CHA7012_09 [UMS]

X-band HBT High Power Amplifier; X波段HBT大功率放大器
CHA7012_09
型号: CHA7012_09
厂家: UNITED MONOLITHIC SEMICONDUCTORS    UNITED MONOLITHIC SEMICONDUCTORS
描述:

X-band HBT High Power Amplifier
X波段HBT大功率放大器

放大器 功率放大器
文件: 总10页 (文件大小:397K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
CHA7012  
RoHS COMPLIANT  
X-band HBT High Power Amplifier  
GaAs Monolithic Microwave IC  
Description  
TI Vc TO  
Vctrl Vc Vc  
The CHA7012 chip is a monolithic two-stage  
GaAs high power amplifier designed for X band  
applications.  
TTL  
Circuit  
Biasing  
Circuit  
This device is manufactured using a GaInP  
HBT process, including, via holes through the  
substrate and air bridge. A nitride layer protects  
the transistors and the passive components.  
IN  
OUT  
Special  
heat  
removal  
techniques  
are  
implemented to guarantee high reliability.  
To simplify the assembly process:  
-the backside of the chip is both RF and DC  
grounded  
Biasing  
Circuit  
TTL  
Circuit  
-bond pads and back side are gold plated for  
compatibility with eutectic die attach method  
and thermosonic or thermo compression  
bonding process.  
Vctrl Vc Vc  
TI Vc TO  
44  
40  
36  
32  
28  
24  
20  
16  
PAE@3dBc (%)  
Pout@3dBc(dBm  
Main Features  
Frequency band: 9.2 -10.4GHz  
Output power (P3dB ): 38.5dBm  
High linear gain: > 20dB  
High PAE: > 38%  
Two biasing modes:  
Linear Gain (Pin=0dBm)  
-VDigital control thanks to TTL interface  
-VAnalog control thanks to biasing circuit  
Chip size: 5.00 x 3.68 x 0.1mm  
9
9.2  
9.4  
9.6  
9.8  
10  
10.2  
10.4  
10.6  
Frequency ( GHz)  
Pout & PAE @3dBc and Linear Gain @ 25°C  
Main Characteristics  
Vc=7.5V, Ic (Quiescent) = 1.9A, Pulse width=100µs, Duty cycle = 20%  
Symbol  
Fop  
Parameter  
Operating frequency range  
Saturated output power @ 25°C  
Min  
Typ  
Max  
Unit  
GHz  
W
9.2  
10.4  
Psat  
9
7
P_3dBc Output power @ 3dBc @ 25°C  
W
G
Small signal gain @ 25°C  
20  
dB  
°C  
Top  
Operating temperature range  
-40  
+80  
ESD Protections: Electrostatic discharge sensitive device. Observe handling precautions!  
Ref. : DSCHA70129082- 23 March 09  
1/10  
Specifications subject to change without notice  
United Monolithic Semiconductors S.A.S.  
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France  
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Electrical Characteristics  
Tamb = 20°C, Vc=7.5V, Ic (Quiescent) = 1.9A, Pulse width=100µs, Duty cycle = 20%  
Symbol  
Fop  
Parameter  
Operating frequency  
Min  
9.2  
Typ  
Max  
10.4  
23  
Unit  
GHz  
dB  
G
Small signal gain  
17.5  
20  
G_T  
Small signal gain variation versus  
temperature  
-0.025  
dB/°C  
RLin  
RLout  
Psat  
Input Return Loss  
8
8
10  
12  
dB  
dB  
Output Return Loss  
Saturated output power  
39.5  
-0.01  
dBm  
dB/°C  
Psat_T  
Saturated output power variation versus  
temperature  
P_3dBc  
PAE_3dBc  
Vc  
Output power @ 3dBc (3)  
Power Added Efficiency @ 3dBc  
Power supply voltage (3)  
Power supply quiescent current (1)  
TTL input voltage  
38  
34  
38.5  
38  
dBm  
%
7.5  
1.9  
8
5
V
Ic  
A
TI  
0
V
I_TI  
TTL input current  
1
5
mA  
V
Vctrl  
Zctr  
Collector control voltage  
Vctrl input port impedance (2)  
Operating temperature range  
350  
Ohm  
°C  
Top  
-40  
+80  
(1) Parameter tunable by Vctrl when control biasing circuit used.  
(2) This value corresponds to the 4 ports in parallel (Pin 4, 8, 14, 18)  
(3) 0.5V variation on Vc leads to around 0.4dB variation of the output power (impact on  
robustness see Maximum ratings)  
Absolute Maximum Ratings (1)  
Tamb = 20°C  
Symbol  
Cmp  
Vc  
Parameter  
Compression level (2)  
Values  
Unit  
dBc  
V
6
Power supply voltage with RF  
Power supply quiescent current  
Power supply current in saturation  
Collector current control voltage  
Maximum junction temperature  
Storage temperature range  
8
2.8  
Ic  
A
Ic_sat  
Vctrl  
Tj  
3.5  
A
6.5  
V
175  
°C  
Tstg  
-55 to +125  
°C  
(1) Operation of this device above anyone of these parameters may cause permanent damage.  
(2) For higher compression the level limit can be increased by decreasing the voltage Vc using  
the rate 0.5 V / dBc  
Equivalent Thermal resistance to Backside: 6°C/W  
Ref. : DSCHA70129082- 23 March 09  
2/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Typical measured characteristics  
Measurements on Jig  
Vc=7.5V, VTTL=5V, Ic (Quiescent) = 1.9A, Pulse width=100µs, Duty cycle = 20%  
30  
28  
26  
24  
22  
20  
18  
16  
14  
12  
10  
+20°C  
+80°C  
-40°C  
8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.1 10.3 10.5 10.7 10.9 11.1  
Frequency (GHz)  
Linear gain versus frequency and temperature  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
+20°C  
+80°C  
-40°C  
8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.1 10.3 10.5 10.7 10.9 11.1  
Frequency (GHz)  
Output Power @ 3dBc versus frequency and temperature  
Ref. : DSCHA70129082- 23 March 09  
3/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
50  
45  
40  
35  
30  
25  
20  
+20°C  
+80°C  
-40°C  
8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.1 10.3 10.5 10.7 10.9 11.1  
Frequency (GHz)  
PAE @ 3dBc versus frequency and temperature  
3
2.9  
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2
+20°C  
+80°C  
-40°C  
8.5 8.7 8.9 9.1 9.3 9.5 9.7 9.9 10.1 10.3 10.5 10.7 10.9 11.1  
Frequency (GHz)  
Ic @ 3dBc versus frequency and temperature  
Ref. : DSCHA70129082- 23 March 09  
4/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
40  
38  
36  
34  
32  
30  
28  
26  
9.2GHz  
9.4GHz  
9.6GHz  
9.8GHz  
10GHz  
10.2GHz  
10.4GHz  
-1  
0
1
2
3
4
5
6
7
8
Compression (dB)  
Output Power @ 25°C versus compression and frequenc y  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
9.2GHz  
9.4GHz  
9.6GHz  
9.8GHz  
10GHz  
10.2GHz  
10.4GHz  
0
-1  
0
1
2
3
4
5
6
7
8
Compression (dB)  
PAE @ 25°C versus compression and frequency  
Ref. : DSCHA70129082- 23 March 09  
5/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
3
2.9  
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2
9.2GHz  
9.4GHz  
9.6GHz  
9.8GHz  
10GHz  
10.2GHz  
10.4GHz  
-1  
0
1
2
3
4
5
6
7
8
Compression (dB)  
Collector current @ 25°C versus compression and fr equency  
Temperatures: -40°C; 20°C; +80°C Vc=7.5V Pul se= 100µs, Duty cycle 20%  
3.0  
2.8  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Vctrl  
TTL Input Voltage  
20
°
C  
+80
°
C  
20 °C  
-40 °C  
+80 °C  
-40 °C  
0
1
2
3
4
5
6
TI/Vctrl (V)  
Collector quiescent current versus TI & Vctrl and temperature  
Ref. : DSCHA70129082- 23 March 09  
6/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Temperatures: -40°C; 20°C;+80°C Vc=7.5V Pulse= 100µs, Duty cycle 20%  
40  
35  
30  
25  
20  
15  
10  
5
+80°C  
+20°C  
-40°C  
0
0
1
2
3
4
5
6
VCTRL (V)  
Collector current control versus control voltage and temperature  
Temperatures: -40°C; 20°C; +80°C Vc=7.5V Pulse= 100µs, Duty cycle20%  
1.2  
1
0.8  
0.6  
0.4  
0.2  
0
+80°C  
+20°C  
-40°C  
0
1
2
3
4
5
6
V TTL( V)  
TTL input current versus TTL voltage and temperature  
Ref. : DSCHA70129082- 23 March 09  
7/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Chip Mechanical Data and Pin references  
2
3
4
5
6
7
8
9
10  
11  
22 21 20  
19 18  
17  
16 15 14  
13  
Chip thickness = 100µm +/- 10 µm  
RF pads (1, 12) = 96 x 196µm²  
DC pads (2, 3, 4, 5, 9,15, 19, 20, 21, 22) = 96 x 96µm²  
DC pads (7, 17) = 192 x 96µm²  
DC pads (11, 13) = 288 x 96µm²  
Pin number  
Pin name  
Description  
Input RF  
NC  
1
8, 16  
IN  
5, 9, 15, 19  
2, 22  
Vctrl  
TI  
Collector current control voltage  
TTL input  
4, 20  
TO  
TTL output  
6, 10, 14, 18  
3, 7, 11, 13, 17, 21  
12  
GND  
V,Vc1,Vc2  
OUT  
Ground (NC)  
Power supply voltage  
Output RF  
Ref. : DSCHA70129082- 23 March 09  
8/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Bonding recommendations  
For thermal and electrical considerations, the chip should be brazed on a metal base plate.  
The RF, DC and modulation port inter-connections should be done according to the following  
table:  
Port  
Connection  
IN (1)  
Inductance (Lbonding) = 0.3nH  
400µm length with wire diameter of 25 µm  
OUT (12)  
Inductance (Lbonding) = 0.3nH  
400µm length with wire diameter of 25 µm  
DC pads to 1st decoupling level  
for double bonding  
DC pads to 1st decoupling level  
for single bonding  
Inductance (Lbonding) =0.7nH  
Two 1.2mm length wires with a diameter of 25 µm  
Inductance (Lbonding) =1nH  
One 1.2mm length wires with a diameter of 25 µm  
1st decoupling level to 2nd  
decoupling level for double  
bonding  
Inductance (Lbonding) =0.7nH  
Two 1.2mm length wires with a diameter of 25 µm  
1st decoupling level to 2nd  
decoupling level for single  
bonding  
Inductance (Lbonding) =1nH  
One 1.2mm length wires with a diameter of 25 µm  
Assembly recommendations in test fixture (using TTL circuits)  
Vc*  
TI*  
IN  
OUT  
100pF  
Non capacitive pad  
10nF  
1µF  
TI*  
Vc*  
100µF  
* Performances obtained with the same accesses connected to the same supply  
Note: Supply feed should be capacitively by-passed. 25µm diameter gold wire is to be preferred.  
Ref. : DSCHA70129082- 23 March 09  
9/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  
X-band High Power Amplifier  
CHA7012  
Assembly recommendations in test fixture  
(using analog biasing circuits)  
Vc  
Vctrl  
IN  
OUT  
100pF  
10nF  
1µF  
Vctrl  
100µF  
Vc  
Note: Supply feed should be capacitively by-passed. 25µm diameter gold wire is to be preferred.  
Ordering Information  
Chip form  
:
CHA7012-99F/00  
Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S.  
assumes no responsibility for the consequences of use of such information nor for any infringement of patents or  
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any  
patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication  
are subject to change without notice. This publication supersedes and replaces all information previously supplied.  
United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life  
support devices or systems without express written approval from United Monolithic Semiconductors S.A.S.  
Ref. : DSCHA70129082- 23 March 09  
10/10  
Specifications subject to change without notice  
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE  
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09  

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