HRW0702A [TYSEMI]
MPAK package is suittable for high density surface mounting and high speed assembly; MPAK包suittable高密度表面安装和高速组装
| 型号： | HRW0702A |
| 厂家： | 
TY Semiconductor Co., Ltd |
| 描述： | MPAK package is suittable for high density surface mounting and high speed assembly |
| 文件： | 总1页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product specification
HRW0702A
SOT-23
Unit: mm
+0.1
-0.1
2.9
0.4
+0.1
-0.1
3
Features
Low forward voltage drop and suitable for
high effifiency rectifying.
1
2
+0.1
0.95
-0.1
+0.05
0.1
-0.01
+0.1
-0.1
1.9
MPAK package is suittable for high density
surface mounting and high speed assembly.
Absolute M axim um R atings Ta = 25
Param eter
Repetitive peak reverse voltage
Forward current
Sym bol
Value
20
Unit
V
VRRM
IF
700
1.4
5
m A
A
Non-repetitive peak forward current
Non-repetitive peak forward surge current
Junction tem perature
IFM
IFSM (Note 1)
A
Tj
125
Storage tem perature
Tstg
-55 to + 125
Note
1. 10m sec sine wave 1 pulse
Electrical Characteristics Ta = 25
Parameter
Forward voltage
Symbol
Conditions
Min
Typ
Max
0.43
200
Unit
V
VF
IR
IF = 500 mA
VR = 30 V
Reverse current
Capacitance
A
C
VR = 0 V, f = 1MHz
Polyimide board
120
340
pF
Thermal resistance
Rth( j-a )
/W
Marking
Marking
S15
http://www.twtysemi.com
sales@twtysemi.com
1 of 1
4008-318-123
相关型号：
©2020 ICPDF网 联系我们和版权申明