SIP4282ADNP2-T1GE4 [VISHAY]

IC BUF OR INV BASED PRPHL DRVR, PDSO4, 1.60 X 1.20 MM, ROHS COMPLIANT, TDFN-4, Peripheral Driver;
SIP4282ADNP2-T1GE4
型号: SIP4282ADNP2-T1GE4
厂家: VISHAY    VISHAY
描述:

IC BUF OR INV BASED PRPHL DRVR, PDSO4, 1.60 X 1.20 MM, ROHS COMPLIANT, TDFN-4, Peripheral Driver

驱动 光电二极管 接口集成电路 驱动器
文件: 总12页 (文件大小:411K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SiP4282, SiP4282A  
www.vishay.com  
Vishay Siliconix  
1.2 A Slew Rate Controlled Load Switch  
DESCRIPTION  
FEATURES  
The SiP4282 series is a slew rate controlled high side  
switch. The switch is of a low ON resistance P-Channel  
MOSFET that supports continuous current up to 1.2 A.  
• 1.8 V to 5.5 V input voltage range for SiP4282  
• 1.5 V to 5.5 V input voltage range for SiP4282A  
• Very low RDS(on), typically 105 mW at 5 V and  
175 mW at 3 V  
The SiP4282 series operates with an input voltage from  
1.8 V to 5.5 V. It offers under voltage lock out that turns the  
switch off when an input under voltage condition exists. The  
“A” option without UVLO extends the minimum operation  
voltage from 1.8 V down to 1.5 V. The SiP4282 is available  
in two different versions of slew rates, 100 μs and 1 ms. The  
SiP4282 series integrates load discharge circuit to ensure  
the discharge of capacitive load when the switch is  
disabled.  
• Slew rate controlled turn-on time options:  
100 μs and 1 ms  
• Fast shutdown load discharge  
• Low quiescent current, 4 μA for SiP4282  
• Low quiescent current, 1 μA for SiP4282A  
• Low shutdown current < 1 μA  
• UVLO of 1.4 V for SiP4282  
The SiP4282 features low input logic level to interface with  
low control voltage from microprocessors. This device has a  
very low operating current (typically 2.5 μA for SiP4282 and  
50 pA for SiP4282A).  
• PowerPAK SC-75 1.6 mm x 1.6 mm and TDFN4 1.2 mm x  
1.6 mm packages  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
The SiP4282 is available in lead (Pb)-free package options  
including 6 pin PPAK SC75-6, and 4 pin TDFN4 1.2 mm x  
1.6 mm DFN4 packages. The operation temperature range  
is specified from -40 °C to +85 °C.  
APPLICATIONS  
• Cellular telephones  
The SiP4282 compact package options, operation voltage  
range, and low operating current make it a good fit for  
battery power applications.  
• Digital still cameras  
• Personal digital assistants (PDA)  
• Hot swap supplies  
• Notebook computers  
• Personal communication devices  
• Portable Instruments  
TYPICAL APPLICATION CIRCUIT  
V
IN  
IN  
OUT  
V
OUT  
SiP4282  
C
1 µF  
C
OUT  
0.1 µF  
IN  
ON/OFF  
GND  
ON/OFF  
GND  
GND  
Fig. 1 - SiP4282 Typical Application Circuit  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
1
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
Vishay Siliconix  
ORDERING INFORMATION  
TEMPERATURE RANGE  
PACKAGE  
SLEW RATE (TYP.) UNDER VOLTAGE LOCKOUT MARKING  
PART NUMBER  
100 μs  
100 μs  
100 μs  
100 μs  
No  
Yes  
No  
LExxx  
LFxxx  
ABx  
SiP4282ADVP3-T1GE3  
SiP4282DVP3-T1GE3  
SiP4282ADNP3-T1GE4  
SiP4282DNP3-T1GE4  
PPAK SC75-6  
-40 °C to +85 °C  
TDFN4 1.2 x 1.6  
Yes  
ACx  
Note  
xxx = lot code  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
LIMIT  
UNIT  
Supply Input Voltage (VIN)  
-0.3 to +6  
Enable Input Voltage (VON / OFF  
Output Voltage (VOUT  
)
-0.3 to +6  
V
)
-0.3 to VIN + 0.3  
Maximum Continuous Switch Current (Imax.  
)
1.4  
3
VIN 2.5 V  
IN < 2.5 V  
A
Maximum Pulsed Current (IDM) VIN  
V
1.6  
ESD Rating (HBM)  
4000  
-40 to +125  
90  
V
Junction Temperature (TJ)  
°C  
6 pin PPAK SC75 b  
4 pin TDFN4 1.2 mm x 1.6 mm c  
6 pin PPAK SC75 b  
a
Thermal Resistance (JA  
)
°C/W  
mW  
170  
610  
Power Dissipation (PD) a  
4 pin TDFN4 1.2 mm x 1.6 mm c  
324  
Notes  
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
a. Device mounted with all leads and power pad soldered or welded to PC board.  
b. Derate 11.1 mW/°C above TA = 70 °C.  
c. Derate 5.9 mW/°C above TA = 70 °C, see PCB layout.  
RECOMMENDED OPERATING RANGE  
PARAMETER  
LIMIT  
UNIT  
V
Input Voltage Range (VIN) for SiP4282 Version  
Input Voltage Range (VIN) for SiP4282A Version  
Operating Temperature Range  
1.8 to 5.5  
1.5 to 5.5  
-40 to +85  
V
°C  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
2
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
Vishay Siliconix  
SPECIFICATIONS  
TEST CONDITIONS  
LIMITS  
UNLESS OTHERWISE SPECIFIED  
-40 °C to +85 °C  
PARAMETER  
SYMBOL  
UNIT  
V
IN = 5, TA = -40 °C to +85 °C  
(typical values are at TA = 25 °C)  
MIN. a  
TYP. b  
MAX. a  
Operating Voltage c  
For SiP4282xxx  
1.8  
-
-
5.5  
5.5  
1.8  
-
VIN  
Operating Voltage  
For SiP4282Axxx  
1.5  
1
-
V
Under Voltage Voltage  
Under Voltage Lockout Hysteresis  
VUVLO  
For SiP4282xxx, VIN falling  
For SiP4282xxx  
1.4  
VUVLO(hyh)  
250  
2.5  
mV  
μA  
For SiP4282xxx, On / Off = active  
For SiP4282Axxx, On / Off = active  
VIN = 5 V, IL = 500 mA, TA = 25 °C  
VIN = 4.2 V, IL = 500 mA, TA = 25 °C  
-
4
Quiescent Current  
On-Resistance  
IQ  
-
0.00005  
105  
110  
135  
230  
1
-
230  
250  
290  
480  
-
V
IN = 3 V, IL = 500 mA, TA = 25 °C  
-
RDS(on)  
m  
V
IN = 1.8 V, IL = 500 mA, TA = 25 °C  
-
For SiP4282Axxx, VIN = 1.5 V,  
IL = 500 mA, TA = 25 °C  
-
-
-
350  
2800  
-
520  
-
On-Resistance Temp-Coefficient  
On / Off Input Low Voltage d  
TCRDS  
ppm/°C  
For SiP4282Axxx,  
VIN 1.5 V to < 1.8 V  
0.3  
VIL  
VIN 1.8 V to < 2.7 V  
VIN 2.7 V to 5.5 V  
VIN 1.5 V to < 2.7 V  
VIN 2.7 V to < 4.2 V  
VIN 4.2 V to 5.5 V  
VOn / Off = 5.5 V  
-
-
-
0.4  
0.6  
-
-
V
1.3  
1.5  
1.8  
-
-
On / Off Input High Voltage d  
VIH  
-
-
-
-
On / Off Input Leakage  
ISINK  
RPD  
-
1
μA  
Output Pull-Down Resistance  
On / Off = Inactive, TA = 25 °C  
-
180  
250  
SiP4282XXX3 AND SiP4282AXXX3 VERSIONS  
Output Turn-On Delay Time  
Output Turn-On Rise Time  
Output Turn-Off Delay Time  
td(on)  
t(on)  
VIN = 5 V, Rload = 10 , TA = 25 °C  
VIN = 5 V, Rload = 10 , TA = 25 °C  
VIN = 5 V, Rload = 10 , TA = 25 °C  
-
-
-
20  
140  
4
40  
180  
10  
μs  
td(off)  
Notes  
a. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.  
b. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.  
c. Part requires minimum start-up of VIN 2 V to ensure operation down to 1.8 V.  
d. For VIN outside this range consult typical ON / OFF threshold curve.  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
3
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
PIN CONFIGURATION  
Vishay Siliconix  
IN  
6
5
4
1
OUT  
OUT  
ON/OFF  
IN  
4
3
1
2
OUT  
GND  
GND  
IN  
2
3
ON/OFF  
GND  
Bottom View  
Bottom View  
Fig. 2 - PPAK SC75-6 Package  
Fig. 3 - TDFN4 1.2 mm x 1.6 mm Package  
PIN DESCRIPTION  
PIN NUMBER  
NAME  
FUNCTION  
PPAK  
TDFN4  
1, 2  
3
4
3
2
4
1
IN  
GND  
ON/OFF  
OUT  
This pin is the p-channel MOSFET source connection. Bypass to ground through a 1 μF capacitor.  
Ground connection  
Enable input  
5, 6  
This pin is the p-channel MOSFET drain connection. Bypass to ground through a 0.1 μF capacitor.  
TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
SiP4282A  
SiP4282  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5  
VIN (V)  
VIN (V)  
Fig. 4 - Quiescent Current vs. Input Voltage  
Fig. 5 - Quiescent Current vs. Input Voltage  
10  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
SiP4282  
SiP4282A  
1
VIN = 5 V  
0.1  
0.01  
VIN = 5 V  
VIN = 3 V  
VIN = 3 V  
0.001  
- 40  
- 20  
0
20  
40  
60  
80  
100  
- 40  
- 20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
Fig. 6 - Quiescent Current vs. Temperature  
S16-0792-Rev. F, 25-Apr-16  
Fig. 7 - Quiescent Current vs. Temperature  
Document Number: 65740  
4
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (internally regulated, 25 °C, unless otherwise noted)  
350  
300  
250  
200  
150  
100  
50  
300  
250  
200  
150  
100  
50  
VIN = 5 V  
0
0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
- 40  
- 20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
VIN (V)  
Fig. 8 - Off Switch Current vs. Input Voltage  
Fig. 9 - Off Switch Current vs. Temperature  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
180  
160  
140  
120  
100  
80  
ILOAD = 500 mA  
IL = 1.2 A  
VIN = 3 V  
IL = 500 mA  
VIN = 5 V  
IL = 100 mA  
60  
1.5  
2.0  
2.5  
3.0  
3.5  
(V)  
4.0  
4.5  
5.0  
5.5  
- 40  
- 20  
0
20  
40  
60  
80  
100  
V
Temperature (°C)  
IN  
Fig. 10 - RDS(on) vs. Input Voltage  
Fig. 11 - RDS(on) vs. Temperature  
220  
210  
200  
190  
180  
170  
160  
150  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
VIH  
VIL  
- 40  
- 20  
0
20  
40  
60  
80  
100  
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0  
Temperature (°C)  
VIN (V)  
Fig. 12 - Output Pull-Down Resistance vs. Temperature  
Fig. 13 - ON / OFF Threshold vs. Input Voltage  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
5
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
TYPICAL WAVEFORMS  
Vishay Siliconix  
SiP4282xxx3 and SiP4282Axxx3 Switching  
(VIN = 3 V)  
SiP4282xxx3 and SiP4282Axxx3 Switching  
(VIN = 5 V)  
SiP4282xxx3 and SiP4282Axxx3 Turn-Off  
(VIN = 3 V)  
SiP4282xxx3 and SiP4282Axxx3 Turn-Off  
(VIN = 5 V)  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
6
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
BLOCK DIAGRAM  
Vishay Siliconix  
OUT  
IN  
Under  
Voltage  
Lockout  
SiP4282xxx3  
only  
Turn-On  
Slew Rate  
Control  
Level  
Shift  
ON/OFF  
GND  
Fig. 14 - SiP4282 Functional Block Diagram  
PCB LAYOUT  
Fig. 15 - TDFN4 1.2 mm x 1.6 mm PCB Layout  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
7
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiP4282, SiP4282A  
www.vishay.com  
Vishay Siliconix  
DETAILED DESCRIPTION  
The SiP4282 is a P-Channel MOSFET power switches  
designed for high-side slew rate controlled load-switching  
applications. Once turned on, the slew-rate control circuitry  
is activated and current is ramped in a linear fashion until it  
reaches the level required for the output load condition. This  
is accomplished by first elevating the gate voltage of the  
MOSFET up to its threshold voltage and then by linearly  
increasing the gate voltage until the MOSFET becomes fully  
enhanced. At this point, the gate voltage is then quickly  
increased to the full input voltage to reduce RDS(on) of the  
MOSFET switch and minimize any associated power losses.  
Thermal Considerations  
The SiP4282 is designed to maintain a constant output load  
current. Due to physical limitations of the layout and  
assembly of the device the maximum switch current is  
1.2 A, as stated in the Absolute Maximum Ratings table.  
However, another limiting characteristic for the safe  
operating load current is the thermal power dissipation of  
the package. To obtain the highest power dissipation (and a  
thermal resistance of 90 °C/W) the power pad of the device  
should be connected to a heat sink on the printed circuit  
board.  
All versions features a shutdown output discharge circuit  
which is activated at shutdown (when the part is disabled  
through the On / Off pin) and discharges the output pin  
through a small internal resistor hence, turning off the load.  
For SiP4282-3, in instances where the input voltage falls  
below 1.4 V (typically) the under voltage lock-out circuitry  
protects the MOSFET switch from entering the saturation  
region or operation by shutting down the chip.  
The maximum power dissipation in any application is  
dependent on the maximum junction temperature,  
TJ (max.) = 125 °C, the junction-to-ambient thermal  
resistance for the SC-75 PPAK package, J-A = 90 °C/W,  
and the ambient temperature, TA, which may be  
formulaically expressed as:  
TJ (max.) - TA  
------------------------------------  
J-A  
125 - TA  
----------------------  
90  
P (max.) =  
=
APPLICATION INFORMATION  
It then follows that, assuming an ambient temperature of  
70 °C, the maximum power dissipation will be limited to  
about 610 mW.  
Input Capacitor  
While a bypass capacitor on the input is not required, a 1 μF  
or larger capacitor for CIN is recommended in almost all  
applications. The bypass capacitor should be placed as  
physically close as possible to the SiP4282 to be effective in  
minimizing transients on the input. Ceramic capacitors are  
recommended over tantalum because of their ability to  
withstand input current surges from low impedance sources  
such as batteries in portable devices.  
So long as the load current is below the 1.2 A limit, the  
maximum continuous switch current becomes a function  
two things: the package power dissipation and the RDS(on) at  
the ambient temperature.  
As an example let us calculate the worst case maximum  
load current at TA = 70 °C. The worst case RDS(on) at 25 °C  
occurs at an input voltage of 1.8 V and is equal to 480 m.  
The RDS(on) at 70 °C can be extrapolated from this data using  
the following formula  
Output Capacitor  
A 0.1 μF capacitor or larger across VOUT and GND is  
recommended to insure proper slew operation. COUT may  
be increased without limit to accommodate any load  
transient condition with only minimal affect on the SiP4282  
turn on slew rate time. There are no ESR or capacitor type  
requirement.  
RDS(on) (at 70 °C) = RDS(on) (at 25 °C) x (1 + TC x T)  
Where TC is 3300 ppm/°C. Continuing with the calculation  
we have  
RDS(on) (at 70 °C) = 480 mx (1 + 0.0033 x (70 °C - 25 °C)) =  
551 m  
Enable  
The maximum current limit is then determined by  
The On / Off pin is compatible with both TTL and CMOS  
logic voltage levels.  
P (max.)  
ILOAD (max.) ----------------------  
RDS(ON)  
Protection Against Reverse Voltage Condition  
The P-channel MOSFET pass transistor has an intrinsic  
diode that is reversed biased when the input voltage is  
greater than the output voltage. Should VOUT exceed VIN,  
this intrinsic diode will become forward biased and allow  
excessive current to flow into the IC thru the VOUT pin and  
potentially damage the IC device. Therefore extreme care  
should be taken to prevent VOUT from exceeding VIN.  
which in case is 1.05 A. Under the stated input voltage  
condition, if the 1.05 A current limit is exceeded the internal  
die temperature will rise and eventually, possibly damage  
the device.  
In conditions where VOUT exceeds VIN a Schottky diode in  
parallel with the internal intrinsic diode is recommended to  
protect the SiP4282.  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?65740.  
S16-0792-Rev. F, 25-Apr-16  
Document Number: 65740  
8
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Package Information  
www.vishay.com  
Vishay Siliconix  
TDFN4 1.2 x 1.6 Case Outline  
D
D2  
b
3
4
3
Pin #1 ID  
(Optional)  
4
2
1
1
2
e
Index Area  
(D/2 x E/2)  
Bottom View  
Top View  
Side View  
MILLIMETERS  
INCHES  
DIM.  
MIN.  
0.45  
0.00  
NOM.  
0.55  
-
MAX.  
0.60  
MIN.  
0.017  
0.00  
NOM.  
0.022  
MAX.  
0.024  
0.002  
A
A1  
A3  
b
0.05  
-
0.15 REF. or 0.127 REF. (1)  
0.006 or 0.005 (1)  
0.20  
1.15  
0.81  
0.25  
1.20  
0.30  
1.25  
0.91  
0.008  
0.045  
0.032  
0.010  
0.012  
0.049  
0.036  
D
0.047  
D2  
e
0.86  
0.034  
0.50 BSC  
1.60  
0.020  
E
1.55  
0.45  
1.65  
0.55  
0.061  
0.018  
0.063  
0.065  
0.022  
E2  
K
0.50  
0.020  
0.25 typ.  
0.30  
0.010 typ.  
0.012  
L
0.25  
0.35  
0.010  
0.014  
ECN: T16-0143-Rev. C, 18-Apr-16  
DWG: 5995  
Note  
(1)  
The dimension depends on the leadframe that assembly house used.  
Revision: 18-Apr-16  
Document Number: 65734  
1
For technical questions, contact: powerictechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Package Information  
Vishay Siliconix  
PowerPAK® SC75-6L (Power IC only)  
D1  
Exposed pad  
e
b
D
Pin4  
Pin 5 Pin6  
K
K
PPAKSC75  
(1.6 x 1.6 mm)  
E1  
E
Exposed pad  
L
Pin3  
Pin 2  
e1  
Pin1  
K2  
K2  
Pin 1 Dot  
By Marking  
Top View  
Bottom View  
A
C
A1  
Side View  
MILLIMETERS  
INCHES  
DIM  
A
Min  
0.70  
0
Nom  
0.75  
-
Max  
0.80  
0.05  
0.30  
0.25  
1.65  
1.05  
1.65  
0.65  
Min  
0.028  
0
Nom  
0.030  
-
Max  
0.032  
0.002  
0.012  
0.010  
0.065  
0.041  
0.065  
0.026  
A1  
b
0.20  
0.15  
1.55  
0.95  
1.55  
0.55  
0.25  
0.20  
1.60  
1.00  
1.60  
0.60  
0.50 BSC  
1.00 BSC  
-
0.008  
0.006  
0.0061  
0.037  
0.061  
0.022  
0.010  
0.008  
0.063  
0.039  
0.063  
0.024  
0.020 BSC  
0.039 BSC  
-
C
D
D1  
E
E1  
e
e1  
K
0.15  
0.20  
0.20  
-
-
0.006  
0.008  
0.008  
-
K2  
L
-
0.25  
0.30  
0.010  
0.012  
ECN: S-60845-Rev. B, 22-May-06  
DWG: 5953  
Document Number: 73850  
22-May-06  
www.vishay.com  
1
PAD Pattern  
Vishay Siliconix  
RECOMMENDED MINIMUM PADS FOR TDFN4 1.2 x 1.6  
0.86  
0.50  
0.30  
3
4
1
2
Recommended Minimum Pads  
Dimensions in mm  
Document Number: 66558  
Revision: 05-Mar-10  
www.vishay.com  
1
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding  
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1

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