10-PG07N3A050S5-M896F96T [VINCOTECH]

High speed and smooth switching;Low gate charge;Very low collector emitter saturation voltage;
10-PG07N3A050S5-M896F96T
型号: 10-PG07N3A050S5-M896F96T
厂家: VINCOTECH    VINCOTECH
描述:

High speed and smooth switching;Low gate charge;Very low collector emitter saturation voltage

文件: 总29页 (文件大小:9039K)
中文:  中文翻译
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10-PG07N3A050S5-M896F96T  
datasheet  
flow3xNPC 1  
650 V / 50 A  
Features  
flow 1 12 mm housing  
● Four quadrant operation  
● Enhanced thermal performance  
● Fast switching IGBTs  
Schematic  
Target applications  
● Solar Inverters  
● UPS  
Types  
● 10-PG07N3A050S5-M896F96T  
Copyright Vincotech  
1
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Buck Switch  
VCES  
Collector-emitter voltage  
650  
48  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
150  
68  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
±20  
175  
Tjmax  
Maximum junction temperature  
°C  
Buck Diode  
VRRM  
Peak repetitive reverse voltage  
650  
45  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
100  
60  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Switch  
VCES  
Collector-emitter voltage  
650  
48  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
150  
68  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
±20  
175  
Tjmax  
Maximum junction temperature  
°C  
Copyright Vincotech  
2
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Boost Diode  
VRRM  
Peak repetitive reverse voltage  
650  
45  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
100  
60  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Sw. Inv. Diode  
VRRM  
Peak repetitive reverse voltage  
650  
45  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
IFRM  
tp limited by Tjmax  
Tj = Tjmax  
100  
60  
A
Ptot  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
>12,7  
9,56  
V
tp = 1 min  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 600  
Copyright Vincotech  
3
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,0005  
50  
25  
3,2  
4
4,8  
V
V
25  
1,35  
1,41  
1,44  
1,75(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
50  
µA  
nA  
Ω
20  
100  
None  
3100  
88  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
12  
VCC = 520 V  
15  
50  
120  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,39  
K/W  
25  
65  
67  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
70  
8
tr  
125  
150  
25  
8
9
Rgon = 8 Ω  
Rgoff = 8 Ω  
85  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
100  
ns  
104  
±15  
350  
50  
11,92  
14,56  
17,26  
0,426  
0,578  
0,522  
0,393  
0,645  
0,785  
tf  
125  
150  
25  
ns  
QrFWD=1,82 µC  
QrFWD=3,26 µC  
QrFWD=3,59 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
Copyright Vincotech  
4
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Diode  
Static  
25  
1,5  
1,92(1)  
2,65  
VF  
IR  
Forward voltage  
50  
125  
150  
1,44  
1,42  
V
Reverse leakage current  
Thermal  
Vr = 650 V  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,58  
K/W  
25  
94,77  
114,24  
112,38  
28,1  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
65,75  
72,89  
1,82  
ns  
di/dt=8774 A/µs  
di/dt=8156 A/µs  
di/dt=7634 A/µs  
Qr  
Recovered charge  
±15  
350  
50  
125  
150  
25  
3,26  
μC  
3,59  
0,476  
0,865  
1,06  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
8284  
7934  
6988  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
5
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,0005  
50  
25  
3,2  
4
4,8  
V
V
25  
1,35  
1,41  
1,44  
1,75(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
25  
50  
µA  
nA  
Ω
20  
100  
None  
3100  
88  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
12  
VCC = 520 V  
15  
50  
120  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,39  
K/W  
25  
58,6  
59,78  
60,21  
11,82  
13,1  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
tr  
125  
150  
25  
13,24  
68,84  
85,65  
89,27  
14,71  
28,24  
33,09  
0,329  
0,524  
0,522  
0,615  
0,918  
1,01  
Rgon = 8 Ω  
Rgoff = 8 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
±15  
350  
50  
tf  
125  
150  
25  
ns  
QrFWD=1,39 µC  
QrFWD=2,88 µC  
QrFWD=3,34 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
Eoff  
125  
150  
Copyright Vincotech  
6
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Diode  
Static  
25  
1,5  
1,92(1)  
2,65  
VF  
IR  
Forward voltage  
50  
125  
150  
1,44  
1,42  
V
Reverse leakage current  
Thermal  
Vr = 650 V  
25  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,58  
K/W  
25  
47,06  
60,23  
64,18  
57,37  
94,16  
106,27  
1,39  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=4018 A/µs  
di/dt=3358 A/µs  
di/dt=3518 A/µs  
Qr  
Recovered charge  
±15  
350  
50  
125  
150  
25  
2,88  
μC  
3,34  
0,365  
0,722  
0,837  
1038,73  
797,08  
824,8  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
7
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Boost Sw. Inv. Diode  
Static  
25  
1,5  
1,92(1)  
2,65  
VF  
IR  
Forward voltage  
50  
125  
150  
1,44  
1,42  
V
Reverse leakage current  
Vr = 650 V  
25  
µA  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
1,58  
K/W  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
-5  
5
5
mW  
mW/K  
K
d
25  
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
8
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
150  
150  
VGE  
:
7 V  
8 V  
125  
100  
75  
50  
25  
0
125  
100  
75  
50  
25  
0
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
1
50  
10  
40  
30  
20  
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
1
2
3
4
5
6
7
10  
10  
tp(s)  
V
GE(V)  
tp  
VCE  
=
=
250  
10  
μs  
V
D =  
tp / T  
1,387  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
8,70E-02  
2,35E-01  
8,38E-01  
1,53E-01  
7,46E-02  
2,39E+00  
2,56E-01  
4,81E-02  
6,04E-03  
4,42E-04  
Copyright Vincotech  
9
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
10  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Diode Characteristics  
figure 6.  
FWD  
figure 7.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
150  
125  
100  
75  
10  
0
10  
-1  
10  
50  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
25  
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,576  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
8,98E-02  
2,77E-01  
8,69E-01  
2,26E-01  
1,14E-01  
2,45E+00  
2,04E-01  
4,27E-02  
6,63E-03  
5,39E-04  
Copyright Vincotech  
11  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switch Characteristics  
figure 8.  
IGBT  
figure 9.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
150  
150  
VGE  
:
7 V  
8 V  
125  
100  
75  
50  
25  
0
125  
100  
75  
50  
25  
0
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 10.  
IGBT  
figure 11.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
1
50  
10  
40  
30  
20  
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
1
2
3
4
5
6
7
10  
10  
tp(s)  
V
GE(V)  
tp  
VCE  
=
=
250  
10  
μs  
V
D =  
tp / T  
1,387  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
8,70E-02  
2,35E-01  
8,38E-01  
1,53E-01  
7,46E-02  
2,39E+00  
2,56E-01  
4,81E-02  
6,04E-03  
4,42E-04  
Copyright Vincotech  
12  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switch Characteristics  
figure 12.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
1
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
13  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Diode Characteristics  
figure 13.  
FWD  
figure 14.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
150  
125  
100  
75  
10  
0
10  
-1  
10  
50  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
25  
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,576  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
8,98E-02  
2,77E-01  
8,69E-01  
2,26E-01  
1,14E-01  
2,45E+00  
2,04E-01  
4,27E-02  
6,63E-03  
5,39E-04  
Copyright Vincotech  
14  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Sw. Inv. Diode Characteristics  
figure 15.  
FWD  
figure 16.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
150  
125  
100  
75  
10  
0
10  
-1  
10  
50  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
25  
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,576  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
8,98E-02  
2,77E-01  
8,69E-01  
2,26E-01  
1,14E-01  
2,45E+00  
2,04E-01  
4,27E-02  
6,63E-03  
5,39E-04  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Thermistor Characteristics  
figure 17.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
16  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switching Characteristics  
figure 18.  
IGBT  
figure 19.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Eon  
Eon  
Eoff  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eon  
Eoff  
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
8
figure 20.  
FWD  
figure 21.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switching Characteristics  
figure 22.  
IGBT  
figure 23.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
tf  
tf  
tr  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
±15  
8
°C  
V
150  
350  
±15  
50  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
Ω
Ω
8
figure 24.  
FWD  
figure 25.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn off gate resistor  
trr = f(IC)  
trr = f(Rgoff)  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switching Characteristics  
figure 26.  
FWD  
figure 27.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn off gate resistor  
Qr = f(IC)  
Qr = f(Rgoff)  
7
6
5
4
3
2
1
0
4,5  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
figure 28.  
FWD  
figure 29.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn off gate resistor  
IRM = f(IC)  
IRM = f(Rgoff)  
150  
125  
100  
75  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
50  
25  
25  
0
0
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Buck Switching Characteristics  
figure 30.  
FWD  
figure 31.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn off gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgoff)  
15000  
15000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
dirr/dt ──────  
12500  
10000  
7500  
5000  
2500  
0
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
R
goff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 32.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
120  
IC MAX  
100  
80  
60  
40  
20  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
8
°C  
Ω
Rgon  
Rgoff  
=
=
8
Ω
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switching Characteristics  
figure 33.  
IGBT  
figure 34.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
2,00  
1,75  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,50  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eon  
Eoff  
Eoff  
Eoff  
Eon  
Eon  
Eon  
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Rgon  
Rgoff  
8
figure 35.  
FWD  
figure 36.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,2  
1,0  
0,8  
0,6  
0,4  
0,2  
0,0  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Copyright Vincotech  
21  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switching Characteristics  
figure 37.  
IGBT  
figure 38.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
-1  
10  
-1  
10  
td(off)  
td(on)  
tf  
tf  
tr  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
±15  
8
°C  
V
150  
350  
±15  
50  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
Ω
Ω
8
figure 39.  
FWD  
figure 40.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn off gate resistor  
trr = f(IC)  
trr = f(Rgoff)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
22  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switching Characteristics  
figure 41.  
FWD  
figure 42.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn off gate resistor  
Qr = f(IC)  
Qr = f(Rgoff)  
6
5
4
3
2
1
0
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
figure 43.  
FWD  
figure 44.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn off gate resistor  
IRM = f(IC)  
IRM = f(Rgoff)  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
80  
60  
40  
20  
0
IRM  
IRM  
IRM  
IRM  
IRM  
IRM  
0
20  
40  
60  
80  
100  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgoff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Boost Switching Characteristics  
figure 45.  
FWD  
figure 46.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn off gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgoff)  
6000  
6000  
5000  
4000  
3000  
2000  
1000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
dirr/dt ──────  
5000  
4000  
3000  
2000  
1000  
0
0
20  
40  
60  
80  
100  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
R
goff(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
8
V
V
Ω
125 °C  
150 °C  
350  
±15  
50  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 47.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
120  
IC MAX  
100  
80  
60  
40  
20  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
8
°C  
Ω
Rgon  
Rgoff  
=
=
8
Ω
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Switching Definitions  
figure 48.  
IGBT  
figure 49.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 50.  
IGBT  
figure 51.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Switching Definitions  
figure 52.  
FWD  
figure 53.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
Copyright Vincotech  
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05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Ordering Code  
Version  
Ordering Code  
Without thermal paste  
10-PG07N3A050S5-M896F96T  
10-PG07N3A050S5-M896F96T-/7/  
10-PG07N3A050S5-M896F96T-/3/  
With thermal paste (5,2 W/mK, PTM6000HV)  
With thermal paste (3,4 W/mK, PSX-P7)  
Marking  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
DC+1  
GND1  
GND1  
DC-1  
DC-1  
GND2  
GND2  
DC+2  
DC+2  
GND3  
GND3  
DC-2  
G32  
0
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
28,2  
23,7  
20,7  
20,6  
20,6  
20,6  
20,6  
20,7  
23,7  
23,7  
20,7  
20,6  
20,6  
12,2  
12,2  
12,2  
12,2  
12,2  
12,2  
8,9  
5,9  
0
2
6
3
9,7  
4
15,7  
18,7  
24,7  
27,7  
33,8  
36,8  
42,8  
46,2  
52,2  
52,2  
52,2  
41,25  
38,25  
32,55  
29,55  
18,7  
18,7  
15,7  
15,7  
4,75  
1,75  
8,35  
11,35  
19,95  
22,95  
44,35  
47,35  
52,2  
52,2  
46,75  
43,95  
40,95  
37,95  
29,2  
26,2  
23,2  
20,4  
11,8  
9
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
S32  
G31  
S31  
S21  
G21  
S22  
G22  
G12  
S12  
G11  
S11  
G14  
S14  
S24  
G24  
G34  
S34  
Therm1  
Therm2  
Ph3  
0
Ph3  
0
S33  
0
G33  
0
G23  
0
S23  
0
Ph2  
0
Ph2  
0
Ph1  
0
Ph1  
6
0
S13  
3
0
G13  
Copyright Vincotech  
27  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Pinout  
DC+1  
1
DC+2  
8,9  
T11  
T13  
T21  
T23  
T31  
D34  
D14  
D16  
D24  
D26  
G11  
23  
G21  
18  
G31  
15  
S11  
24  
S21  
17  
S31  
16  
T33  
D36  
D11  
D21  
D31  
G13  
44  
G23  
37  
G33  
36  
S13  
43  
S23  
38  
S33  
35  
GND1  
2,3  
GND2  
6,7  
GND3  
10,11  
Ph1  
41,42  
Ph2  
39,40  
Ph3  
33,34  
T14  
T12  
T24  
T22  
T34  
D35  
D32  
D15  
D13  
D25  
D23  
D12  
D22  
G14  
25  
G24  
28  
G34  
29  
S14  
26  
S24  
27  
S34  
30  
T32  
D33  
G12  
21  
G22  
20  
G32  
13  
S12  
22  
S22  
19  
S32  
14  
Rt  
DC-1  
4,5  
DC-2  
12  
Therm1  
31  
Therm2  
32  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T11, T21, T31, T12,  
IGBT  
650 V  
50 A  
Buck Switch  
T22, T32  
D11, D21, D31, D12,  
D22, D32  
FWD  
IGBT  
FWD  
650 V  
650 V  
650 V  
650 V  
50 A  
50 A  
50 A  
50 A  
Buck Diode  
Boost Switch  
Boost Diode  
T13, T23, T33, T14,  
T24, T34  
D13, D23, D33, D14,  
D24, D34  
D15, D16, D25, D26,  
D35, D36  
FWD  
NTC  
Boost Sw. Inv. Diode  
Thermistor  
Rt  
Copyright Vincotech  
28  
05 Sep. 2021 / Revision 2  
10-PG07N3A050S5-M896F96T  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 1 packages see vincotech.com website.  
Package data  
Package data for flow 1 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
- New Datasheet format, module is unchanged  
- Correct Rth of all position  
- Change Boost Switching Dynamic measurement  
- Clearance value  
10-PG07N3A050S5-M896F96T-D2-14  
5 Sep. 2021  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
29  
05 Sep. 2021 / Revision 2  

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