BTB1236AK3-O-TB-S [CYSTEKEC]
Silicon PNP Epitaxial Planar Transistor;型号: | BTB1236AK3-O-TB-S |
厂家: | CYSTECH ELECTONICS CORP. |
描述: | Silicon PNP Epitaxial Planar Transistor |
文件: | 总6页 (文件大小:230K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 1/6
Silicon PNP Epitaxial Planar Transistor
BTB1236AK3
Description
• High BVCEO
• High current capability
• Pb-free lead plating package
Symbol
Outline
TO-92L
BTB1236AK3
B:Base
C:Collector
E:Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Base Current
Symbol
VCBO
VCEO
VEBO
IC
Limits
Unit
V
V
V
A
-180
-160
-7
-1.5
-3
ICP
A
A
IB
0.5
Collector Power Dissipation
Junction Temperature
Storage Temperature
PC
900
150
-55~+150
mW
°C
°C
Tj
Tstg
BTB1236AK3
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 2/6
Characteristics
(Ta=25°C)
Symbol
BVCBO
Min. Typ.
Max.
Unit
Test Conditions
I =-50 A, I =0
-180
-
-
-
-
-1
-1
-0.3
-0.6
-0.75
320
-
V
V
V
µA
µA
V
V
V
-
-
µ
C
E
BVCEO
BVEBO
ICBO
-160
-
IC=-1mA, IB=0
I =-50 A, I =0
-7
-
µ
E
C
-
-
VCB=-160V, IE=0
VEB=-5V, IC=0
IC=-500mA, IB=-50mA
IC=-1A, IB=-100mA
VCE=-5V, IC=-5mA
VCE=-5V, IC=-200mA
VCE=-5V, IC=-500mA
VCE=-5V, IC=-150mA
VCB=-10V, IE=0, f=1MHz
IEBO
-
-
*VCE(sat)
*VCE(sat)
*VBE(on)
hFE1
hFE2
fT
Cob
-
-
-
-
-
-
-
-0.45
100
30
-
180
24
-
-
MHz
pF
-
*Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2%
Classification Of hFE1
Rank
O
Y
160~320
Range
100~200
Ordering Information
Device
HFE rank
O
Package
Shipping
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
TO-92L
(Pb-free lead plating)
BTB1236AK3-O-BK-S
500 pcs / bag, 10 bags/box, 10 boxes/carton
BTB1236AK3-Y-BK-S
BTB1236AK3-O-TB-S
BTB1236AK3-Y-TB-S
Y
O
Y
500 pcs / bag, 10 bags/box, 10 boxes/carton
2000 pcs / Tape & Box
2000 pcs / Tape & Box
BTB1236AK3
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 3/6
Typical Characteristics
Current Gain vs Collector Current
Saturation Voltage vs Collector Current
1000
100
10
1000
100
10
VCE=5V
VCESAT@IC=50IB
VCE=2V
VCE=1V
VCESAT@IC=10IB
10
1
100
1000
10000
1
10
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
On Voltage vs Collector Current
Saturation Voltage vs Collector Current
VBESAT@IC=10IB
1000
1000
VBESAT@IC=50IB
100
100
1
10
100
1000
10000
1
10
100
1000
10000
Collector Current---IC(mA)
Collector Current---IC(mA)
Power Derating Curve
Capacitance vs Reverse-biased Voltage
1000
100
10
1000
900
800
700
600
500
400
300
200
100
0
0
50
100
150
200
0.1
1
10
100
Reverse-biased Voltage---VR(V)
Ambient Temperature---TA(℃)
BTB1236AK3
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 4/6
TO-92L Taping Outline
Millimeters
Max.
5.10
8.20
4.10
0.50
0.78
13.00
12.90
6.65
2.80
1.00
19.00
6.50
9.50
1.00
21.00
16.50
-
DIM
Item
Min.
A1
A
T
d
d1
P
P0
P2
F1, F2
△h
W
W0
W1
W2
H
H0
L1
D0
t1
Component body width
Component body height
Component body thickness
Lead wire diameter
Lead wire diameter 1
Pitch of component
4.70
7.80
3.70
0.40
0.62
12.40
12.50
6.05
2.20
-1.00
17.50
5.50
8.50
-
19.00
15.50
2.50
3.80
0.35
0.15
3.55
-1.00
Feed hole pitch
Hole center to component center
Lead to lead distance
Component alignment, F-R
Tape width
Hole down tape width
Hole position
Hole down tape position
Height of component from tape center
Lead wire clinch height
Lead wire (tape portion)
Feed hole diameter
4.20
0.45
0.25
4.15
1.00
Taped lead thickness
Carrier tape thickness
Position of hole
t2
P1
△P
Component alignment
BTB1236AK3
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 5/6
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25 °C to peak temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTB1236AK3
CYStek Product Specification
Spec. No. : C854K3
Issued Date : 2012.10.08
Revised Date :
CYStech Electronics Corp.
Page No. : 6/6
TO-92L Dimension
Marking:
Product Name
B1236
Date Code: Year+Month
Year: 7→2007, 8→2008
Month: 1→1, 2→2, ‧‧‧,
9→9, A→10, B→11, C→12
□□
Style: Pin 1.Emitter 2.Collector 3.Base
3-Lead TO-92L Plastic Package
CYStek Package Code: K3
*: Typical
Millimeters
Inches
DIM
Millimeters
Min.
Inches
*0.05
DIM
Min.
Max.
Max.
4.100
1.580
0.550
0.800
0.450
5.100
-
Min.
0.307
Max.
0.323
Min.
Max.
A
A1
b
0.146
0.050
0.014
0.024
0.014
0.185
0.157
0.161
0.062
0.022
0.031
0.018
0.201
-
3.700
1.280
0.350
0.600
0.350
4.700
4.000
E
e
e1
L
ϕ
h
7.800
8.200
*1.270
0.096
0.543
-
0.104
0.559
0.063
0.012
2.440
13.800
-
2.640
14.200
1.600
0.300
b1
c
D
0.000
0.000
D1
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1236AK3
CYStek Product Specification
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