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AP9408AGH [A-POWER]

Lower Gate Charge, Simple Drive Requirement; 更低的栅极电荷，简单的驱动要求
AP9408AGH
型号： AP9408AGH
厂家： ADVANCED POWER ELECTRONICS CORP.    ADVANCED POWER ELECTRONICS CORP.
描述：

Lower Gate Charge, Simple Drive Requirement
更低的栅极电荷，简单的驱动要求

晶体 栅极 晶体管 功率场效应晶体管 开关 脉冲 驱动
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中文：  中文翻译
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AP9408AGH  
RoHS-compliant Product  
Advanced Power  
Electronics Corp.  
N-CHANNEL ENHANCEMENT MODE  
POWER MOSFET  
▼ Lower Gate Charge  
BVDSS  
RDS(ON)  
ID  
30V  
10mΩ  
53A  
D
▼ Simple Drive Requirement  
▼ Fast Switching Characteristic  
G
S
Description  
Advanced Power MOSFETs from APEC provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and cost-effectiveness.  
G
D
S
TO-252(H)  
The TO-252 package is widely preferred for commercial-industrial  
surface mount applications and suited for low voltage applications  
such as DC/DC converters.  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
30  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
±20  
V
ID@TC=25℃  
ID@TC=100℃  
IDM  
Continuous Drain Current  
Continuous Drain Current  
Pulsed Drain Current1  
53  
A
33  
A
160  
A
PD@TC=25℃  
TSTG  
Total Power Dissipation  
44.6  
W
℃
℃
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
Parameter  
Value  
Units  
℃/W  
℃/W  
Rthj-c  
Maximum Thermal Resistance, Junction-case  
Maximum Thermal Resistance, Junction-ambient  
2.8  
Rthj-a  
110  
Data & specifications subject to change without notice  
1
200810283  
AP9408AGH  
Electrical Characteristics@Tj=25oC(unless otherwise specified)  
Symbol  
BVDSS  
RDS(ON)  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance2 VGS=10V, ID=30A  
VGS=0V, ID=250uA  
30  
-
-
-
-
-
V
10  
15  
mΩ  
mΩ  
V
GS=4.5V, ID=20A  
-
VGS(th)  
Gate Threshold Voltage  
Forward Transconductance  
Drain-Source Leakage Current  
Gate-Source Leakage  
Total Gate Charge2  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time2  
Rise Time  
VDS=VGS, ID=250uA  
VDS=10V, ID=30A  
VDS=30V, VGS=0V  
VGS=±20V  
ID=20A  
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
30  
-
3
V
gfs  
-
S
IDSS  
IGSS  
uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
Ω
10  
-
±100  
Qg  
6.5  
1.8  
3.7  
7
10.5  
Qgs  
Qgd  
td(on)  
tr  
VDS=24V  
-
VGS=4.5V  
-
VDS=15V  
-
ID=1A  
4.5  
16  
6
-
td(off)  
tf  
Turn-off Delay Time  
Fall Time  
RG=3.3Ω,VGS=10V  
RD=15Ω  
-
-
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
VGS=0V  
600  
185  
80  
2.5  
960  
-
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
VDS=25V  
f=1.0MHz  
-
f=1.0MHz  
3.8  
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
VSD  
trr  
Forward On Voltage2  
Reverse Recovery Time2  
IS=30A, VGS=0V  
IS=10A, VGS=0V,  
dI/dt=100A/µs  
-
-
-
-
1.2  
V
23  
16  
-
-
ns  
nC  
Qrr  
Reverse Recovery Charge  
Notes:  
1.Pulse width limited by max. junction temperature  
2.Pulse test  
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.  
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.  
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED  
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN.  
2
AP9408AGH  
160  
120  
80  
40  
0
100  
80  
60  
40  
20  
0
T C =25 o C  
T C =150 o C  
10V  
7.0 V  
6.0V  
5.0 V  
10V  
7 .0V  
6.0V  
5.0 V  
V G =4.0V  
V G = 4.0 V  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
0.0  
1.0  
2.0  
3.0  
4.0  
V DS , Drain-to-Source Voltage (V)  
V DS , Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
14  
13  
12  
11  
10  
9
2.0  
1.6  
1.2  
0.8  
0.4  
I D =20A  
I D =30A  
C =25 o C  
V
G =10V  
T
Ω
8
-50  
0
50  
100  
150  
2
4
6
8
10  
T j , Junction Temperature ( o C)  
V GS , Gate-to-Source Voltage (V)  
Fig 3. On-Resistance v.s. Gate Voltage  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
1.6  
1.2  
0.8  
0.4  
0.0  
30  
20  
10  
0
T j =150 o C  
T j =25 o C  
0
0.4  
0.8  
1.2  
-50  
0
50  
100  
150  
T j , Junction Temperature ( o C)  
V SD , Source-to-Drain Voltage (V)  
Fig 5. Forward Characteristic of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
3
AP9408AGH  
f=1.0MHz  
8
1000  
800  
600  
400  
200  
0
I D =20A  
V
DS =15V  
DS =18V  
6
4
2
0
V
V
DS =24V  
C iss  
C oss  
C rss  
1
5
9
13  
17  
21  
25  
29  
0
2
4
6
8
10  
12  
V DS ,Drain-to-Source Voltage (V)  
Q G , Total Gate Charge (nC)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
1000  
1
Duty factor = 0.5  
100  
10  
1
0.2  
100us  
0.1  
0.1  
0.05  
1ms  
10ms  
100ms  
PDM  
t
0.02  
T
DC  
0.01  
Duty Factor = t/T  
T C =25 o C  
Peak Tj = PDM x Rthjc + TC  
Single Pulse  
Single Pulse  
0
0.01  
0.1  
1
10  
100  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t , Pulse Width (s)  
V DS ,Drain-to-Source Voltage (V)  
Fig 9. Maximum Safe Operating Area  
Fig 10. Effective Transient Thermal Impedance  
VDS  
VG  
90%  
QG  
4.5V  
QGD  
QGS  
10%  
VGS  
tr  
td(on)  
td(off) tf  
Q
Charge  
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
4
ADVANCED POWER ELECTRONICS CORP.  
Package Outline : TO-252  
Millimeters  
D
SYMBOLS  
MIN  
NOM MAX  
D1  
A2  
A3  
B1  
D
1.80  
0.40  
0.40  
6.00  
4.80  
3.50  
2.20  
0.50  
5.10  
0.50  
--  
2.30  
0.50  
0.70  
6.50  
5.35  
4.00  
2.63  
0.85  
5.70  
1.10  
2.30  
0.50  
2.80  
0.60  
1.00  
7.00  
5.90  
4.50  
3.05  
1.20  
6.30  
1.80  
--  
E2  
D1  
E3  
F
E3  
E1  
F1  
E1  
E2  
e
C
0.35  
0.65  
B1  
F1  
F
1.All Dimensions Are in Millimeters.  
e
e
2.Dimension Does Not Include Mold Protrusions.  
R : 0.127~0.381  
A2  
(0.1mm  
C
A3  
Part Marking Information & Packing : TO-252  
Laser Marking  
Part Number  
Meet Rohs requirement  
for low voltage MOSFET only  
9408AGH  
Package Code  
LOGO  
YWWSSS  
Date Code (YWWSSS)  
Y：Last Digit Of The Year  
WW：Week  
SSS：Sequence  
5

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