VMB0004_F_BCM [VICOR]
BCM Bus Converter; BCM母线转换器
| 型号： | VMB0004_F_BCM |
| 厂家： | 
VICOR CORPORATION |
| 描述： | BCM Bus Converter |
| 文件： | 总19页 (文件大小：1369K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VMB0004MFJ
VMB0004MFT
PRELIMINARY DATASHEET
TM
BCM
Bus Converter
FEATURES
DESCRIPTION
The MIL-COTS V•I ChipTM bus converter is a high efficiency
(>95%) Sine Amplitude ConverterTM (SACTM) operating from a
240 to 330 Vdc primary bus to deliver an isolated 30 – 41.25 V
nominal, unregulated secondary.
• 270 Vdc – 33.75 Vdc 235 W Bus Converter
• MIL-STD-704E/F Compliant
• High efficiency (>95%) reduces system power
consumption
The VMB0004MFJ and VMB0004MFT are provided in a
V•I Chip package compatible with standard pick-and-place and
surface mount assembly processes.
• High power density (>796 W/in3)
reduces power system footprint by >40%
• Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
VIN = 240 – 330 V
OUT = 30 – 41.25 V(NO LOAD)
POUT = 235 W(NOM)
K = 1/8
V
• Provides enable/disable control, internal temperature
monitoring
• Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
• High Voltage 270 V Aircraft Distributed Power
• 28 Vdc MIL-COTS PRMtm Interface (MP028F036M21AL)
• High Density Power Supplies
• Communications Systems
•
TYPICAL APPLICATION
VC
VC
SG
OS
CD
PR
PC
TM
PC
enable / disable
TM
PC
TM
IL
L
O
A
D
switch
SW1
PRM
240 – 330 Vdc
BCM
VTM
(MIL-STD-704E/F)
30 – 41.25 Vdc
26 – 50 Vdc
1 – 50 Vdc
F1
+Out
+In
+Out
+In
-In
+Out
+In
C1
20 µF
VIN
-Out
-In
-Out
-Out
-In
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 1 of 19
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
CONTROL PIN SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
See section 5.0 for further application details and guidelines.
+IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +400 Vdc
PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc
TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7 Vdc
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 4242 V (Hi Pot)
+IN/-IN to +OUT/-OUT. . . . . . . . . . . . . . . . . . . 500 V (working)
+OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +60 Vdc
Temperature during reflow . . . . . . . . . . . . . . . . 245°C (MSL 6)
•
PC (V I Chip BCM Primary Control)
The PC pin can enable and disable the BCM. When held below
VPC_DIS the BCM shall be disabled. When allowed to float with
an impedance to –IN of greater than 50 kΩ the module will
start. When connected to another BCM PC pin, the BCMs will
start simultaneously when enabled. The PC pin is capable of
being driven high by either an external logic signal or internal
pull up to 5 V (operating).
PACKAGE ORDERING INFORMATION
•
TM (V I Chip BCM Temperature Monitor)
The TM pin monitors the internal temperature of the BCM
within an accuracy of +5/-5°C. It has a room temperature
setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It
can source up to 100 µA and may also be used as a “Power
Good” flag to verify that the BCM is operating.
4
3
2
1
A
B
C
D
A
B
C
D
E
+Out
-Out
+In
E
F
G
H
TM
H
J
RSV
PC
J
K
L
K
+Out
-Out
L
M
N
P
R
T
M
N
P
R
T
-In
Bottom View
Signal
Name
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
+In
–In
TM
RSV
PC
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
+Out
–Out
PART NUMBER
DESCRIPTION
VMB0004MFJ
-55°C – 125°C TJ operating, J lead
VMB0004MFT
-55°C – 125°C TJ operating, Through hole
Rev. 1.6
2/2010
Page 2 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
1.0 ELECTRICAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of --55°C < TJ < 125°C (M-Grade); All other specifications are at TJ = 25ºC unless otherwise noted
ATTRIBUTE
Voltage range
dV/dt
Quiescent power
No load power dissipation
SYMBOL
CONDITIONS / NOTES
MIN
240
TYP
270
MAX
UNIT
VIN
dVIN /dt
PQ
330
1
410
10
Vdc
V/µs
mW
W
PC connected to -IN
VIN = 240 to 330 V
395
2.5
PNL
VIN = 330 V COUT = 100 µF,
POUT = 235 W
Inrush Current Peak
DC Input Current
IINR_P
IIN_DC
4
A
A
POUT = 235 W
0.95
VOUT
K Factor
K
1/8
(
)
VIN
VIN = 270 VDC; See Figure 14
VIN = 240 – 330 VDC; See Figure 14
235
215
Output Power (Average)
Output Power (Peak)
POUT
W
W
VIN = 270 VDC
Average POUT < = 235 W, Tpeak < 5 ms
POUT_P
352.5
Output Voltage
Output Current (Average)
VOUT
IOUT
Section 3.0 No load
Pout < = 235 W
30
41.25
7.3
V
A
V
IN = 270 V, POUT = 235 W
94.1
94
93.7
95.4
95.2
94.7
η
%
Efficiency (Ambient)
VIN = 240 V to 330 V, POUT = 235 W
VIN = 270 V, TJ = 100° C,POUT = 235 W
η
η
Efficiency (Hot)
Minimum Efficiency
(Over Load Range)
%
%
60 W < POUT < 235 W Max
90
Output Resistance (Ambient)
Output Resistance (Hot)
Output Resistance (Cold)
Load Capacitance
Switching Frequency
Ripple Frequency
ROUT
ROUT
ROUT
COUT
FSW
TJ = 25° C
TJ = 125° C
TJ = -55° C
100
130
40
130
180
105
170
210
160
100
1.72
3.44
mΩ
mΩ
mΩ
uF
MHz
MHz
1.56
3.12
1.64
3.28
FSW_RP
COUT = 0 µF, POUT = 235 W, VIN = 270 V,
Section 8.0
VIN = 270 V, CPC = 0; See Figure 17
Output Voltage Ripple
VOUT_PP
TON1
160
540
400
mV
ms
VIN to VOUT (Application of VIN)
460
620
PC
PC Voltage (Operating)
PC Voltage (Enable)
VPC
4.7
2
5
2.5
5.3
3
1.95
300
5
400
1000
1000
V
V
V
uA
mA
kΩ
pF
pF
kΩ
Hz
VPC_EN
VPC_DIS
IPC_EN
IPC_OP
RPC_SNK
CPC_INT
CPC_EXT
RPC
PC Voltage (Disable)
PC Source Current (Startup)
PC Source Current (Operating)
PC Internal Resistance
PC Capacitance (Internal)
PC Capacitance (External)
External PC Resistance
PC External Toggle Rate
50
2
50
100
3.5
150
Internal pull down resistor
Section 5.0
External capacitance delays PC enable time
Connected to –VIN
50
FPC_TOG
1
V
IN = 270 V, Pre-applied
PC to VOUT with PC Released
Ton2
50
100
4
150
µs
CPC = 0, COUT = 0; See Figure 17
VIN = 270 V, Pre-applied
CPC = 0, COUT = 0; See Figure 17
PC to VOUT, Disable PC
TPC_DIS
10
µs
Rev. 1.6
2/2010
Page 3 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
1.0 ELECTRICAL CHARACTERISTICS (CONT.)
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of --55°C < TJ < 125°C (M-Grade); All other specifications are at TJ = 25ºC unless otherwise noted
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
+5
UNIT
TM
TM accuracy
TM Gain
TM Source Current
TM Internal Resistance
External TM Capacitance
TM Voltage Ripple
ACTM
ATM
ITM
RTM_SNK
CTM
VTM_PP
-5
ºC
mV/°C
uA
10
40
100
25
50
50
500
kΩ
pF
CTM = 0µF, VIN = 330 V, POUT = 235 W
200
400
mV
PROTECTION
Negative going OVLO
Positive going OVLO
Negative going UVLO
Positive going UVLO
Output Overcurrent Trip
Short Circuit Protection
Trip Current
Short Circuit Protection
Response Time
Thermal Shutdown
Junction setpoint
VIN_OVLO-
VIN_OVLO+
VIN_UVLO-
VIN_UVLO+
IOCP
350
355
90
100
9
365
372
115
125
12
380
385
125
135
14
V
V
V
V
A
VIN = 270 V, 25°C
ISCP
TSCP
14
0.8
125
A
1
1.2
us
°C
TJ_OTP
130
135
GENERAL SPECIFICATION
Isolation Voltage (Hi-Pot)
Working Voltage (IN – OUT)
Isolation Capacitance
Isolation Resistance
MTBF
VHIPOT
VWORKING
CIN_OUT
RIN_OUT
4242
V
V
pF
500
800
Unpowered unit
500
10
660
4.2
MΩ
MIL HDBK 217F, 25° C, GB
cTUVus
CE Mark
Mhrs
Agency Approvals/Standards
Rev. 1.6
2/2010
Page 4 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
1.1 APPLICATION CHARACTERISTICS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
No Load Power
Inrush Current Peak
SYMBOL
CONDITIONS / NOTES
TYP
UNIT
PNL
INR_P
η
VIN = 270 V, PC enabled; See Figure 1
COUT = 100 µF, POUT = 235 W
VIN = 270 V, POUT = 235 W
VIN = 270 V, POUT = 235 W
VIN = 270 V
VIN = 270 V
VIN = 270 V
COUT = 0 uF, POUT = 235 W @ VIN = 270,
VIN = 270 V
5.5
2.5
W
A
%
Efficiency (Ambient)
95.4
94.7
105
130
180
η
Efficiency (Hot – 100°C)
Output Resistance (-55°C)
Output Resistance (25°C)
Output Resistance (120°C)
%
ROUT
ROUT
ROUT
mΩ
mΩ
mΩ
Output Voltage Ripple
VOUT Transient (Positive)
VOUT Transient (Negative)
VOUT_PP
VOUT_TRAN+
VOUT_TRAN-
TUVLO
160
1.4
1.3
150
5
mV
,
I
OUT_STEP = 0 TO 7.3 A
ISLEW >10 A/us; See Figure 11
OUT_STEP = 7.3 A to 0 A,
V
I
V
ISLEW > 10 A/us; See Figure 12
Undervoltage Lockout
Response Time
Output Overcurrent
Response Time
us
ms
TOCP
9 < IOCP < 14 A
Overvoltage Lockout
Response Time
TM Voltage (Ambient)
TOVLO
120
3
µs
V
VTM_AMB
TJ 27°C
Rev. 1.6
2/2010
Page 5 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
Full Load Efficiency vs. Case Temperature
No Load Power Dissipation vs Line
9
8
7
6
5
4
3
2
1
0
96.0
95.8
95.6
95.4
95.2
95.0
94.8
94.6
94.4
94.2
230
250
270
Input Voltage (V)
-55°C 25°C
290
310
330
-100
-50
Case Temperature (C)
240 V 270 V
0
50
100
330 V
150
TCASE
:
100°C
V
IN
:
Figure 1 – No load power dissipation vs. VIN; TCASE
Figure 2 – Full load efficiency vs. temperature; VIN
Efficiency & Power Dissipation vs. 25°C Case
Efficiency & Power Dissipation -55°C Case
98
95
90
85
80
75
70
65
15
13
11
9
15
96
94
92
90
88
86
84
82
80
η
η
13
11
9
PD
PD
7
7
5
5
3
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
Output Current (A)
Output Current (A)
240 V
270 V
330 V
240 V
270 V
330 V
VIN:
240 V
270 V
330 V
240 V
270 V
330 V
VIN:
Figure 3 – Efficiency and power dissipation at -55°C (case); VIN
Figure 4 – Efficiency and power dissipation at 25°C (case); VIN
ROUT vs. Case Temperature
Efficiency & Power Disspiation 100°C Case
98
190
16.5
14.5
180
170
160
150
140
130
120
110
100
90
96
94
92
90
88
86
84
82
80
η
12.5
10.5
8.5
PD
6.5
4.5
2.5
0
1
2
3
4
5
6
7
8
-80
-60
-40
-20
0
20
40
60
80
100
120
Output Current (A)
Case Temperature (°C)
240 V
270 V
330 V
240 V
270 V
330 V
VIN:
IOUT
:
0.73 A
7.3 A
Figure 5 – Efficiency and power dissipation at 100°C (case); VIN
Figure 6 – ROUT vs. temperature vs. IOUT
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 6 of 19
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
Ripple vs. Load
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
Load Current (A)
Vpk-pk (mV)
Figure 7 – Vripple vs. IOUT ; 270 Vin, no external capacitance
Figure 8 – PC to VOUT startup waveform
Figure 9 – VIN to VOUT startup waveform
Figure 10 – Output voltage and input current ripple, 270 Vin,
235 W no COUT
Figure 11 – Positive load transient (0 – 7.3 A)
Figure 12 – Negative load transient (7.3 A – 0 A)
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 7 of 19
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
Safe Operating Area
400
350
300
250
200
150
100
50
0
29.00
31.00
33.00
35.00
37.00
39.00
41.00
Steady State
5 mS 352.5 W Ave
Figure 13 – PC disable waveform, 270 VIN, 100 µF COUT full load
Figure 14 – Safe Operating Area vs. VOUT
400
350
50 mS operation
OVP
full current
330
300
Normal
Operating Range
280
MIL-STD-704F Envelope of normal
V transients for 270 Vdc systems
250
200
50% rated current
50 mS full current 1% duty
150
125
UVL
60
0
20
40
80
100
120
mS
Figure 15 — Envelope of normal voltage transient for 270 volts DC system.
Rev. 1.6
2/2010
Page 8 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
2.0 PACKAGE/MECHANICAL SPECIFICATIONS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
Length
Width
Height
Volume
Footprint
L
W
H
Vol
F
32.4 / 1.27
21.7 / 0.85
32.5 / 1.28
22.0 / 0.87
32.6 / 1.29
22.3 / 0.89
mm/in
mm/in
6.48 / 0.255 6.73 / 0.265 6.98 / 0.275 mm/in
No Heatsink
No Heatsink
4.81 / 0.295
7.3 / 1.1
796
cm3/in3
cm2/in2
W/in3
W/cm3
oz/g
Power Density
Weight
PD
W
No Heatsink
49
0.5/14
Nickel (0.51-2.03 µm)
Palladium (0.02-0.15 µm)
Gold (0.003-0.05 µm)
Lead Finish
µm
Operating Temperature
Storage Temperature
Thermal Capacity
Peak Compressive Force
Applied to Case (Z-axis)
TJ
TST
-55
-65
125
125
°C
°C
Ws/°C
9
5
No J-lead support
6
lbs
ESDHBM
ESDMM
Human Body Model[a]
Machine Model[b]
MSL 5
1500
400
ESD Rating
VDC
225
245
150
3
6
1.5
°C
°C
s
°C/s
°C/s
°C/W
Peak Temperature During Reflow
MSL 6
Peak Time Above 183°C
Peak Heating Rate During Reflow
Peak Cooling Rate Post Reflow
Thermal Impedance
1.5
1.5
1.1
ØJC
Min Board Heatsinking
[a]
[b]
JEDEC JESD 22-A114C.01
JEDED JESD 22-A115-A
Rev. 1.6
2/2010
Page 9 of 19
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
F
T
2.1 MECHANICAL DRAWING
NOTES:
mm
BOTTOM VIEW
1. DIMENSIONS ARE
.
inch
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
TOP VIEW ( COMPONENT SIDE )
DXF and PDF files are available on vicorpower.com
2.2 RECOMMENDED LAND PATTERN
RECOMMENDED LAND PATTERN
NOTES:
1. DIMENSIONS ARE
mm
(
COMPONENT SIDE SHOWN )
.
inch
2. UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
3. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 10 of 19
vicorpower.com
VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
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T
2.3 MECHANICAL DRAWING
TOP VIEW ( COMPONENT SIDE )
NOTES:
BOTTOM VIEW
(mm)
1. DIMENSIONS ARE
.
inch
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = 0.25 [0.01]; X.XX [X.XXX] = 0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
2.4 RECOMMENDED LAND PATTERN
NOTES:
(mm)
1. DIMENSIONS ARE
.
inch
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = 0.25 [0.01]; X.XX [X.XXX] = 0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 11 of 19
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VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
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T
2.5 RECOMMENDED LAND PATTERN FOR PUSH PIN HEAT SINK
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
TOP SIDE SHOWN
4. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = 0.3 [0.01]
X.XX [X.XXX] = 0.13 [0.005]
5. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
Rev. 1.6
2/2010
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 12 of 19
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VMB0004MFJ - VMB0004M
PRELIMINARY DATASHEET
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T
3.0 POWER, VOLTAGE, EFFICIENCY RELATIONSHIPS
Because of the high frequency, fully resonant SAC topology,
power dissipation and overall conversion efficiency of BCM
converters can be estimated as shown below.
OUTPUT
POWER
INPUT
POWER
Key relationships to be considered are the following:
1. Transfer Function
a. No load condition
PR
OUT
PNL
VOUT = VIN • K
Eq. 1
Figure 16 – Power transfer diagram
Where K (transformer turns ratio) is constant
for each part number
b. Loaded condition
VOUT = Vin • K – IOUT • ROUT
Eq. 2
2. Dissipated Power
The two main terms of power losses in the
BCM module are:
- No load power dissipation (PNL) defined as the power
used to power up the module with an enabled power
train at no load.
- Resistive loss (ROUT) refers to the power loss across
the BCM modeled as pure resistive impedance.
~
~
PDISSIPATED
P
NL + PROUT
Eq. 3
Therefore, with reference to the diagram shown in Figure 16
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT Eq. 4
Notice that ROUT is temperature and input voltage dependent
and PNL is temperature dependent (See Figure 16).
The above relations can be combined to calculate the overall module efficiency:
POUT
PIN
PIN – PNL – PROUT
VIN • IIN – PNL – (IOUT)2 • ROUT
PNL + (IOUT)2 • ROUT
η
=
=
=
= 1 –
Eq. 5
(
)
PIN
VIN • IIN
VIN • IIN
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4.0 OPERATING
Figure 17 – Timing diagram
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5.0 USING THE CONTROL SIGNALS TM AND PC
6.0 FUSE SELECTION
The PC control pin can be used to accomplish the following
functions:
V•I Chips are not internally fused in order to provide flexibility
in configuring power systems. Input line fusing of V•I Chips is
recommended at system level, in order to provide thermal
protection in case of catastrophic failure.
• Delayed start: At start-up, PC pin will source a constant
100 uA current to the internal RC network. Adding an
external capacitor will allow further delay in reaching the
2.5 V threshold for module start.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
• Synchronized start up: In a parallel module array, PC pins
shall be connected in order to ensure synchronous start of all
the units. While every controller has a calibrated 2.5 V
reference on PC comparator, many factors might cause
different timing in turning on the 100 uA current source on
each module, i.e.:
• Current rating (usually greater than maximum BCM current)
• Maximum voltage rating (usually greater than the maximum
possible input voltage)
• Ambient temperature
• Nominal melting I2t
• Recommended fuse: ≤2.5 A Bussmann PC-Tron or
SOC type 36CFA.
– Different VIN slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be
shared and all the modules will be enabled synchronously.
• Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM PC provides a
regulated 5 V, 2 mA voltage source.
• Output Disable: PC pin can be actively pulled down in order
to disable module operations. Pull down impedance shall be
lower than 850 Ω and toggle rate lower than 1 Hz.
• Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
It is important to notice that PC doesn’t have current sink
capability (only 150 kΩ typical pull down is present),
therefore, in an array, PC line will not be capable of disabling
all the modules if a fault occurs on one of them.
The temperature monitor (TM) pin provides a voltage propor-
tional to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
• Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to
•
remember that V I chips are multi-chip modules, whose
temperature distribution greatly vary for each part number as
well with input/output conditions, thermal management and
environmental conditions. Therefore, TM cannot be used to
thermally protect the system.
• Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage is
re-enabled.
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7.0 CURRENT SHARING
The SAC topology bases its performance on efficient transfer
of energy through a transformer, without the need of closed
loop control. For this reason, the transfer characteristic can be
approximated by an ideal transformer with some resistive drop
and positive temperature coefficient.
It is important to notice that, when successfully started, BCMs
are capable of bidirectional operations (reverse power transfer
is enabled if the BCM input falls within its operating range and
the BCM is otherwise enabled). In parallel arrays, because of
the resistive behavior, circulating currents are never experienced
(energy conservation law).
This type of characteristic is close to the impedance characteristic
of a DC power distribution system, both in behavior
(AC dynamic) and absolute value (DC dynamic).
General recommendations to achieve matched array impedances
are (see also AN016 for further details):
When connected in an array (with same K factor), the BCM
module will inherently share the load current with parallel
units, according to the equivalent impedance divider that the
system implements from the power source to the point of load.
• to dedicate common copper planes within the PCB to
deliver and return the current to the modules
• to make the PCB layout as symmetric as possible
• to apply same input/output filters (if present) to each unit
Figure 18 – BCM Array
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8.0 INPUT AND OUTPUT FILTER DESIGN
A major advantage of SAC systems versus conventional PWM
converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme
high frequency, is amplitude modulated as a function of input
voltage and output current, and efficiently transfers charge
through the isolation transformer. A small amount of
capacitance, embedded in the input and output stages of the
module, is sufficient for full functionality and is key to achieve
power density.
Total load capacitance at the output of the BCM shall not
exceed the specified maximum. Owing to the wide bandwidth
and low output impedance of the BCM, low frequency bypass
capacitance and significant energy storage may be more
densely and efficiently provided by adding capacitance at the
input of the BCM. At frequencies <500 kHz the BCM appears
as an impedance of ROUT between the source and load.
Within this frequency range capacitance at the input appears
as effective capacitance on the output per the relationship
defined in Eq. 5.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
CIN
K2
COUT
=
Eq. 6
1.Guarantee low source impedance:
To take full advantage of the BCM dynamic response, the
impedance presented to its input terminals must be low
from DC to approximately 5 MHz. The connection of the
This enables a reduction in the size and number of capacitors
used in a typical system.
•
V I Chip to its power source should be implemented with
minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed
with a RC damper to retain low source impedance and
stable operation. With an interconnect inductance of
200 nH, the RC damper may be as high as 1 µF in series
with 0.3 Ω. A single electrolytic or equivalent low-Q
capacitor may be used in place of the series RC bypass.
2.Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the BCM, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the BCM multiplied by its
K factor. This is illustrated in Figures 11 and 12.
3.Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
•
The V I Chip input/output voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is exposed
to the applied voltage and power MOSFETs must withstand
it. A criterion for protection is the maximum amount of
energy that the input or output switches can tolerate if
avalanched.
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Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper applica-
tion or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the
original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this war-
ranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions.
Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in re-
turning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of
this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intel-
lectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098
and 6,984,965
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