2ED020I12-F2
更新时间：2024-12-03 14:22:35
品牌：INFINEON
描述：Half Bridge Based Peripheral Driver, 2A, PDSO32, GREEN, PLASTIC, SOP-36/32
概述
规格参数
数据手册2ED020I12-F2 概述
Half Bridge Based Peripheral Driver, 2A, PDSO32, GREEN, PLASTIC, SOP-36/32 MOSFET 驱动器
2ED020I12-F2 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 零件包装代码： | SOIC |
| 包装说明： | SOP-36/32 | 针数： | 36/42 |
| Reach Compliance Code： | compliant | ECCN代码： | EAR99 |
| HTS代码： | 8542.39.00.01 | 风险等级： | 5.61 |
| 内置保护： | TRANSIENT; OVER CURRENT; UNDER VOLTAGE | 接口集成电路类型： | HALF BRIDGE BASED PERIPHERAL DRIVER |
| JESD-30 代码： | R-PDSO-G32 | 长度： | 12.7 mm |
| 湿度敏感等级： | 3 | 功能数量： | 2 |
| 端子数量： | 32 | 最高工作温度： | 125 °C |
| 最低工作温度： | -40 °C | 输出电流流向： | SOURCE AND SINK |
| 标称输出峰值电流： | 2 A | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | SSOP | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE, SHRINK PITCH | 峰值回流温度（摄氏度）： | NOT SPECIFIED |
| 座面最大高度： | 2.65 mm | 最大供电电压： | 5.5 V |
| 最小供电电压： | 4.5 V | 标称供电电压： | 5 V |
| 电源电压1-最大： | 20 V | 电源电压1-分钟： | 13 V |
| 电源电压1-Nom： | 15 V | 表面贴装： | YES |
| 温度等级： | AUTOMOTIVE | 端子形式： | GULL WING |
| 端子节距： | 0.65 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 7.5 mm |
| Base Number Matches： | 1 |
2ED020I12-F2 数据手册
通过下载2ED020I12-F2数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载EiceDRIVER™
2ED020I12-F2
Dual IGBT Driver IC
Final Data Sheet
Rev. 2.0, 2012-06-05
Industrial Power Control
Edition 2012-06-05
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
EiceDRIVER™
2ED020I12-F2
Revision History
Page or Item
Subjects (major changes since previous revision)
Rev. 2.0, 2012-06-05
Trademarks of Infineon Technologies AG
AURIX™, BlueMoon™, C166™, CanPAK™, CIPOS™, CIPURSE™, COMNEON™, EconoPACK™, CoolMOS™,
CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™,
MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OptiMOS™, ORIGA™, PRIMARION™,
PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™,
SINDRION™, SIPMOS™, SMARTi™, SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™,
TRENCHSTOP™, TriCore™, X-GOLD™, X-PMU™, XMM™, XPOSYS™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2010-10-26
Final Data Sheet
3
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
1
2
3
3.1
3.2
Pin Configuration and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Pin Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
4.1
4.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.4
4.5
4.6
4.6.1
4.6.2
4.6.3
4.7
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Internal Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Undervoltage Lockout (UVLO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
READY Status Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Active Shut-Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Non-Inverting and Inverting Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Driver Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
External Protection Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
5.1
5.2
5.3
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Recommended Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Logic Input and Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Active Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.4
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
5.4.8
6
7
Timing Diagramms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Final Data Sheet
4
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
List of Figures
Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Typical Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Block Diagram 2ED020I12-F2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PG-DSO-36-58 (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application Example Bipolar Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Application Example Unipolar Supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Propagation Delay, Rise and Fall Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Typical Switching Behavior. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
DESAT Switch-Off Behavior. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
UVLO Behavior. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 10 PG-DSO-36-58 (Plastic (Green) Dual Small Outline Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Final Data Sheet
5
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
List of Tables
Table 1
Table 2
Table 3
Table 4
Table 5
Table 6
Table 7
Table 8
Table 9
Table 10
Table 11
Table 12
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Recommended Operating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Logic Input and Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Active Miller Clamp . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Short Circuit Clamping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Dynamic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Desaturation Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Active Shut Down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Final Data Sheet
6
Rev. 2.0, 2012-06-05
EiceDRIVER™
Dual IGBT Driver IC
2ED020I12-F2
1
Overview
Main Features
•
•
•
•
•
Dual channel isolated IGBT Driver
For 600V/1200 V IGBTs
2 A rail-to-rail output
Vcesat-detection
Active Miller Clamp
Product Highlights
•
•
•
•
•
Coreless transformer isolated driver
Galvanic Insulation
Integrated protection features
Small footprint
Suitable for operation at high ambient temperature
Typical Application
•
•
•
•
AC and Brushless DC Motor Drives
High Voltage DC/DC-Converter
UPS-Systems
Welding
Description
The 2ED020I12-F2 is a galvanic isolated dual channel IGBT driver in PG-DSO-36-58 package that provides two
fully independent driver outputs with a current capability of typically 2A.
All logic pins are 5V CMOS compatible and could be directly connected to a microcontroller.
The data transfer across galvanic isolation is realized by the integrated Coreless Transformer Technology.
The 2ED020I12-F2 provides several protection features like IGBT desaturation protection, active Miller clamping
and active shut down.
Product Name
Gate Drive Current
Package
2ED020I12-F2
±2 A
PG-DSO-36-58
Final Data Sheet
7
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Overview
VCC2HS
2
VCC1HS
DESATHS
2
EiceDRIVERTM
2ED020I12-F2
INHS+, INHS-,
/RSTHS
OUTHS
/FLTHS,
RDYHS
CLAMPHS
GND2HS
High Side
Low Side
2
VEE2HS
VCC2LS
CPU
VCC1LS
3
DESATLS
3
INLS+, INLS-,
/RSTLS
/FLTLS,
RDYLS
OUTLS
CLAMPLS
GND2LS
GND1
3
VEE2LS
Figure 1
Typical Application
Final Data Sheet
8
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Block Diagram
2
Block Diagram
GND1
1
2
3
4
5
6
7
8
9
36 VEE2HS
35 CLAMPHS
34 OUTHS
2V
0
0
&
Δt
Δt
0
INHS+
INHS-
/RSTHS
RX
LOGIC
TX
VEE2HS
VCC2HS
LOGIC
/FLTHS
RDYHS
/FLTHS
/RSTHS
VCC1HS
GND1
33 VCC2HS
32 GND2HS
31 VEE2HS
30 DESATHS
29 not existing
28 not existing
27 not existing
26 not existing
25 CLAMPLS
24 VEE2LS
23 OUTLS
UVLO
TX
VEE2HS
UVLO
VCC2HS
I3
LOGIC
DESAT
K3
LOGIC
RX
R
9V
GND2HS
NC
NC 10
GND1 11
INLS+ 12
INLS- 13
2V
0
0
&
Δt
Δt
0
/RSTLS
RX
LOGIC
TX
VEE2LS
VCC2LS
LOGIC
RDYLS 14
/FLTLS 15
/RSTLS 16
VCC1LS 17
GND1 18
/FLTLS
UVLO
TX
UVLO
VEE2LS
22 VCC2LS
21 GND2LS
20 DESATLS
19 VEE2LS
VCC2LS
I3
LOGIC
DESAT
K3
LOGIC
RX
R
9V
GND2LS
Figure 2
Block Diagram 2ED020I12-F2
Final Data Sheet
9
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Pin Configuration and FunctionalityPin Configuration
3
Pin Configuration and Functionality
3.1
Pin Configuration
Remark: xxxHS and xxxLS at the end of pin name only indicate an order for description, both drivers are isolated
and could be used as high side or low side without any preference.
Table 1
Pin Configuration
Pin
No.
Name
Function
1
GND1
Common ground input side
2
INHS+
INHS-
Non inverted driver input high side
Inverted driver input high side
Ready output high side
3
4
RDYHS
/FLTHS
/RSTHS
VCC1HS
GND1
5
Inverted fault output high side
Inverted reset input high side
Positive power supply input high side
Common ground input side
6
7
8
9
NC
Not used, internally connected to Pin 10
Not used, internally connected to Pin 9
Common ground input side
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
NC
GND1
INLS+
Non inverted driver input low side
Inverted driver input lowside
Ready output low side
INLS-
RDYLS
/FLTLS
/RSTLS
VCC1LS
GND1
Inverted fault output low side
Inverted reset input low side
Positive power supply input low side
Common ground input side
VEE2LS
DESATLS
GND2LS
VCC2LS
OUTLS
VEE2LS
CLAMPLS
Negative power supply low side driver
Desaturation protection low side driver
Signal ground low side driver
Power supply low side driver
Output low side driver
Negative power supply low side driver
Miller clamping low side driver
Pin not existing, cut out
Pin not existing, cut out
Pin not existing, cut out
Pin not existing, cut out
DESATHS
VEE2HS
Desaturation protection high side driver
Negative power supply high side driver
Final Data Sheet
10
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Pin Configuration and FunctionalityPin Functionality
Table 1
Pin Configuration (cont’d)
Name Function
Pin
No.
32
33
34
35
36
GND2HS
VCC2HS
OUTHS
Signal ground high side driver
Power supply high side driver
Output high side driver
CLAMPHS
VEE2HS
Miller clamping high side driver
Negative power supply high side driver
1
GND1
INHS+
INHS-
RDYHS
/FLTHS
/RSTHS
VCC1HS
GND1
NC
VEE2HS 36
2
3
4
5
6
7
8
9
CLAMPHS 35
OUTHS 34
VCC2HS 33
GND2HS 32
VEE2HS 31
DESATHS 30
10
11
12
13
14
15
16
17
18
NC
GND1
INLS+
INLS-
CLAMPLS 25
VEE2LS 24
OUTLS 23
RDYLS
/FLTLS
/RSTLS
VCC1LS
GND1
VCC2LS 22
GND2LS 21
DESATLS 20
19
VEE2LS
Figure 3
PG-DSO-36-58 (top view)
3.2
Pin Functionality
Remark: xxxHS and xxxLS at the end of pin name only indicate an order for description, both drivers are isolated
and could be used as high side or low side without any preference.
GND1
Common ground connection of the input side.
INHS+, INLS+ Non Inverting Driver Input
INxx+ control signal for the driver output if INxx- is set to low (The IGBT is on if INxx+ = high and INxx– = low).
A minimum pulse width is defined to make the IC robust against glitches at IN+. An internal pull-down-resistor
ensures IGBT off-state.
Final Data Sheet
11
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Pin Configuration and FunctionalityPin Functionality
INHS–, INLS– Inverting Driver Input
INxx- control signal for driver output if INxx+ is set to high (IGBT is on if INxx– = low and INxx+ = high).
A minimum pulse width is defined to make the IC robust against glitches at INxx–. An internal pull-up-resistor
ensures IGBT off-state.
/RSTHS, /RSTLS Reset Input
Function 1: Enable/shutdown of the input chip (The IGBT is off if /RSTxx = low). A minimum pulse width is defined
to make the IC robust against glitches at /RSTxx.
Function 2: Resets the DESAT-FAULT-state of the chip if /RSTxx is low for a time TRST. An internal pull-up-
resistor is used to ensure /FLTxx status output.
/FLTHS, /FLTLS Fault Output
Open-drain output to report a desaturation error of the IGBT (/FLTxx is low if desaturation occurs).
RDYHS, RDYLS Ready Status Output
Open-drain output to report the correct operation of the device (RDYxx = high if both chips are above the UVLO
level and the internal chip transmission is faultless).
VCC1HS, VCC1LS Positive Supply
5 V power supply of the input chip
VEE2HS, VEE2LS Negative Supply
Negative power supply pins of the output chip. If no negative supply voltage is available, both pins have to be
connected to GND2xx.
DESATHS, DESATLS Desaturation Detection Input
Monitoring of the IGBT saturation voltage (VCE) to detect desaturation caused by short circuits. If OUT is high, VCE
is above a defined value and a certain blanking time has expired, the desaturation protection is activated and the
IGBT is switched off. The blanking time is adjustable by an external capacitor.
CLAMPHS, CLAMPLS Miller Clamping
Ties the gate voltage to ground after the IGBT has been switched off at a defined voltage to avoid a parasitic
switch-on of the IGBT.During turn-off, the gate voltage is monitored and the clamp output is activated when the
gate voltage goes 2 V below VEE2xx.
GND2HS, GND2LS Reference Ground
Reference ground of the output chip.
OUTHS, OUTLS Driver Output
Output pin to drive an IGBT. The voltage is switched between VEE2xx and VCC2xx. In normal operating mode
Vout is controlled by INxx+, INxx- and /RSTxx. During error mode (UVLO, internal error or DESATxx Vout is set
to VEE2xx independent of the input control signals.
VCC2HS, VCC2LS Positive Supply
Positive power supply pin of the output side.
Final Data Sheet
12
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Functional DescriptionIntroduction
4
Functional Description
4.1
Introduction
The 2ED020I12-F2 is an advanced IGBT dual gate driver that can be also used for driving power MOS devices.
Control and protection functions are included to make possible the design of high reliability systems.
The device consists of two galvanic separated driver. The input can be directly connected to a standard 5 V DSP
or microcontroller with CMOS in/output and the output driver are connected to the high side and low side switch.
The rail-to-rail driver outputs enables the user to provide easy clamping of the IGBTs gate voltage during short
circuit of the IGBT. So an increase of short circuit current due to the feedback via the Miller capacitance can be
avoided. Further, a rail-to-rail output reduces power dissipation.
The device also includes IGBT desaturation protection with FAULT status outputs.
Two READY status outputs reports if the device is supplied and operates correctly.
+5V
VCC1HS
2 * 4k7
100nF
1k
+15V_2
VCC2HS
SGND
GND1
1µF
DESATHS
OUTHS
INHS
10R
INHS+
INHS-
CLAMPHS
GND2HS
RDY
FLT
RS
RDYHS
/FLTHS
/RSTHS
VCC1LS
220pF
1µF-8V_2
+15V_1
1µF
VEE2HS
VCC2LS
1k
100nF
DESATLS
OUTLS
INLS
10R
INLS+
INLS-
CLAMPLS
GND2LS
RDYLS
/FLTLS
/RSTLS
220pF
1µF-8V_1
VEE2LS
2ED020I12-F2
Figure 4
Application Example Bipolar Supply
4.2
Supply
The driver 2ED020I12-F2 is designed to support two different supply configurations, bipolar supply and unipolar
supply.
In bipolar supply the driver is typically supplied with a positive voltage of 15V at VCC2 and a negative voltage of
-8V at VEE2, please refer to Figure 4. Negative supply prevents a dynamic turn on due to the additional charge
which is generated from IGBT input capacitance times negative supply voltage. If an appropriate negative supply
voltage is used, connecting CLAMPxx to IGBT gate is redundant and therefore typically not necessary.
Final Data Sheet
13
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Functional DescriptionInternal Protection Features
For unipolar supply configuration the driver is typically supplied with a positive voltage of 15V at VCC2. Erratically
dynamic turn on of the IGBT could be prevented with active Miller clamp function, so CLAMP output is directly
connected to IGBT gate, please refer to Figure 5.
+5V
VCC1HS
2 * 4k7
100nF
1k
+15V_2
VCC2HS
SGND
GND1
1µF
DESATHS
OUTHS
INHS
10R
INHS+
INHS-
CLAMPHS
GND2HS
VEE2HS
RDY
FLT
RS
RDYHS
/FLTHS
/RSTHS
VCC1LS
220pF
1k
+15V_1
VCC2LS
100nF
1µF
DESATLS
OUTLS
INLS
10R
INLS+
INLS-
CLAMPLS
GND2LS
VEE2LS
RDYLS
/FLTLS
/RSTLS
220pF
2ED020I12-F2
Figure 5
Application Example Unipolar Supply
4.3
Internal Protection Features
4.3.1
Undervoltage Lockout (UVLO)
To ensure correct switching of IGBTs the device is equipped with undervoltage lockout for all driver outputs as well
as for input section, please see Figure 9.
If the power supply voltage VVCC1xx of the input section drops below VUVLOL1 a turn-off signal is sent to the output
driver before power-down. The IGBT is switched off and the signals at INxx+ and INxx- are ignored as long as
V
VCC1xx reaches the power-up voltage VUVLOH1.
If the power supply voltage VVCC2xx of the output driver goes down below VUVLOL2 the IGBT is switched off and
signals from the input chip are ignored as long as VVCC2xx reaches the power-up voltage VUVLOH2. VEE2xx is not
monitored, otherwise negative supply voltage range from 0 V to -12 V would not be possible.
4.3.2
READY Status Output
The READY outputs shows the status of three internal protection features.
•
•
•
UVLO of the input chip
UVLO of the output chip after a short delay
Internal signal transmission after a short delay
It is not necessary to reset the READY signal since its state only depends on the status of the former mentioned
protection signals.
Final Data Sheet
14
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Functional DescriptionNon-Inverting and Inverting Inputs
4.3.3
Watchdog Timer
During normal operation the internal signal transmission is monitored by a watchdog timer. If the transmission fails
for a given time, the IGBT is switched off and the READY output reports an internal error.
4.3.4
Active Shut-Down
The Active Shut-Down feature ensures a safe IGBT off-state if the output chip is not connected to the power
supply, IGBT gate is clamped at OUTxx to VEE2xx.
4.4
Non-Inverting and Inverting Inputs
There are two possible input modes to control the IGBT. At non-inverting mode INxx+ controls the driver output
while INxx- is set to low. At inverting mode INxx- controls the driver output while INxx+ is set to high, please see
Figure 7. A minimum input pulse width is defined to filter occasional glitches.
4.5
Driver Outputs
The output driver sections uses only MOSFETs to provide a rail-to-rail output. This feature permits that tight control
of gate voltage during on-state and short circuit can be maintained as long as the drivers supply is stable. Due to
the low internal voltage drop, switching behaviour of the IGBT is predominantly governed by the gate resistor.
Furthermore, it reduces the power to be dissipated by the driver.
4.6
External Protection Features
4.6.1
Desaturation Protection
A desaturation protection ensures the protection of the IGBT at short circuit. When the DESAT voltage goes up
and reaches 9 V, the output is driven low. Further, the FAULT output is activated, please refer to Figure 8. A
programmable blanking time is used to allow enough time for IGBT saturation. Blanking time is provided by a
highly precise internal current source and an external capacitor.
4.6.2
Active Miller Clamp
In a half bridge configuration the switched off IGBT tends to dynamically turn on during turn on phase of the
opposite IGBT. A Miller clamp allows sinking the Miller current across a low impedance path in this high dV/dt
situation. Therefore in many applications, the use of a negative supply voltage can be avoided.
During turn-off, the gate voltage is monitored and the clamp output is activated when the gate voltage goes below
typical 2 V (related to VEE2). The clamp is designed for a Miller current up to 2 A.
4.6.3
Short Circuit Clamping
During short circuit the IGBTs gate voltage tends to rise because of the feedback via the Miller capacitance. An
additional protection circuit connected to OUTxx and CLAMPxx limits this voltage to a value slightly higher than
the supply voltage. A current of maximum 500 mA for 10 μs may be fed back to the supply through one of this
paths. If higher currents are expected or a tighter clamping is desired external Schottky diodes may be added.
4.7
RESET
The reset inputs have two functions.
Firstly, /RSTxx is in charge of setting back the FAULT output. If /RSTxx is low longer than a given time, /FLTxx will
be cleared at the rising edge of /RSTxx; otherwise, it will remain unchanged. Moreover, it works as
enable/shutdown of the input logic.
Final Data Sheet
15
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersAbsolute Maximum Ratings
5
Electrical Parameters
5.1
Absolute Maximum Ratings
Note:Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of
the integrated circuit. Unless otherwise noted all parameters refer to GND1. The specification for all driver
signals is valid for HS and LS with out special notice, e.g. IN+ covers INHS+ as well as INLS+. The signals
from driver output side are measured with respect to their specific GND2HS or GND2LS.
Table 2
Absolute Maximum Ratings
Parameter
Symbol
Values
Max.
Unit
Note /
Test Condition
Min.
-0.3
-12
–
1)
Positive power supply output side
Negative power supply output side
VVCC2
VVEE2
Vmax2
20
0.3
28
V
V
V
1)
Maximum power supply voltage
output side
–
(VVCC2 - VVEE2
)
Gate driver output
VOUT
IOUT
V
VEE2-0.3
V
max2+0.3
V
A
–
Gate driver high output maximum
current
–
2.4
t = 2 µs
Gate & Clamp driver low output
maximum current
IOUT
–
2.4
A
t = 2 µs
Maximum short circuit clamping time tCLP
–
10
μs
V
ICLAMP/OUT = 500 mA
Positive power supply input side
VVCC1
VLogicIN
-0.3
-0.3
6.5
6.5
–
–
Logic input voltages
(IN+,IN-,RST)
V
Opendrain Logic output voltage (FLT) VFLT#
-0.3
-0.3
6.5
6.5
V
V
–
–
Opendrain Logic output voltage
(RDY)
VRDY
Opendrain Logic output current (FLT) IFLT#
Opendrain Logic output current (RDY) IRDY
–
10
10
mA
mA
V
–
–
–
1)
Pin DESAT voltage
Pin CLAMP voltage
VDESAT
VCLAMP
VISO
-0.3
-0.3
-1200
V
VCC2 +0.3
3)
V
VCC2 +0.32) °C
–
Input to output isolation voltage
(GND2)
1200
V
1)
Output to output isolation voltage
(GND2HS vs GND2LS)
VISO_OUT
-1200
1200
V
Junction temperature
TJ
-40
-55
–
150
150
100
400
1000
°C
–
–
Storage temperature
TS
°C
Power dissipation, per input part
Power dissipation, per output part
Power dissipation, total
PD, IN
PD, OUT
PD, tot
mW
mW
mW
4) @TA = 25°C
4) @TA = 25°C
4) @TA = 25°C
–
–
Final Data Sheet
16
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersAbsolute Maximum Ratings
Table 2
Absolute Maximum Ratings (cont’d)
Parameter
Symbol
Values
Max.
Unit
Note /
Test Condition
Min.
Thermal resistance (Input part)
Thermal resistance (Output part)
RTHJA,IN
RTHJA,OUT
VESD
–
375
110
1
K/W
4) @TA = 25°C,
PD, IN_HS+LS
=
200 mW,
PD, OUT_HS+LS
800 mW
=
–
–
K/W
kV
4) @TA = 25°C,
PD, IN_HS+LS
=
200 mW,
PD, OUT_HS+LS
800 mW
=
ESD Capability
Human Body Model5)
1) With respect to GND2.
2) May be exceeded during short circuit clamping.
3) With respect to VEE2.
4) IC power dissipation is derated linearly at 11.8 mW/°C above 65°C. Thermal performance may change significantly with
layout and heat dissipation of components in close proximity.
5) According to EIA/JESD22-A114-B (discharging a 100 pF capacitor through a 1.5 kΩ series resistor).
Final Data Sheet
17
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersOperating Parameters
5.2
Operating Parameters
Note:Within the operating range the IC operates as described in the functional description. Unless otherwise
noted all parameters refer to GND1. The specification for all driver signals is valid for HS and LS with out
special notic, e.g. IN+ covers INHS+ as well as INLS+. The signals from driver output side are measured
with respect to their specific GND2HS or GND2LS.
Table 3
Operating Parameters
Parameter
Symbol
Values
Max.
Unit
Note /
Test Condition
Min.
13
1)
Positive power supply output side
Negative power supply output side
VVCC2
VVEE2
Vmax2
20
0
V
V
V
1)
-12
–
Maximum power supply voltage
output side
28
–
(VVCC2 - VVEE2
)
Positive power supply input side
VVCC1
4.5
5.5
5.5
V
V
–
–
Logic input voltages
(IN+,IN-,RST)
VLogicIN
-0.3
2)
Pin CLAMP voltage
Pin DESAT voltage
Pin TLSET voltage
Ambient temperature
VCLAMP
VDESAT
VTLSET
TA
V
VEE2-0.3
VVCC2
VVCC2
VVCC2
125
V
–
1)
-0.3
-0.3
-40
–
V
1)
V
°C
kV/μs
–
Common mode transient immunity3) |DVISO/dt|
50
@ 500 V
1) With respect to GND2.
2) May be exceeded during short circuit clamping.
3) The parameter is not subject to production test - verified by design/characterization
5.3
Recommended Operating Parameters
Note:Unless otherwise noted all parameters refer to GND1. The specification for all driver signals is valid for HS
and LS with out special notic, e.g. IN+ covers INHS+ as well as INLS+. The signals from driver output side
are measured with respect to their specific GND2HS or GND2LS.
Table 4
Recommended Operating Parameters
Symbol
Parameter
Value
15
Unit
V
Note / Test Condition
1)
Positive power supply output side
Negative power supply output side
VVCC2
VVEE2
VVCC1
1)
-8
V
Positive power supply input side
1) With respect to GND2.
5
V
–
Final Data Sheet
18
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
5.4
Electrical Characteristics
Note:The electrical characteristics involve the spread of values for the supply voltages, load and junction
temperatures given below. Typical values represent the median values, which are related to production
processes at T = 25°C. Unless otherwise noted all voltages are given with respect to GND. The specification
for all driver signals is valid for HS and LS with out special notic, e.g. IN+ covers INHS+ as well as INLS+.
The signals from driver output side are measured with respect to their specific GND2HS or GND2LS.
5.4.1
Voltage Supply
Table 5
Voltage Supply
Symbol
Parameter
Values
Typ.
Unit
Note /
Test Condition
Min.
–
Max.
4.3
–
UVLO Threshold Input
Chip
VUVLOH1
VUVLOH1
4.1
3.8
–
V
V
V
–
–
–
3.5
0.15
UVLO Hysteresis Input VHYS1
Chip (VUVLOH1 - VUVLOL1
–
)
UVLO Threshold Output VUVLOH2
–
12.0
11.0
0.9
12.6
–
V
V
V
–
–
–
Chip
VUVLOL2
10.4
0.7
UVLO Hysteresis Output VHYS2
–
Chip (VUVLOH1 - VUVLOL1
)
Quiescent Current Input IQ1
–
7
9
mA
VVCC1 = 5 V
Chip
IN+ = High,
IN- = Low
=>OUT = High,
RDY = High,
/FLT = High
Quiescent Current
Output Chip
IQ2
–
4
6
mA
V
V
VCC2 = 15 V
VEE2 = -8 V
IN+ = High,
IN- = Low
=>OUT = High,
RDY = High,
/FLT = High
Final Data Sheet
19
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
5.4.2
Logic Input and Output
Table 6
Logic Input and Output
Symbol
Parameter
Values
Typ.
–
Unit
Note /
Test Condition
Min.
Max.
IN+,IN-, RST Low Input Voltage VIN+L
VIN-L
VRSTL#
IN+,IN-, RST High Input Voltage VIN+H
VIN-H
,
,
–
1.5
V
–
,
,
3.5
–
–
–
V
–
VRSTH#
IN-, RST Input Current
IIN-, IRST#
-400
–
-100
μA
V
V
IN- = GND1
RST# = GND1
IN+ Input Current
IIN+
,
100
400
–
μA
μA
V
IN+ = VCC1
RDY,FLT Pull Up Current
I
PRDY, IPFLT# -400
-100
V
V
RDY = GND1
FLT# = GND1
Input Pulse Suppression IN+,
IN-
TMININ+
TMININ-
,
30
40
40
–
–
–
–
ns
ns
ns
–
–
–
Input Pulse Suppression RST
for ENABLE/SHUTDOWN
TMINRST
30
Pulse Width RST
for Reseting FLT
TRST
800
FLT Low Voltage
RDY Low Voltage
VFLTL
–
–
–
–
300
300
mV
mV
I
I
SINK(FLT#) = 5 mA
SINK(RDY) = 5 mA
VRDYL
Final Data Sheet
20
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
5.4.3
Gate Driver
Table 7
Gate Driver
Parameter
Symbol
Values
Typ.
Unit
Note /
Test Condition
Min.
Max.
High Level Output
Voltage
VOUTH1
VOUTH2
VOUTH3
VOUTH4
V
V
V
CC2 -1.2
V
V
V
V
CC2 -0.8
CC2 -2.0
CC2 -5
–
–
–
–
–
V
V
V
V
A
I
I
I
I
OUTH = -20 mA
OUTH = -200 mA
OUTH = -1 A
CC2 -2.5
CC2 -9
CC2 -10
OUTH = -2 A
High Level Output Peak IOUTH
Current
-1.5
-2.0
IN+ = High,
IN- = Low;
OUT = High
Low Level Output
Voltage
VOUTL1
VOUTL2
VOUTL3
VOUTL4
–
V
V
V
V
VEE2 +0.04 VVEE2+0.09
V
V
V
V
A
I
I
I
I
OUTL = 20 mA
OUTL = 200 mA
OUTL = 1 A
–
VEE2 +0.3
VEE2 +2.1
VEE2 +7
V
V
–
VEE2+0.85
VEE2+5
–
–
OUTL = 2 A
Low Level Output Peak IOUTL
Current
1.5
2.0
–
IN+ = Low,
IN- = Low;
OUT = Low,
V
V
VCC2 = 15 V,
VEE2 = -8 V
5.4.4
Active Miller Clamp
Table 8
Active Miller Clamp
Symbol
Parameter
Values
Typ.
Unit
Note / Test Condition
Min.
Max.
Low Level Clamp
Voltage
VCLAMPL1
VCLAMPL2
VCLAMPL3
ICLAMPL
–
–
–
2
V
V
V
–
VEE2+0.03
V
V
V
–
VEE2 +0.08 V
I
I
I
OUTL = 20 mA
OUTL = 200 mA
OUTL = 1 A
VEE2+0.3
VEE2+1.9
VEE2 +0.8
VEE2 +4.8
V
V
A
1)
Low Level Clamp
Current
Clamp Threshold
Voltage
VCLAMP
1.6
2.1
2.4
V
Related to VEE2
1) The parameter is not subject to production test - verified by design/characterization
Final Data Sheet
21
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
5.4.5
Short Circuit Clamping
Table 9
Short Circuit Clamping
Symbol
Parameter
Values
Typ.
Unit
Note /
Test Condition
Min.
Max.
Clamping voltage (OUT) VCLPout
(VOUT - VVCC2
–
0.8
1.3
0.7
1.3
V
IN+ = High,
IN- = Low,
OUT = High
)
I
OUT = 500 mA
pulse test,
CLPmax = 10 μs)
t
Clamping voltage
VCLPclamp
–
–
–
V
V
IN+ = High,
IN- = Low,
OUT = High
(CLAMP) (VVCLAMP-VVCC2
)
I
CLAMP = 500 mA
(pulse test,
CLPmax = 10 μs)
t
Clamping voltage
(CLAMP)
VCLPclamp
1.1
IN+ = High,
IN- = Low,
OUT = High
I
CLAMP = 20 mA
5.4.6
Dynamic Characteristics
Dynamic characteristics are measured with VVCC1 = 5 V, VVCC2 = 15 V and VVEE2 = -8 V.
Table 10
Dynamic Characteristics
Symbol
Parameter
Values
Typ.
Unit
Note /
Test Condition
Min.
Max.
IN+, IN- input to output
propa-gation delay ON
TPDON
145
170
165
-5
195
ns
ns
ns
CLOAD = 100 pF
V
V
IN+ = 50%,
OUT=50% @ 25°C
IN+, IN- input to output
propa-gation delay OFF
TPDOFF
TPDISTO
145
-35
190
25
IN+, IN- input to output
propa-gation delay
distortion (TPDOFF - TPDON
)
IN+, IN- input to output
propagation delay ON
variation due to temp
TPDONt
–
–
–
–
–
–
25
40
20
ns
ns
ns
1) CLOAD = 100 pF
V
IN+ = 50%,
V
OUT=50%
IN+, IN- input to output
propagation delay OFF
variation due to temp
TPDOFFt
1) CLOAD = 100 pF
VIN+ = 50%,
VOUT=50%
IN+, IN- input to output
propagation delay
TPDISTOt
1) CLOAD = 100 pF
VIN+ = 50%,
distortion variation due to
VOUT=50%
temp (TPDOFF-TPDON
)
Final Data Sheet
22
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
Table 10
Dynamic Characteristics (cont’d)
Parameter
Symbol
Min.
Values
Typ.
Unit
Note /
Test Condition
Max.
Rise Time
Fall Time
TRISE
10
30
60
ns
ns
ns
ns
C
LOAD = 1 nF
VL 10%, VH 90%
LOAD = 34 nF
VL 10%, VH 90%
LOAD = 1 nF
VL 10%, VH 90%
LOAD = 34 nF
200
10
400
50
800
90
C
TFALL
C
200
350
600
C
VL 10%, VH 90%
1) The parameter is not subject to production test - verified by design/characterization
5.4.7
Desaturation Protection
Table 11
Desaturation Protection
Parameter
Symbol
Min.
Values
Typ.
Unit
Note /
Test Condition
Max.
Blanking Capacitor
Charge Current
IDESATC
450
500
550
μA
V
V
V
VCC2 =15 V,
VEE2=- 8 V
DESAT = 2 V
Blanking Capacitor
Discharge Current
IDESATD
9
14
–
mA
V
V
V
VCC2 =15 V,
VEE2 = -8 V
DESAT = 6 V
Desaturation Reference VDESAT
Level
8.3
–
9
9.5
–
V
V
VCC2 = 15 V
Desaturation Filter Time TDESATfilter
250
ns
V
V
V
VCC2 = 15 V,
VEE2 = -8 V
DESAT = 9 V
Desaturation Sense to TDESATOUT
OUT Low Delay
–
350
–
430
2.25
0.95
–
ns
μs
V
V
OUT = 90%
C
LOAD = 1 nF
FLT# = 10%;
IFLT # = 5 mA
Desaturation Sense to TDESATFLT
FLT Low Delay
–
V
Desaturation Low
Voltage
VDESATL
0.4
–
0.6
400
IN+ = Low, IN- = Low,
OUT = Low
Leading edge blanking TDESATleb
ns
Not subject of
production test
Final Data Sheet
23
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Electrical ParametersElectrical Characteristics
5.4.8
Active Shut Down
Table 12
Active Shut Down
Symbol
Parameter
Values
Typ.
Unit
Note /
Test Condition
Min.
Max.
1)
Active Shut Down Voltage VACTSD
–
–
2.0
V
I
V
OUT = -200 mA,
CC2 open
1) With reference to VEE2
Final Data Sheet
24
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Timing DiagrammsElectrical Characteristics
6
Timing Diagramms
50%
IN+
90%
10%
50%
OUT
TRISE
TFALL
TPDON
TPDOFF
Figure 6
Propagation Delay, Rise and Fall Time
IN+
IN-
/RST
OUT
Figure 7
Typical Switching Behavior
Final Data Sheet
25
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Timing DiagrammsElectrical Characteristics
IN+
TPDON
TPDON
TPDOFF
OUT
TDESATfilter
TDESATOUT
VDESAT typ. 9V
TDESATleb
TDESATleb
DESAT
blanking time
/FLT
TDESATFLT
/RST
>TRSTmin
Figure 8
DESAT Switch-Off Behavior
ESD diode conduction
IN+
VUVLOH1
VUVLOL1
VCC1
VUVLOH2
VUVLOL2
VCC2
OUT
RDY
/FLT
/RST
Figure 9
UVLO Behavior
Final Data Sheet
26
Rev. 2.0, 2012-06-05
EiceDRIVER™
2ED020I12-F2
Package OutlinesElectrical Characteristics
7
Package Outlines
FOOTPRINT
MILLIMETERS
INCHES
DOCUMENT NO.
DIM
Z8B00159298
MIN
-
MAX
2.65
0.20
2.45
0.41
0.32
12.80
10.60
7.60
MIN
-
MAX
0.104
0.008
0.096
A
A1
A2
b
0
0.10
2.25
0.25
0.23
12.60
10.00
7.40
0.004
0.089
0.010
0.009
0.496
0.394
0.291
SCALE
0.016
0.013
1.0
c
0
1.0
D
0.504
E
0.417
0.299
2mm
E1
e
0.65 BSC
32
0.026 BSC
32
EUROPEAN PROJECTION
N
L
0.50
0.25
0°
0.90
0.45
8°
0.020
0.010
0°
0.035
h
0.018
8°
T
T 1
ccc
ddd
F1
F2
F3
0°
8°
0°
8°
0.10
0.17
9.73
0.45
1.67
0.004
ISSUE DATE
25.03.2011
0.007
0.383
REVISION
02
0.018
0.066
Figure 10 PG-DSO-36-58 (Plastic (Green) Dual Small Outline Package)
Final Data Sheet 27
Rev. 2.0, 2012-06-05
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG
2ED020I12-F2 相关器件
| 型号 | 制造商 | 描述 | 价格 | 文档 |
| 2ED020I12-FI | INFINEON | Dual IGBT Driver IC | 获取价格 |
|
| 2ED020I12F2XUMA1 | INFINEON | Half Bridge Based Peripheral Driver, 2A, PDSO32, GREEN, PLASTIC, SOP-36/32 | 获取价格 |
|
| 2ED020I12FA | INFINEON | Dual IGBT Driver IC | 获取价格 |
|
| 2ED020I12FAXUMA2 | INFINEON | Half Bridge Based Peripheral Driver, 2A, PDSO32, GREEN, PLASTIC, DSO-36/32 | 获取价格 |
|
| 2ED020I12FIXUMA1 | INFINEON | Half Bridge Based Peripheral Driver, 2A, PDSO18, GREEN, PLASTIC, DSO-20/18 | 获取价格 |
|
| 2ED1322S12M | INFINEON | EiceDRIVER™ 1200 V half-bridge gate driver IC with typical 2.3 A source, 4.6 A sink current and cross conduction prevention in DSO-16 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1322S12M is based on our SOI-technology which has an excellent ruggedness and noise immunity against negative transient voltages on VS pin. Since the device has no parasitic thyristor structures, the design is very robust against parasitic latch up across the operating temperature and voltage r | 获取价格 |
|
| 2ED1324S12P | INFINEON | EiceDRIVER? 1200 V half-bridge gate driver IC with 2.3 A source, 2.3 A sink current and cross conduction prevention in the sufficient creepage, clearance distance DSO-20 (300mils) package for 1200 V SiC MOSFET and IGBT power devices. The 2ED1324S12P supports Active Miller Clamp (AMC), Short Circuit Clamp (SCC) and Cross conduction prevention for the best in class switching performance in the sufficient creepage/clearance distance package DSO-20. Based on the used SOI-technology there is an excel | 获取价格 |
|
| 2ED2101S06F | INFINEON | 650 V high speed, high-side and low-side gate driver with typical 0.29 A source and 0.7 A sink currents in DSO-8 package for driving power MOSFETs and IGBTs. | 获取价格 |
|
| 2ED2103S06F | INFINEON | 650 V high speed half-bridge gate driver with typical 0.29 A source and 0.7 A sink currents in DSO-8 package for driving power MOSFETs and IGBTs. | 获取价格 |
|
| 2ED2104S06F | INFINEON | 650 V high speed half-bridge gate driver with typical 0.29 A source and 0.7 A sink currents in DSO-8 package for driving power MOSFETs and IGBTs. | 获取价格 |
|
2ED020I12-F2 相关文章
苹果Apple Intelligence适配百度AI模型遇技术挑战
- 2024-12-05
- 10
苹果携手亚马逊，定制AI芯片助力Apple Intelligence模型训练
- 2024-12-05
- 9
革命性突破：光衍射极限下微型步行机器人成功面世
- 2024-12-05
- 11
Soitec将为格罗方德9SW平台供应300mm RF-SOI晶圆
- 2024-12-05
- 9
