AOK9N90 [AOS]

900V,9A N-Channel MOSFET; 900V ,9A N沟道MOSFET
AOK9N90
型号: AOK9N90
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

900V,9A N-Channel MOSFET
900V ,9A N沟道MOSFET

文件: 总5页 (文件大小:295K)
中文:  中文翻译
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AOK9N90  
900V,9A N-Channel MOSFET  
General Description  
Product Summary  
VDS  
1000@150  
9A  
The AOK9N90 is fabricated using an advanced high  
voltage MOSFET process that is designed to deliver high  
levels of performance and robustness in popular AC-DC  
applications.By providing low RDS(on), Ciss and Crss along  
with guaranteed avalanche capability this part can be  
adopted quickly into new and existing offline power supply  
designs.  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
< 1.3  
100% UIS Tested  
100% Rg Tested  
For Halogen Free add "L" suffix to part number:  
AOK9N90L  
Top View  
TO-247  
D
G
S
S
D
G
AOK9N90  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
AOK9N90  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
900  
V
V
VGS  
±30  
TC=25°C  
9
6
Continuous Drain  
Current  
ID  
TC=100°C  
A
Pulsed Drain Current C  
Avalanche Current C  
IDM  
34  
IAR  
3.6  
A
Repetitive avalanche energy C  
EAR  
EAS  
dv/dt  
194  
388  
5
mJ  
Single plused avalanche energy G  
Peak diode recovery dv/dt  
TC=25°C  
mJ  
V/ns  
W
W/ oC  
368  
2.9  
PD  
Power Dissipation B  
Derate above 25oC  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
°C  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds  
Thermal Characteristics  
TL  
300  
°C  
Parameter  
Symbol  
RθJA  
AOK9N90  
40  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A,D  
Maximum Case-to-sink A  
RθCS  
0.5  
Maximum Junction-to-Case  
RθJC  
0.34  
Rev0: Nov 2012  
www.aosmd.com  
Page 1 of 5  
AOK9N90  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=250A, VGS=0V, TJ=25°C  
ID=250A, VGS=0V, TJ=150°C  
900  
BVDSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Zero Gate Voltage Drain Current  
1000  
0.9  
V
BVDSS  
/TJ  
V/ oC  
ID=250A, VGS=0V  
VDS=900V, VGS=0V  
VDS=720V, TJ=125°C  
1
IDSS  
µA  
10  
IGSS  
VGS(th)  
RDS(ON)  
gFS  
VDS=0V, VGS=±30V  
Gate-Body leakage current  
Gate Threshold Voltage  
±100  
4.5  
nΑ  
V
VDS=5V, ID=250µA  
VGS=10V, ID=4.5A  
VDS=40V, ID=4.5A  
IS=1A,VGS=0V  
3.4  
4
1
Static Drain-Source On-Resistance  
Forward Transconductance  
Diode Forward Voltage  
1.3  
S
13  
0.7  
VSD  
1
9
V
IS  
Maximum Body-Diode Continuous Current  
Maximum Body-Diode Pulsed Current  
A
ISM  
34  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1700 2130 2560  
pF  
pF  
pF  
VGS=0V, VDS=25V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
100  
8
152  
14  
200  
20  
0.6  
1.3  
2.0  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
35  
46  
9.5  
20.5  
45  
58  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=720V, ID=9A  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
VGS=10V, VDS=450V, ID=9A,  
Turn-On Rise Time  
80  
R
G
=25
Ω  
tD(off)  
tf  
Turn-Off DelayTime  
116  
60  
Turn-Off Fall Time  
trr  
IF=9A,dI/dt=100A/µs,VDS=100V  
IF=9A,dI/dt=100A/µs,VDS=100V  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
450  
6.0  
568  
7.8  
690  
ns  
Qrr  
µC  
10.0  
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial  
TJ =25°C.  
D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.  
G. L=60mH, IAS=3.6A, VDD=150V, RG=25, Starting TJ=25°C  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev0: Nov 2012  
www.aosmd.com  
Page 2 of 5  
AOK9N90  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
100  
10  
1
20  
-55°C  
VDS=40V  
16  
12  
8
10V  
6.5V  
6V  
125°C  
VGS=5.5V  
25°C  
4
0
0.1  
0
5
10  
15  
20  
25  
30  
2
4
6
8
10  
VDS (Volts)  
Fig 1: On-Region Characteristics  
VGS(Volts)  
Figure 2: Transfer Characteristics  
3
2.5  
2
2
1.6  
1.2  
0.8  
0.4  
0
VGS=10V  
ID=4.5A  
VGS=10V  
1.5  
1
0.5  
0
0
4
8
12  
16  
20  
-100  
-50  
0
50  
100  
150  
200  
ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage  
Figure 4: On-Resistance vs. Junction Temperature  
1.2  
1.1  
1
1.0E+02  
1.0E+01  
1.0E+00  
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
25°C  
0.9  
0.8  
-100  
-50  
0
50  
TJ (°C)  
Figure 5:Break Down vs. Junction Temparature  
100  
150  
200  
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
Rev0: Nov 2012  
www.aosmd.com  
Page 3 of 5  
AOK9N90  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
10000  
VDS=720V  
ID=9A  
Ciss  
1000  
100  
10  
Coss  
6
Crss  
3
0
1
0
14  
28  
42  
56  
70  
0.1  
1
10  
100  
VDS (Volts)  
Figure 8: Capacitance Characteristics  
Qg (nC)  
Figure 7: Gate-Charge Characteristics  
100  
10  
12  
10  
8
RDS(ON)  
limited  
10µs  
100µ  
6
1
1ms  
DC  
10ms  
4
0.1  
0.01  
2
TJ(Max)=150°C  
TC=25°C  
0
0
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
TCASE (°C)  
VDS (Volts)  
Figure 9: Current De-rating (Note B)  
Figure 10: Maximum Forward Biased Safe Operating  
Area for AOK9N90 (Note F)  
10  
D=Ton/T  
J,PK=TC+PDM.ZθJC.RθJC  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
R
θJC=0.34°C/W  
1
0.1  
PD  
Single Pulse  
0.01  
0.001  
Ton  
T
0.000001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance for AOK9N90 (Note F)  
Rev0: Nov 2012  
www.aosmd.com  
Page 4 of 5  
AOK9N90  
Gate Charge Test Circuit &Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Vds  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
t d(on)  
t
r
t d(off)  
t
f
t on  
toff  
Unclamped Inductive Switching (UIS) Test Circuit& Waveforms  
L
2
EAR=1/2LI  
AR  
BVDSS  
Vds  
Id  
Vds  
+
Vgs  
Vdd  
IAR  
Vgs  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode RecoveryTest Circuit &Waveforms  
Qrr =- Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
Isd  
trr  
L
IF  
Isd  
dI/dt  
+
IRM  
Vdd  
Vgs  
VDC  
Vdd  
-
Vds  
Rev0: Nov 2012  
www.aosmd.com  
Page 5 of 5  

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