10-PZ12NMA080F205-M260F53Y [VINCOTECH]

5us short circuit withstand time;High speed switching;Minimized tail current;
10-PZ12NMA080F205-M260F53Y
型号: 10-PZ12NMA080F205-M260F53Y
厂家: VINCOTECH    VINCOTECH
描述:

5us short circuit withstand time;High speed switching;Minimized tail current

文件: 总28页 (文件大小:8781K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
10-PZ12NMA080F205-M260F53Y  
datasheet  
flowMNPC 0  
1200 V / 80 A  
Topology features  
flow 0 12 mm housing  
● Kelvin Emitter for improved switching performance  
● Temperature sensor  
● Mixed Voltage Neutral Point Clamped Topology (T-Type)  
Component features  
● 5us short circuit withstand time  
● High speed switching  
● Minimized tail current  
Housing features  
● Base isolation: Al2O3  
● Clip-in, reliable mechanical connection, qualified for wave  
soldering  
● Convex shaped substrate for superior thermal contact  
● Thermo-mechanical push-and-pull force relief  
● Press-fit pin  
Schematic  
● Reliable cold welding connection  
Target applications  
● Energy Storage Systems  
● Industrial Drives  
● Solar Inverters  
● UPS  
Types  
● 10-PZ12NMA080F205-M260F53Y  
Copyright Vincotech  
1
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Buck Switch  
VCES  
Collector-emitter voltage  
1200  
76  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
240  
186  
±20  
5
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 600 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Buck Diode  
VRRM  
Peak repetitive reverse voltage  
600  
51  
V
A
IF  
Forward current (DC current)  
Total power dissipation  
Tj = Tjmax  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Ptot  
69  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Switch  
VCES  
Collector-emitter voltage  
650  
59  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
225  
86  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
±20  
175  
Tjmax  
Maximum junction temperature  
°C  
Copyright Vincotech  
2
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Boost Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
44  
V
A
IF  
Forward current (DC current)  
Surge (non-repetitive) forward current  
Surge current capability  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
IFSM  
I2t  
270  
365  
94  
A
Single Half Sine Wave,  
tp = 10 ms  
A2s  
W
°C  
Ptot  
Total power dissipation  
Tj = Tjmax  
Tjmax  
Maximum junction temperature  
175  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
>12,7  
9
V
tp = 1 min  
V
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 200  
Copyright Vincotech  
3
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,004  
80  
25  
5
6
7
V
V
25  
2,18  
2,39  
2,44  
2,6(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
20  
20  
0
25  
25  
50  
µA  
nA  
Ω
0
500  
None  
6400  
440  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
160  
VCC = 960 V  
0/15  
80  
316  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,51  
K/W  
25  
51,72  
51,69  
51,75  
10,05  
10,67  
10,8  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
tr  
125  
150  
25  
Rgon = 4 Ω  
Rgoff = 4 Ω  
59,79  
73,88  
78,32  
37,81  
57,28  
63,12  
0,574  
1,05  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
±15  
350  
55  
tf  
125  
150  
25  
ns  
QrFWD=1,01 µC  
QrFWD=2,54 µC  
QrFWD=3,25 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
mWs  
mWs  
1,21  
1,01  
Eoff  
125  
150  
1,76  
2,06  
Copyright Vincotech  
4
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Buck Diode  
Static  
25  
2,27  
1,68  
1,58  
2,8(1)  
VF  
IR  
Forward voltage  
60  
125  
150  
V
Reverse leakage current  
Thermal  
Vr = 600 V  
25  
10  
µA  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,38  
K/W  
25  
78,93  
98,7  
IRM  
Peak recovery current  
125  
150  
25  
A
107,7  
23,12  
51,55  
68,95  
1,01  
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=6620 A/µs  
di/dt=5238 A/µs  
di/dt=5071 A/µs  
Qr  
Recovered charge  
±15  
350  
55  
125  
150  
25  
2,54  
μC  
3,25  
0,141  
0,403  
0,536  
11555,08  
6307,82  
5897,32  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
5
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Switch  
Static  
VGE(th)  
Gate-emitter threshold voltage  
VCE = VGE  
0,00075 25  
25  
3,2  
4
4,8  
V
V
1,56  
1,56  
1,59  
1,75(1)  
VCEsat  
Collector-emitter saturation voltage  
15  
75  
125  
150  
ICES  
IGES  
rg  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
0
650  
0
25  
50  
µA  
nA  
Ω
20  
25  
100  
None  
4500  
130  
17  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
VCC = 520 V  
15  
75  
164  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,1  
K/W  
25  
147,86  
148,56  
148,32  
14,94  
17,75  
18,76  
131,26  
148,34  
153,5  
16,43  
40,62  
44,67  
1,24  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
tr  
125  
150  
25  
Rgon = 16 Ω  
Rgoff = 16 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
±15  
350  
70  
tf  
125  
150  
25  
ns  
QrFWD=1,77 µC  
QrFWD=3,8 µC  
QrFWD=4,55 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
1,47  
mWs  
mWs  
1,55  
0,783  
1,2  
Eoff  
125  
150  
1,33  
Copyright Vincotech  
6
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Diode  
Static  
25  
2,22  
2,31  
2,21  
2,54(1)  
VF  
IR  
Forward voltage  
50  
125  
150  
25  
V
2,5(1)  
60  
Reverse leakage current  
Thermal  
Vr = 1200 V  
µA  
150  
4400  
8800  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,02  
K/W  
25  
82,66  
100,13  
108,75  
37,78  
IRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
123,66  
130,08  
1,77  
ns  
di/dt=4895 A/µs  
di/dt=4510 A/µs  
di/dt=4310 A/µs  
Qr  
Recovered charge  
±15  
350  
70  
125  
150  
25  
3,8  
μC  
4,55  
0,228  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
0,708  
mWs  
A/µs  
0,878  
6587,02  
5434,74  
5156,51  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
7
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
25  
-5  
5
130  
1,5  
mW  
mW/K  
K
d
25  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
8
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
200  
200  
VGE  
:
7 V  
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
150  
100  
50  
150  
100  
50  
0
0,0  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
4,5  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
4,5  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
80  
10  
-1  
60  
40  
20  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
2
4
6
8
10  
10  
10  
tp(s)  
V
GE(V)  
tp  
VCE  
=
=
250  
59  
μs  
V
D =  
tp / T  
0,51  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
4,69E-02  
9,41E-02  
2,77E-01  
6,79E-02  
2,44E-02  
3,44E+00  
5,98E-01  
1,08E-01  
1,98E-02  
1,61E-03  
Copyright Vincotech  
9
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switch Characteristics  
figure 5.  
IGBT  
figure 6.  
IGBT  
Safe operating area  
Gate voltage vs gate charge  
IC = f(VCE  
)
VGE = f(Qg)  
1000  
17,5  
15,0  
12,5  
10,0  
7,5  
100  
10  
100µs  
1ms  
10ms  
1
100ms  
DC  
5,0  
0,1  
0,01  
2,5  
0,0  
1
10  
100  
1000  
10000  
0
50  
100  
150  
200  
250  
300  
350  
V
CE(V)  
Qg(μC)  
D =  
IC  
=
single pulse  
40  
25  
A
Ts =  
Tj =  
80  
15  
°C  
V
°C  
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
10  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Diode Characteristics  
figure 7.  
FWD  
figure 8.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
150  
125  
100  
75  
10  
0
10  
-1  
10  
-2  
10  
50  
0,5  
0,2  
0,1  
-3  
0,05  
0,02  
0,01  
0,005  
0
10  
25  
-4  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,379  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
8,16E-02  
2,02E-01  
7,09E-01  
2,16E-01  
9,74E-02  
7,28E-02  
3,99E+00  
6,32E-01  
1,11E-01  
3,68E-02  
5,31E-03  
1,31E-03  
Copyright Vincotech  
11  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switch Characteristics  
figure 9.  
IGBT  
figure 10.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
200  
200  
VGE  
:
7 V  
8 V  
9 V  
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
150  
100  
50  
150  
100  
50  
0
0,0  
0
0,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
V
CE(V)  
VCE(V)  
tp  
=
tp  
=
250  
15  
μs  
V
250  
150  
μs  
°C  
25 °C  
VGE  
=
Tj =  
125 °C  
150 °C  
Tj:  
VGE from 7 V to 17 V in steps of 1 V  
figure 11.  
IGBT  
figure 12.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
1
70  
10  
60  
50  
40  
30  
20  
10  
0
10  
-1  
10  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
-3  
0
0
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
1
2
3
4
5
6
7
10  
10  
tp(s)  
V
GE(V)  
tp  
VCE  
=
=
250  
10  
μs  
V
D =  
tp / T  
1,104  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
2,16E-01  
6,30E-01  
1,62E-01  
3,68E-02  
6,02E-02  
4,05E-01  
6,87E-02  
1,13E-02  
2,51E-03  
3,09E-04  
Copyright Vincotech  
12  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switch Characteristics  
figure 13.  
IGBT  
figure 14.  
IGBT  
Safe operating area  
Gate voltage vs gate charge  
IC = f(VCE  
)
VGE = f(Qg)  
1000  
17,5  
15,0  
12,5  
10,0  
7,5  
100  
10  
1
5,0  
0,1  
0,01  
2,5  
0,0  
1
10  
100  
1000  
10000  
0
25  
50  
75  
100  
125  
150  
175  
V
CE(V)  
Qg(μC)  
D =  
IC  
=
single pulse  
75  
25  
A
Ts =  
Tj =  
80  
15  
°C  
V
°C  
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
13  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Diode Characteristics  
figure 15.  
FWD  
figure 16.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
150  
125  
100  
75  
10  
0
10  
-1  
10  
50  
0,5  
0,2  
0,1  
-2  
10  
0,05  
0,02  
0,01  
0,005  
0
25  
-3  
0
0,0  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,5  
1,0  
1,5  
2,0  
2,5  
3,0  
3,5  
4,0  
4,5  
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,016  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
5,56E-02  
1,14E-01  
4,09E-01  
2,64E-01  
9,94E-02  
7,49E-02  
3,42E+00  
5,52E-01  
9,78E-02  
3,21E-02  
6,42E-03  
9,84E-04  
Copyright Vincotech  
14  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Thermistor Characteristics  
figure 17.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
15  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switching Characteristics  
figure 18.  
IGBT  
figure 19.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of IGBT turn on gate resistor  
E = f(IC)  
E = f(Rg)  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eoff  
Eoff  
Eon  
Eoff  
Eon  
Eoff  
Eon  
Eon  
Eoff  
Eon  
Eoff  
Eon  
0
20  
40  
60  
80  
100  
120  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
Ω
125 °C  
150 °C  
350  
±15  
55  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Rgon  
Rgoff  
4
figure 20.  
FWD  
figure 21.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of IGBT turn on gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
0,8  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
0,8  
0,7  
0,6  
0,5  
0,4  
0,3  
0,2  
0,1  
0,0  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
20  
40  
60  
80  
100  
120  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
55  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Copyright Vincotech  
16  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switching Characteristics  
figure 22.  
IGBT  
figure 23.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of IGBT turn on gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
-1  
10  
-1  
10  
tf  
td(off)  
td(on)  
tf  
tr  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
20  
40  
60  
80  
100  
120  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
Rg(Ω)  
IC(A)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
±15  
4
°C  
V
150  
350  
±15  
55  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
Ω
Ω
4
figure 24.  
FWD  
figure 25.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,12  
0,10  
0,08  
0,06  
0,04  
0,02  
0,00  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
trr  
trr  
trr  
trr  
trr  
trr  
0
20  
40  
60  
80  
100  
120  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
55  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
17  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switching Characteristics  
figure 26.  
FWD  
figure 27.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
6
5
4
3
2
1
0
4,5  
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
20  
40  
60  
80  
100  
120  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
55  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
figure 28.  
FWD  
figure 29.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
150  
125  
100  
75  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
IRM  
IRM  
50  
IRM  
50  
25  
25  
0
0
0,0  
0
20  
40  
60  
80  
100  
120  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
55  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Copyright Vincotech  
18  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Buck Switching Characteristics  
figure 30.  
FWD  
figure 31.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
15000  
20000  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
dirr/dt ──────  
12500  
10000  
7500  
5000  
2500  
0
0
20  
40  
60  
80  
100  
120  
IC(A)  
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
15,0  
17,5  
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
4
V
V
Ω
125 °C  
150 °C  
350  
±15  
55  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 32.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
175  
IC MAX  
150  
125  
100  
75  
50  
25  
0
0
250  
500  
750  
1000  
1250  
1500  
V
CE(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
4
4
Ω
Copyright Vincotech  
19  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switching Characteristics  
figure 33.  
IGBT  
figure 34.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of IGBT turn on gate resistor  
E = f(IC)  
E = f(Rg)  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
5
4
3
2
1
0
Eon  
Eon  
Eon  
Eoff  
Eon  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eoff  
Eoff  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
Ω
125 °C  
150 °C  
350  
±15  
70  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Rgon  
Rgoff  
16  
figure 35.  
FWD  
figure 36.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of IGBT turn on gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
1,25  
1,00  
0,75  
0,50  
0,25  
0,00  
1,0  
0,8  
0,6  
0,4  
0,2  
0,0  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
125 °C  
150 °C  
350  
±15  
70  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Copyright Vincotech  
20  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switching Characteristics  
figure 37.  
IGBT  
figure 38.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of IGBT turn on gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(on)  
td(off)  
td(on)  
td(off)  
-1  
10  
-1  
10  
tr  
tf  
tf  
tr  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
Rg(Ω)  
IC(A)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
350  
±15  
16  
°C  
V
150  
350  
±15  
70  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
Ω
Ω
16  
figure 39.  
FWD  
figure 40.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,45  
0,40  
0,35  
0,30  
0,25  
0,20  
0,15  
0,10  
0,05  
0,00  
trr  
trr  
trr  
trr  
trr  
trr  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
125 °C  
150 °C  
350  
±15  
70  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
21  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switching Characteristics  
figure 41.  
FWD  
figure 42.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of IGBT turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
125 °C  
150 °C  
350  
±15  
70  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
figure 43.  
FWD  
figure 44.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of IGBT turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
150  
125  
100  
75  
200  
175  
150  
125  
100  
75  
IRM  
IRM  
IRM  
50  
IRM  
IRM  
IRM  
50  
25  
25  
0
0
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
60  
70  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
125 °C  
150 °C  
350  
±15  
70  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
22  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Boost Switching Characteristics  
figure 45.  
FWD  
figure 46.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
9000  
17500  
15000  
12500  
10000  
7500  
5000  
2500  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
8000  
dirr/dt ──────  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
0
25  
50  
75  
100  
125  
IC(A)  
0
10  
20  
30  
40  
50  
60  
70  
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
350  
±15  
16  
V
V
Ω
125 °C  
150 °C  
350  
±15  
70  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 47.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
175  
IC MAX  
150  
125  
100  
75  
50  
25  
0
0
100  
200  
300  
400  
500  
600  
700  
800  
V
CE(V)  
Tj =  
At  
150  
16  
°C  
Ω
Rgon  
Rgoff  
=
=
16  
Ω
Copyright Vincotech  
23  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Switching Definitions  
figure 48.  
IGBT  
figure 49.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 50.  
IGBT  
figure 51.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
Copyright Vincotech  
24  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Switching Definitions  
figure 52.  
FWD  
figure 53.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
Copyright Vincotech  
25  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Ordering Code  
Version  
Ordering Code  
Without thermal paste  
10-PZ12NMA080F205-M260F53Y  
10-PZ12NMA080F205-M260F53Y-/7/  
10-PZ12NMA080F205-M260F53Y-/3/  
With thermal paste (5,2 W/mK, PTM6000HV)  
With thermal paste (3,4 W/mK, PSX-P7)  
Marking  
Name  
Date code  
UL & VIN  
Lot  
Serial  
SSSS  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
S2  
33,6  
30,8  
22  
0
2
0
G2  
3
0
-DC  
-DC  
GND  
S4  
4
19,2  
10,1  
2,8  
0
0
5
0
6
0
7
0
G4  
8
0
7,1  
9,9  
12,7  
15,5  
22,6  
22,6  
22,6  
22,6  
22,6  
22,6  
22,6  
14,8  
8,2  
Line  
Line  
Line  
Line  
G3  
9
0
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
0
0
0
2,8  
10,1  
19,2  
22  
S3  
GND  
+DC  
+DC  
G1  
30,8  
33,6  
33,6  
33,6  
S1  
NTC1  
NTC2  
not assembled  
not assembled  
Copyright Vincotech  
26  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Pinout  
+DC  
15,16  
T1  
D1  
17  
18  
G1  
S1  
12  
G3  
S3  
T3  
D4  
T4  
13  
Line  
08,09,10,11  
GND  
05,14  
D3  
07  
G4  
S4  
T2  
02  
D2  
06  
G2  
S2  
NTC  
01  
-DC  
03,04  
NTC2  
20  
NTC1  
19  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T1_1,_2, T2_1,_2  
D3, D4  
IGBT  
FWD  
1200 V  
600 V  
80 A  
60 A  
75 A  
50 A  
Buck Switch  
Buck Diode  
Boost Switch  
Boost Diode  
Thermistor  
T3, T4  
IGBT  
650 V  
D1, D2  
FWD  
1200 V  
NTC  
Thermistor  
Copyright Vincotech  
27  
12 Jul. 2022 / Revision 1  
10-PZ12NMA080F205-M260F53Y  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 135  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 0 packages see vincotech.com website.  
Package data  
Package data for flow 0 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-PZ12NMA080F205-M260F53Y-D1-14  
12 Jul. 2022  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
28  
12 Jul. 2022 / Revision 1  

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