TFDS4500 [VISHAY]
2.7-5.5V Serial Infrared Transceiver Module Family; 2.7-5.5V串行红外收发器模块系列
| 型号： | TFDS4500 |
| 厂家： | 
VISHAY |
| 描述： | 2.7-5.5V Serial Infrared Transceiver Module Family |
| 文件： | 总12页 (文件大小：557K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
2.7–5.5V Serial Infrared Transceiver Module Family
(SIR, 115.2 kbit/s)
Features
Applications
D Compliant to IrDA 1.2 (up to
D BabyFace (Universal) Package
Capable of Surface Mount
Solderability to Side- and
Top-View Orientation
D Directly Interfaces with Various
Super I/O and Controller Devices
and TEMIC’s TOIM3000 and
TOIM3232 I/Os
D Notebook Computers, Desktop
PCs, Palmtop Computers (Win
CE, Palm PC), PDAs
D Digital Still and Video Cameras
D Printers, Fax Machines,
Photocopiers, Screen Projectors
D Telecommunication Products
(Cellular Phones, Pagers)
D Internet TV Boxes, Video
conferencing systems
115.2 kbit/s)
D Wide Operating Voltage Range
(2.7 to 5.5 V )
D Low Power Consumption
(1.3 mA Supply Current)
D Power Sleep Mode Through
V
CC1
/SD Pin (5 nA Sleep
D Few External Components
Current)
Required
D Long Range (up to 3.0 m at 115.2
D Backward Compatible to All
TEMIC SIR Infrared
kbit/s)
D External Infrared Adapters
D Three Surface Mount Package
Options
– Universal (9.7 x 4.7 x 4.0 mm)
– Side View (13.0x5.95x5.3mm)
– Top View (13.0x7.6x5.95mm)
(Dongles)
Transceivers
D Medical and Industrial Data
Collection Devices
D Built–in EMI Protection – No
External Shielding Necessary
Description
The TFDU4100, TFDS4500, and TFDT4500 are a family provides flexibility for a variety of applications and space
of low-power infrared transceiver modules compliant to constraints.
the IrDA 1.2 standard for serial infrared (SIR) data
communication, supporting IrDA speeds up to 115.2
kbit/s. Integrated within the transceiver modules are a The transceivers are capable of directly interfacing with
photo PIN diode, infrared emitter (IRED), and a a wide variety of I/O chips which perform the pulse-width
low-power analog control IC to provide a total front–end modulation/demodulation function, including TEMIC’s
solution in a single package. TEMIC’s SIR transceivers TOIM3000 and TOIM3232.
At a minimum, a
are available in three package options, including our current-limiting resistor in series with the infrared emitter
BabyFace package (TFDU4100), the smallest SIR and a Vcc bypass capacitor are the only external
transceiver available on the market. This wide selection components required to implement a complete solution.
Package Options
TFDU4100
Baby Face (Universal)
TFDS4500
Side View
TFDT4500
Top View
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.
Pending—Rev. A, 03-Apr-98
1
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
Functional Block Diagram
V
/SD
CC1
V
CC2
Driver
Rxd
Amplifier
Comparator
R
S
IRED Anode
AGC
Logic
SC
Txd
IRED Cathode
Open Collector Driver
GND
Pin Assignment and Description
Pin Number
“ U ”, “ T ”
Option
“ S ”
Option
Function
Description
I/O
Active
1
8
IRED Anode IRED anode, should be externally connected to V
control resistor
through a current
CC2
2
3
4
1
7
2
IRED Cathode IRED cathode, internally connected to driver transistor
Txd
Rxd
Transmit Data Input
I
HIGH
LOW
Received Data Output, push–pull CMOS driver output capable of driving a
standard CMOS or TTL load. No external pull–up or pull–down resistor is
required (20 kΩ resistor internal to device). Pin is inactive during
transmission.
O
5
6
7
8
6
3
5
4
NC
Do not connect
V
/ SD
Supply Voltage/Shutdown (see “Shutdown” on page 6)
CC1
SC
Sensitivity control
Ground
I
HIGH
GND
8
7
6
5
IRED
Detector
IRED
Detector
1
2 3 4 5 6 7 8
1
2
3
4
1
2
3
4
5
6
7
8
IRED
Detector
”U” Option
BabyFace (Universal)
”S” Option
Side View
”T” Option
Top View
2
Pending—Rev. A, 03-Apr-98
Pre-Release Information
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
Ordering Information
Part Number
TFDU4100–TR3
TFDU4100–TT3
TFDS4500–TR3
Qty/ Reel
Description
1000 pcs
1000 pcs
750 pcs
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
TFDT4500–TR3
750 pcs
Absolute Maximum Ratings
Parameter
Symbol
Test Conditionsa
Minb
– 0.5
– 0.5
Typc
Maxb
6
Unit
Supply Voltage Range
V
V
CC1
CC2
V
Voltage Range of IRED Drive Output
IRED anode pin, T LOW
6
xd
d
Input Currents
10
mA
Output Sink Current
25
e
Power Dissipation
P
200
125
85
mW
D
Junction Temperature
T
J
Ambient Temperature Range (Operating)
Storage Temperature Range
Soldering Temperature
T
amb
–25
–25
°C
T
stg
85
t = 20 s
215
240
100
500
6
Average IRED Current
I
(DC)
IRED
mA
V
Repetitive Pulsed IRED Current
IRED Anode Voltage at Current Output
Transmitter Data Input Voltage
Receiver Data Output Voltage
I
(RP)
t < 90µs, t <20%
IRED
on
V
– 0.5
– 0.5
– 0.5
2.5
IREDA
V
V
V
+ 0.5
+ 0.5
Txd
cc
cc
V
Rxd
f
Virtual Source Size
d
2.8
mm
Maximum Intensity for Class 1 Operation of
IEC 825 or EN60825
EN60825, 1997
400
mW/sr
g
Notes
a. Reference point GND pin unless otherwise noted.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. All pins except IRED cathode pin and IRED anode pin.
e. See Derating Curve
f. Method: (1-1/e) encircled energy.
g. Worst case IrDA SIR pulse pattern.
Pending—Rev. A, 03-Apr-98
3
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
Electrical Characteristics
Parameter
Transceiver
Symbol
Test Conditionsa
Minb
Typc
Maxb
Unit
Supply Voltage
Supply Voltage
V
V
Receive Mode
2.7
2.0
5.5
5.5
2.5
1.5
5.5
4.5
CC1
CC1
V
Transmit Mode, R = 51 Ω
2
V
V
V
V
= 5.5V
= 2.7V
= 5.5V
= 2.7V
1.3
1.0
5.0
3.5
CC1
CC1
CC1
CC1
Supply Current, V
(Receive Mode)
Pin
CC1
I
S
S
mA
Supply Current, V
(Transmit Mode)
Pin (avg)
CC1
I
d
Leakage Current of IR Emitter, IRED
Anode Pin
V
= OFF, T = LOW,
V
= 6V,
CC1
xd
CC2
I
I
0.005
50
0.5
µA
µs
S
T = 25°– 85° C
Transceiver Power On Settling Time
S
Optoelectronic Characteristics
Parameter
Symbol
Test Conditionsa
Minb
Typc
Maxb
Unit
Receiver
E
α = ±15_, SIR Mode, SC = LOW
α = ±15_, SIR Mode, SC = LOW,
20
35
35
15
emin
e
Min Detection Threshold Irradiance
Min Detection Threshold Irradiance
2
2
mW/m
V
= 2.7V
CC1
d
E
emin
α = ±15_, SIR Mode, SC = HIGH
6
3.3
8
10
5
E
emax
α = ± 90_, SIR Mode, V
α = ± 90_, SIR Mode, V
= 5V
CC1
d
2
Max Detection Threshold Irradiance
kW/m
= 3V
15
CC1
Logic Low Receiver Input Irradiance
Rxd Output Voltage
E
SC = HIGH or LOW
4
mW/m
V
emax (low)
V
Active, C = 15 pF, R = 2.2 kΩ
0.5
4
0.8
OL
V
Non–active, C = 15 pF, R = 2.2 kΩ
V
–0.5
CC
OH
Output Current
V
< 0.8V
mA
ns
OL
Rise Time
t
t
C = 15 pF, R = 2.2 kΩ
C = 15 pF, R = 2.2 kΩ
20
1400
200
8
r
Fall Time
20
f
Rxd Pulse Width of Output Signal
P
115.2 kbit/s mode
1.41
w
µs
µs
f
Jitter
t
Over a period of 10 bit, 115.2 kbit/s
2
j
Latency
Notes
t
100
500
L
a.
T
= 25_C, V = 2.7 – 5.5 V unless otherwise noted.
amb
CC
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d.
I
(peak) = 210 mA (At IRED Anode pin)
IRED
–8
e. BER = 10 (IrDA specification).
f. Leading edge of output signal.
4
Pending—Rev. A, 03-Apr-98
Pre-Release Information
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
Optoelectronic Characteristics (Cont’d)
Parameter
Transmitter
Symbol
Test Conditionsa
Minb
Typc
Maxb
Unit
Current limiting resistor is series to
d
IRED Operating Current
I
0.3
0.4
0.8
A
V
D
IRED: R = 8.2 Ω, V
= 5V
1
CC2
Logic Low Transmitter Input Voltage
Logic High Transmitter Input Voltage
V
(T
IL xd
)
0
V
(T
IH xd
)
2.4
V
+0.5
CC1
Current limiting resistor in series to
e
IRED: R = 8.2Ω @ V
= 5V, α =
Output Radiant Intensity
I
45
140
200
mW/sr
1
CC2
eH
±15_
Logic Low Level
Output Radiant Intensity
I
0.04
900
mW/sr
eL
Angle of Half Intensity
α
±24
_
Peak Wavelength of Emission
Halfwidth of Emission Spectrum
λ
880
P
nm
60
115.2 kHz square wave signal, duty
cycle 1:1
Optical Rise Time, Fall Time
Optical Overshoot
t , t
200
600
25
ns
%
µs
R
F
Over a period of 10 bits, independent
of information content
Rising Edge Peak–to–Peak Jitter
Notes
t
j
0.2
a.
T
= 25_C, V = 2.7 – 5.5 V unless otherwise noted.
amb
CC
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. IRED Operating Current can be adjusted by variation of R
e. In agreement with IEC 825 eye safety limit
1
Recommended Circuit Diagram
The only required components for designing an IrDA 1.2 given by the absolute maximum ratings on the data sheet
compatible design using TEMIC SIR transceivers are a and the eye safety limitations given by IEC825–1.
current limiting resistor to the IRED. However,
V
CC2
depending on the entire system design and board layout,
additional components may be required (see Figure 1).
V
SD
CC1/
R1
TFDx4x00
IRED
Cathode Anode
IRED
R2
It is recommended that the capacitors C1 and C2 are
positioned as near as possible to the transceiver power
supply pins, as in the proposed layout in Figure 1. A
tantalum capacitor should be used for C1, while a ceramic
capacitor should be used for C2 to suppress RF noise.
Also, when connecting the described circuit to the power
supply, low impedance wiring should be used.
Rxd
Txd
Rxd
Txd
SC
V
SD
CC1/
C1
C2
GND
NC
GND
SC
R1 is used for controlling the current through the IR
emitter. For increasing the output power of the IRED, the
value of the resistor should be reduced. Similarly, to
reduce the output power of the IRED, the value of the
resistor should be increased. For typical values of R1 see
Fig 2. For IrDA compliant operation, a current control
Note: Outlined components are optional depending on quality of
power supply.
Figure 1. Recommended Application Circuit
resistor of 8–12 Ω is recommended. The upper drive R2, C1 and C2 are optional and dependent on the quality
current limitation is dependent on the duty cycle and is of the supply voltage V
and injected noise. An
CC1
Pending—Rev. A, 03-Apr-98
5
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
unstable power supply with dropping voltage during
transmission may reduce sensitivity (and transmission
range) of the transceiver.
Shutdown
The internal switch for the IRED in TEMIC SIR
transceivers is designed to be operated like an open
Table 1. Recommended Application Circuit Components
collector driver. Thus, the V
source can be an
Component
Recommended Value
CC2
unregulated power supply while only a well regulated
power source with a supply current of 1.3 mA connected
C1
100 nF, Ceramic (use 470 nF for less stable power
supplies)
to V /SD is needed to provide power to the remainder
CC1
C2
R1
1 µF, Tantalum
of the transceiver circuitry in receive mode. In transmit
mode, this current is slightly higher (approxiamately 4
mA average at 3V supply current) and the voltage is not
required to be kept as stable as in receive mode. A voltage
8.2 Ω, 0.25 W (recommend using two 0.125 W
resistors in parallel)
R2
22 – 47 Ω, 0.125 W
drop of V
is acceptable down to about 2.2V when
CC1
buffering the voltage directly from the V
by a 470 nF ceramic capacitor (C1) and a 51 Ω serial
resistor (R2) is used (see figure 1).
pin to GND
The sensitivity control (SC) pin allows the minimum
detection irradiance threshold of the transceiver to be
lowered when set to a logic HIGH. Lowering the
irradiance threshold increases the sensitivity to infrared
signals and increases transmission range up to 3 meters.
However, setting the SC pin to logic HIGH also makes
the transceiver more susceptible to transmission errors
due to an increased sensitivity to fluorescent light
distrubances. It is recommended to set the SC pin to logic
LOW or left open if the increased range is not required or
if the system will be operating in bright ambient light.
CC1
This configuration minimizes the influence of high
current surges from the IRED on the internal analog
control circuitry of the transceiver and the application
circuit. Also, board space and cost savings can be
achieved by eliminating the additional linear regulator
normally needed for the IRED’s high current
requirements.
The guide pins on the side-view and top-view packages
are internally connected to ground but should not be
connected to the system ground to avoid ground loops.
They should be used for mechanical purposes only and
should be left floating.
The transceiver can be very efficiently shutdown by
keeping the IRED connected to the power supply V
CC2
but switching off V /SD. The power source to
CC1
300
250
V
CC1
/SD can be provided directly from a microcontroller
(see Figure 3). In shutdown, current loss is realized only
as leakage current through the current limiting resistor to
the IRED (typically, 5 nA). The settling time after
200
150
100
5.25 V, Min. Efficiency,
Min. VF, Min. R
switching V /SD on again is approxiamately 50 µs.
CC1
DSon
TEMIC’s TOIM3232 interface circuit is designed for this
shutdown feature. The V _SD, S0 or S1 outputs on the
cc
TOIM3232 can be used to power the transceiver with the
necessary supply current.
4.75 V, Min. Efficiency,
Min. VF, Max. R
DSon
50
0
If the microcontroller or the microprocessor is unable to
drive the 1.3-mA supply current required by the
transceiver, a low-cost SOT-23 pnp transistor can be used
to switch voltage on and off from the regulated power
supply (see figure 4). The additional component cost is
minimal and saves the system designer additional power
supply costs.
IrDA Field of View: Cone of "15_
4.0
6.0
8.0
10.0 12.0 14.0
16.0
Current Control Resistor, Rl (W)
Figure 2. I vs R
e
l
6
Pending—Rev. A, 03-Apr-98
Pre-Release Information
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
Shutdown (Cont’d)
I
IRED
TFDU4100 (Note: Typical Values Listed)
Receive Mode
+
_
@5 V: I
= 300 mA, I = 1.3 mA
Power Supply
IRED
S
Regulated Power Supply
R
ILIM
@2.7 V: I
= 300 mA, I = 1.0 mA
S
IRED
50 mA
Transmit Mode
@5 V: I
= 300 mA, I = 5 mA (Avg.)
IRED
S
@2.7 V: I
= 300 mA, I = 3.5 mA (Avg.)
IRED
S
IRED
Anode
Microcontroller or
Microprocessor
20 mA
I
S
V
/SD
CC1
Figure 3.
I
IRED
TFDU4100 (Note: Typical Values Listed)
Receive Mode
+
_
@5 V: I
= 300 mA, I = 1.3 mA
Power Supply
IRED
S
Regulated Power Supply
50 mA
R
1
@2.7 V: I
= 300 mA, I = 1.0 mA
S
IRED
Transmit Mode
@5 V: I
= 300 mA, I = 5 mA (Avg.)
IRED
S
@2.7 V: I
= 300 mA, I = 3.5 mA (Avg.)
IRED
S
IRED
Anode
I
S
Microcontroller or
Microprocessor
20 mA
V
/SD
CC1
Figure 4.
Pending—Rev. A, 03-Apr-98
7
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
TFDU4100 – BabyFace (Universal) Package
Mechanical Dimensions
8
Pending—Rev. A, 03-Apr-98
Pre-Release Information
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
TFDS4500 – Side View Package
Mechanical Dimensions
TK84 731
TFDS 4500
Pending—Rev. A, 03-Apr-98
9
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
TFDT4500 – Top View Package
Mechanical Dimensions
TK84 731
TFDS 4500
10
Pending—Rev. A, 03-Apr-98
Pre-Release Information
TELEFUNKEN
Semiconductor
TFDU4100/TFDS4500/TFDT4500
Recommended SMD Pad Layouta
TFDU4100
Ć
BabyFace (Universal) Package
TFDT4500
Ć
Top View Package
(note: leads of the device should be at least 0.3
mm within the ends of the pads. Pad is longer to
designate pin connection to transciver)
TFDS4500
Ć
Side View Package
1
1
a. The leads of the device should be soldered in the center position.
Pending—Rev. A, 03-Apr-98
11
Pre-Release Information
TELEFUNKEN
TFDU4100/TFDS4500/TFDT4500
Semiconductor
Recommended Solder Profile
260
240
220
10 s Max. @ 230 _C
2 – 4 _C/Seconds
200
180
160
_
140
120 – 180 Seconds
90 s Max.
120
100
80
2 – 4 _C/Seconds
60
40
20
0
0
50
100
150
200
250
300
350
Time (Seconds)
Current Derating Curve
600
500
400
300
Current derating as a function of the
maximum forward current of IRED.
Maximum duty cycle: 20%
200
100
0
–40
–20
0
20
40
60
80
100
120
140
Temperature (_C)
12
Pending—Rev. A, 03-Apr-98
Pre-Release Information
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