AOT400 [AOS]

N-Channel Enhancement Mode Field Effect Transistor; N沟道增强型网络场效晶体管
AOT400
型号: AOT400
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

N-Channel Enhancement Mode Field Effect Transistor
N沟道增强型网络场效晶体管

晶体 晶体管
文件: 总5页 (文件大小:70K)
中文:  中文翻译
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AOT400  
N-Channel Enhancement Mode Field Effect Transistor  
General Description  
Features  
The AOT400 uses advanced trench technology and  
design to provide excellent RDS(ON) with low gate  
charge. This device is suitable for use in PWM, load  
switching and general purpose applications. Standard  
Product AOT400 is Pb-free (meets ROHS & Sony  
259 specifications). AOT400L is a Green Product  
ordering option. AOT400 and AOT400L are  
electrically identical.  
VDS (V) = 75V  
ID = 110 A  
(VGS = 10V)  
RDS(ON) < 4.7 m(VGS = 10V)  
RDS(ON) < 5.2 m(VGS = 6V)  
TO-220  
D
Top View  
Drain Connected  
to Tab  
G
S
G
D
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
Maximum  
Units  
VDS  
Drain-Source Voltage  
75  
V
VGS  
Gate-Source Voltage  
Continuous Drain  
Current G  
±20  
110  
V
A
TC=25°C  
TC=100°C  
ID  
110  
Pulsed Drain Current C  
Avalanche Current C  
Repetitive avalanche energy L=0.1mH C  
IDM  
IAR  
EAR  
200  
100  
A
1500  
300  
mJ  
TC=25°C  
PD  
W
Power Dissipation B  
TC=100°C  
150  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 175  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient A  
Maximum Junction-to-Case B  
Symbol  
RθJA  
Typ  
Max  
Units  
Steady-State  
Steady-State  
65  
75  
°C/W  
°C/W  
RθJC  
0.25  
0.5  
Alpha & Omega Semiconductor, Ltd.  
AOT400  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=10mA, VGS=0V  
VDS=75V, VGS=0V  
75  
V
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate Threshold Voltage  
On state drain current  
V
DS=0V, VGS=±20V  
100  
4
nA  
V
VGS(th)  
ID(ON)  
VDS=VGS, ID=250µA  
2
2.8  
VGS=10V, VDS=5V  
200  
A
V
GS=10V, ID=30A  
GS=6V, ID=30A  
4.2  
7.2  
4.6  
106  
200  
0.7  
4.7  
8.2  
5.2  
mΩ  
mΩ  
RDS(ON)  
TJ=125°C  
Static Drain-Source On-Resistance  
V
VDS=5V, ID=30A  
DS=15V, ID=70A  
IS=1A, VGS=0V  
gFS  
Forward Transconductance  
Diode Forward Voltage  
S
V
VSD  
IS  
1
V
A
Maximum Body-Diode Continuous Current  
110  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
8390 10500  
1060  
pF  
pF  
pF  
V
GS=0V, VDS=25V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
450  
VGS=0V, VDS=0V, f=1MHz  
1.2  
1.5  
SWITCHING PARAMETERS  
Qg(10V)  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
167  
40  
210  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
V
GS=10V, VDS=30V, ID=30A  
45  
29  
VGS=10V, VDS=30V, RL=1,  
41  
R
GEN=3Ω  
tD(off)  
tf  
90  
34  
trr  
IF=30A, dI/dt=100A/µs  
IF=30A, dI/dt=100A/µs  
64  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
80  
ns  
Qrr  
180  
nC  
A: The value of R θJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=175°C, using junction-to-case thermal resistance, and is more useful in setting the upper  
dissipation limit for cases where additional heatsinking is used.  
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=175°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming  
a maximum junction temperature of TJ(MAX)=175°C.  
G. The maximum current rating is limited by bond-wires.  
Rev3: August 2005  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
AOT400  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
200  
80  
10V  
6V  
5V  
175  
150  
125  
100  
75  
VDS=5V  
60  
40  
20  
0
125°C  
4.5V  
25°C  
50  
VGS=4V  
25  
0
0
1
2
3
4
5
2
2.5  
3
3.5  
VGS(Volts)  
4
4.5  
5
VDS (Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
6
5
4
3
2
2.2  
2
VGS=6V  
VGS=10V, 30A  
1.8  
1.6  
1.4  
1.2  
1
VGS=10V  
VGS=6V,30A  
0.8  
0
20  
40  
60  
80  
100  
0
25  
50  
75  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
100  
125  
150  
175  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
12  
10  
8
1.0E+02  
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
1.0E-03  
1.0E-04  
ID=30A  
125°C  
125°C  
6
25°C  
25°C  
4
2
0.0  
0.2  
0.4  
0.6  
SD (Volts)  
Figure 6: Body-Diode Characteristics  
0.8  
1.0  
1.2  
4
8
12  
16  
20  
V
VGS (Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
AOT400  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
12  
10  
10  
VDS=30V  
ID=30A  
8
Ciss  
8
6
6
4
2
0
4
Coss  
2
Crss  
0
0
40  
80  
120  
Qg (nC)  
160  
200  
0
15  
30  
45  
60  
75  
VDS (Volts)  
Figure 7: Gate-Charge Characteristics  
Figure 8: Capacitance Characteristics  
1000.0  
100.0  
10.0  
1.0  
1000  
800  
600  
400  
200  
TJ(Max)=175°C, TA=25°C  
10µs  
TJ(Max)=175°C  
TA=25°C  
RDS(ON)  
limited  
100µs  
10ms  
DC  
0.1  
0.0001  
0.001  
0.01  
0.1  
1
10  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 10: Single Pulse Power Rating Junction-to-  
Case (Note F)  
VDS (Volts)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note F)  
10  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
D=Ton/T  
J,PK=TA+PDM.ZθJC.RθJC  
T
RθJC=0.5°C/W  
1
0.1  
PD  
Ton  
T
Single Pulse  
0.0001  
0.01  
0.00001  
0.001  
0.01  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)  
0.1  
1
10  
100  
Alpha & Omega Semiconductor, Ltd.  
AOT400  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
350  
300  
250  
120  
100  
80  
200  
L ID  
60  
tA  
=
150  
100  
50  
BV VDD  
40  
20  
0
TA=25°C  
0
0.00001  
0.0001  
0.001  
0.01  
0
25  
50  
75  
CASE (°C)  
Figure 13: Power De-rating (Note B)  
100  
125  
150  
175  
Time in avalanche, tA (s)  
Figure 12: Single Pulse Avalanche capability  
T
120  
100  
80  
60  
40  
20  
0
0
25  
50  
75  
CASE (°C)  
Figure 14: Current De-rating (Note B)  
100  
125  
150  
175  
T
Alpha & Omega Semiconductor, Ltd.  

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