HFCT-5951ATG [ETC]
FIBER OPTIC TRANSCEIVER ; 光纤收发器\n型号: | HFCT-5951ATG |
厂家: | ETC |
描述: | FIBER OPTIC TRANSCEIVER
|
文件: | 总18页 (文件大小:275K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Agilent HFCT-5951xxx/ HFCT-5952xxx
Single Mode Laser Small Form Factor
Transceivers for ATM, SONET OC-12/
SDH STM-4 (S4.1)
Data Sheet
Features
• HFCT-5951xxx/ HFCT-5952xxxare
compliant to the intermediate
reach SONET OC12/ SDH STM-4
(S4.1) specifications
• Multisourced 2 x 5 and 2 x 10
package styles with LC receptacle
• Single +3.3 V power supply
Description
• Temperature range:
The HFCT-5951xxx/HFCT-
5952xxx transceivers are high
performance, cost effective
modules for serial optical data
communications applications
specified for a signal rate of
622 Mb/s. They are designed to
provide SONET/SDH compliant
links for 622 Mb/s intermediate
reach links.
The receiver section uses a
MOVPE grown planar PIN
photodetector for low dark
current and excellent
HFCT-595xTL/ TG: 0°C to +70°C
HFCT-595xATL/ ATG:
-40°C to +85°C
• Wave solder and aqueous wash
process compatible
• Manufactured in an ISO9002
certifiedfacility
• Performance
HFCT-5951xxx/ HFCT-5952xxx:
Links of 15 km with 9/ 125 µm SMF
• Fully Class 1 CDRH/ IEC 825
compliant
responsivity.
A pseudo-ECL logic interface
simplifies interface to external
circuitry.
These transceivers are supplied
in 2 x 5 and 2 x 10 DIP style
footprint with the LC fiber
connector interface and are fully
compliant with SFF Multi Source
Agreement (MSA).
All modules are designed for
single mode fiber and operate at
a nominal wavelength of 1300 nm.
They incorporate high
• Pin Outs:
HFCT-5951xxx 2 x 5
HFCT-5952xxx 2 x 10
performance, reliable, long
wavelength optical device and
proven circuit technology to give
long life and consistent service.
Applications
• SONET/ SDHequipment
interconnect,
STS-12/ SDH STM-4 rate
• Intermediate reach (up to 15 km)
ATM links
The transmitter section consists
of a Fabry Perot Laser (FP). The
transmitter has full IEC 825 and
CDRH Class 1 eye safety.
FunctionalDescription
Receiver Section
Design
Noise Immunity
The receiver section contains an
Figure 1 also shows a filter
The receiver includes internal
circuit components to filter
power supply noise. However
under some conditions of EMI
and power supply noise, external
power supply filtering may be
necessary (see application
section).
InGaAs/InP photo detector and a function which limits the
preamplifier mounted in an bandwidth of the preamp output
optical subassembly. This optical signal. The filter is designed to
subassembly is coupled to a
postamp/decision circuit.
bandlimit the preamp output
noise and thus improve the
receiver sensitivity.
The postamplifier is ac coupled
to the preamplifier as illustrated
in Figure 1. The coupling
capacitors are large enough to
pass the SONET/SDH test pattern above 622 Mb/s.
at 622 MBd without significant
These components will reduce
the sensitivity of the receiver as
the signal bit rate is increased
The Signal Detect Circuit
The signal detect circuit works
by sensing the peak level of the
received signal and comparing
this level to a reference. The SD
output is low voltage TTL.
The device incorporates a
photodetector bias circuit. This
output must be connected to V
and can be monitored by
connecting through a series
resistor (see application section).
distortion or performance
penalty. If a lower signal rate, or
a code which has significantly
more low frequency content is
used, sensitivity, jitter and pulse
distortion could be degraded.
CC
PHOTODETECTOR
BIAS
DATA OUT
FILTER
TRANS-
IMPEDANCE
PRE-
AMPLIFIER
PECL
OUTPUT
BUFFER
AMPLIFIER
DATA OUT
GND
TTL
OUTPUT
BUFFER
SIGNAL
DETECT
CIRCUIT
SD
Figure 1 - Receiver Block Diagram
2
FunctionalDescription
Transmitter Section
Design
The transmitter section uses a
Fabry Perot (FP) laser as its
optical source, see Figure 2. The
package has been designed to be
compliant with IEC 825 eye safety
requirements under any single
fault condition. The optical
output is controlled by a custom
IC that detects the laser output
via the monitor photodiode. This
IC provides both dc and ac
current drive to the laser to
ensure correct modulation, eye
diagram and extinction ratio over
temperature, supply voltage and
operating life.
The transmitter section also
includes monitor circuitry for
both the laser diode bias current
and laser diode optical power.
PHOTODIODE
(rear facet monitor)
Note 1
FP
LASER
DATA
LASER
MODULATOR
DATA
PECL
INPUT
LASER BIAS
DRIVER
BMON(+)
BMON(-)
Note 1
LASER BIAS
CONTROL
PMON(+)
PMON(-)
Note 1
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Figure 2 - Simplified Transmitter Schematic
3
Package
The overall package concept for
the Agilent transceiver consists
of four basic elements; two
optical subassemblies and two
electrical subassemblies. They
are housed as illustrated in the
block diagram in Figure 3.
The receiver electrical
subassembly includes an internal subassemblies both carry the
shield for the electrical and
optical subassemblies to ensure
high immunity to external EMI
fields.
The PCB’s for the two electrical
signal pins that exit from the
bottom of the transceiver. The
solder posts are fastened into the
molding of the device and are
designed to provide the
mechanical strength required to
withstand the loads imposed on
the transceiver by mating with
the LC connectored fiber cables.
Although they are not connected
electrically to the transceiver, it
is recommended to connect them
to chassis ground.
The optical subassemblies are
The package outline drawing and each attached to their respective
pin out are shown in Figures 4, 5 transmit or receive electrical
and 6. The details of this package subassemblies. These two units
outline and pin out are compliant are than fitted within the outer
with the multisource definition
of the 2 x 5 and 2 x 10 DIP.
housing of the transceiver that is
molded of filled nonconductive
plastic to provide mechanical
strength. The housing is then
encased with a metal EMI
protective shield. Four ground
connections are provided for
connecting the EMI shield to
signal ground.
The electrical subassemblies
consist of high volume
multilayer printed circuit boards
on which the IC and various
surface-mounted passive circuit
elements are attached.
RX SUPPLY
Note 3
PHOTO DETECTOR
BIAS Note 2
DATA OUT
DATA OUT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
QUANTIZER IC
RX GROUND
SIGNAL
DETECT
LC
TX GROUND
Note 1
RECEPTACLE
DATA IN
DATA IN
LASER BIAS
MONITORING
LASER
OPTICAL
SUBASSEMBLY
Tx DISABLE
MON(+) Note 1
BMON(-) Note 1
MON(+) Note 1
PMON(-) Note 1
LASER DRIVER
AND CONTROL
CIRCUIT
B
LASER DIODE
OUTPUT POWER
MONITORING
Note 1
P
T SUPPLY
CASE
X
Note 1: THESE FUNCTIONS ONLY AVAILABLE ON 2 x 10 PINOUT DESIGN
Note 2: CONNECTED TO RXV IN 2 x 5 DESIGN
CC
Note 3: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3 - Block Diagram.
4
+ 0
- 0.2
+0
13.59
0.535
13.59
(0.535)
MAX
15.0 ± 0.2
(0.591 ± 0.008)
(
)
-0.008
TOP VIEW
48.2
(1.898)
6.25
(0.246)
9.8
(0.386)
MAX
10.8 ± 0.2
9.6 ± 0.2
(0.425 ± 0.008)(0.378 ±0.008)
3.81
(0.15)
1
Ø 1.07
0.25
(0.01)
10.16
(0.4)
1
(0.039)
(0.042)
20 x 0.5
(0.02)
(0.039)
19.5 ±0.3
(0.768 ±0.012)
1.78
(0.07)
BACK VIEW
FRONT VIEW
SIDE VIEW
20 x 0.25 (PIN THICKNESS)
(0.01)
NOTE: END OF PINS
CHAMFERED
BOTTOM VIEW
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Figure 4 - HFCT-5951xxx/ HFCT-5952xxx Package Outline Drawing (2 x 10 Design shown)
5
Connection Diagram (HFCT-5952xxx)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
o
o
o
o
o
o
o
o
o
o
o
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
1
2
3
4
5
6
7
8
9
20
19
18
17
16
15
14
13
12
11
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
o
o
o
o
o
o
o
o
o
Top
View
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
10
Figure 5 - Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Photo Detector Bias, VpdR:
This pin enables monitoring of
photo detector bias current. It
must be connected directly to
Pin 9 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 17 Laser Diode Bias Current
Monitor - Negative End B
The laser diode bias current is
accessible by measuring the
–
MON
V
RX, or to V RX through a
voltage developed across pins 17
and 18. Dividing the voltage by
10 Ohms (internal) will yield the
value of the laser bias current.
CC
CC
Pin 10 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
resistor (Max 200 R) for
monitoring photo detector bias
current.
Pins 2, 3, 6 Receiver Signal Ground
Pin 18 Laser Diode Bias Current
Pin 11 Transmitter Power Supply
V RX:
Monitor - Positive End B
+
MON
EE
V
CC
TX:
Directly connect these pins to the
receiver ground plane.
See pin 17 description.
Provide +3.3 V dc via the
recommended transmitter power
supply filter circuit. Locate the
power supply filter circuit as
Pin 19 Laser Diode Optical Power
Pins 4, 5 DO NOT CONNECT
Monitor - Negative End P
–
MON
The back facet diode monitor
current is accessible by measuring
the voltage developed across pins
19 and 20. The voltage across a
200 Ohm internal resistor between
pins 19 and 20 will be proportional
to the photo current.
close as possible to the V TX
Pin 7 Receiver Power Supply V RX:
CC
CC
pin.
Provide +3.3 V dc via the
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
Pins 12, 16 Transmitter Signal Ground
V TX:
EE
Directly connect these pins to the
transmitter signal ground plane.
close as possible to the V RX
CC
pin. Note: the filter circuit should
not cause V to drop below
minimum specification.
Pin 20 Laser Diode Optical Power
CC
Pin 13 Transmitter Disable T
:
DIS
Monitor - Positive End P
+
MON
Optional feature, connect this pin
to +3.3 V TTL logic high “1” to
disable module. To enable module
connect to TTL logic low “0”.
See pin 19 description.
Pin 8 Signal Detect SD:
Normal optical input levels to the
receiver result in a logic “1”
output.
Mounting Studs/ Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is recommended
that the holes in the circuit board
be connected to chassis ground.
Pin 14 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
Low optical input levels to the
receiver result in a logic “0”
output.
This Signal Detect output can be
used to drive a low voltage TTL
input on an upstream circuit,
such as Signal Detect input or
Loss of Signal-bar.
Pin 15 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
6
Connection Diagram (HFCT-5951xxx)
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
o
o
o
o
o
o
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
1
2
3
4
5
10
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
o
o
o
o
9
8
7
6
Figure 6 - Pin Out Diagram (Top View)
Pin Descriptions:
Pin 1 Receiver Signal Ground V RX:
Directly connect this pin to the
receiver ground plane.
Pin 4 Receiver Data Out Bar RD-:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 9 Transmitter Data In TD+:
No internal terminations are
provided. See recommended
circuit schematic.
EE
Pin 2 Receiver Power Supply V RX:
CC
Provide +3.3 V dc via the
Pin 5 Receiver Data Out RD+:
No internal terminations are
provided. See recommended
circuit schematic.
Pin 10 Transmitter Data In Bar TD-:
No internal terminations are
provided. See recommended
circuit schematic.
recommended receiver power
supply filter circuit. Locate the
power supply filter circuit as
close as possible to the V RX
pin. Note: the filter circuit should
CC
Pin 6 Transmitter Power Supply
Mounting Studs/ Solder Posts
The two mounting studs are
provided for transceiver
mechanical attachment to the
circuit board. It is recommended
that the holes in the circuit board
be connected to chassis ground.
V
CC
TX:
not cause V to drop below
CC
Provide +3.3 V dc via the
minimum specification.
recommended transmitter power
supply filter circuit. Locate the
power supply filter circuit as
Pin 3 Signal Detect SD:
Normal optical input levels to the
receiver result in a logic “1”
output.
close as possible to the V TX
CC
pin.
Package Grounding Tabs
Connect four package grounding
tabs to signal ground.
Pin 7 Transmitter Signal Ground
Low optical input levels to the
receiver result in a logic “0”
output.
V TX:
EE
Directly connect this pin to the
transmitter signal ground plane.
This Signal Detect output can be
used to drive a low voltage TTL
input on an upstream circuit,
such as Signal Detect input or
Loss of Signal-bar.
Pin 8 Transmitter Disable T
:
DIS
Optional feature, connect this pin
to +3.3 V TTL logic high “1” to
disable module. To enable module
connect to TTL logic low “0”.
7
Application Information
transmitter output optical power
(dBm avg) and the lowest
receiver sensitivity (dBm avg).
This OPB provides the necessary
optical signal range to establish a PECL signals. The transmitter
working fiber-optic link. The OPB driver circuit regulates the
is allocated for the fiber-optic
cable length and the
Data Line Interconnections
The Applications Engineering
Group at Agilent is available to
assist you with technical
understanding and design trade-
offs associated with these
transceivers. You can contact
them through your Agilent sales
representative.
Agilent’sHFCT-5951xxx/HFCT-
5952xxx fiber-optic transceivers
are designed to couple to +3.3 V
output optical power. The
regulated light output will
corresponding link penalties. For maintain a constant output
proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget.
optical power provided the data
pattern is reasonably balanced in
duty cycle. If the data duty cycle
has long, continuous state times
(low or high data duty cycle),
then the output optical power
will gradually change its average
output optical power level to its
preset value.
The following information is
provided to answer some of the
most common questions about
the use of the parts.
Optical Power Budget and Link
Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiber-
optic link is determined by the
difference between the minimum
Electrical and Mechanical Interface
RecommendedCircuit
Figures 7 and 8 shows the
recommended interface for
deploying the Agilent transceivers
in a +3.3 V system.
VCC (+3.3 V)
82
Z = 50
Z = 50
VCC (+3.3 V)
100 nF
100 nF
T
DIS (LVTTL)
BMON
BMON
PMON
PMON
VCC (+3.3 V)
130
-
130
82
TD-
+
NOTE A
130
130
-
TD+
+
20 19 18 17 16 15 14 13 12 11
VCC (+3.3 V)
1 µH
10 µF
TX
C3
C2
C1
VCC (+3.3 V)
RX
1 µH
RD+
RD-
10 µF
1
2
3
4
5
6
7
8
9
10
Z = 50
V RX (+3.3 V)
100
NOTE B
CC
100 nF
200
Z = 50
NOTE C
VCC (+3.3 V)
10 nF
100 nF
3 k
130
130
10 k
SD
LVTTL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: CIRCUIT ASSUMES HIGH IMPENDANCE INTERNAL BIAS @ VCC - 1.3 V.
Note C: THE BIAS RESISTOR FOR VpdR SHOULD NOT EXCEED 200 OHM.
THIS IS NOT REQUIRED
BY THE HFCT-5952ATL/ TL
Figure 7 - Recommended Interface Circuit (HFCT-5952xxx)
8
VCC (+3.3 V)
100 nF
100 nF
82
Z = 50
Z = 50
VCC (+3.3 V)
TDIS (LVTTL)
130
130
82
130
6
TD-
100 nF
NOTE A
130
TD+
10
9
8
7
VCC (+3.3 V)
VCC (+3.3 V)
1 µH
TX
10 µF
1 µH
C3
100 nF
C2
C1
VCC (+3.3 V)
82
82
RX
RD+
C4 *
10 µF
1
2
3
4
5
Z = 50
130
NOTE B
100 nF
100 nF
RD-
130
Z = 50
VCC (+3.3 V)
130
130
10 k
SD
LVTTL
THIS IS NOT REQUIRED
BY THE HFCT-5951ATL/ TL
Note: C1 = C2 = C3 = 10 nF or 100 nF
Note A: CIRCUIT ASSUMES OPEN EMITTER OUTPUT
Note B: WHEN INTERNAL BIAS IS PROVIDED REPLACE SPLIT RESISTORS WITH 100 TERMINATION
* C4 IS AN OPTIONAL BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
Figure 8 - Recommended Interface Circuit (HFCT-5951xxx)
The HFCT-5951xxx/HFCT-
As for the receiver section, it is
internally ac-coupled between
the preamplifier and the
postamplifier stages. The actual
Data and Data-bar outputs of the
postamplifier are dc-coupled to
their respective output pins (pins
9 and 10 on the HFCT-5951xxx
and pins 14 and 15 on the
HFCT-5952xxx). The two data
outputs of the receiver should be
terminated with identical load
circuits to avoid unnecessarily
on circuits because of its
infrequent state changes.
5952xxx have a transmit disable
function which is a single-ended
+3.3 V TTL input which is dc-
coupled to pin 13 on the HFCT-
5952xxx and pin 8 on HFCT-
5951xxx. In addition the HFCT-
5952xxx offers the designer the
option of monitoring the laser
diode bias current and the laser
diode optical power. The voltage
measured between pins 17 and
18 is proportional to the bias
current through an internal 10 W
resistor. Similarly the optical
power rear facet monitor circuit
provides a photo current which
is proportional to the voltage
measured between pins 19 and
20 on the 2 x 10 version, this
voltage is measured across an
internal 200 W resistor.
The HFCT-5952xxx offers the
designer the option of monitoring
the PIN photo detector bias
current. Figures 7 and 8 show a
resistor network, which could be
used to do this. Note that the
photo detector bias current pin
must be connected to V
.
CC
Agilent also recommends that a
decoupling capacitor is used on
this pin.
large ac currents in V . If the
CC
outputs are loaded identically the
ac current is largely nulled.
Signal Detect is a single-ended,
+3.3 V TTL compatible output
signal that is dc-coupled to pin 3
on the HFCT-5951xxx and pin 8
on the HFCT-5952xxx modules.
Signal Detect should not be ac-
coupled externally to the follow-
9
8.89
(0.35)
Power Supply Filtering and Ground
Planes
3.56
(0.14)
2 x Ø 2.29 MAX. 2 x Ø 1.4 ±0.1
2 x Ø 1.4 ±0.1
(0.055 ±0.004)
7.11
(0.28)
(0.09)
(0.055 ±0.004)
It is important to exercise care in
circuit board layout to achieve
optimum performance from these
transceivers. Figures 7 and 8
show the power supply circuit
which complies with the small
form factor multisource
4 x Ø 1.4 ±0.1
(0.055 ±0.004)
10.16
(0.4)
13.34
(0.525)
agreement. It is further
recommended that a continuous
ground plane be provided in the
circuit board directly under the
transceiver to provide a low
inductance ground for signal
return current. This
recommendation is in keeping
with good high frequency board
layout practices.
7.59
(0.299)
9.59
(0.378)
2
(0.079)
9 x 1.78
(0.07)
2
3
3
2 x Ø 2.29
(0.09)
(0.079)
(0.118)
(0.118)
4.57
(0.18)
20 x Ø 0.81 ±0.1
(0.032 ±0.004)
6
16
3.08
(0.236)
(0.63)
(0.121)
Package footprint and front panel
considerations
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE SFF TRANSCEIVER.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR
GROUND CONNECTION IN KEEP-OUT AREAS.
3. 2 x 10 TRANSCEIVER MODULE REQUIRES 26 PCB HOLES (20 I/ O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/ O PINS, 2 SOLDER POSTS AND 4 PACKAGE
GROUNDING TABS).
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the current
multisource agreement which
defined the 2 x 5 and 2 x 10
package styles. This drawing is
reproduced in Figure 9 with the
addition of ANSI Y14.5M
compliant dimensioning to be
used as a guide in the mechanical
layout of your circuit board.
Figure 10 shows the front panel
dimensions associated with such
a layout.
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
5. THE MOUNTING STUDS SHOULD BE SOLDERED TO CHASSIS GROUND FOR MECHANICAL INTEGRITY AND TO
ENSURE FOOTPRINT COMPATIBILITY WITH OTHER SFF TRANSCEIVERS.
6. HOLES FOR HOUSING LEADS MUST BE TIED TO SIGNAL GROUND.
Figure 9 - Recommended Board Layout Hole Pattern
Signal Detect
The Signal Detect circuit
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
ElectromagneticInterference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFCT-5951xxx/
HFCT-5952xxx to provide
provides a deasserted output
signal when the optical link is
broken (or when the remote
transmitter is OFF). The Signal
Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optional power
and -45 dBm avg. input optical
power indicating a definite
optical fault (e.g. unplugged
connector for the receiver or
transmitter, broken fiber, or
Eye Safety Circuit
For an optical transmitter device
to be eye-safe in the event of a
single fault failure, the transmit-
ter must either maintain eye-safe
operation or be disabled.
The HFCT-5951xxx/HFCT-
5952xxx is intrinsically eye safe
and does not require shut down
circuitry.
failed far-end transmitter or data excellent EMI performance. The
source). The Signal Detect does
not detect receiver data error or
error-rate. Data errors can be
determined by signal processing
offered by upstream PHY ICs.
EMI performance of a chassis is
dependent on physical design and
features which help improve EMI
suppression. Agilent encourages
using standard RF suppression
practices and avoiding poorly
EMI-sealedenclosures.
10
Agilent’s HFCT-5951ATL/TL/
HFCT-5952ATL/TL OC-12/STM-4
LC transceivers have nose shields
which provide a convenient
chassis connection to the nose of
the transceiver. This nose shield
improves system EMI
15.24
(0.6)
10.16 ±0.1
(0.4 ±0.004)
TOP OF PCB
B
B
performance by closing off the
LC aperture. Localized shielding
is also improved by tying the four
metal housing package grounding
tabs to signal ground on the
PCB. Though not obvious by
inspection, the nose shield and
metal housing are electrically
separated for customers who do
not wish to directly tie chassis
and signal grounds together.
Figure 10 shows the
DETAIL A
1
(0.039)
15.24
(0.6)
A
SOLDER POSTS
recommended positioning of the
transceivers with respect to the
PCB and faceplate.
14.22 ±0.1
(0.56 ±0.004)
15.75 MAX. 15.0 MIN.
(0.62 MAX. 0.59 MIN.)
SECTION B - B
Package and Handling Instructions
Flammability
DIMENSIONS IN MILLIMETERS (INCHES)
1. FIGURE DESCRIBES THE RECOMMENDED FRONT PANEL OPENING FOR A LC OR SG SFF TRANSCEIVER.
2. SFF TRANSCEIVER PLACED AT 15.24 mm (0.6) MIN. SPACING.
The HFCT-5951xxx/HFCT-
5952xxx transceivers housing
consist of high strength, heat
resistant and UL 94 V-0 flame
retardant plastic and metal
packaging.
Figure 10 - Recommended Panel Mounting
Recommended Solder fluxes
Solder fluxes used with the
HFCT-5951xxx/HFCT-5952xxx
should be water-soluble, organic
fluxes. Recommended solder
fluxes include Lonco 3355-11
from London Chemical West, Inc.
of Burbank, CA, and 100 Flux
from Alpha-Metals of Jersey City,
NJ.
use of cleaners that use
halogenatedhydrocarbons
because of their potential
environmental harm.
Recommended Solder and Wash
Process
The HFCT-5951xxx/HFCT-
5952xxx are compatible with
industry-standardwave
processes.
LC SFF Cleaning Recommendations
In the event of contamination of
the optical ports, the
recommended cleaning process is
the use of forced nitrogen. If
contamination is thought to have
Process plug
The transceivers are supplied
with a process plug for
Recommended Cleaning/ Degreasing remained, the optical ports can
Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
be cleaned using a NTT
international Cletop stick type
(diam. 1.25 mm) and HFE7100
cleaning fluid.
protection of the optical port
within the LC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping
and storage. It is made of a high-
temperature, molded sealing
material.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone.Also,
Agilent does not recommend the
11
Regulatory Compliance
The second case to consider is
Eye Safety
The Regulatory Compliance for
static discharges to the exterior of These laser-based transceivers are
transceiver performance is shown the equipment chassis containing classified as AEL Class I (U.S. 21
in Table 1. The overall equipment the transceiver parts. To the extent CFR(J) and AEL Class 1 per EN
design will determine the
certification level. The transceiver is exposed to the outside of the
performance is offered as a
figure of merit to assist the
designer in considering their use
in equipment designs.
that the LC connector receptacle
60825-1 (+A11). They are eye safe
when used within the data sheet
limits per CDRH. They are also
eye safe under normal operating
conditions and under all
reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
equipment chassis it may be
subject to whatever system-level
ESD test criteria that the
equipment is intended to meet.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet FCC regulations in the
United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 9) for more details.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal
ESD handling precautions for
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to 3.6 V
ESD sensitive devices. These pre- Immunity
cautions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas.
Transceivers will be subject to
radio-frequencyelectromagnetic
fields following the IEC 61000-4-3
test method.
transmitter V
.
CC
Table 1: Regulatory Compliance - Targeted Specification
Feature
Electrostatic Discharge
(ESD) to the
Test Method
MIL-STD-883
Method 3015
Performance
Class 2 (>2 kV).
Electrical Pins
Electrostatic Discharge
(ESD) to the LC
Receptacle
Variation of IEC 61000-4-2
Tested to 8 kV contact discharge.
Electromagnetic
Interference (EMI)
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
Margins are dependent on customer board and chassis
designs.
VCCI Class I
Immunity
Variation of IEC 61000-4-3
Typically show no measurable effect from a
10 V/ m field swept from 27 to 1000 MHz applied to the
transceiver without a chassis enclosure.
Accession Number: ) 9521220-43
Laser Eye Safety
and Equipment Type
Testing
FDA CDRH 21-CFR 1040
Class 1
IEC 60825-1
License Number: ) 933/ 510104/ 02
Amendment 2 2001-01
Component
Recognition
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
UL File. E173874
12
CAUTION:
There are no user serviceable
parts nor any maintenance
required for the HFCT-5951xxx/
HFCT-5952xxx. All adjustments
are made at the factory before
shipment to our customers.
Tampering with or modifying the
performance of the
HFCT-5951xxx/HFCT-5952xxx
will result in voided product
warranty. It may also result in
improper operation of the
HFCT-5951xxx/HFCT-5952xxx
circuitry, and possible overstress
of the laser source. Device
degradation or product failure
may result.
Connection of the HFCT-5951xxx/
HFCT-5952xxx to a non-approved
optical source, operating above
the recommended absolute
maximum conditions or
operating the HFCT-5951xxx/
HFCT-5952xxx in a manner
inconsistent with their design
and function may result in
hazardous radiation exposure
and may be considered an act of
modifying or manufacturing a
laser product. The person(s)
performing such an act is
required by law to recertify and
reidentify the laser product
under the provisions of U.S. 21
CFR (Subchapter J).
13
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in
isolation, all other parameters having values within the recommended operating conditions. It should not be assumed that limiting
values of more than one parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for
extended periods can adversely affect device reliability.
Parameter
Symbol
Min.
-40
Typ.
Max.
+85
3.6
Unit
°C
V
Reference
Storage Temperature
Supply Voltage
T
S
V
CC
-0.5
-0.5
1
Data Input Voltage
Data Output Current
Relative Humidity
V
I
V
CC
V
ID
50
85
mA
%
RH
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Ambient Operating Temperature
HFCT-5951TL/ TG/ HFCT-5952TL/ TG
HFCT-5951ATL/ ATG/ HFCT-5952ATL/ ATG TA
Supply Voltage
TA
0
-40
3.14
+70
+85
3.47
°C
°C
V
2
2
V
CC
Power Supply Rejection
PSR
100
50
mV
3
Pk-Pk
Transmitter Differential Input Voltage
Data Output Load
V
D
0.3
1.6
1.0
0.6
V
W
RDL
TTL Signal Detect Output Current - Low
TTL Signal Detect Output Current - High
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
IOL
mA
µA
V
IOH
-400
2.2
TDIS
TDIS
V
TASSERT
TDEASSERT
10
µs
4
5
Transmit Disable Deassert Time
1.0
ms
Process Compatibility
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Wave Soldering and Aqueous Wash
TSOLD/ tSOLD
+260/ 10 °C/ sec.
6
Notes:
1. The transceiver is class 1 eye safe up to V = 3.6 V.
2. Ambient operating temperature utilizes air flow of 2 ms over the device.
CC
-1
3. Tested with a sinusoidal signal in the frequency range from 10 Hz to 1 MHz on the V supply with the recommended power supply filter in place.
CC
Typically less than a 1 dB change in sensitivity is experienced.
4. Time delay from Transmit Disable Assertion to laser shutdown.
5. Time delay from Transmit Disable Deassertion to laser startup.
6. Aqueous wash pressure <110 psi.
14
Transmitter Electrical Characteristics
HFCT-5951TL/ TG/ HFCT-5952TL/ TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ ATG/ HFCT-5952ATL/ ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCT
Min.
Typ.
30
Max.
120
Unit
mA
W
Reference
Supply Current
1
Power Dissipation
PDIST
0.10
800
0.42
930
Data Input Voltage Swing (single-ended)
V - V
250
mV
IH
IL
Transmitter Differential
Data Input Current - Low
Transmitter Differential
I
IL
-350
µA
Data Input Current - High
Laser Diode Bias Monitor Voltage
I
IH
350
700
200
µA
mV
mV
2, 3
2, 3
Power Monitor Voltage
10
Receiver ElectricalCharacteristics
HFCT-5951TL/ TG/ HFCT-5952TL/ TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ ATG/ HFCT-5952ATL/ ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
ICCR
Min.
Typ.
70
Max.
110
0.38
930
0.5
Unit
mA
W
Reference
Supply Current
1
4
5
6
6
7
7
Power Dissipation
PDISR
0.23
800
Data Output Voltage Swing (single-ended)
Data Output Rise Time
V - V
575
mV
ns
OH
OL
tr
tf
Data Output Fall Time
0.5
ns
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time (OFF to ON)
Signal Detect Deassert Time (ON to OFF)
V
OL
0.8
V
V
OH
2.0
2.3
V
ASMAX
100
100
µs
ANSMAX
µs
Notes:
1. Excludes data output termination currents.
2. The laser bias monitor current and laser diode optical power are calculated as ratios of the corresponding voltages to their current sensing
resistors, 10 W and 200 W (see Figure 7). On the 2 x 10 version only.
3. On the 2 x 10 version only.
4. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V and I minus the sum of
CC
CC
the products of the output voltages and currents.
5. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
6. These are 20-80% values.
7. SD is LVTTL compatible.
15
Transmitter Optical Characteristics
HFCT-5951TL/ TG/ HFCT-5952TL/ TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ ATG/ HFCT-5952ATL/ ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
Min.
-15
Typ.
Max.
-8
Unit
dBm
nm
Reference
Output Optical Power 9 µm SMF
Center Wavelength
Spectral Width - rms
Optical Rise Time
POUT
lC
1
1274
1356
2.5
s
nm rms
ps
2
3
3
tr
250
250
Optical Fall Time
tf
ps
Extinction Ratio
ER
8.2
dB
Output Optical Eye
Back Reflection Sensitivity
Jitter Generation
Compliant with eye mask Bellcore GR-CORE-000253 and ITU-T G.957
-8.5
70
7
dB
4
5
5
pk to pk
RMS
25
2
mUI
mUI
Receiver Optical Characteristics
HFCT-5951TL/ TG/ HFCT-5952TL/ TG: T = 0°C to +70°C, V = 3.14 V to 3.47 V
A
CC
HFCT-5951ATL/ ATG/ HFCT-5952ATL/ ATG: T = -40°C to +85°C, V = 3.14 V to 3.47 V
A
CC
Parameter
Symbol
Min.
Typ.
Max.
Unit
Reference
Receiver Sensitivity
P
IN MIN
-32
-28
dBm avg. 6
dBm avg. 6
nm
Receiver Overload
PIN MAX
-8
Input Operating Wavelength
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
Optical Return Loss, ORL
l
1270
1570
-28
PA
PD
PH
-34
-34.3
1.7
dBm avg.
dBm avg.
dB
-45
0.5
4
-35
-14
dB
Notes:
1. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
2. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian shaped spectrum which
results in RMS = FWHM/ 2.35.
3. These are unfiltered 20-80% values.
4. This meets the “desired” requirement in SONET specification (GR253). The figure given is the allowable mismatch for 1 dB degradation in receiver
sensitivity.
23
5. For the jitter measurements, the device was driven with SONET OC-12C data pattern filled with a 2 -1 PRBS payload.
23
6. Minimum sensitivity and saturation levels for a 2 -1 PRBS with 72 ones and 72 zeros inserted. Over the range the receiver is guaranteed to
-10
provide output data with a Bit Error Rate better than or equal to 1 x 10
.
16
Design Support Materials
Agilent has created a number of
reference designs with major
PHY IC vendors in order to
demonstrate full functionality
and interoperability. Such design
information and results can be
made available to the designer as
a technical aid. Please contact
your Agilent representative for
further information if required.
Ordering Information
Temperature range 0°C to +70°C
HFCT-5951TL
HFCT-5952TL
2 x 5 footprint with EMI nose shield
2 x 10 footprint with EMI nose shield
HFCT-5951TG 2 x 5 footprint without EMI nose shield
HFCT-5952TG 2 x 10 footprint without EMI nose shield
Temperature range -40°C to +85°C
HFCT-5951ATL 2 x 5 footprint with EMI nose shield
HFCT-5952ATL 2 x 10 footprint with EMI nose shield
HFCT-5951ATG 2 x 5 footprint without EMI nose shield
HFCT-5952ATG 2 x 10 footprint without EMI nose shield
Class 1 Laser Product: This product conforms to the
applicable requirements of 21 CFR 1040 at the date of
manufacture
Date of Manufacture:
Agilent Technologies Inc., No 1 Yishun Ave 7, Singapore
Handling Precautions
1. The HFCT-5951xxx/HFCT-5952xxx can be damaged by current surges or overvoltage.
Power supply transient precautions should be taken.
2. Normal handling precautions for electrostatic sensitive devices
should be taken.
17
www.agilent.com/ semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/ Canada: +1 (800) 235-0312 or
(408) 654-8675
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 271 2451
India, Australia, New Zealand: (+65) 271 2394
Japan: (+81 3) 3335-8152(Domestic/ International), or
0120-61-1280(DomesticOnly)
Korea: (+65) 271 2194
Malaysia, Singapore: (+65) 271 2054
Taiwan: (+65) 271 2654
Data subject to change.
Copyright © 2002 Agilent Technologies, Inc.
Obsoletes:5988-5223EN
March 8, 2002
5988-5922EN
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