DRV8837C

更新时间:2024-12-05 05:35:56
品牌:TI
描述:12V、1A H 桥电机驱动器

DRV8837C 概述

12V、1A H 桥电机驱动器

DRV8837C 数据手册

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DRV8837  
www.ti.com  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
LOW-VOLTAGE H-BRIDGE IC  
Check for Samples: DRV8837  
1
FEATURES  
DESCRIPTION  
The DRV8837 provides an integrated motor-driver  
solution for cameras, consumer products, toys, and  
other low-voltage or battery-powered motion-control  
applications. The device has one H-bridge driver, and  
can drive one dc motor or one winding of a stepper  
motor, as well as other devices like solenoids. The  
output driver block consists of N-channel power  
MOSFETs configured as an H-bridge to drive the  
motor winding. An internal charge pump generates  
needed gate-drive voltages.  
2
H-Bridge Motor Driver  
Drives a DC Motor or One Winding of a  
Stepper Motor or Other Loads  
Low MOSFET On-Resistance: HS + LS  
280 mΩ  
1.8-A Maximum Drive Current  
1.8-V to 11-V Motor-Operating Supply-Voltage  
Range  
Separate Motor and Logic Supply Pins  
PWM (IN/IN) Interface  
The DRV8837 can supply up to 1.8 A of output  
current. It operates on a motor power-supply voltage  
from 1.8 V to 11 V, and a device power-supply  
voltage of 1.8 V to 7 V.  
Low-Power Sleep Mode With 120-nA Maximum  
Combined Supply Current  
Dedicated SLEEP Pin  
The DRV8837 has a PWM (IN/IN) input interface,  
which is compatible with industry-standard devices.  
2-mm × 2-mm 8-Pin WSON Package  
There are internal shutdown functions for overcurrent  
protection, short-circuit protection, undervoltage  
lockout and overtemperature.  
APPLICATIONS  
Cameras  
The DRV8837 package is an 8-pin 2-mm × 2-mm  
WSON PowerPAD™ package.  
DSLR Lenses  
Consumer Products  
Toys  
Robotics  
Medical Devices  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2012, Texas Instruments Incorporated  
DRV8837  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
ORDERABLE PART NUMBER  
DRV8837DSGR  
PACKAGE  
WSON – DSG  
WSON – DSG  
TOPSIDE MARKING  
SHIPPING  
Reel of 3000  
Reel of 250  
837  
837  
DRV8837DSGT  
(1) For the most-current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
FUNCTIONAL BLOCK DIAGRAM  
1.8 to 11 V  
VM  
VM  
VM  
Drives DC Motor or  
½ Stepper  
OUT1  
Gate  
Drive  
OCP  
Charge  
Pump  
1.8 to 7 V  
VCC  
Step  
Motor  
DCM  
VM  
VCC  
Logic  
OUT2  
Gate  
Drive  
OCP  
IN1  
IN2  
Over-  
Temp  
SLEEP  
Osc  
GND  
B0479-01  
Figure 1. Functional Block Diagram  
2
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Links: DRV8837  
DRV8837  
www.ti.com  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
DRV8837  
DSG Package  
(Top View)  
1
2
3
4
8
7
6
5
VM  
OUT1  
OUT2  
GND  
VCC  
Thermal  
Pad  
(GND)  
SLEEP  
IN1  
IN2  
P0145-01  
PIN DESCRIPTIONS  
PIN  
I/O  
DESCRIPTION  
EXTERNAL COMPONENTS OR CONNECTIONS  
NAME  
NO.  
Power and Ground  
GND  
VCC  
4
8
1
Device ground  
Device supply  
Motor supply  
Bypass to GND with a 0.1-μF 6.3-V ceramic capacitor.  
Bypass to GND with a 0.1-μF 16-V ceramic capacitor.  
VM  
Control  
Logic-high sets OUT1 high  
Internal pulldown resistor  
IN1  
IN2  
6
5
I
I
Input 1  
Input 2  
Logic-high sets OUT2 high  
Internal pulldown resistor  
Logic-low puts device in low-power sleep mode  
Logic-high for normal operation  
SLEEP  
7
I
Sleep mode input  
Internal pulldown resistor  
Output  
OUT1  
OUT2  
2
3
O
O
Output 1  
Output 2  
Connect to motor winding  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)(1)(2)  
VALUE  
UNIT  
VM  
Power supply voltage range  
Power supply voltage range  
Digital pin voltage range  
–0.3 to 12  
–0.3 V to 7  
–0.5 V to 7  
V
V
VCC  
V
Peak motor drive output current  
Operating virtual junction temperature range  
Storage temperature range  
Internally limited  
–40 to 150  
A
TJ  
ºC  
ºC  
Tstg  
–60 to 150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to network ground terminal.  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links: DRV8837  
DRV8837  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
www.ti.com  
UNIT  
THERMAL INFORMATION  
DRV8837  
DSG  
8 PINS  
60.9  
THERMAL METRIC(1)  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJCtop  
θJB  
71.4  
32.2  
ψJT  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
1.6  
ψJB  
32.8  
θJCbot  
9.8  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
Spacer  
4
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Links: DRV8837  
DRV8837  
www.ti.com  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
1.8  
1.8  
0
NOM  
MAX  
7
UNIT  
V
VCC  
VM  
Device power supply voltage range  
Motor power-supply voltage range  
H-bridge output current(1)  
11  
V
IOUT  
fPWM  
VIN  
1.8  
250  
5.5  
A
Externally applied PWM frequency  
Logic-level input voltage  
0
kHz  
V
0
(1) Power dissipation and thermal limits must be observed.  
ELECTRICAL CHARACTERISTICS  
TA = 25°C, VM = 5 V, VCC = 3 V (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Power Supplies  
VM = 5 V, VCC = 3 V, no PWM  
VM = 5 V, VCC = 3 V, 50-kHz PWM  
VM = 5 V, VCC = 3 V, SLEEP = 0 V  
VM = 5 V, VCC = 3 V, no PWM  
VM = 5 V, VCC = 3 V, 50-kHz PWM  
VM = 5 V, VCC = 3 V, SLEEP = 0 V  
VCC rising  
40  
0.8  
30  
100  
1.5  
95  
µA  
mA  
nA  
µA  
mA  
nA  
IVM  
VM operating supply current  
VM sleep-mode supply current  
VCC operating supply current  
VCC sleep-mode supply current  
VCC undervoltage lockout voltage  
IVMQ  
IVCC  
IVCQ  
VUVLO  
300  
0.7  
5
500  
1.5  
25  
1.8  
1.7  
V
VCC falling  
Logic-Level Inputs  
VIL  
Input low voltage  
0.25 VCC  
0.38 VCC  
0.46 VCC  
0.08 VCC  
V
V
VIH  
VHYS  
IIL  
Input high voltage  
Input hysteresis  
0.5 VCC  
V
Input low current  
Input high current  
Pulldown resistance  
VIN = 0 V  
–5  
5
µA  
µA  
kΩ  
IIH  
VIN = 3.3 V  
50  
RPD  
100  
280  
H-Bridge FETs  
rds(on) HS + LS FET on-resistance  
VCC = 3 V, VM = 5 V, IO = 800 mA,  
TJ = 25°C  
330  
mΩ  
IOFF  
Off-state leakage current  
VOUT = 0 V  
±200  
nA  
Protection Circuits  
IOCP  
tOCR  
tTSD  
Overcurrent protection trip level  
1.9  
3.5  
A
OCP retry time  
1
ms  
ºC  
Thermal shutdown temperature  
Die temperature  
150  
160  
180  
TIMING REQUIREMENTS  
TA = 25°C, VM = 5 V, VCC = 3 V, RL = 20 Ω  
MIN  
MAX UNIT  
1
2
3
4
5
6
t1  
t2  
t3  
t4  
t5  
t6  
Output enable time  
Output disable time  
120  
120  
120  
120  
150  
150  
ns  
ns  
ns  
ns  
ns  
ns  
Delay time, INx high to OUTx high  
Delay time, INx low to OUTx low  
Output rise time  
50  
50  
Output fall time  
Copyright © 2012, Texas Instruments Incorporated  
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5
Product Folder Links: DRV8837  
DRV8837  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
www.ti.com  
IN1  
IN2  
t1  
t4  
t2  
OUT1  
Z
Z
t3  
OUT2  
Z
Z
DRV8837  
80%  
80%  
OUTx  
20%  
20%  
t5  
t6  
T0542-01  
Figure 2. Input/Output Timing  
FUNCTIONAL DESCRIPTION  
Bridge Control  
The DRV8837 is controlled using a PWM input interface, also called an IN/IN interface. Each output is controlled  
by a corresponding input pin.  
The following table shows the logic for the DRV8837:  
IN1  
0
IN2  
0
OUT1  
OUT2  
Function (DC Motor)  
Coast  
Z
L
Z
H
L
0
1
Reverse  
1
0
H
L
Forward  
1
1
L
Brake  
Sleep Mode  
If the nSLEEP pin is brought to a logic-low state, the DRV8837 enters a low-power sleep mode. In this state, all  
unnecessary internal circuitry is powered down.  
Power Supplies and Input Pins  
The input pins may be driven within their recommended operating conditions with or without the VCC and/or VM  
power supplies present. No leakage current path exists to the supply. There is a weak pulldown resistor  
(approximately 100 kΩ) to ground on each input pin.  
6
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Copyright © 2012, Texas Instruments Incorporated  
Product Folder Links: DRV8837  
DRV8837  
www.ti.com  
SLVSBA4A JUNE 2012REVISED AUGUST 2012  
VCC and VM may be applied and removed in any order. When VCC is removed, the device enters a low-power  
state and draws very little current from VM. If the supply voltage is between 1.8 V and 7 V, VCC and VM may be  
connected together.  
Protection Circuits  
The DRV8837 is fully protected against undervoltage, overcurrent, and overtemperature events.  
OVERCURRENT PROTECTION (OCP)  
An analog current limit circuit on each FET limits the current through the FET by removing the gate drive. If  
this analog current limit persists for longer than the OCP time, all FETs in the H-bridge are disabled. After  
approximately 1 ms, the bridge is re-enabled automatically.  
Overcurrent conditions on both high- and low-side devices, that is, a short to ground, supply, or across the  
motor winding all result in an overcurrent shutdown.  
THERMAL SHUTDOWN (TSD)  
If the die temperature exceeds safe limits, all FETs in the H-bridge are disabled. Once the die temperature  
has fallen to a safe level, operation automatically resumes.  
UNDERVOLTAGE LOCKOUT (UVLO)  
If at any time the voltage on the VCC pin falls below the undervoltage lockout threshold voltage, all circuitry  
in the device is disabled and internal logic is reset. Operation resumes when VCC rises above the UVLO  
threshold.  
THERMAL INFORMATION  
Thermal Protection  
The DRV8837 has thermal shutdown (TSD) as described in the Protection Circuits section. If the die temperature  
exceeds approximately 150°C, the device is disabled until the temperature drops to a safe level.  
Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation,  
insufficient heatsinking, or too high an ambient temperature.  
Power Dissipation  
Power dissipation in the DRV8837 is dominated by the power dissipated in the output FET resistance, or rDS(on)  
.
Average power dissipation can be roughly estimated by:  
2
PTOT = rDS(on) ´(IOUT(RMS)  
)
(1)  
where PTOT is the total power dissipation, rDS(on) is the resistance of the HS plus LS FETs, and IOUT(RMS) is the  
rms or dc output current being supplied to the load.  
The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and  
heatsinking.  
Note that rDS(on) increases with temperature, so as the device heats, the power dissipation increases.  
Copyright © 2012, Texas Instruments Incorporated  
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Product Folder Links: DRV8837  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
DRV8837DSGR  
DRV8837DSGT  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
WSON  
WSON  
DSG  
8
8
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
837  
837  
ACTIVE  
DSG  
250  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jun-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
DRV8837DSGR  
DRV8837DSGT  
WSON  
WSON  
DSG  
DSG  
8
8
3000  
250  
330.0  
180.0  
8.4  
8.4  
2.3  
2.3  
2.3  
2.3  
1.15  
1.15  
4.0  
4.0  
8.0  
8.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jun-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
DRV8837DSGR  
DRV8837DSGT  
WSON  
WSON  
DSG  
DSG  
8
8
3000  
250  
367.0  
210.0  
367.0  
185.0  
35.0  
35.0  
Pack Materials-Page 2  
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型号 制造商 描述 价格 文档
DRV8837CDSGR TI 11-V, 1-A H-bridge motor driver 8-WSON -40 to 85 获取价格
DRV8837CDSGT TI 12V、1A H 桥电机驱动器 | DSG | 8 | -40 to 85 获取价格
DRV8837DSGR TI LOW-VOLTAGE H-BRIDGE IC 获取价格
DRV8837DSGT TI LOW-VOLTAGE H-BRIDGE IC 获取价格
DRV8837EVM TI LOW-VOLTAGE H-BRIDGE IC 获取价格
DRV8838 TI 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 获取价格
DRV8838DSGR TI 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 | DSG | 8 | -40 to 85 获取价格
DRV8838DSGT TI 具有相位/使能控制的 11V、1.8A H 桥电机驱动器 | DSG | 8 | -40 to 85 获取价格
DRV8839 TI LOW VOLTAGE DUAL 1/2-H-BRIDGE DRIVER IC 获取价格
DRV8839DSSR TI LOW VOLTAGE DUAL 1/2-H-BRIDGE DRIVER IC 获取价格

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