SUD50P08-25L-E3 [VISHAY]

P-Channel 80-V (D-S) 175 °C MOSFET; P通道80 -V ( D- S) 175℃ MOSFET
SUD50P08-25L-E3
型号: SUD50P08-25L-E3
厂家: VISHAY    VISHAY
描述:

P-Channel 80-V (D-S) 175 °C MOSFET
P通道80 -V ( D- S) 175℃ MOSFET

文件: 总7页 (文件大小:105K)
中文:  中文翻译
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New Product  
SUD50P08-25L  
Vishay Siliconix  
P-Channel 80-V (D-S) 175 °C MOSFET  
FEATURES  
PRODUCT SUMMARY  
TrenchFET® Power MOSFET  
VDS (V)  
rDS(on) (Ω)  
Qg (Typ)  
I
D (A)a  
- 50  
RoHS  
0.0252 at VGS = - 10 V  
0.029 at VGS = - 4.5 V  
COMPLIANT  
- 80  
55 nC  
- 47  
TO-252  
S
G
Drain Connected to Tab  
G
D
S
Top View  
Ordering Information: SUD50P08-25L-E3 (Lead (Pb)-free)  
D
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
Limit  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
- 80  
20  
V
VGS  
- 50a  
- 42.5a  
- 12.5b, c  
- 10.5b, c  
TC = 25 °C  
C = 70 °C  
T
Continuous Drain Current (TJ = 175 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
A
IDM  
IS  
Pulsed Drain Current  
- 40  
- 50a  
TC = 25 °C  
TA = 25 °C  
Continuous Source-Drain Diode Current  
- 6.9b, c  
- 45  
101  
IAS  
Avalanche Current  
L = 0.1 mH  
TC = 25 °C  
EAS  
Single-Pulse Avalanche Energy  
mJ  
W
136  
T
C = 70 °C  
A = 25 °C  
95  
PD  
Maximum Power Dissipation  
8.3b, c  
T
5.8b, c  
TA = 70 °C  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
- 55 to 175  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
Maximum Junction-to-Ambientb, d  
RthJA  
t 10 sec  
15  
18  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
Steady State  
0.85  
1.1  
Notes:  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 10 sec.  
d. Maximum under steady state conditions is 40 °C/W.  
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
www.vishay.com  
1
New Product  
SUD50P08-25L  
Vishay Siliconix  
SPECIFICATIONS T = 25 °C, unless otherwise noted  
J
Parameter  
Symbol  
Test Conditions  
Min  
Typ  
Max  
Unit  
Static  
VDS  
ΔVDS/TJ  
ΔVGS(th)/TJ  
VGS(th)  
VGS = 0 V, ID = - 250 µA  
ID = - 250 µA  
Drain-Source Breakdown Voltage  
- 80  
V
V
DS Temperature Coefficient  
- 73  
mV/°C  
VGS(th) Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
- 5.5  
VDS = VGS, ID = - 250 µA  
- 1  
- 3  
100  
- 1  
V
IGSS  
VDS = 0 V, VGS  
=
20 V  
nA  
VDS = - 80 V, VGS = 0 V  
DS = - 80 V, VGS = 0 V, TJ = 55 °C  
VDS 5 V, VGS = - 10 V  
IDSS  
ID(on)  
rDS(on)  
gfs  
Zero Gate Voltage Drain Current  
On-State Drain Currenta  
µA  
A
V
- 10  
VGS = - 10 V, ID = - 12.5 A  
0.021  
0.024  
52  
0.0252  
0.029  
Drain-Source On-State Resistancea  
Forward Transconductancea  
Ω
S
VGS = - 4.5 V, ID = - 10.5 A  
VDS = - 15 V, ID = - 12.5 A  
Dynamicb  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
4700  
320  
235  
105  
55  
VDS = - 40 V, VGS = 0 V, f = 1 MHz  
pF  
VDS = - 40 V, VGS = - 10 V, ID = - 12.5 A  
160  
85  
Qg  
Total Gate Charge  
nC  
Ω
Qgs  
Qgd  
Rg  
Gate-Source Charge  
V
DS = - 40 V, VGS = - 4.5 V, ID = - 12.5 A  
16  
Gate-Drain Charge  
26  
Gate Resistance  
f = 1 MHz  
4
td(on)  
tr  
td(off)  
tf  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
45  
70  
330  
145  
165  
25  
Rise Time  
220  
95  
V
DD = - 40 V, RL = 3.8 Ω  
ns  
ID - 10.5 A, VGEN = - 10 V, Rg = 1 Ω  
Turn-Off Delay Time  
Fall Time  
110  
15  
Turn-On Delay Time  
Rise Time  
25  
40  
V
DD = - 40 V, RL = 3.8 Ω  
ns  
A
ID - 10.5 A, VGEN = - 4.5 V, Rg = 1 Ω  
Turn-Off Delay Time  
105  
100  
160  
150  
Fall Time  
Drain-Source Body Diode Characteristics  
Continuous Source-Drain Diode Current  
Pulse Diode Forward Currenta  
Body Diode Voltage  
IS  
ISM  
VSD  
trr  
TC = 25 °C  
- 50  
- 40  
- 1.2  
85  
IS = - 10.5 A  
- 0.8  
55  
V
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Reverse Recovery Fall Time  
Reverse Recovery Rise Time  
ns  
nC  
Qrr  
ta  
110  
37  
165  
IF = - 10.5 A, di/dt = 100 A/µs, TJ = 25 °C  
ns  
tb  
18  
Notes:  
a. Pulse test; pulse width 300 µs, duty cycle 2 %.  
b. Guaranteed by design, not subject to production testing.  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation  
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
www.vishay.com  
2
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
New Product  
SUD50P08-25L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C unless noted  
20  
16  
12  
8
40  
35  
30  
25  
20  
15  
10  
5
V
GS  
= 10 thru 4 V  
T
A
= 125 °C  
25 °C  
4
3 V  
- 55 °C  
3.0 3.5  
0
0.0  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V
GS  
- Gate-to-Source Voltage (V)  
V
DS  
- Drain-to-Source Voltage (V)  
Output Characteristics  
Transfer Characteristics  
0.026  
8000  
7000  
6000  
5000  
4000  
3000  
2000  
1000  
0
0.025  
0.024  
0.023  
0.022  
0.021  
0.020  
V
GS  
= 6 V  
C
iss  
V
GS  
= 10 V  
C
oss  
C
rss  
0
5
10  
15  
20  
25  
30  
35  
40  
0
10  
20  
30  
40  
50  
60  
70  
80  
I
D
- Drain Current (A)  
V
DS  
- Drain-to-Source Voltage (V)  
On-Resistance vs. Drain Current and Gate Voltage  
Capacitance  
2.3  
2.1  
1.9  
1.7  
1.5  
1.3  
1.1  
0.9  
0.7  
0.5  
10  
8
I
D
= 12.5 A  
I
D
= 12.5 A  
V
GS  
= 10 V  
V
DS  
= 64 V  
6
V
DS  
= 40 V  
V
GS  
= 6 V  
4
2
0
- 50 - 25  
0
25  
50  
75 100 125 150 175  
0
20  
40  
60  
80  
100  
120  
Q
g
- Total Gate Charge (nC)  
T - Junction Temperature (°C)  
J
Gate Charge  
On-Resistance vs. Junction Temperature  
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
www.vishay.com  
3
New Product  
SUD50P08-25L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C unless noted  
0.05  
0.04  
0.03  
0.02  
0.01  
40  
T
= 125 °C  
T
= 150 °C  
A
J
10  
T
= 25 °C  
A
T
= 25 °C  
J
1
0.00  
2
3
4
5
6
7
- Gate-to-Source Voltage (V)  
GS  
8
9
10  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
V
SD  
- Source-to-Drain Voltage (V)  
On-Resistance vs. Gate-to-Source Voltage  
Source-Drain Diode Forward Voltage  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
35  
30  
I
= 250 µA  
D
25  
20  
15  
10  
5
0
- 50 - 25  
0
25  
50  
75 100 125 150 175  
0.01  
0.1  
1
10  
100  
1000  
T
J
- Temperature (°C)  
Time (sec)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
100  
100 µs  
*Limited by  
DS(on)  
r
10  
1
1 ms  
10 ms  
100 ms  
1 s  
10 s  
0.1  
0.01  
dc  
T
= 25 °C  
A
Single Pulse  
0.001  
0.1  
1
10  
100  
1000  
V
DS  
- Drain-to-Source Voltage (V)  
*V > minimum V  
GS  
at which r is specified  
GS  
DS(on)  
Safe Operating Area, Junction-to-Ambient  
www.vishay.com  
4
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
New Product  
SUD50P08-25L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C unless noted  
140  
120  
100  
80  
60  
50  
40  
30  
20  
10  
0
Package Limited  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
175  
0
25  
50  
75  
100  
125  
150  
175  
T
C
- Case Temperature (°C)  
T
C
- Case Temperature (°C)  
Power Derating  
Current Derating*  
100  
10  
L · I  
D
T
A
=
BV - V  
DD  
1
0.000001  
0.00001  
0.0001  
0.001  
0.01  
T
A
- Time In Avalanche (sec)  
Single Pulse Avalanche Capability  
*The power dissipation PD is based on TJ(max) = 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissi-  
pation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit.  
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
www.vishay.com  
5
New Product  
SUD50P08-25L  
Vishay Siliconix  
TYPICAL CHARACTERISTICS 25 °C unless noted  
2
1
Duty Cycle = 0.5  
0.2  
Notes:  
0.1  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
1. Duty Cycle, D =  
2
2. Per Unit Base = R  
= 65 °C/W  
thJA  
(t)  
3. T - T = P  
Z
JM  
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-2  
-1  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
100  
1000  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Case  
10  
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Tech-  
nology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability  
data, see http://www.vishay.com/ppg?73443.  
Document Number: 73443  
S-71660-Rev. B, 06-Aug-07  
www.vishay.com  
6
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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