HMC558A [ADI]
Conversion loss: 7.5 dB typical at 5.5 GHz to 10 GHz;
| 型号： | HMC558A |
| 厂家： | 
ADI |
| 描述： | Conversion loss: 7.5 dB typical at 5.5 GHz to 10 GHz |
| 文件： | 总15页 (文件大小：367K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
5.5 GHz to 14 GHz,
GaAs MMIC Fundamental Mixer
HMC558A
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Conversion loss: 7.5 dB typical at 5.5 GHz to 10 GHz
Local oscillator (LO) to radio frequency (RF) isolation: 45 dB
typical at 5.5 GHz to 10 GHz
HMC558A
LO
RF
LO to intermediate frequency (IF) isolation: 45 dB typical at
10 GHz to 14 GHz
Input third-order intercept (IIP3): 21 dBm typical at 10 GHz
to 14 GHz
IF
Figure 1.
Input P1dB: 11.5 dBm typical at 10 GHz to 14 GHz
Input second-order intercept (IIP2): 55 dBm typical at 10 GHz
to 14 GHz
Passive double-balanced topology
Wide IF bandwidth: dc to 6 GHz
12-lead ceramic leadless chip carrier package
APPLICATIONS
Point to point microwave radios
Point to multipoint radios
Military end use
Instrumentation, automatic test equipment (ATE), and sensors
GENERAL DESCRIPTION
The HMC558A is a general-purpose, double-balanced mixer in a
leadless RoHS compliant SMT package that can be used as an
upconverter or downconverter between 5.5 GHz and 14 GHz.
This mixer is fabricated in a gallium arsenide (GaAs) metal semi-
conductor field effect transistor (MESFET) process, and requires
no external components or matching circuitry.
The HMC558A provides excellent LO to RF and LO to IF isolation
due to optimized balun structures, and operates with LO drive
levels as low as 9 dBm. The RoHS compliant HMC558A eliminates
the need for wire bonding, and is compatible with high volume
surface-mount manufacturing techniques.
Rev. 0
Document Feedback
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responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2016 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC558A
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance ......................................................6
Upconverter Performance............................................................9
Return Loss and Isolation Performance.................................. 10
Spurious Performance ............................................................... 12
Theory of Operation ...................................................................... 13
Applications Information.............................................................. 14
Typical Application Circuit....................................................... 14
Evaluation Board Information ................................................. 14
Outline Dimensions....................................................................... 15
Ordering Guide .......................................................................... 15
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
11/2016—Revision 0: Initial Version
Rev. 0 | Page 2 of 15
Data Sheet
HMC558A
SPECIFICATIONS
LO drive level = 15 dBm, TA = 25°C, IF = 100 MHz, upper sideband, unless otherwise noted. All measurements performed as a
downconverter.
Table 1.
Parameter
Min
5.5
Typ
Max
14
Unit
GHz
GHz
dBm
GHz
RF FREQUENCY RANGE
LO FREQUENCY RANGE
LO DRIVE LEVEL
5.5
14
15
IF FREQUENCY RANGE
PERFORMANCE AT RF = 5.5 GHz to 10 GHz
Conversion Loss
Single Sideband (SSB) Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (IP1dB)
Input Second-Order Intercept (IIP2)
RF to IF Isolation
DC
15
6
7.5
7.5
17.5
10
50
16
9.5
dB
dB
dBm
dBm
dB
8
dB
LO to RF Isolation
LO to IF Isolation
35
20
45
35
dB
dB
PERFORMANCE AT RF = 10 GHz to 14 GHz
Conversion Loss
SSB Noise Figure
8.5
10
10
dB
dB
IIP3
IP1dB
IIP2
16
21
11.5
55
dBm
dBm
dB
RF to IF Isolation
LO to RF Isolation
LO to IF Isolation
10
30
20
19
40
45
dB
dB
dB
Rev. 0 | Page 3 of 15
HMC558A
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
Parameter
Rating
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Maximum Junction Temperature
Continuous PDISS (T = 85°C) (Derate
5.5 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
Field Induced Charged Device Model
(FICDM)
25 dBm
25 dBm
25 dBm
3 mA
175°C
495 mW
Table 3. Thermal Resistance
Package Type
E-12-11
θJC
Unit
180
°C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
−40°C to +85°C
−65°C to +150°C
−65°C to +150°C
ESD CAUTION
2500 V (Class 2)
1000 V (Class C5)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 15
Data Sheet
HMC558A
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
12 11 10
GND
LO
1
2
3
9
8
7
GND
RF
HMC558A
TOP VIEW
(Not to Scale)
GND
GND
4
5
6
NOTES
1. NIC = NO INTERNAL CONNECTION.
2. EXPOSED PAD. CONNECT THE EXPOSED PAD TO A LOW
IMPEDANCE THERMAL AND ELECTRICAL GROUND PLANE.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No.
Mnemonic Description
1, 3, 4, 6, 7, 9 GND
Ground. See Figure 6 for the ground interface schematic.
2
5
LO
IF
Local Oscillator Port. This pin is ac-coupled and matched to 50 Ω. See Figure 4 for the LO interface schematic.
DC-Coupled IF. For applications not requiring operation to dc, dc block this port externally using a series
capacitor whose value is chosen to pass the necessary IF frequency range. For operation to dc, this pin
must not source or sink more than 3 mA of current, or device nonfunction and possible device failure may
result. See Figure 5 for the IF interface schematic.
8
RF
NIC
EPAD
RF Port. This pin is ac-coupled internally and matched to 50 Ω. See Figure 3 for the RF interface schematic.
No Internal Connection. These pins can be grounded.
Exposed Pad. Connect the exposed pad to a low impedance thermal and electrical ground plane.
10, 11, 12
INTERFACE SCHEMATICS
IF
RF
Figure 5. IF Interface
Figure 3. RF Interface
GND
LO
Figure 6. Ground Interface
Figure 4. LO Interface
Rev. 0 | Page 5 of 15
HMC558A
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Data taken as downconverter, upper sideband (low-side LO), TA = 25°C, LO drive level = 15 dBm unless otherwise specified.
0
0
9dBm
–40°C
+25°C
+85°C
12dBm
15dBm
18dBm
20dBm
–2
–2
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency at Various Temperatures,
IF = 100 MHz
Figure 10. Conversion Gain vs. RF Frequency at Various LO Powers,
IF = 100 MHz
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
32.5
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
9dBm
2.5
0
5.0
12dBm
15dBm
18dBm
20dBm
–40°C
2.5
0
+25°C
+85°C
–2.5
–5.0
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures,
IF = 100 MHz
Figure 11. Input IP3 vs. RF Frequency at Various LO Powers,
IF = 100 MHz
0
0
–2
–40°C
9dBm
+25°C
12dBm
15dBm
18dBm
20dBm
–2
+85°C
–4
–6
–8
–4
–6
–8
–10
–10
–12
–14
–16
–18
–20
–12
–14
–16
–18
–20
6
7
8
9
10
11
12
13
14
15
16
6
7
8
9
10
11
12
13
14
15
16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 9. Conversion Gain vs. RF Frequency at Various Temperatures,
IF = 2 GHz
Figure 12. Conversion Gain vs. RF Frequency at Various LO Powers,
IF = 2 GHz
Rev. 0 | Page 6 of 15
Data Sheet
HMC558A
32.5
35
30
25
20
15
10
5
–40°C
+25°C
+85°C
–40°C
30.0
+25°C
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
+85°C
5.0
2.5
0
–2.5
–5.0
–7.5
0
6
7
8
9
10
11
12
13
14
15
16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input IP3 vs. RF Frequency at Various Temperatures,
IF = 2 GHz
Figure 16. Input P1dB vs. RF Frequency at Various Temperatures,
IF = 100 MHz
25
0
–40°C
–40°C
+25°C
+85°C
+25°C
–2.5
+85°C
20
15
10
5
–5.0
–7.5
–10.0
–12.5
–15.0
–17.5
–20.0
–22.5
–25.0
0
4
5
6
7
8
9
10 11 12 13 14 15 16
0
1
2
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 14. Conversion Gain vs. IF Frequency at Various Temperatures
Figure 17. SSB Noise Figure vs. RF Frequency at Various Temperatures,
IF = 100 MHz
35.0
25
9dBm
32.5
9dBm
12dBm
15dBm
12dBm
30.0
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
2.5
0
–2.5
–5.0
–7.5
–10.0
–12.5
15dBm
18dBm
20dBm
18dBm
20
15
10
5
0
6
7
8
9
10
11
12
13
14
15
16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 15. Input IP3 vs. RF Frequency at Various LO Powers,
IF = 2 GHz
Figure 18. SSB Noise Figure vs. RF Frequency at Various LO Powers,
IF = 100 MHz
Rev. 0 | Page 7 of 15
HMC558A
Data Sheet
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
9dBm
12dBm
15dBm
18dBm
20dBm
–40°C
+25°C
+85°C
10
0
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 19. Input IP2 vs. RF Frequency at Various Temperatures,
IF = 100 MHz
Figure 21. Input IP2 vs. RF Frequency at Various LO Powers,
IF = 100 MHz
90
90
–40°C
+25°C
80
80
70
60
50
40
30
20
10
0
+85°C
70
60
50
40
30
20
10
0
9dBm
12dBm
15dBm
18dBm
20dBm
6
7
8
9
10
11
12
13
14
15
16
6
7
8
9
10
11
12
13
14
15
16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 20. Input IP2 vs. RF Frequency at Various Temperatures,
IF = 2000 MHz
Figure 22. Input IP2 vs. RF Frequency, at Various LO Powers,
IF = 2000 MHz
Rev. 0 | Page 8 of 15
Data Sheet
HMC558A
UPCONVERTER PERFORMANCE
Data taken as upconverter, upper sideband, TA = 25°C, LO drive level = 15 dBm unless otherwise specified.
–2
0
12dBm
15dBm
18dBm
20dBm
–40°C
+25°C
+85°C
–2
–4
–4
–6
–6
–8
–8
–10
–12
–14
–16
–18
–20
–10
–12
–14
–16
–18
–20
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 23. Conversion Gain vs. RF Frequency for Various Temperatures,
IF = 100 MHz
Figure 25. Conversion Gain vs. RF Frequency for Various LO Powers,
IF = 100 MHz
32.5
32.5
–40°C
12dBm
30.0
30.0
+25°C
15dBm
+85°C
18dBm
20dBm
27.5
27.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
25.0
22.5
20.0
17.5
15.0
12.5
10.0
7.5
5.0
5.0
2.5
2.5
0
0
–2.5
–5.0
–2.5
–5.0
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY(GHz)
Figure 26. Input IP3 vs. RF Frequency for Various LO Powers,
IF = 100 MHz
Figure 24. Input IP3 vs. RF Frequency for Various Temperatures,
IF = 100 MHz
Rev. 0 | Page 9 of 15
HMC558A
Data Sheet
RETURN LOSS AND ISOLATION PERFORMANCE
Data taken at TA = 25°C, LO drive level = 15 dBm unless otherwise specified.
80
70
60
50
40
30
20
10
0
80
–40°C
+25°C
9dBm
12dBm
15dBm
18dBm
20dBm
+85°C
70
LO TO RF
60
LO TO RF
50
40
30
20
10
0
LO TO IF
LO TO IF
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 29. LO to RF and LO to IF Isolation vs. LO Frequency at Various
LO Powers, IF = 100 MHz
Figure 27. LO to RF and LO to IF Isolation vs. LO Frequency at Various
Temperatures, IF = 100 MHz
40
40
9dBm
12dBm
15dBm
18dBm
–40°C
+25°C
+85°C
35
30
25
20
15
10
5
35
30
25
20
15
10
5
0
0
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 30. RF to IF Isolation vs. RF Frequency at Various LO Powers,
IF = 100 MHz
Figure 28. RF to IF Isolation vs. RF Frequency at Various Temperatures,
IF = 100 MHz
Rev. 0 | Page 10 of 15
Data Sheet
HMC558A
10
5
0
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
5
0
–5
–5
–10
–15
–20
–25
–30
–35
–40
–10
–15
–20
–25
–30
–35
–40
4
5
6
7
8
9
10 11 12 13 14 15 16
4
5
6
7
8
9
10 11 12 13 14 15 16
LO FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 31. LO Return Loss vs. LO Frequency at Various Temperatures
Figure 33. RF Return Loss vs. RF Frequency at Various Temperatures,
IF = 100 MHz, LO Power = 15 dBm
5
–40°C
+25°C
+85°C
0
–5
–10
–15
–20
–25
–30
–35
–40
0.1
1.1
2.1
3.1
4.1
5.1
6.1
7.1
8.1
9.1 10.1
IF FREQUENCY (GHz)
Figure 32. IF Return Loss vs. IF Frequency at Various Temperatures,
LO Power = 15 dBm, LO Frequency = 11 GHz
Rev. 0 | Page 11 of 15
HMC558A
Data Sheet
SPURIOUS PERFORMANCE
Mixer spurious products are measured in dBc from the IF output power level. Spur values are (M × RF) − (N × LO).
Lower sideband selected, IF = 100 MHz, RF frequency = 8.1 GHz, RF input power = −10 dBm, LO frequency = 8.0 GHz, LO drive = 15 dBm.
nLO
0
1
2
3
4
0
1
2
3
4
N/A1
10.3
83.6
79
−1
0
24.7
22.7
64
24.4
34.9
58.9
69.6
85.7
35.9
54.3
81.9
75.7
91.3
mRF
59
84.3
78.4
77.8
84.6
76.3
1 N/A means not applicable.
Rev. 0 | Page 12 of 15
Data Sheet
HMC558A
THEORY OF OPERATION
The HMC558A is a general-purpose double balanced mixer in a
leadless RoHS compliant SMT package that can be used as an
upconverter or downconverter between 5.5 GHz and 14 GHz. This
mixer is fabricated in a GaAs MESFET process, and requires no
external components or matching circuitry. The HMC558A
provides excellent LO to RF and LO to IF isolation due to
optimized balun structures and operates with LO drive levels as low
as 9 dBm. The RoHS compliant HMC558A eliminates the need for
wire bonding, and is compatible with high volume surface mount
manufacturing techniques.
Rev. 0 | Page 13 of 15
HMC558A
Data Sheet
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION BOARD INFORMATION
The circuit board used in an application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and exposed pad must be connected
directly to the ground plane, similarly to that shown in Figure 35.
Use a sufficient number of via holes to connect the top and
bottom ground planes. The evaluation circuit board shown in
Figure 35 is available from Analog Devices, Inc., upon request.
12 11 10
1
2
3
9
8
7
LO
RF
4
5
6
IF
LO
RF
Figure 34. Typical Application Circuit
J2
J1
IF
U1
J3
Figure 35. HMC558A Evaluation Board Top Layer
Table 5. Bill of Materials for the EV1HMC558ALC3B Evaluation Board
Level Item Part Number Quantity Reference Designator Description
1
1
1
1
1
2
3
4
117611-1
104935
105192
1
2
1
1
PCB, evaluation board
2.92 mm connector, SRI
SMA connector, Johnson
Device under test (DUT)
J1 to J2
J3
U1
HMC558ALC3B
Rev. 0 | Page 14 of 15
Data Sheet
HMC558A
OUTLINE DIMENSIONS
3.13
3.00 SQ
2.87
0.36
0.30
0.24
PIN 1
INDICATOR
PIN 1
(0.32 × 0.32)
10
12
9
1
3
0.50
BSC
1.60
1.50 SQ
1.40
EXPOSED
PAD
7
4
6
BOTTOM VIEW
TOP VIEW
SIDE VIEW
1.00 REF
2.10 BSC
0.92 MAX
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 36. 12-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-12-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature
Package
Option
Package Body
Material
Lead
Finish
MSL
Rating
Model1
Range
Description
Branding
HMC558ALC3B
−40°C to +85°C
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
12-Terminal Ceramic
Leadless Chip Carrier [LCC]
E-12-1
E-12-1
E-12-1
Alumina
Ceramic
Alumina
Ceramic
Alumina
Ceramic
Gold over
Nickel
Gold over
Nickel
Gold over
Nickel
MSL3
H558A
XXXX
H558A
XXXX
H558A
XXXX
HMC558ALC3BTR
−40°C to +85°C
MSL3
MSL3
HMC558ALC3BTR-R5 −40°C to +85°C
EV1HMC558ALC3B
Evaluation PCB Assembly
1 Z = RoHS Compliant Part.
©2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15000-0-11/16(0)
Rev. 0 | Page 15 of 15
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