AON7405 [AOS]

30V P-Channel MOSFET; 30V P沟道MOSFET
AON7405
型号: AON7405
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

30V P-Channel MOSFET
30V P沟道MOSFET

文件: 总6页 (文件大小:252K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AON7405  
30V P-Channel MOSFET  
General Description  
Product Summary  
VDS  
-30V  
The AON7405 uses advanced trench technology to  
provide excellent RDS(ON) with low gate charge.  
This device is ideal for load switch and battery protection  
applications.  
ID (at VGS= -10V)  
RDS(ON) (at VGS= -10V)  
RDS(ON) (at VGS = -6V)  
-50A  
< 6.2m  
< 8.9mΩ  
100% UIS Tested  
100% Rg Tested  
D
DFN 3.3x3.3 EP  
Top View  
Top View  
Bottom  
1
2
3
4
8
7
6
5
Pin 1  
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
Maximum  
-30  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
V
V
VGS  
±25  
TC=25°C  
-50  
Continuous Drain  
CurrentG  
ID  
TC=100°C  
-39  
A
Pulsed Drain Current C  
IDM  
-210  
-25  
TA=25°C  
TA=70°C  
Continuous Drain  
Current  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
IDSM  
A
-20  
IAR, IAS  
-44  
A
EAR, EAS  
97  
mJ  
TC=25°C  
Power Dissipation B  
TC=100°C  
83  
PD  
W
33  
TA=25°C  
6.25  
4
PDSM  
W
°C  
Power Dissipation A  
TA=70°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Thermal Characteristics  
Parameter  
Symbol  
Typ  
16  
Max  
20  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A  
t 10s  
RθJA  
Maximum Junction-to-Ambient A D  
Maximum Junction-to-Case  
Steady-State  
Steady-State  
45  
55  
RθJC  
1.1  
1.5  
Rev 1: Feb 2010  
www.aosmd.com  
Page 1 of 6  
AON7405  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max Units  
STATIC PARAMETERS  
ID=-250µA, VGS=0V  
BVDSS  
Drain-Source Breakdown Voltage  
-30  
V
VDS=-30V, VGS=0V  
-1  
µA  
-5  
IDSS  
Zero Gate Voltage Drain Current  
TJ=55°C  
VDS=0V, VGS= ±25V  
VDS=VGS ID=-250µA  
VGS=-10V, VDS=-5V  
VGS=-10V, ID=-20A  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
±100  
-2.8  
nA  
V
VGS(th)  
ID(ON)  
-1.7  
-2.2  
-210  
A
5.1  
7.6  
6.2  
9.2  
8.9  
mΩ  
TJ=125°C  
RDS(ON)  
Static Drain-Source On-Resistance  
VGS=-6V, ID=-20A  
7.1  
mΩ  
mΩ  
S
VGS=-4.5V, ID=-10A  
10.7  
46  
VDS=-5V, ID=-20A  
IS=-1A,VGS=0V  
Maximum Body-Diode Continuous CurrentG  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
-0.7  
-1  
V
-50  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1960 2450 2940  
pF  
pF  
pF  
VGS=0V, VDS=-15V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
380  
220  
7
550  
370  
14  
720  
520  
28  
VGS=0V, VDS=0V, f=1MHz  
SWITCHING PARAMETERS  
Qg(10V) Total Gate Charge  
33  
16  
5.5  
7
42  
21  
7
51  
26  
8.5  
17  
nC  
nC  
nC  
nC  
ns  
Qg(4.5V) Total Gate Charge  
VGS=-10V, VDS=-15V, ID=-20A  
Qgs  
Qgd  
tD(on)  
tr  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
12  
9.5  
10  
104  
78  
VGS=-10V, VDS=-15V, RL=0.75,  
RGEN=3Ω  
ns  
tD(off)  
tf  
ns  
ns  
trr  
IF=-20A, dI/dt=500A/µs  
IF=-20A, dI/dt=500A/µs  
20  
37  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
25  
47  
30  
57  
ns  
Qrr  
nC  
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The  
Power dissipation PDSM is based on R θJA t 10s value and the maximum allowed junction temperature of 150°C. The value in any given  
application depends on the user's specific board design.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep  
initial TJ =25°C.  
D. The RθJA is the sum of the thermal impedence from junction to case RθJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink,  
assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.  
G. The maximum current rating is limited by package.  
H. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Rev 1: Feb 2010  
www.aosmd.com  
Page 2 of 6  
AON7405  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
120  
100  
80  
60  
40  
20  
0
120  
VDS=-5V  
-5V  
100  
80  
60  
40  
20  
0
-6V,-8V,-10V  
-4V  
25°C  
125°C  
VGS=-3.5V  
0
1
2
3
4
5
1
2
3
4
5
6
-VDS (Volts)  
-VGS(Volts)  
Fig 1: On-Region Characteristics (Note E)  
Figure 2: Transfer Characteristics (Note E)  
9
8
7
6
5
4
3
1.8  
1.6  
1.4  
1.2  
1
VGS=-10V  
ID=-20A  
VGS=-6V  
VGS=-6V  
I =-20A  
D
VGS=-10V  
0.8  
0
5
10  
15  
20  
25  
30  
0
25  
50  
75  
100  
125  
150  
175  
-ID (A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage (Note E)  
Figure 4: On-Resistance vs. Junction Temperature  
(Note E)  
1.0E+02  
21  
ID=-20A  
1.0E+01  
17  
13  
9
1.0E+00
125°C  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
1.0E-05  
125°C  
25°C  
5
25°C  
1
0.0  
0.2  
0.4  
-VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
3
4
5
6
7
8
9
10  
-VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
(Note E)  
Rev 1: Feb 2010  
www.aosmd.com  
Page 3 of 6  
AON7405  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
4000  
10  
VDS=-15V  
ID=-20A  
3500  
3000  
2500  
2000  
1500  
1000  
500  
8
Ciss  
6
4
Coss  
2
Crss  
0
0
0
10  
20  
30  
40  
50  
0
5
10  
15  
20  
25  
30  
Qg (nC)  
-VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
400  
350  
300  
250  
200  
150  
100  
50  
TJ(Max)=150°C  
TC=25°C  
10µs  
RDS(ON)  
100µs  
limited  
1ms  
DC  
0.1  
TJ(Max)=150°C  
TC=25°C  
0.0  
0
0.01  
0.1  
1
10  
100  
0.0001  
0.001  
0.01  
0.1  
1
10  
-VDS (Volts)  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
Case (Note F)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TC+PDM.ZθJC.RθJC  
RθJC=1.5°C/W  
0.1  
0.01  
PD  
Ton  
T
Single Pulse  
0.0001  
0.00001  
0.001  
0.01  
0.1  
1
10  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
Rev 1: Feb 2010  
www.aosmd.com  
Page 4 of 6  
AON7405  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
1000  
100  
10  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
TA=25°C  
TA=100°C  
TA=150°C  
TA=125°C  
0
25  
50  
75  
100  
125  
150  
1
10  
100  
1000  
Time in avalanche, tA (µs)  
Figure 12: Single Pulse Avalanche capability  
(Note C)  
T
CASE (°C)  
Figure 13: Power De-rating (Note F)  
60  
50  
40  
30  
20  
10  
10000  
1000  
100  
10  
TA=25°C  
1
0
0
0.00001  
0.001  
0.1  
10  
1000  
25  
50  
75  
100  
125  
150  
TCASE (°C)  
Pulse Width (s)  
Figure 14: Current De-rating (Note F)  
Figure 15: Single Pulse Power Rating Junction-to-  
Ambient (Note H)  
10  
1
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
TJ,PK=TA+PDM.ZθJA.RθJA  
RθJA=55°C/W  
0.1  
0.01  
0.001  
0.0001  
PD  
Single Pulse  
Ton  
T
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)  
Rev 1: Feb 2010  
www.aosmd.com  
Page 5 of 6  
AON7405  
Gate Charge Test Circuit & Waveform  
Vgs  
Qg  
-
-10V  
-
VDC  
Qgs  
Qgd  
+
Vds  
VDC  
+
DUT  
Vgs  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
toff  
ton  
t
f
td(off)  
td(on)  
t
r
Vgs  
-
90%  
10%  
DUT  
Vdd  
Vgs  
VDC  
+
Rg  
Vgs  
Vds  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
EAR= 1/2 LIA2R  
L
Vds  
Id  
Vgs  
Vds  
-
BVDSS  
Vgs  
Vdd  
VDC  
+
Id  
Rg  
I AR  
DUT  
Vgs  
Vgs  
Diode Recovery Test Circuit & Waveforms  
Qrr = - Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
trr  
L
-Isd  
-IF  
Isd  
Vgs  
dI/dt  
-IRM  
+
Vdd  
VDC  
Vdd  
-
-Vds  
Rev 1: Feb 2010  
www.aosmd.com  
Page 6 of 6  

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