AOI472A [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOI472A
型号: AOI472A
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总7页 (文件大小:159K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AOI472A  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOI472A is fabricated with SDMOSTM trench  
technology that combines excellent RDS(ON) with low gate  
charge.The result is outstanding efficiency with  
controlled switching behavior. This universal technology  
is well suited for PWM, load switching and general  
purpose applications.  
V
DS (V) =25V  
(VGS = 10V)  
(VGS = 10V)  
(VGS = 4.5V)  
ID = 50A  
R
DS(ON) < 5.2mΩ  
DS(ON) < 9.5mΩ  
R
100% UIS Tested!  
100% Rg Tested!  
- RoHS Compliant  
- Halogen Free  
TO-251A  
IPAK  
D
Bottom View  
Top View  
D
G
S
G
D
D
S
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
25  
±20  
50  
V
VGS  
ID  
IDM  
IDSM  
Gate-Source Voltage  
Continuous Drain  
Current G  
V
A
TC=25°C  
TC=100°C  
39  
Pulsed Drain Current C  
100  
17  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Repetitive avalanche energy L=50uHC  
A
13  
IAR  
50  
A
EAR  
63  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
50  
PD  
W
25  
TA=25°C  
2.5  
PDSM  
W
Power Dissipation A  
TA=70°C  
1.6  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
15  
Max  
20  
50  
3
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
41  
Steady-State  
Steady-State  
RθJC  
2.1  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
25  
V
VDS=25V, VGS=0V  
10  
50  
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
VDS=0V, VGS= ±20V  
VDS=VGS ID=250µA  
VGS=10V, VDS=5V  
100  
2.5  
nA  
V
VGS(th)  
ID(ON)  
1.2  
2
100  
A
V
GS=10V, ID=30A  
4.3  
6.2  
8
5.2  
7.4  
9.5  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
VGS=4.5V, ID=20A  
VDS=5V, ID=30A  
IS=1A,VGS=0V  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
65  
0.7  
S
V
A
1
Maximum Body-Diode Continuous Current  
50  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1500 1800 2200  
pF  
pF  
pF  
VGS=0V, VDS=12.5V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
340  
200  
1.1  
445  
285  
1.6  
580  
400  
2.4  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V)  
Total Gate Charge  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
25  
12  
31  
15  
4.8  
8.9  
8
40  
20  
7
nC  
nC  
nC  
nC  
ns  
Qg(4.5V)  
Qgs  
Qgd  
tD(on)  
tr  
V
GS=10V, VDS=12.5V, ID=30A  
3.5  
6.5  
13  
VGS=10V, VDS=12.5V,  
10.4  
29  
9
ns  
RL=0.42, RGEN=3Ω  
tD(off)  
tf  
ns  
ns  
trr  
IF=30A, dI/dt=500A/µs  
IF=30A, dI/dt=500A/µs  
9.5  
17  
12  
21  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
15  
26  
ns  
Qrr  
nC  
2
A. The value of RθJA is measured with the device mounted on 1in FR-4 board with 2oz. Copper, in a still air environment with T =25°C. The Power  
A
dissipation PDSM is based on R θJA and the maximum allowed junction temperature of 150°C. The value in any given application depends on the  
user's specific board design, and the maximum temperature of 175°C may be used if the PCB allows it.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation  
limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C. Ratings are based on low frequency and duty cycles to keep initial T  
J
=25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=175°C. The SOA curve provides a single pulse rating.  
G. The maximum current rating is limited by bond-wires.  
2
H. These tests are performed with the device mounted on 1 in FR-4 board with 2oz. Copper, in a still air environment with T =25°C.  
A
Rev0 : Dec-08  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
80  
60  
40  
20  
0
80  
60  
40  
20  
0
10V  
5V  
VDS=5V  
4.5V  
4V  
7V  
125°C  
VGS=3.5V  
25°C  
0
1
2
3
4
5
0
1
2
3
4
5
VGS(Volts)  
V
DS (Volts)  
Figure 2: Transfer Characteristics (Note E)  
Fig 1: On-Region Characteristics (Note E)  
12  
10  
8
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
ID=30A  
VGS=4.5V  
6
VGS=4.5V  
4
VGS=10V  
ID=20A  
2
0.8  
0
0
25  
50  
75  
100 125 150 175 200  
0
5
10  
15  
20  
25  
30  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
20  
15  
10  
5
1.0E+02  
1.0E+01  
ID=30A  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
25°C  
0
0.0  
0.2  
0.4  
0.6  
SD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.8  
1.0  
1.2  
2
4
6
8
10  
V
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
2800  
2400  
2000  
1600  
1200  
800  
VDS=12.5V  
ID=30A  
8
Ciss  
6
4
Coss  
2
400  
Crss  
0
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10 15  
VDS (Volts)  
20  
25  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
200  
160  
120  
80  
1000.0  
100.0  
10.0  
1.0  
TJ(Max)=175°C  
TC=25°C  
10µs  
RDS(ON)  
limited  
100µs  
DC  
1ms  
10ms  
TJ(Max)=175°C  
TC=25°C  
0.1  
40  
0.0  
0
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
V
DS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
J,PK=TC+PDM.ZθJC.RθJC  
T
RθJC=3°C/W  
PD  
0.1  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
80  
60  
40  
20  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
TA=100°C  
TA=125°C  
TA=150°C  
0
0
25  
50  
75  
100  
125  
150  
175  
0.000001  
0.00001  
0.0001  
0.001  
Time in avalanche, tA (s)  
TCASE (°C)  
Figure 12: Single Pulse Avalanche capability (Note  
C)  
Figure 13: Power De-rating (Note F)  
10000  
1000  
100  
10  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
1
0.00001  
0.001  
0.1  
10  
1000  
0
25  
50  
75  
100  
125  
150  
175  
T
CASE (°C)  
Pulse Width (s)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
Figure 14: Current De-rating (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=50°C/W  
0.1  
0.01  
PD  
Single Pulse  
Ton  
T
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
16  
14  
12  
10  
8
3
30  
25  
20  
15  
10  
5
12  
10  
8
di/dt=700A/us  
Qrr  
di/dt=700A/us  
125ºC  
125ºC  
25ºC  
2.5  
2
25ºC  
trr  
1.5  
1
6
125ºC  
25ºC  
125ºC  
6
4
Irm  
4
S
25ºC  
2
0.5  
0
2
0
0
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
25  
30  
IB (A)  
IB (A)  
Figure 17: Diode Reverse Recovery Charge and  
Peak Current vs. Conduction Current  
Figure 18: Diode Reverse Recovery Time and Soft  
Coefficient vs. Conduction Current  
20  
2.5  
30  
25  
20  
15  
10  
5
10  
Is=20A  
Is=20A  
125ºC  
2
8
6
4
2
0
15  
10  
5
125ºC  
25ºC  
25ºC  
1.5  
1
trr  
S
125º  
25ºC  
Qrr  
125ºC  
25ºC  
0.5  
Irm  
0
0
0
0
100 200 300 400 500 600 700 800  
0
100 200 300 400 500 600 700 800  
di/dt (A/µs)  
di/dt (A/µs)  
Figure 20: Diode Reverse Recovery Time and Soft  
Figure 19: Diode Reverse Recovery Charge and  
Coefficient vs. di/dt  
Peak Current vs. di/dt  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AOI472A  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
td(on)  
t
r
td(off)  
t
f
ton  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
EAR= 1/2 LIA2R  
BVDSS  
Vds  
Id  
Vgs  
Vds  
+
Vgs  
Vdd  
I AR  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Q rr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
Isd  
I F  
Isd  
Vgs  
dI/dt  
I RM  
+
Vdd  
VDC  
Vdd  
-
Vds  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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