SW
OVD
16 kΩ
FB
GND
82 kΩ
Analog voltage
(3) Input PWM signal with filtering to FB terminal
I can be adjusted with filtering PWM signal using RC filter indicated in recommended circuit, because the
F
PWM signal can be regard as analog voltage after filtering.
This method is without repeating IC ON/OFF, and no need to consider holding rash current.
[Notice]
•
LED current value goes over 100% of the current set with RSENS, if the input voltage after filtering is
between 0 V to 300 mV (typ.).
<<Recommended application>>
VIN =
2.8 to 5.5 V
S-Di
22 μH
VIN
SHDN
SW
OVD
16 kΩ
82 kΩ
0.1 μF
FB
GND
10 kΩ
PWM signal
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TB62755FPG
(4) Input logic signal
I can be adjusted with logic signal input as indicated in recommended circuit.
F
The resistor connected the ON-State Nch MOSFET drain and RSENS determines IF.
Average of setting current I (mA) is next, approximately.
F
300[mV]
Sum of resistor value[Ω]
I
[mA]=
F
<<Recommended application>>
VIN =
2.8 to 5.5 V
S-Di
22 μH
VIN
SHDN
SW
OVD
FB
R1
R2
M2
GND
M1
Logic signal
LED Current
M1
M2
300[mV]
OFF
OFF
RSENS[Ω]
RSENS[Ω] + R1[Ω]
RSENS[Ω] × R1[Ω]
ON
OFF
300 [mV] ×
300 [mV] ×
RSENS[Ω] + R2[Ω]
RSENS[Ω] × R2[Ω]
OFF
ON
ON
ON
RSENS[Ω]× R1[Ω]+ RSENS[Ω]× R2[Ω]+ R1[Ω]× R2[Ω]
RSENS[Ω]× R1[Ω]× R2[Ω]
300 [mV]×
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TB62755FPG
Absolute Maximum Ratings (Ta = 25°C if without notice)
Characteristics
Power supply voltage
Symbol
VIN
Rating
Unit
−0.3 to + 6.0
−0.3 to +VIN + 0.3 (Note 3)
−0.3 to + 40
V
V
VIN
Input voltage
(SHDN)
Switching terminal voltage
Switching terminal current
V
(SW)
(SW)
V
O
I
O
1500
mA
2.4 (Note 1)(Note 2)
Power dissipation
Thermal resistance
P
W
D
(Exposed Pad mounting)
52(Note 1)
R
°C/W
th (j-a)
(Exposed Pad mounting)
Operation temperature range
Storage temperature range
Maximum junction temperature
T
−40 to + 85
−55 to + 150
150
°C
°C
°C
opr
T
stg
T
j
Note 1: PCB Condition : 76.2×114.3×1.6mm, JEDEC (4 layers)
Note 2: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each
degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).
Note 3: Ensure that the supply voltage never exceeds 6.0 V.
Operating Condition (Ta = −40 to 85°C if without notice)
Test
Circuit
Characteristics
Power supply voltage
LED current
Symbol
VIN
Test Condition
Min
2.8
⎯
Typ.
⎯
Max
5.5
⎯
Unit
V
⎯
⎯
VIN = 3.6 V, RSENS = 15 Ω
7 white LEDs, Ta = 25°C
I
⎯
20
mA
F
Electrical Characteristics (Ta = 25°C, VIN = 2.8 to 5.5 V if without notice)
Test
Circuit
Characteristics
Power supply voltage
Symbol
VIN
Test Condition
Min
Typ.
Max
Unit
⎯
1
⎯
2.8
⎯
⎯
5.5
0.9
1.0
V
Operating consumption current
Quiescent consumption current
I
VIN = 3.6 V, RSENS = 15 Ω
0.6
0.5
mA
μA
IN (ON)
I
2
VIN = 3.6 V,
V
= 0 V
⎯
IN (OFF)
SHDN
SHDN terminal “H” level input voltage
SHDN terminal “L” level input voltage
3
3
⎯
⎯
1.3
0
⎯
⎯
VIN
0.4
V
V
V
SHDNH
V
SHDNL
VIN = 3.6 V,
SHDN
SHDN terminal current
I SHDN
4
⎯
0
1.0
μA
V
= 3.6 V or 0 V
Integrated MOS-T switching
r
frequency
f
5
6
7
VIN = 3.6 V,
V
= 3.6 V
0.77
⎯
1.0
0.5
1.43
1
MHz
μA
OSC
SHDN
Switching terminal leak current
I
(SW)
⎯
oz
VIN = 3.6 V, RSENS = 15 Ω
Ta = 25°C, L = 22 μH
285
300
315
mV
FB terminal feedback voltage
V
FB
VIN = 4.2 V, RSENS = 150 Ω
Ta = 25°C, L = 22 μH
7
7
8
285
−5
300
⎯
315
5
mV
%
VIN = 3.6 V (typ.)
VIN = 3.0 to 5.0 V
FB terminal line regulation
FB terminal current
ΔV
FB
VIN = 3.6 V,
I
⎯
0.02
⎯
μA
FB
V
= 3.6 V, V = 300 mV
FB
SHDN
OVD terminal detect voltage
OVD terminal leakage current
V
9
⎯
34.5
37
39.5
1
V
OVD
I
10
V
= 30 V
⎯
0.5
μA
OVD
OVD
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TB62755FPG
TEST Circuit
1. I
2. I
IN (OFF)
IN (ON)
6
5
4
6
5
4
SW GND
SW GND
FB
TB62755FPG
TB62755FPG
SHDN
SHDN
VIN
A
OVD
2
VIN
1
OVD
2
3
3
A
3.
V
, V
4.
I
SHDN
SHDNH
SHDNL
6
5
4
6
5
4
SW GND
FB
SW
GND
FB
TB62755FPG
TB62755FPG
SHDN
SHDN
VIN OVD
VIN OVD
1
2
3
1
2
3
A
A
5. f
6. I (SW)
OSC
OZ
F
6
1 kΩ
A
6
5
4
5
4
SW GND
FB
SW
GND
FB
TB62755FPG
TB62755FPG
SHDN
SHDN
VIN OVD
VIN
OVD
2
1
2
3
1
3
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TB62755FPG
*1
FB
7. V , ΔV
8. I
FB
FB
22 μH
CRS04
A
1
6
2
6
5
4
VIN
SW
OVD
SW GND
FB
TB62755FPG
TB62755FPG
SHDN
SHDN
GND
5
FB
4
VIN OVD
3
1
2
3
V
*1
OVD
9. V
10. I
OVD
22 μH
CRS04
6
5
4
SW
GND
FB
1
6
2
VIN
SW
OVD
TB62755FPG
TB62755FPG
V
SHDN
VIN
OVD
2
1
3
SHDN
GND
5
FB
4
3
A
*1: The locations of the pins differ from the actual ones to simplify the diagram. See page 1 for the actual pin
locations.
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TB62755FPG
Package Dimensions
Weight: 0.005g (typ.)
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TB62755FPG
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough
evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerations
Notes on handling of ICs
[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush current
at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
[4] Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
12
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TB62755FPG
Points to remember on handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the device so
that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can
lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design
the device taking into considerate the effect of IC heat radiation with peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the
motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is
small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum
ratings. To avoid this problem, take the effect of back-EMF into consideration in system design.
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TB62755FPG
About solderability, following conditions were confirmed
Solderability
(1)
Use of Sn-37Pb solder Bath
solder bath temperature: 230°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
(2)
Use of Sn-3.0Ag-0.5Cu solder Bath
solder bath temperature: 245°C
dipping time: 5 seconds
the number of times: once
use of R-type flux
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TB62755FPG
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public
impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the
aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology
products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign
Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software
or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2011-05-25
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