NUP4103FCT1/D [ETC]
4 Channel ESD Array ; 4通道ESD阵列\n
| 型号： | NUP4103FCT1/D |
| 厂家： | 
ETC |
| 描述： | 4 Channel ESD Array
|
| 文件： | 总6页 (文件大小：63K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
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Features
CIRCUIT DESCRIPTION
• Unidirectional, Quad ESD Protection
• Ultra-small Flip Chip Packaging (0.95 mm x 1.33 mm)
• Compliance with IEC61000-4-2 (Level 4) Requirements
• Maximum Leakage Current of 100 nA at 3.3 V
A1
C1
B2
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
A3
C3
• Small Package Saves On PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000, HBM
and MM
• Low Leakage Capability Minimizes Power Loss in the System
Applications
• ESD Protection for Portable Equipment
• Cell Phones
• MP3 Players
5 PIN FLIP CHIP CSP
CASE 766AB
PLASTIC
• PDAs
TOP VIEW
(Bumps Down)
BOTTOM VIEW
(Bumps Up)
1
2
3
3
2 1
MAXIMUM RATINGS (T = 25°C, unless otherwise specified)
J
Rating
Symbol
Value
Unit
A
B
C
A
B
C
ESD Discharge IEC61000-4-2,
- Air Discharge
- Contact Discharge
Human Body Model
Machine Model
V
PP
kV
30
30
16
1.6
Junction Temperature
T
150
°C
°C
J
Operating Ambient Temperature
Range
T
A
-40 to +85
DEVICE MARKING
Storage Temperature Range
T
STG
-55 to +150
°C
ED
E = Specific Device Code
D = Month Code
ORDERING INFORMATION
Device
Package
Shipping
NUP4103FCT1
Flip Chip
3000/Tape & Reel
Semiconductor Components Industries, LLC, 2003
1
Publication Order Number:
June, 2003 - Rev. 0
NUP4103FC/D
NUP4103FC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)
J
Parameter
Reverse Stand-Off Voltage
Breakdown Voltage
Symbol
Conditions
Min
Typ
7.0
30
Max
5.5
Unit
V
V
RWM
I
= 10 mA (Note 1)
RWM
V
BR
I = 1.0 mA (Note 2)
6.0
8.0
V
T
Leakage Current
I
R
V
= 3.3 V per line
100
nA
pF
RM
Junction Capacitance
C
V = 2.5 V, f = 1 MHz
R
J
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
) which should be equal or greater than the DC
RWM
2. V is measured at pulse test current I .
BR
T
TYPICAL PERFORMANCE CURVES
(T = 25°C unless otherwise specified)
J
50
100.0E-9
10.0E-9
45
40
35
1.0E-9
30
25
20
100.0E-12
10.0E-12
-40
-15
10
35
60
85
0
1
2
3
4
5
V , Reverse Voltage (V)
R
T, Temperature (°C)
Figure 1. Reverse Voltage vs Junction Capacitance
Figure 2. Reverse Leakage Current
vs Junction Temperature
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2
NUP4103FC
200 ns
Figure 3. ESD Response for Human Body Model (+8 kV)
2.0 V/div
500 mV/div
200 ns
Figure 4. ESD Response for Human Body Model (-8 kV)
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3
NUP4103FC
Printed Circuit Board Recommendations
500 mm Pitch
300 mm Solder Ball
Parameter
PCB Pad Size
Pad Shape
Pad Type
250 mm +25 / -0
Round
NSMD
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
350 mm ±25
125 mm
250 x 250 mm sq.
50/50
No Clean Type 3 or Finer
OSP Cu
Trace Width
150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 5. Solder Mask versus Non-Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
200
183 °C
2 to 5 °C/s
150
140 to 160 °C
100
50
1 to 5 °C/s
0
0
1
2
3
4
5
1 to 2 min
30-100 sec
TIME (minutes)
Figure 6. Solder Reflow Profile
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4
NUP4103FC
PACKAGE DIMENSIONS
5 PIN FLIP CHIP CSP
CASE 766AB-01
ISSUE O
4 X
D
A
B
E
NOTES:
0.10
C
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
TERMINAL A1
LOCATOR
DIM
A
A1
A2
D
E
b
e
f
MIN
---
0.210
0.380
MAX
0.680
0.270
0.430
A1
A
1.330 BSC
0.960 BSC
0.290 0.340
0.500 BSC
0.433 BSC
0.866 BSC
0.10
C
C
A2
D1
0.05
C
SEATING
PLANE
D1
f
1
2
3
5 X
b
e
0.05
0.03
C A B
C
A
B
C
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5
NUP4103FC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
Literature Fulfillment:
JAPAN: ON Semiconductor, Japan Customer Focus Center
2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051
Phone: 81-3-5773-3850
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada
Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada
Email: ONlit@hibbertco.com
ON Semiconductor Website: http://onsemi.com
For additional information, please contact your local
Sales Representative.
N. American Technical Support: 800-282-9855 Toll Free USA/Canada
NUP4103FC/D
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