SI1473DH-T1-E3 [VISHAY]

P-Channel 30-V (D-S) MOSFET; P通道30 -V (D -S )的MOSFET
SI1473DH-T1-E3
型号: SI1473DH-T1-E3
厂家: VISHAY    VISHAY
描述:

P-Channel 30-V (D-S) MOSFET
P通道30 -V (D -S )的MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 光电二极管
文件: 总7页 (文件大小:110K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
New Product  
Si1473DH  
Vishay Siliconix  
P-Channel 30-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
I
D (A)c  
VDS (V)  
rDS(on) (Ω)  
Qg (Typ)  
0.100 at VGS = - 10 V  
0.145 at VGS = - 4.5 V  
- 1.6  
- 1.6  
APPLICATIONS  
- 30  
4.1 nC  
RoHS  
COMPLIANT  
Load Switch for Portable Devices  
SOT-363  
SC-70 (6-LEADS)  
S
D
D
G
1
2
3
6
D
D
S
Marking Code  
BJ XX  
5
4
Lot Traceability  
and Date Code  
G
Part #  
Code  
Top View  
Ordering Information: Si1473DH-T1-E3 (Lead (Pb)-free)  
D
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
- 30  
20  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
-1.6c  
- 1.6c  
- 1.6a, b, c  
- 1.6a, b, c  
- 6.5c  
- 1.6c  
- 1.6a, b, c  
2.78  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 150 °C)a, b  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current (10 µs Pulse Width)  
Continuous Source-Drain Diode Currenta, b  
TC = 25 °C  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
A = 25 °C  
1.78  
Maximum Power Dissipationa, b  
PD  
W
2.5a, b  
T
1a, b  
- 55 to 150  
260  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)c, d  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
Maximum Junction-to-Ambienta, d  
RthJA  
t 5 sec  
60  
34  
80  
45  
°C/W  
RthJF  
Maximum Junction-to-Foot (Drain)  
Steady State  
Notes:  
a. Surface Mounted on 1" x 1" FR4 board.  
b. t = 5 sec.  
c. Package limited.  
d. Maximum under Steady State conditions is 125 °C/W.  
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
www.vishay.com  
1
New Product  
Si1473DH  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = - 250 µA  
ID = - 250 µA  
Drain-Source Breakdown Voltage  
- 30  
V
V
DS Temperature Coefficient  
- 32  
4
mV/°C  
VGS(th) Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
VDS = VGS, ID = - 250 µA  
- 1  
- 3  
- 3  
- 100  
- 1  
V
IGSS  
VDS = 0 V, VGS  
=
20 V  
nA  
VDS = - 30 V, VGS = 0 V  
DS = - 30 V, VGS = 0 V, TJ = 55 °C  
VDS 5 V, VGS = - 10 V  
IDSS  
ID(on)  
rDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
µA  
A
V
- 10  
VGS = - 10 V, ID = - 2.0 A  
0.084  
0.120  
6
0.100  
0.145  
Drain-Source On-State Resistancea  
Ω
S
VGS = - 4.5 V, ID = - 1.6 A  
Forward Transconductancea  
VDS = - 10 V, ID = - 2.0 A  
Dynamicb  
Ciss  
Coss  
Crss  
Qg  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
Turn-On Delay Time  
Rise Time  
365  
68  
51  
4.1  
1.2  
1.7  
9.2  
24  
60  
25  
15  
4
VDS = - 15 V, VGS = 0 V, f = 1 MHz  
pF  
6.2  
Qgs  
Qgd  
Rg  
VDS = - 15 V, VGS = - 4.5 V, ID = - 2.5 A  
f = 1 MHz  
nC  
Ω
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
40  
100  
40  
25  
8
V
DD = - 15 V, RL = 7.5 Ω  
ID - 2 A, VGEN = - 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
ns  
Turn-On Delay Time  
Rise Time  
10  
15  
6
20  
25  
12  
V
DD = - 15 V, RL = 7.5 Ω  
ID - 2 A, VGEN = - 10 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Current  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
- 1.6  
- 6.5  
- 1.2  
35  
A
IS = - 2 A, VGS = 0 V  
Body Diode Voltage  
- 0.85  
23  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
ns  
nC  
Qrr  
ta  
15  
23  
IF = - 2.0 A, di/dt = 100 A/µs, TJ = 25 °C  
9
ns  
tb  
Reverse Recovery Rise Time  
14  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
New Product  
Si1473DH  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
10  
2.0  
1.6  
1.2  
0.8  
0.4  
0.0  
V
GS  
= 10 thru 5 V  
8
6
4
2
0
4 V  
T
= 125 °C  
J
25 °C  
3 V  
- 55 °C  
0.0  
0.6  
V
1.2  
1.8  
2.4  
3.0  
1
2
3
4
5
- Drain-to-Source Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
DS  
Output Characteristics  
Transfer Characteristics  
600  
480  
360  
240  
120  
0
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
C
iss  
V
GS  
= 4.5 V  
V
= 10 V  
GS  
C
oss  
C
rss  
0.0  
1.6  
3.2  
4.8  
6.4  
8.0  
0
6
12  
18  
24  
30  
I
D
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
I
D
= 2.5 A  
I
D
= 2 A  
V
GS  
= 10 V  
V
DS  
= 10 V  
V
= 15 V  
DS  
V
GS  
= 4.5 V  
6
V
DS  
= 20 V  
4
2
0
0
2
4
6
8
10  
- 50 - 25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
g
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
www.vishay.com  
3
New Product  
Si1473DH  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
10  
I
D
= 2 A  
TJ = 150 °C  
1
TJ = 25 °C  
TJ = 125 °C  
0.1  
TJ = 25 °C  
0.01  
0
1
2
3
4
5
6
7
8
9
10  
0.0  
0.3  
0.6  
0.9  
1.2  
1.5  
V
GS  
- Gate-to-Source Voltage (V)  
V
SD  
- Source-to-Drain Voltage (V)  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.6  
30  
24  
18  
12  
6
0.4  
0.2  
I
D
= 250 µA  
I
D
= 5 mA  
0.0  
- 0.2  
- 0.4  
0
- 50 - 25  
0
25  
50  
75  
100 125 150  
0.1  
0.001  
0.01  
1
10  
T
- Temperature (°C)  
Time (sec)  
J
Single Pulse Power, Junction-to-Ambient  
Threshold Voltage  
10  
Limited by r  
DS(on)  
1
1 ms  
10 ms  
100 ms  
0.1  
1 s  
10 s  
dc  
T
= 25 °C  
C
Single Pulse  
0.01  
0.01  
10  
- Drain-to-Source Voltage (V)  
100  
0.1  
1
V
DS  
*V  
GS  
minimum V at which r  
is specified  
GS  
DS(on)  
Safe Operating Area, Junction-to-Ambient  
www.vishay.com  
4
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
New Product  
Si1473DH  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
4.5  
3.5  
2.8  
2.1  
1.4  
0.7  
0.0  
3.6  
2.7  
Package Limited  
1.8  
0.9  
0.0  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
T - Case Temperature (°C)  
C
75  
100  
125  
150  
T
- Case Temperature (°C)  
C
Power Derating, Junction-to-Foot  
Current Derating*  
1.20  
0.96  
0.72  
0.48  
0.24  
0.00  
0
25  
50  
75  
100  
125  
150  
T
- Ambient Temperature (°C)  
A
Power Derating, Junction-to-Ambient  
*The power dissipation PD is based on TJ(max) = 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dis-  
sipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package  
limit.  
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
www.vishay.com  
5
New Product  
Si1473DH  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
0.1  
P
DM  
t
1
0.05  
0.02  
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 125 °C/W  
thJA  
(t)  
3. T - T = P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
1
10  
100  
1000  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-  
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability  
data, see http://www.vishay.com/ppg?74438.  
www.vishay.com  
6
Document Number: 74438  
S-70308-Rev. B, 12-Feb-07  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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