TFDU6300-TT1 [VISHAY]
Fast Infrared Transceiver Module (FIR, 4 Mbit/s) for 2.4 V to 3.6 V Operation; 快速红外收发器模块（ FIR ， 4兆位/秒）为2.4 V至3.6 V操作
| 型号： | TFDU6300-TT1 |
| 厂家： | 
VISHAY |
| 描述： | Fast Infrared Transceiver Module (FIR, 4 Mbit/s) for 2.4 V to 3.6 V Operation |
| 文件： | 总15页 (文件大小：214K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TFDU6300
Vishay Semiconductors
Fast Infrared Transceiver Module (FIR, 4 Mbit/s)
for 2.4 V to 3.6 V Operation
Description
The TFDU6300 transceiver is an infrared transceiver
module compliant to the latest IrDA physical layer
low-power standard for fast infrared data
communication, supporting IrDA speeds up to
®
®
4 Mbit/s (FIR), HP-SIR , Sharp ASK and carrier
based remote control modes up to 2 MHz. Integrated
within the transceiver module is a photo PIN diode, an
infrared emitter (IRED), and a low-power control IC to
provide a total front-end solution in a single package.
This new Vishay FIR transceiver is built in a new
smaller package using the experiences of the lead
20101
frame BabyFace technology. The transceivers are implementing a complete solution. TFDU6300 has a
capable of directly interfacing with a wide variety of tri-state output and is floating in shutdown mode with
I/O devices, which perform the modulation/ a weak pull-up. An otherwise identical transceiver
demodulation function. At a minimum, a V bypass with low-voltage (1.8 V) logic levels is available as
CC
capacitor is the only external component required TFDU6301.
Features
• Compliant to the latest IrDA physical layer
specification (up to 4 Mbit/s) with an
extended low power range of > 70 cm
(typ. 1 m) and TV remote control (> 9 m)
• Low profile (universal) package capable of surface
mount soldering to side and top view orientation
• Directly interfaces with various super I/O and
controller devices
e3
• Operates from 2.4 V to 3.6 V within
specification
• Low power consumption (1.8 mA typ. supply
current)
• Only one external component required
• Split power supply, transmitter and receiver can be
operated from two power supplies with relaxed
requirements saving costs
• Power shutdown mode (0.01 µA typ. shutdown
current)
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
• Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96EC
• Surface mount package
- Universal (L 8.5 mm x H 2.5 mm x W 3.1 mm)
• Tri-state-receiver output, floating in shut down with
a weak pull-up
Applications
• Notebook computers, desktop PCs, palmtop
computers (Win CE, Palm PC), PDAs
• Telecommunication products (cellular phones,
pagers)
• Digital cameras and video cameras
• Printers, fax machines, photocopiers, screen
projectors
• Internet TV boxes, video conferencing systems
• External infrared adapters (dongles)
• Medical and industrial data collection
Parts Table
Part
TFDU6300-TR3
Description
Qty/reel or tube
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
2500 pcs
2500 pcs
750 pcs
750 pcs
TFDU6300-TT3
TFDU6300-TR1
TFDU6300-TT1
www.vishay.com
1
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Functional Block Diagram
VCC1
Tri-State
Driver
RXD
Amplifier
Comparator
VCC2
SD
Logic
and
Controlled
Driver
Control
TXD
18468_1
GND
Figure 1. Functional Block Diagram
Pin Description
Pin number
Function
Description
I/O
Active
IRED anode to be externally connected to Vcc2 (VIRED). For higher voltages
than 3.6 V an external resistor might be necessary for reducing the internal
power dissipation. This pin is allowed to be supplied from an uncontrolled
power supply separated from the controlled Vcc1 - supply.
VCC2
1
IRED Anode
IRED
Cathode
2
3
IRED cathode, internally connected to driver transistor
This input is used to transmit serial data when SD is low. An on-chip
protection circuit disables the IRED driver if the TXD pin is asserted for
longer than 100 µs. When used in conjunction with the SD pin, this pin is
also used to control the receiver mode. Logic reference: Vcc1
TXD
RXD
I
High
Low
High
Received data output, push-pull CMOS driver output capable of driving
standard CMOS. No external pull-up or pull-down resistor is required.
Floating with a weak pull-up of 500 kOhm (typ.) in shutdown mode. High/
Low levels related to Vcc1. RXD echoes the TXD signal.
4
5
O
Shutdown, also used for dynamic mode switching. Setting this pin active
places the module into shutdown mode. On the falling edge of this signal,
the state of the TXD pin is sampled and used to set receiver low bandwidth
(TXD = Low: SIR) or high bandwidth (TXD = High: MIR and FIR) mode.
SD
I
I
VCC1
6
7
8
Supply voltage
Internally not connected.
Ground
NC
GND
TFDU6301
weight 0.075 g
19531
Figure 2. Pinning
Document Number 84763
Rev. 1.8, 03-Jul-08
www.vishay.com
2
TFDU6300
Vishay Semiconductors
Absolute Maximum Ratings
Reference point Pin: GND unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
VCC1
Min.
Typ.
Max.
6
Unit
V
Supply voltage range,
transceiver
0 V < VCC2 < 6 V
- 0.5
Supply voltage range,
transmitter
0 V < VCC1 < 6 V
VCC2
- 0.5
- 0.5
6.5
V
Vin < VCC1 is allowed
Voltage at all I/O pins
Input currents
6
V
For all pins, except IRED anode pin
10
mA
mA
mW
Output sinking current
Power dissipation
25
PD
TJ
500
Junction temperature
125
+ 85
+ 85
260
°C
°C
Ambient temperature range
(operating)
Tamb
Tstg
- 25
- 25
Storage temperature range
Soldering temperature
Average output current
°C
See chapter “Recommended
Solder Profiles”
°C
I
IRED (DC)
150
700
mA
< 90 µs, ton < 20 %
IIRED (RP)
Repetitive pulse output current
ESD protection
mA
kV
Human body model
1
Virtual source size
Method: (1-1/e) encircled energy
d
1.8
2.0
mm
Laser/LED safety information
With the edition IEC/EN 60825-1:2006 LEDs were removed from the basic laser eye safety standard but are still covered by
DIN EN 60825-12 (VDE 0837-12):2004-12 (or equivalent IEC standard). Therefore still a risk assessment is necessary according the
test conditions of the basic standard, which were changed in respect to the former editions.
We recommend using the so-called simplified method not taking the virtual source size into account.
Our devices are tested for not to exceed the given eye safety limit according class 1 using the simplified assessment with C6 = 1.
(When the virtual source size would be taken into account, the safety limit is even higher.)
LEDs for communication applications are covered by the following safety regulations:
IEC/EN 60825-1:2006, DIN EN 60825-12 (VDE 0837-12):2004-12, see above IEC 62471 Ed. 1:2006, “Photobiological Safety of Lamps
and Lamp Systems": TFDU6301 is in the "Exempt Group"
"DIRECTIVE 2006/25/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 5. April 2006" on the minimum health and
safety requirements regarding the exposure of workers to risks arising from physical agents (artificial optical radiation) (19th individual
Directive within the meaning of Article 16 (1) of Directive 89/391/EEC): TFDU6301 is in accordance with this regulation.
:
Definitions
In the Vishay transceiver data sheets the following nomenclature is used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy 1.2, adding the SIR Low Power Standard. IrPhy 1.3 extended the Low
Power Option to MIR and FIR and VFIR was added with IrPhy 1.4. A new version of the standard in any case obsoletes the former version.
With introducing the updated versions the old versions are obsolete. Therefore the only valid IrDA standard is the actual version IrPhy 1.4
(in Oct. 2002).
www.vishay.com
3
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Electrical Characteristics
Transceiver
Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Supply voltage
Test conditions
Symbol
VCC
Min.
2.4
Typ.
Max.
3.6
Unit
V
Receive mode only, idle
In transmit mode, add additional 85 mA (typ) for IRED current.
Add RXD output current depending on RXD load.
Dynamic Supply current
ICC
ICC
SIR mode
1.8
2.0
3.0
3.3
mA
mA
MIR/FIR mode
SD = High
T= 25 °C, not ambient light
sensitive, detector is disabled in
shutdown mode
ISD
Shutdown supply current
Shutdown supply current
0.01
µA
SD = High, full specified
temperature range, not ambient
light sensitive
ISD
1
µA
TA
Operating temperature range
Input voltage low (TXD, SD)
Input voltage high (TXD, SD)
Input leakage current (TXD, SD)
Input capacitance, TXD, SD
Output voltage low
- 25
- 0.5
+ 85
0.5
6
°C
V
VIL
CMOS level1)
VIH
IICH
CI
VCC - 0.3
- 1
V
V
in = 0.9 x VCC1
+ 1
5
µA
pF
IOL = 500 µA
VOL
0.4
V
V
Cload = 15 pF
IOH = - 250 µA
Cload = 15 pF
Output voltage high
VOH
0.9 x VCC1
Output RXD current limitation
high state
low state
Short to ground
Short to VCC1
20
20
mA
mA
SD shutdown pulse duration
RXD to VCC1 impedance
Activating shutdown
30
•
µs
RRXD
400
500
600
kΩ
SD mode programming pulse
duration
tSDPW
All modes
200
ns
Note:
1) The typical threshold level is 0.5 x VCC1 (VCC1 = 3 V). It is recommended to use the specified min./max. values to avoid increased
operating current.
Document Number 84763
Rev. 1.8, 03-Jul-08
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4
TFDU6300
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
Min.
Typ.
Max.
Unit
9.6 kbit/s to 115.2 kbit/s
λ = 850 nm to 900 nm,
Minimum irradiance Ee1) in
50
(5)
80
(8)
mW/m2
Ee
angular range2)
(µW/cm2)
V
CC = 2.4 V
1.152 Mbit/s
λ = 850 nm to 900 nm,
Minimum irradiance Ee in
angular range, MIR mode
100
(10)
mW/m2
Ee
(µW/cm2)
V
CC = 2.4 V
4 Mbit/s
λ = 850 nm to 900 nm,
CC = 2.4 V
Minimum irradiance Ee
inangular range, FIR mode
130
(13)
200
(20)
mW/m2
Ee
Ee
(µW/cm2)
V
Maximum irradiance Ee in
5
kW/m2
λ = 850 nm to 900 nm
angular range3)
(500)
(mW/cm2)
tr (RXD)
tf (RXD)
Rise time of output signal
Fall time of output signal
10 % to 90 %, CL = 15 pF
90 % to 10 %, CL = 15 pF
10
10
40
40
ns
ns
Input pulse length
1.4 µs < PWopt < 25 µs
RXD pulse width of output
signal, 50 %, SIR mode
tPW
tPW
tPW
tPW
1.6
105
105
225
2.2
250
125
250
3
µs
ns
ns
ns
Input pulse length
Wopt = 217 ns, 1.152 Mbit/s
RXD pulse width of output
signal, 50 %, MIR mode
275
145
275
P
Input pulse length
Wopt = 125 ns, 4 Mbit/s
RXD pulse width of output
signal, 50 %, FIR mode
P
Input pulse length
Wopt = 250 ns, 4 Mbit/s
RXD pulse width of output
signal, 50 %, FIR mode
P
Input irradiance = 100 mW/m2,
4.0 Mbit/s
1.152 Mbit/s
≤ 115.2 kbit/s
25
80
350
ns
ns
ns
Stochastic jitter, leading edge
After completion of shutdown
programming sequence
power on delay
Receiver start up time
250
100
µs
µs
Latency
Note:
tL
40
All timing data measured with 4 Mbit/s are measured using the IrDA® FIR transmission header. The data given here are valid 5 µs after
starting the preamble.
1) IrDA low power specification is 90 mW/m2. Specification takes into account a window loss of 10 %.
2) IrDA sensitivity definition (equivalent to threshold irradiance):
Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specification while the source is
operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
3) Maximum Irradiance Ee In Angular Range, power per unit area. The optical power delivered to the detector by a source operating
at the maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related
link errors. If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER)
specification.
For more definitions see the document "Symbols and Terminology" on the Vishay Website
(http://www.vishay.com/docs/82512/82512.pdf).
www.vishay.com
5
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Transmitter
Tamb = 25 °C, VCC1 = VCC2 = 2.4 V to 3.6 V unless otherwise noted.
Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
Parameter
Test conditions
Symbol
Min.
330
Typ.
440
t
Max.
600
Unit
mA
IRED operating current, switched
current limiter
Note: No external resistor current
limiting resistor is needed
ID
tpw
tpw
tpw_lim
IIRED
Input pulse width t < 20 µs
Input pulse width 20 µs < t < 150 µs
Input pulse width t ≥ 150 µs
µs
µs
µs
µA
Output pulse width limitation
Output leakage IRED current
18
150
150
1
- 1
65
Output radiant intensity, s. figure 3,
recommended appl. circuit
VCC = VIRED = 3.3 V, α = 0°
TXD = High, SD = Low
Ie
Ie
180
125
4681)
mW/sr
mW/sr
Output radiant intensity, s. figure 3,
recommended appl. circuit
V
= V
= 3.3 V,
α
= 0°, 15°
TXD = High, SD = Low
VCC1 = 3.3 V, α = 0°, 15°
50
4681)
CC
IRED
Output radiant intensity
TXD = Low or SD = High (Receiver
is inactive as long as SD = High)
Ie
0.04
900
mW/sr
deg
Output radiant intensity, angle of
half intensity
Peak - emission wavelength2)
α
± 24
λp
875
886
45
nm
nm
Spectral bandwidth
Δλ
Optical rise time,
Optical fall time
tropt
tfopt
,
10
40
ns
ns
ns
Input pulse width 217 ns,
1.152 Mbit/s
Optical output pulse duration
Optical output pulse duration
Optical output pulse duration
topt
topt
topt
207
117
242
217
125
250
227
133
Input pulse width 125 ns,
4 Mbit/s
Input pulse width 250 ns,
4 Mbit/s
258
25
ns
%
Optical overshoot
Note:
1) Maximum value is given by eye safety class 1, IEC 60825-1, simplified method.
2) Due to this wavelength restriction compared to the IrDA spec of 850 nm to 900 nm the transmitter is able to operate as source for the
®
standard Remote Control applications with codes as e.g. Philips RC5/RC6 or RECS 80. When operated under IrDA full range
conditions (125 mW/sr) the RC range to be covered is in the range from 8 m to 12 m, provided that state of the art remote control
receivers are used.
Document Number 84763
Rev. 1.8, 03-Jul-08
www.vishay.com
6
TFDU6300
Vishay Semiconductors
Recommended Circuit Diagram
Operated at a clean low impedance power supply the resistive and inductive wiring should be avoided. The
TFDU6300 needs no additional external components. inputs (TXD, SD) and the output RXD should be
However, depending on the entire system design and directly (DC) coupled to the I/O circuit.
board layout, additional components may be required
(see figure 3).
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage.
R2, C1 and C2 are optional and dependent on the
quality of the supply voltages V
and injected
CCx
noise. An unstable power supply with dropping
voltage during transmission may reduce the
sensitivity (and transmission range) of the
transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to
the transceiver power supply pins. A Tantalum
capacitor should be used for C1 while a ceramic
capacitor is used for C2.
VCC2
VCC1
GND
IRED Anode
VCC
R1
R2
C1
C2
Ground
SD
SD
TXD
RXD
TXD
RXD
IREDCathode
In addition, when connecting the described circuit to
the power supply, low impedance wiring should be
used.
19307
When extended wiring is used the inductance of the
power supply can cause dynamically a voltage drop
Figure 3. Recommended Application Circuit
at V
. Often some power supplies are not able to
CC2
follow the fast current rise time. In that case another
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line.
This one should be a Tantalum or other fast capacitor
to guarantee the fast rise time of the IRED current.
The resistor R1 is only necessary for high operating
voltages and elevated temperatures.
Vishay transceivers integrate a sensitive receiver and
a built-in power driver. The combination of both needs
a careful circuit board layout. The use of thin, long,
4.7 µF (type, see table under C1) at V
helpful.
will be
CC2
Keep in mind that basic RF-design rules for circuit
design should be taken into account. Especially
longer signal lines should not be used without
termination. See e.g. "The Art of Electronics" Paul
Horowitz, Winfield Hill, 1989, Cambridge University
Press, ISBN: 0521370957.
Table 1.
Recommended Application Circuit Components
Component
Recommended value
Vishay part number
293D 475X9 016B
C1
C2
4.7 µF, 16 V
0.1 µF, Ceramic
VJ 1206 Y 104 J XXMT
No resistor necessary, the internal controller is able to
control the current
R1
R2
10 Ω, 0.125 W
CRCW-1206-10R0-F-RT1
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7
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
I/O and Software
In the description, already different I/Os are
mentioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the
I/O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Setting to the Lower Bandwidth Mode
(2.4 kbit/s to 115.2 kbit/s)
1. Set SD input to logic "High".
2. Set TXD input to logic "Low". Wait t ≥ 200 ns.
s
3. Set SD to logic "Low" (this negative edge latches
state of TXD, which determines speed setting).
4. TXD must be held for t ≥ 200 ns.
TXD is now enabled as normal TXD input for the
h
Mode Switching
The TFDU6300 is in the SIR mode after power on as
a default mode, therefore the FIR data transfer rate
has to be set by a programming sequence using the
TXD and SD inputs as described below. The low
frequency mode covers speeds up to 115.2 kbit/s.
Signals with higher data rates should be detected in
the high frequency mode. Lower frequency data can
also be received in the high frequency mode but with
reduced sensitivity. To switch the transceivers from
low frequency mode to the high frequency mode and
vice versa, the programming sequences described
below are required.
lower bandwidth mode.
Note:
When applying this sequence to the device already in the lower
bandwidth mode, the SD pulse is interpreted as shutdown. In this
case the RXD output of the transceiver may react with a single
pulse (going active low) for a duration less than 2 µs. The operating
software should take care for this condition.
In case the applied SD pulse is longer than 4 µs, no RXD pulse is
to be expected but the receiver startup time is to be taken into
account before the device is in receive condition.
50 %
SD
Setting to the High Bandwidth Mode
(0.576 Mbit/s to 4 Mbit/s)
1. Set SD input to logic "High".
2. Set TXD input to logic "High". Wait t ≥ 200 ns.
3. Set SD to logic "Low" (this negative edge latches
state of TXD, which determines speed setting).
t
s
t
h
High: FIR
Low: SIR
s
50 %
50 %
TXD
4. After waiting t ≥ 200 ns TXD can be set to logic
"Low". The hold time of TXD is limited by the
maximum allowed pulse length.
h
14873
TXD is now enabled as normal TXD input for the high
bandwidth mode.
Figure 4. Mode Switching Timing Diagram
Table 2.
Truth table
Inputs
Outputs
Optical input irradiance mW/m2
SD
TXD
RXD
Transmitter
Weakly pulled
(500 kΩ) to VCC1
High
x
x
0
Ie
High
High > 150 µs
Low
x
x
Low (echo)
High
0
0
< 4
High
Low
> Min. detection threshold irradiance
< Max. detection threshold irradiance
Low
Low
Low (active)
x
0
0
> Max. detection threshold irradiance
Document Number 84763
Rev. 1.8, 03-Jul-08
www.vishay.com
8
TFDU6300
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/doc?82601).
260
10 s max. at 230 °C
240
220
200
180
160
140
120
100
80
240 °C max.
2 to 4 °C/s
160 °C max.
120 to180 s
90 s max.
2 to 4 °C/s
60
40
275
≥
T
= 260 °C
T
255 °C for 10 s....30 s
peak
250
225
200
175
150
125
100
75
20
0
≥
T
217 °C for 70 s max.
0
50
100
150
200
250
300
350
19535
Time/s
30 s max.
70 s max.
Figure 5. Recommended Solder Profile for Sn/Pb Soldering
90 s to 120 s
2 °C to 4 °C/s
2 °C to 3 °C/s
Lead (Pb)-Free, Recommended Solder Profile
50
25
The TFDU6300 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in
figure 6 and 7 are VISHAY's recommended profiles
for use with the TFDU6300 transceivers. For more
details please refer to the application note
0
0
50
100
150
200
250
300
350
19532
Time/s
Figure 6. Solder Profile, RSS Recommendation
280
260
240
220
200
180
160
140
120
100
80
T
peak
= 260 °C max.
< 4 °C/s
“SMD Assembly Instructions”
(http://www.vishay.com/doc?82602).
1.3 °C/s
Time above 217 °C t ≤ 70 s
< 2 °C/s
≤
Time above 250 °C t 40 s
A
ramp-up rate less than 0.9 °C/s is not
Peak temperature T
= 260 °C
peak
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
60
40
20
0
0
50
100
150
200
250
300
TFDU Fig3
Time/s
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Figure 7. RTS Recommendation
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
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9
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Package Dimensions in mm
TFDU6300 (Universal) Package
20627
Footprint
Mounting Center
Mounting Center
7 x 0.95 = 6.65
0.95
0.2*
0.7
0.7 (8 x)
Top View
Side View
* min 0.2 Photoimageable
solder mask recommended
between pads to prevent bridgeing
20626
Figure 8. Package Drawing
Document Number 84763
Rev. 1.8, 03-Jul-08
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10
TFDU6300
Vishay Semiconductors
Reel Dimensions in mm
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
Figure 9. Reel Drawing
W1 min.
W2 max.
W3 min.
W3 max.
Tape width
A max.
mm
N
mm
60
mm
16
mm
16.4
16.4
mm
22.4
22.4
mm
15.9
15.9
mm
19.4
19.4
180
16
330
50
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Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Tape Dimensions in mm
Drawing-No.: 9.700-5280.01-4
Issue: 1; 03.11.03
19855
Figure 10. Tape Drawing, TFDU6300 for Top View Mounting
Document Number 84763
Rev. 1.8, 03-Jul-08
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12
TFDU6300
Vishay Semiconductors
Tape Dimensions in mm
19856
Drawing-No.: 9.700-5279.01-4
Issue: 1; 08.12.04
19856
Figure 11. Tape Drawing, TFDU6300 for Side View Mounting
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13
Document Number 84763
Rev. 1.8, 03-Jul-08
TFDU6300
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively.
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA.
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages,
and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated
with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 84763
Rev. 1.8, 03-Jul-08
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14
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
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