AMMP-5618-TR2 [AGILENT]
6-20 GHz General Purpose Amplifier; 6-20 GHz的通用放大器
| 型号： | AMMP-5618-TR2 |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | 6-20 GHz General Purpose Amplifier |
| 文件： | 总9页 (文件大小：242K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Agilent AMMP-5618
6–20 GHz General Purpose Amplifier
Data Sheet
Features
• 5 x 5 mm surface mount package
•
Broad band performance 6–20 GHz
• High +19 dBm output power
• Medium 13 dB typical gain
• 50Ω input and output match
• Single 5V (107 mA) supply bias
Description
Vd
2
Agilent’s AMMP-5618 is a high
power, medium gain amplifier
that operates from 6 GHz to
20 GHz. The amplifier is designed
to be an easy-to-use component
for any surface mount PCB
application. In communication
systems, it can be used as a LO
buffer, or as a transmit driver
amplifier. During typical opera-
tion with a single 5V supply, each
gain stage is biased for Class-A
operation for optimal power
output with minimal distortion.
The amplifier has integrated 50Ω
I/O match, DC blocking, self-bias
and choke to eliminate complex
tuning and assembly processes
typically required by hybrid
(discrete-FET) amplifiers. The
package is fully SMT compatible
with backside grounding and I/O
to simplify assembly.
1
7
3
5
Applications
• Microwave radio systems
RFin
RFout
4
8
• Satellite VSAT, DBS up/down link
• LMDS & Pt-Pt mmW long haul
6
• Broadband wireless access
(including 802.16 and 802.20
WiMax)
Attention:
Observe precautions for
handling electrostatic
sensitive devices.
• WLL and MMDS loops
• Commercial grade military
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Agilent Application Note A004R:
Electrostatic Discharge Damage and Control.
Absolute Maximum Ratings[1]
Symbol
Parameters/Conditions
Units
Min.
Max.
Vd
Positive Drain Voltage
Drain Current
V
7
Note: These devices are ESD
sensitive. The following precau-
tions are strongly recommended.
Ensure that an ESD approved
carrier is used when dice are
transported from one destination
to another. Personal grounding is
to be worn at all times when
handling these devices.
Id
mA
dBm
°C
150
20
Pin
CW Input Power
Tch
Operating Channel Temperature
Storage Case Temperature
Max. Assembly Temp (60 sec max)
+150
+150
+300
Tstg
Tmax
Note:
°C
-65
°C
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
AMMP-5618 DC Specifications/Physical Properties[1]
Symbol
Parameters and Test Conditions
Units
Min.
Typ.
Max.
Id
Drain Supply Current (under any RF power drive and temperature) (Vd=5.0V)
mA
107
34
140
θch-b
Notes:
Thermal Resistance[2] (Backside temperature, Tb = 25°C)
°C/W
1. Ambient operational temperature TA = 25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (Tchannel (Tc) = 34°C) as measured using infrared microscopy. Thermal Resistance at backside temperature (Tb)
= 25°C calculated from measured data.
RF Specifications[3,4,6] (TA= 25°C, Vd= 5.0V, Id(Q)=107 mA, Zo=50 Ω)
Symbol
Parameters and Test Conditions
Units
Typ.
Sigma
Gain
NF
Small-signal Gain[5]
dB
13
0.4
0.2
0.9
1.2
Noise Figure into 50Ω[5]
dB
4.4
P-1dB
OIP3
Output Power at 1 dB Gain Compression
dBm
dBm
+19
+30
Third Order Intercept Point;
∆f = 100 MHz; Pin = -20 dBm
RLin
Input Return Loss
Output Return Loss
Reverse Isolation
dB
dB
dB
-12
-12
-40
0.7
0.6
1.2
RLout
Isol
Notes:
3. Small/Large -signal data measured in a fully de-embedded test fixture form TA = 25°C.
4. Pre-assembly into package performance verified 100% on-wafer per AMMC-5618 published specifications
5. This final package part performance is verified by a functional test correlated to actual performance at one or more frequencies
6. Specifications are derived from measurements in a 50Ω test environment. Aspects of the amplifier performance may be improved over a more narrow
bandwidth by application of additional conjugate, linearity, or low noise (Γopt) matching.
2
AMMP-5618 Typical Performance (TA = 25°C, Vd = 5V, Id = 107 mA, Zin = Zout = 50Ω unless otherwise stated)
Note: These measurements are in 50Ω test environment. Aspects of the amplifier performance may be improved over a narrower
bandwidth by application of additional conjugate, linearity or low noise (Γopt) matching.
15
12
9
0
-10
-20
-30
-40
-50
0
-5
-10
-15
-20
-25
-30
6
3
0
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
Figure 1. Gain.
Figure 2. Isolation.
Figure 3. Input Return Loss.
0
-5
8
7
6
5
4
3
35
30
25
20
15
10
5
-10
-15
-20
-25
-30
OP1dB
OIP3
0
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
6
8
10
12
14
16
18 20
6
8
10
12
14
16
18
20
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4. Output Return Loss.
Figure 5. Noise Figure.
Figure 6. Typical Power, OP-1dB and OIP3.
20
15
10
5
0
-10
-20
-30
-40
-50
-60
0
25°C
-40°C
+85°C
25°C
-40°C
+85°C
-5
-10
-15
-20
25°C
-40°C
+85°C
0
-5
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
Figure 7. Gain Over Temperature.
Figure 8. Isolation Over Temperature.
Figure 9. Input RL Over Temperature.
3
AMMP-5618 Typical Performance (TA = 25°C, Vd = 5V, Id = 107 mA, Zin = Zout = 50Ω unless otherwise stated)
Note: These measurements are in 50Ω test environment. Aspects of the amplifier performance may be improved over a narrower
bandwidth by application of additional conjugate, linearity or low noise (Γopt) matching.
0
-5
8
7
6
5
4
3
108
106
104
102
100
98
25°C
-40°C
+85°C
25°C
-40°C
+85°C
-10
-15
-20
-25
-30
25°C
-40°C
+85°C
96
94
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
6
8
10
12
14
16
18 20
3
3.5
4
4.5
5
FREQUENCY (GHz)
Vdd (V)
Figure 10. Output Return Loss Over
Temperature.
Figure 11. NF Over Temperature.
Figure 12. Bias Current Over Temperature.
0
-10
-20
-30
-40
-50
-60
0
16
12
3V
3V
4V
4V
5V
-5
5V
-10
-15
-20
8
3V
4
4V
5V
0
4
6
8
10 12 14 16 18 20
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20
FREQUENCY (GHz)
4
6
8
10 12 14 16 18 20 22
FREQUENCY (GHz)
Figure 14. Isolation Over Vdd.
Figure 15. Input RL Over Vdd.
Figure 13. Gain Over Vdd.
0
-5
20
16
12
8
35
30
25
20
15
10
5
3V
4V
5V
-10
-15
-20
-25
-30
-35
3V
4V
5V
3V
4V
5V
4
0
0
4
6
8
10 12 14 16 18 20
FREQUENCY (GHz)
6
8
10
12
14
16
18 20
6
8
10
12
14
16
18 20
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 16. Output Return Loss Over Vdd.
Figure 17. Output Power Over Vdd.
Figure 18. OIP3 Over Vdd.
4
AMMP-5618 Typical Scattering Parameters[1] (TA = 25°C, Vd = 5V, ZO = 50Ω)
Freq.
GHz
S11
S21
S12
Mag
S22
dB
Mag Phase
dB
Mag Phase
dB
Phase
dB
Mag Phase
2.0
-2.995 0.708
-3.432 0.674
-4.250 0.613
-4.096 0.624
-4.325 0.608
-4.797 0.576
-6.417 0.478
-11.055 0.280
-18.578 0.118
-23.802 0.065
-25.186 0.055
-27.287 0.043
-27.021 0.045
-24.540 0.059
-23.582 0.066
-23.477 0.067
-24.304 0.061
-22.475 0.075
-19.215 0.109
-16.258 0.154
-14.234 0.194
-13.024 0.223
-12.514 0.237
-12.482 0.238
-12.919 0.226
-13.636 0.208
-13.993 0.200
-13.835 0.203
-13.000 0.224
-12.524 0.236
-12.067 0.222
-11.963 0.200
-12.862 0.181
-12.547 0.187
-11.062 0.225
-10.610 0.272
-10.469 0.300
-10.018 0.316
-9.997 0.316
-10.136 0.311
-9.631 0.330
-7.870 0.404
-5.619 0.524
-4.449 0.599
-4.155 0.620
-4.196 0.617
-4.530 0.594
70.854
-22.696 0.073
-16.093 0.157
-4.538 0.593
-1.726 0.461
45.614
-58.670
-49.826
-43.091
-36.349
-39.160
-42.543
-50.015
-46.815
-42.183
-40.719
-39.954
-39.602
-39.264
-39.039
-38.938
-38.808
-38.711
-38.711
-38.700
-38.773
-38.489
-38.221
-38.071
-37.739
-37.252
-37.903
-37.680
-38.692
-39.424
-38.107
-37.443
-37.604
-37.848
-38.170
-38.384
-39.112
-39.698
-40.748
-42.165
-43.928
-45.145
-49.217
-47.596
-53.021
-51.322
-46.344
-45.149
0.001
0.003
0.007
0.015
0.011
0.007
0.003
0.005
0.008
0.009
0.010
0.010
0.011
0.011
0.011
0.011
0.012
0.012
0.012
0.012
0.012
0.012
0.012
0.013
0.014
0.013
0.013
0.012
0.011
0.012
0.013
0.013
0.013
0.012
0.012
0.011
0.010
0.009
0.008
0.006
0.006
0.003
0.004
0.002
0.003
0.005
0.006
91.028
-0.537
0.940
0.923
0.841
0.642
0.615
0.559
0.475
0.373
0.302
0.247
0.191
0.138
0.113
0.126
0.152
0.172
0.180
0.169
0.149
0.119
0.094
0.074
0.063
0.059
0.057
0.050
0.050
0.051
0.071
0.081
0.080
0.079
0.072
0.060
0.063
0.093
0.141
0.204
0.265
0.323
0.369
0.437
0.445
0.440
0.421
0.383
0.325
118.786
56.844
2.5
7.524
62.385
-30.565
172.431
-48.599
-129.213
166.320
130.192
155.918
114.699
69.159
-0.694
3.0
-59.292
-112.628
-174.493
121.652
52.449
-0.007
-1.503
-77.196
-20.982
-101.456
-168.104
130.723
79.201
3.5
-157.105
-52.399
-107.307
-175.227
108.456
38.847
-3.848
4.0
0.287
5.870
0.394
1.131
-4.217
4.5
-5.052
5.0
10.805 3.164
13.764 4.712
14.224 5.385
14.468 5.475
14.500 5.495
14.416 5.506
14.509 5.501
14.512 5.503
14.512 5.503
14.523 5.510
14.491 5.490
14.473 5.479
14.479 5.482
14.388 5.425
14.419 5.382
14.367 5.350
14.328 5.326
14.202 5.249
14.147 5.216
13.972 5.054
14.029 4.971
13.739 4.920
13.725 4.969
13.966 5.109
14.024 5.143
14.002 5.130
14.148 5.217
14.132 5.207
14.210 5.254
14.091 5.183
13.858 5.046
13.623 4.911
13.398 4.785
13.019 4.797
12.886 4.724
12.504 4.219
11.738 3.863
10.831 3.480
-6.475
5.5
-16.473
-62.704
-78.360
-114.355
176.586
89.220
-8.555
6.0
-10.393
-12.156
-14.372
-17.196
-18.937
-17.986
-16.383
-15.281
-14.875
-15.430
-16.520
-18.494
-20.529
-22.659
-24.039
-24.607
-24.958
-26.020
-25.949
-25.799
-23.027
-21.872
-21.936
-22.039
-22.843
-24.452
-24.014
-20.632
-16.990
-13.793
-11.540
-9.819
36.021
6.5
-23.228
-75.874
-127.412
-176.352
134.523
87.924
-7.111
7.0
27.235
-54.746
-111.340
-179.767
115.789
65.272
7.5
-12.197
-50.735
-88.381
-124.530
-160.536
163.632
128.550
92.021
8.0
8.5
16.508
9.0
-43.865
-104.344
-175.038
107.849
44.619
9.5
41.684
25.081
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
14.5
15.0
15.5
16.0
16.5
17.0
17.5
18.0
18.5
19.0
19.5
20.0
20.5
21.0
21.5
22.0
22.5
23.0
23.5
24.0
24.5
25.0
-3.914
-11.906
-47.630
-83.772
-122.670
-163.935
150.698
107.199
69.051
-48.272
-93.057
-137.014
179.443
136.208
92.923
-5.409
61.222
-51.554
-95.001
-138.454
177.883
132.024
87.229
26.022
-8.975
-43.893
-78.798
-114.505
-153.055
172.112
133.007
104.224
82.267
50.240
6.926
37.568
-35.308
-77.276
-118.133
-158.923
158.580
115.249
72.656
10.165
38.470
-2.864
-5.903
-10.215
-27.632
-63.932
-90.189
-122.785
-163.441
144.595
83.275
-52.805
-103.865
-152.985
153.118
93.198
37.833
0.928
29.105
-35.629
-72.292
-109.537
-147.597
176.777
139.612
102.558
74.095
28.065
-14.187
-58.599
-104.365
-149.000
165.396
122.433
77.749
-33.067
-88.132
-138.271
173.388
122.816
65.257
30.364
-10.504
-47.217
-83.538
-119.330
-153.160
166.236
131.591
97.415
-1.277
29.934
49.307
-8.659
-59.633
-127.317
171.791
119.140
71.146
-13.003
-63.650
-112.183
-157.885
159.348
116.230
-1.915
-7.188
-40.229
-136.023
114.374
21.965
-7.034
-7.133
9.293
8.021
6.897
2.915
2.518
2.212
-7.517
61.706
-8.346
22.766
23.384
-35.249
-9.765
-21.448
Note:
1. Data obtained from in fixture de-embedded
to package edge.
Input Reference Plane
fors-parameters
Output Reference Plane
fors-parameters
(View from package bottom)
5
Biasing and Operation
The AMMC-5618 does not require
a negative gate voltage to bias
any of the three stages. No
ground wires are needed because
all ground connections are made
with plated through-holes to the
backside of the package.
The AMMC-5618 is normally
biased with a single positive
drain supply connected to both
VD pins through bypass capaci-
tors as shown in Figure 19. The
recommended supply voltage is
5V. It is important to have 0.1 µF
bypass capacitor, and the capaci- Refer to the Absolute Maximum
Figure 21. Demonstration Board
(available upon request).
tor should be placed as close to
the component as possible.
Ratings table for allowed DC and
thermal conditions.
Vd
(Typ 5V)
0.1 µF
1
7
2
6
3
5
RFin
RFout
4
8
BASE
GND
Figure 19. Typical Application.
V
V
D2
D1
Feedback
Network
Feedback
Network
Matching
Matching
RF Input
Matching
RF Output
V
V
G2
G1
Figure 20. Simplified MMIC Schematic.
6
1
2 3
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
.200 [5.08]
8
4
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
7
6 5
.200 [5.08]
.075 [1.91]
Side View
Front View
.114 [2.9]
.011 [0.28]
.018 [0.46]
.014 [0.365]
3
2 1
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
.016 [0.40]
4
8
.126 [3.2]
.059 [1.5]
.100 [2.54]
.012 [0.30]
3. Recommended attachment is
conductive solder paste.
Please see recommended
solder reflow profile. Conduc-
tive epoxy is not recom-
mended. Hand soldering is not
recommended.
.029 [0.75]
5
6 7
.100 [2.54]
.016 [0.40]
.028 [0.70]
.093 [2.36]
Dimensional Tolerances: 0.002" [0.05 mm]
Back View
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
Notes:
1. * Indicates Pin 1
2. Dimensions are in inches [millimeters]
3. All Grounds must be soldered to PCB RF Ground
Figure 22. Outline Drawing.
.093 [2.36]
.010 [0.25]
.016 [0.40]
.011 [0.28]
.0095 [0.24]
.016 [0.40]
.126 [3.20]
.059 [1.50]
.020 [0.50]
.012 [0.3]
6. Packages have been qualified
to withstand a peak tempera-
ture of 260°C for 20 seconds.
Verify that the profile will not
expose device beyond these
limits.
.018 [0.46]
.0095 [0.24]
.018 [0.46]
.114 [2.90]
Figure 23. Suggested PCB Material and Land Pattern.
7
Solder Reflow Profile
lead to excessive solder paste
smear or bridging across the I/O
pads. Considering the fact that
solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use a laser cut stencil composed
of 0.127 mm (5 mils) thick
stainless steel which is capable of
producing the required fine
stencil outline.
Stencil Design Guidelines
A properly designed solder
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 24. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 1 will vary among differ-
ent solder pastes from different
manufacturers and is shown here
for reference only.
screen or stencil is required to
ensure optimum amount of solder
paste is deposited onto the PCB
pads. The recommended stencil
layout is shown in Figure 25. The
stencil has a solder paste deposi-
tion opening approximately 70%
to 90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil
The combined PCB and stencil
layout is shown in Figure 26.
openings larger than 100% will
300
Peak = 250 5°C
250
Melting point = 218°C
200
150
100
50
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
250
0
0
50
100
150
200
300
Seconds
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
0.40
0.46
0.70
0.60
0.67
0.60
0.36
0.40
1.60
0.9550
0.27
3.20 1.80 0.40
0.36
0.95
0.36
0.30
0.27
0.36
1.80
0.36
Stencil
Opening
1.60
2.90
0.40
4x - R0.14
Figure 26. Combined PCB and Stencil Layouts (mm).
Figure 25. Stencil Outline Drawing (mm).
8
Part Number Ordering Information
Devices
Device Orientation (Top View)
Part Number
per Container
Container
antistatic bag
7” Reel
AMMP-5618-BLK
AMMP-5618-TR1
AMMP-5618-TR2
10
100
500
7” Reel
Carrier Tape and Pocket Dimensions
www.agilent.com/semiconductors
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Hong Kong: (65) 6756 2394
India, Australia, New Zealand: (65) 6755 1939
Japan: (+81 3) 3335-8152(Domestic/International), or
0120-61-1280(Domestic Only)
Korea: (65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand, Philippines,
Indonesia: (65) 6755 2044
Taiwan: (65) 6755 1843
Data subject to change.
Copyright © 2005 Agilent Technologies, Inc.
January 31, 2005
5989-1994EN
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