PC87382DG/K1 [WINBOND]
Micro Peripheral IC,;
| 型号： | PC87382DG/K1 |
| 厂家： | 
WINBOND |
| 描述： | Micro Peripheral IC, |
| 文件： | 总4页 (文件大小：79K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Product Brief
February 2006
Revision 1.2
PC87382
LPC-to-LPC Switch for Docking Stations, with Fast
Infrared Port, Serial Port and GPIOs
General Description
Outstanding Features
The PC87382, a member of the Winbond LPC SuperI/O fam-
ily, is targeted for a wide range of portable applications. The
PC87382 is PC2001 and ACPI compliant, and features an
LPC-to-LPC Switch with hot plugability, Fast Infrared port
(FIR, IrDA 1.1 compliant), Serial Port, and General-Purpose
Input/Output (GPIO) support for a total of eight ports.
■ LPC-to-LPC Switch with hot plugability, enables LPC
devices in the Docking Station to be connected to the
Main LPC Bus, thus reducing the number of signals re-
quired through the Docking Station connector
■ LPC bus interface, based on Intel’s LPC Interface
Specification Revision 1.1, August 2002 (supports
CLKRUN signal)
The PC87382 enables glueless implementation of an LPC-
to-LPC Switch between the motherboard LPC bus and the
Docking Station, and supports hot insertion and hot removal.
■ Fast Infrared port
■ PC2001 and ACPI Revision 3.0 compliant
■ Serial IRQ support (15 options)
■ Protection features, including GPIO lock and pin con-
figuration lock
■ Eight GPIO ports including five with “assert IRQ” capa-
bility
■ XOR Tree and TRI-STATE device pins (for ICT) test-
ability modes.
■ 5V tolerant and back-drive protected pins (except LPC
bus pins)
■ 48-pin LQFP package
System Block Diagram
Docking
Station
Portable
Platform
I/O
Ports
South Bridge
LPC Bus
Docking LPC Bus
PC87382
DCLKOUT
Docking
SIO
Embedded
Controller
TPM
Serial
Infrared
Interface Interface
© 2006 Winbond Electronics Corporation
www.winbond.com
Features
• LPC System Interface
• Eight General-Purpose I/O (GPIO) Ports
— 8-bit I/O cycles
— Support assert IRQ
— CLKRUN support
— Programmable drive type for each output pin (open-
drain, push-pull or output disable)
— Implements PCI mobile design guide recommenda-
tion (PCI Mobile Design Guide 1.1, Dec. 18, 1998)
— Programmable option for internal pull-up resistor on
each input pin
• LPC-to-LPC Switch
— Output lock option
— Hot plugability
— Input debounce mechanism
— CLKRUN support
• Serial Port
— The connection is controlled by software
— Low switch resistance and propagation delay
— Programmable Clock to Reset Delay
— Software compatible with the 16550A and the 16450
— Shadow register support for write-only bit monitoring
— UART data rates up to 1.5 Mbaud
• PC2001 and ACPI Compliant
• Fast Infrared Port (FIR)
— PnP Configuration Register structure
— Flexible resource allocation for all logical devices
■ Relocatable base address
— Software compatible with the 16550A and the 16450
— Shadow register support for write-only bit monitoring
— FIR IrDA 1.1 compliant
■ 15 IRQ routing options
— HP-SIR
■ Two optional 8-bit DMA channels (where applica-
— ASK-IR option of SHARP-IR
ble) selected from four possible DMA channels
— DASK-IR option of SHARP-IR
— Supports ACPI Specification Revision 3.0 September 2,
— Consumer Remote Control supports RC-5, RC-6,
2004
NEC, RCA and RECS 80
• Clock Sources
— DMA support: 1 or 2 channels
— 14.318 MHz or 48 MHz clock input
• Strap Configuration
— LPC clock, up to 33 MHz
— Base Address (BADDR) strap to determine the base
— 14.318 MHz or 48 MHz clock output to the docking
address of the Index-Data register pair
station
— Strap Inputs to select testability mode
• Power Supply
• Testability
— 3.3V supply operation
— XOR Tree
— All pins are 5V tolerant, except LPC bus pins
— All pins are back-drive protected, except LPC bus pins
— TRI-STATE device pins
Internal Block Diagram
LPC Interface
14.31818 MHz
Clock
Generator
Bus
Interface
Docking
LPC Switch
48 MHz
FIR
GPIO Ports
Serial Port 1
Infrared
Interface
Docking LPC
Interface
Ports
I/O
Serial
Interface
www.winbond.com
2
Revision 1.2
Physical Dimensions
All dimensions are in millimeters
64-Pin Thin Quad Flatpack (TQFP)
Order Number 87382DG/K1
Revision 1.2
3
www.winbond.com
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended
for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic
signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore,
Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein
personal injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sales.
Headquarters
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 1-408-9436666
TEL: 86-21-62365999
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
FAX: 1-408-5441798
FAX: 86-21-62365998
Taipei Office
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 81-45-4781881
TEL: 852-27513100
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
FAX: 81-45-4781800
FAX: 852-27552064
For Advanced PC Product Line information contact: APC.Support@winbond.com
Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners
www.winbond.com
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