VSMY385010X01-GS08 [VISHAY]
Infrared LED,;
| 型号： | VSMY385010X01-GS08 |
| 厂家： | 
VISHAY |
| 描述： | Infrared LED, |
| 文件： | 总6页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSMY385010X01
Vishay Semiconductors
www.vishay.com
High Speed Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
FEATURES
• Package type: surface-mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
• AEC-Q101 qualified
• Peak wavelength: λp = 850 nm
• High reliability
• High radiant intensity
• Angle of half intensity: ϕ = 60°
948553
• Suitable for high pulse current operation
• Floor life: 168 h, MSL 3, according to
J-STD-020
• Lead (Pb)-free reflow soldering
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
As part of the SurfLightTM portfolio, the VSMY385010X01 is
an infrared, 850 nm emitting diode based on surface emitter
technology with high radiant intensity, high optical power
and high speed, molded in a PLCC-2 package for surface
mounting (SMD).
RELEASED FOR APPLICATIONS
• Infrared radiation source for operation with CMOS
cameras (illumination)
• Automotive sensors
• Light curtain
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (°)
λP (nm)
tr (ns)
VSMY385010X01
12
60
850
7
Note
•
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
PLCC-2
VSMY385010X01-GS08
VSMY385010X01-GS18
Tape and reel
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
•
MOQ: minimum order quantity
Rev. 1.0, 26-Jun-2019
Document Number: 84590
1
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010X01
Vishay Semiconductors
www.vishay.com
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
70
UNIT
mA
mA
A
Forward current
IF
Pulse peak forward current
Surge forward current
Power dissipation
tp/T = 0.5, tp = 100 μs
IFM
140
tp = 100 μs
IFSM
PV
0.5
140
mW
°C
Junction temperature
Tj
110
Operating temperature range
Storage temperature range
Soldering temperature
Thermal resistance junction-to-ambient
Tamb
Tstg
Tsd
-40 to +105
-40 to +110
260
°C
°C
According to Fig. 7, J-STD-020
JESD51
°C
RthJA
250
K/W
80
70
60
50
40
30
20
10
0
140
120
100
RthJA = 250 K/W
RthJA = 250 K/W
80
60
40
20
0
0
20
40
60
80
100
0
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
Tamb - Ambient Temperature (°C)
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
IF = 50 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 0.5 A, tp = 100 μs
IF = 70 mA
SYMBOL
MIN.
TYP.
1.6
MAX.
UNIT
V
VF
VF
VF
TKVF
IR
-
-
-
-
1.8
Forward voltage
1.65
2.8
-
-
-
V
V
Temperature coefficient of VF
Reverse current
-1.3
mV/K
μA
Not designed for reverse operation
Junction capacitance
V
R = 0 V, f = 1 MHz, E = 0
IF = 50 mA, tp = 20 ms
IF = 70 mA, tp = 20 ms
IF = 0.5 A, tp = 100 μs
IF = 70 mA, tp = 20 ms
IF = 70 mA
Cj
-
30
8
-
pF
Ie
5.5
11
mW/sr
mW/sr
mW/sr
mW
%/K
°
Radiant intensity
Ie
-
12
70
40
-0.2
60
850
35
0.25
7
-
Ie
-
-
Radiant power
φe
-
-
Temperature coefficient of φe
Angle of half intensity
Peak wavelength
Spectral bandwidth
Temperature coefficient of λp
Rise time
TKφe
ϕ
-
-
-
-
IF = 50 mA
IF = 70 mA
IF = 70 mA
λp
840
870
nm
Δλ
TKλp
tr
-
-
-
-
-
-
-
-
nm
nm/K
ns
IF = 70 mA, 10 % to 90 %
IF = 70 mA, 10 % to 90 %
Fall time
tf
6
ns
Rev. 1.0, 26-Jun-2019
Document Number: 84590
2
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010X01
Vishay Semiconductors
www.vishay.com
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
100
10
100
80
60
40
20
0
IF = 70 mA
tp = 100 μs
1.2
1.4
1.6
1.8
2.0
2.2
2.4
750
800
850
900
950
VF - Forward Voltage (V)
λ - Wavelength (nm)
Fig. 5 - Relative Radiant Power vs. Wavelength
Fig. 3 - Forward Current vs. Forward Voltage
0°
10°
20°
10
30°
40°
tp = 100 μs
1.0
0.9
1
50°
60°
0.8
0.7
70°
80°
0.1
0.6
0.4
0.2
0
10
100
948013-1
IF - Forward Current (mA)
Fig. 4 - Relative Radiant Intensity vs. Forward Current
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
Rev. 1.0, 26-Jun-2019
Document Number: 84590
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010X01
Vishay Semiconductors
www.vishay.com
PACKAGE DIMENSIONS in millimeters
3.5 0.2
Pin identification
Technical drawings
according to DIN
specifications
A
C
Dimensions in mm
Ø2.4
3+0.15
Drawing-No.: 6.541-5067.02-4
Issue: 5; 23.09.13
Mounting Pad Layout
1.2
Area covered
with solderresist
1.6 (1.9)
Dimensions: Reflow and vapor pha
4
se (wave soldering)
SOLDER PROFILE
DRYPACK
Axis Title
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
300
10000
1000
100
Max. 260 °C
245 °C
255 °C
240 °C
250
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
217 °C
200
Max. 30 s
150
Floor life: 168 h
Max. 120 s
Max. 100 s
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, according to J-STD-020
100
50
0
Max. ramp down 6 °C/s
Max. ramp up 3 °C/s
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-033D or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
10
0
50
100
150
Time (s)
200
250
300
19841
Fig. 7 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
Rev. 1.0, 26-Jun-2019
Document Number: 84590
4
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY385010X01
Vishay Semiconductors
www.vishay.com
TAPE AND REEL
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
Adhesive tape
10.0
9.0
120°
Blister tape
4.5
3.5
13.00
12.75
2.5
1.5
63.5
60.5
Identification
Component cavity
94 8670
Label:
Vishay
type
group
Fig. 8 - Blister Tape
tape code
production
code
14.4 max.
180
178
3.5
3.1
2.2
2.0
quantity
94 8665
Fig. 11 - Dimensions of Reel-GS08
5.75
5.25
4.0
3.6
8.3
7.7
3.6
3.4
10.4
8.4
1.85
1.65
120°
4.5
0.25
1.6
1.4
4.1
3.9
4.1
3.9
2.05
1.95
3.5
94 8668
13.00
12.75
2.5
1.5
Fig. 9 - Tape Dimensions in mm for PLCC-2
62.5
60.0
Identification
MISSING DEVICES
Label:
Vishay
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
type
group
tape code
production
code
14.4 max.
321
329
quantity
18857
Fig. 12 - Dimensions of Reel-GS18
De-reeling direction
94 8158
COVER TAPE REMOVAL FORCE
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
> 160 mm
40 empty
compartments
min. 75 empty
compartments
Tape leader
Carrier leader
Carrier trailer
Fig. 10 - Beginning and End of Reel
Rev. 1.0, 26-Jun-2019
Document Number: 84590
5
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2019
Document Number: 91000
1
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