DMP1012UFDF-7 [DIODES]

Small Signal Field-Effect Transistor,;
DMP1012UFDF-7
型号: DMP1012UFDF-7
厂家: DIODES INCORPORATED    DIODES INCORPORATED
描述:

Small Signal Field-Effect Transistor,

文件: 总7页 (文件大小:284K)
中文:  中文翻译
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DMP1012UFDF  
12V P-CHANNEL ENHANCEMENT MODE MOSFET  
Product Summary  
Features  
0.6mm Profile Ideal for Low Profile Applications  
PCB Footprint of 4mm2  
ID Max  
BVDSS  
RDS(ON) Max  
TC = +25°C  
Low On-Resistance  
15m@ VGS = -4.5V  
20mΩ @ VGS = -3.7V  
30mΩ @ VGS = -2.5V  
40m@ VGS = -1.8V  
-20A  
-18A  
-16A  
-11A  
Fast Switching Speed  
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  
Halogen and Antimony Free. "Green" Device (Note 3)  
-12V  
Mechanical Data  
Case: U-DFN2020-6 (Type F)  
Description  
This new generation MOSFET is designed to minimize the on-state  
resistance (RDS(ON)) and yet maintain superior switching performance,  
making it ideal for high efficiency power management applications.  
Case Material: Molded Plastic, ―Green‖ Molding Compound.  
UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020  
Terminals: Finish NiPdAu over Copper Leadframe. Solderable  
e4  
per MIL-STD-202, Method 208  
Applications  
Weight: 0.007 grams (Approximate)  
Battery Management Application  
Power Management Functions  
DC-DC Converters  
U-DFN2020-6 (Type F)  
D
G
Pin1  
S
Pin Out  
Bottom View  
Top View  
Bottom View  
Internal Schematic  
Ordering Information (Note 4)  
Part Number  
DMP1012UFDF-7  
DMP1012UFDF-13  
Case  
Packaging  
3,000/Tape & Reel  
10,000/Tape & Reel  
U-DFN2020-6 (Type F)  
U-DFN2020-6 (Type F)  
Notes:  
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.  
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"  
and Lead-free.  
3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and  
<1000ppm antimony compounds.  
4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.  
Marking Information  
PF = Product Type Marking Code  
YM = Date Code Marking  
Y = Year (ex: F = 2018)  
PF  
M = Month (ex: 9 = September)  
Date Code Key  
Year  
2018  
2019  
2020  
2021  
2022  
2023  
2024  
2025  
Code  
F
G
H
I
J
K
L
M
Month  
Code  
Jan  
1
Feb  
2
Mar  
3
Apr  
4
May  
5
Jun  
6
Jul  
7
Aug  
8
Sep  
9
Oct  
O
Nov  
N
Dec  
D
1 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
Maximum Ratings (@TA = +25°C, unless otherwise specified.)  
Characteristic  
Drain-Source Voltage  
Symbol  
VDSS  
Value  
-12  
Unit  
V
Gate-Source Voltage  
±8  
V
VGSS  
Steady  
State  
TC = +25°C  
TC = +70°C  
TA = +25°C  
-20  
-16  
A
ID  
Continuous Drain Current VGS = -4.5V (Note 10)  
t<5s (Note 6)  
-12.6  
-55  
A
A
ID  
Pulsed Drain Current (10μs Pulse, Duty Cycle = 1%)  
Maximum Body Diode Continuous Current (Note 6)  
Avalanche Current (Note 7), L = 0.1mH  
IDM  
-2.8  
-21  
A
IS  
IAS  
A
Avalanche Energy (Note 7,) L = 0.1mH  
22  
mJ  
EAS  
Thermal Characteristics  
Characteristic  
Symbol  
PD  
Value  
0.72  
Unit  
TA = +25°C  
Total Power Dissipation (Note 5)  
W
0.46  
172  
130  
2.11  
TA = +70°C  
Steady State  
t<5s  
Thermal Resistance, Junction to Ambient (Note 5)  
Total Power Dissipation (Note 6)  
°C/W  
W
R  
JA  
TA = +25°C  
TA = +70°C  
Steady State  
t<5s  
PD  
1.36  
59  
44  
Thermal Resistance, Junction to Ambient (Note 6)  
R  
JA  
°C/W  
°C  
Thermal Resistance, Junction to Case (Note 6)  
Operating and Storage Temperature Range  
Steady State  
9.0  
R  
JC  
-55 to +150  
TJ, TSTG  
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)  
Characteristic  
OFF CHARACTERISTICS (Note 8)  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Gate-Source Leakage  
Symbol  
Min  
Typ  
Max  
Unit  
Test Condition  
-12  
-1  
V
BVDSS  
IDSS  
VGS = 0V, ID = -250μA  
VDS = -10V, VGS = 0V  
VGS = ±8V, VDS = 0V  
µA  
nA  
±100  
IGSS  
ON CHARACTERISTICS (Note 8)  
Gate Threshold Voltage  
-0.3  
-0.5  
11  
-0.9  
15  
V
mΩ  
V
VGS(TH)  
RDS(ON)  
VSD  
VDS = VGS, ID = -250μA  
VGS = -4.5V, ID = -5A  
VGS = -3.7V, ID = -5A  
VGS = -2.5V, ID = -4A  
VGS = -1.8V, ID = -1A  
VGS = 0V, IS = -10A  
12  
20  
Static Drain-Source On-Resistance  
15  
30  
20  
40  
Diode Forward Voltage  
DYNAMIC CHARACTERISTICS (Note 9)  
Input Capacitance  
-0.8  
-1.2  
1344  
342  
297  
15  
Ciss  
Coss  
Crss  
Rg  
VDS = -10V, VGS = 0V,  
f = 1.0MHz  
Output Capacitance  
pF  
Reverse Transfer Capacitance  
Gate Resistance  
Ω
VDS = 0V, VGS = 0V, f = 1MHz  
19.5  
31  
Total Gate Charge (VGS = -4.5V)  
Total Gate Charge (VGS = -8V)  
Gate-Source Charge  
Qg  
Qg  
nC  
ns  
VDS = -6V, ID = -10A  
2.1  
7.9  
6.0  
32  
Qgs  
Qgd  
tD(ON)  
tR  
Gate-Drain Charge  
Turn-On Delay Time  
Turn-On Rise Time  
VDS = -6V, VGS = -4.5V,  
Rg = , ID = -8A  
71  
Turn-Off Delay Time  
tD(OFF)  
tF  
85  
Turn-Off Fall Time  
Reverse Recovery Time  
Reverse Recovery Charge  
46  
ns  
tRR  
IF = -12A, di/dt = 500A/μs  
44  
nC  
QRR  
Notes:  
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.  
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.  
7. IAS and EAS ratings are based on low frequency and duty cycles to keep TJ = +25°C.  
8. Short duration pulse test used to minimize self-heating effect.  
9. Guaranteed by design. Not subject to product testing.  
10. Package limited.  
2 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
30  
25  
20  
15  
10  
5
30.0  
25.0  
20.0  
15.0  
10.0  
5.0  
VGS = -8.0V  
VGS = -4.5V  
VGS = -3.0V  
VGS = -2.5V  
VDS = -5V  
VGS = -1.5V  
VGS=-2.0V  
VGS = -1.8V  
TA = 125oC  
TA = 150oC  
TA = 85oC  
TA = 25oC  
TA = -55oC  
VGS = -1.0V  
2.5  
0
0.0  
0
0.5  
1
1.5  
2
2.5  
0
0.5  
1
1.5  
2
3
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 1. Typical Output Characteristic  
VGS, GATE-SOURCE VOLTAGE (V)  
Figure 2. Typical Transfer Characteristic  
0.04  
0.03  
0.02  
0.01  
0
0.2  
0.18  
0.16  
0.14  
0.12  
0.1  
ID = -5.0A  
VGS = -1.8V  
VGS = -2.5V  
0.08  
0.06  
0.04  
0.02  
0
ID = -2.0A  
VGS = -3.7V  
VGS = -4.5V  
0
1
2
3
4
5
6
7
8
0
5
10  
15  
20  
25  
30  
VGS, GATE-SOURCE VOLTAGE (V)  
ID, DRAIN-SOURCE CURRENT (A)  
Figure 3. Typical On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4. Typical Transfer Characteristic  
1.5  
1.2  
0.9  
0.6  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
VGS = -4.5V, ID = -5A  
VGS = -4.5V  
TA = 150oC  
TA = 125oC  
TA = 85oC  
TA = 25oC  
VGS = -2.5V, ID = -4A  
0.008  
0.006  
0.004  
0.002  
0
TA = -55oC  
0
5
10  
15  
20  
25  
30  
-50  
-25  
0
25  
50  
75  
100 125 150  
ID, DRAIN CURRENT (A)  
TJ, JUNCTION TEMPERATURE ()  
Figure 6. On-Resistance Variation with Temperature  
Figure 5. Typical On-Resistance vs. Drain Current and  
Temperature  
3 of 7  
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January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
0.02  
0.018  
0.016  
0.014  
0.012  
0.01  
1
0.8  
0.6  
0.4  
0.2  
0
VGS = -2.5V, ID = -4A  
ID = -1mA  
VGS = -4.5V, ID = -5A  
0.008  
0.006  
0.004  
0.002  
0
ID = -250μA  
-50  
-25  
0
25  
TJ, JUNCTION TEMPERATURE ()  
Figure 7. On-Resistance Variation with Temperature  
50  
75  
100 125 150  
-50  
-25  
0
25  
50  
75  
100 125 150  
TJ, JUNCTION TEMPERATURE ()  
Figure 8. Gate Threshold Variation vs. Junciton  
Temperature  
30  
25  
20  
15  
10  
5
10000  
1000  
100  
f=1MHz  
VGS = 0V  
Ciss  
Coss  
TA = 85oC  
TA = 125oC  
Crss  
TA = 25oC  
TA = 150oC  
TA = -55oC  
0
0
0.3  
0.6  
0.9  
1.2  
1.5  
0
2
4
6
8
10  
12  
VSD, SOURCE-DRAIN VOLTAGE (V)  
Figure 9. Diode Forward Voltage vs. Current  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 10. Typical Junction Capacitance  
8
6
4
2
0
100  
10  
PW =100µs  
RDS(ON) Limited  
PW =1ms  
PW =10ms  
PW =100ms  
PW =1s  
1
VDS = -6V, ID = -10A  
TJ(Max) = 150℃  
TC = 25℃  
Single Pulse  
0.1  
0.01  
PW =10s  
DC  
DUT on 1*MRP Board  
VGS= -4.5V  
0
10  
20  
Qg (nC)  
Figure 11. Gate Charge  
30  
0.01  
0.1  
1
10  
100  
VDS, DRAIN-SOURCE VOLTAGE (V)  
Figure 12. SOA, Safe Operation Area  
4 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
1
D=0.7  
D=0.5  
D=0.3  
D=0.9  
0.1  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
D=0.005  
0.01  
RθJA(t) = r(t) * RθJA  
RθJA = 172/W  
Duty Cycle, D = t1 / t2  
D=Single Pulse  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t1, PULSE DURATION TIME (sec)  
Figure 13. Transient Thermal Resistance  
5 of 7  
www.diodes.com  
January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
Package Outline Dimensions  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
U-DFN2020-6  
(Type F)  
Min Max  
0.570.63  
0.00 0.05  
A3  
A1  
A
Dim  
A
A1  
A3  
b
Typ  
0.60  
0.03  
0.15  
0.30  
2.00  
0.95  
0.38  
2.00  
1.15  
0.70  
Seating Plane  
-
-
0.25 0.35  
1.95 2.05  
0.85 1.05  
D
D
D2  
e3  
k2  
e4  
D2a 0.33 0.43  
E
E2  
E2a  
e
e2  
e3  
e4  
k
1.95 2.05  
1.05 1.25  
0.65 0.75  
D2a  
E2a  
0.65 BSC  
z2  
0.863 BSC  
0.70 BSC  
0.325 BSC  
0.37 BSC  
0.15 BSC  
0.36 BSC  
D2  
E
E2  
k1  
k1  
k2  
L
e2  
L
k
z1  
0.225 0.325 0.275  
0.20 BSC  
z
z1  
z2  
0.110 BSC  
0.20 BSC  
e
b
All Dimensions in mm  
z( 4x)  
Suggested Pad Layout  
Please see http://www.diodes.com/package-outlines.html for the latest version.  
U-DFN2020-6 (Type F)  
X3  
Y
C
X
Value  
Dimensions  
(in mm)  
C
X
0.650  
0.400  
0.480  
0.950  
1.700  
0.425  
0.800  
1.150  
1.450  
2.300  
X1  
X2  
X3  
Y
Y1  
Y2  
Y3  
Y4  
Y3  
Y2  
Y1 Y4  
X1  
Pin1  
X2  
6 of 7  
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January 2018  
© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  
DMP1012UFDF  
IMPORTANT NOTICE  
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,  
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE  
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).  
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes  
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the  
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or  
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume  
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated  
website, harmless against all damages.  
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.  
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and  
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or  
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.  
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings  
noted herein may also be covered by one or more United States, international or foreign trademarks.  
LIFE SUPPORT  
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express  
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body, or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the  
failure of the life support device or to affect its safety or effectiveness.  
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any  
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related  
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its  
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.  
Copyright © 2018, Diodes Incorporated  
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© Diodes Incorporated  
DMP1012UFDF  
Datasheet number: DS37039 Rev. 2 - 2  

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