FR97063ASOGTR [FITIPOWER]
23V, 2A, 600KHz Asynchronous Step-Down DC/DC Converter;
| 型号： | FR97063ASOGTR |
| 厂家： | 
Fitipower |
| 描述： | 23V, 2A, 600KHz Asynchronous Step-Down DC/DC Converter |
| 文件： | 总12页 (文件大小：831K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
fitipower integrated technology lnc.
23V, 2A, 600KHz Asynchronous Step-Down
DC/DC Converter
Description
Features
The FR97063A is a monolithic step-down switch
mode converter with a built-in power MOSFET. It
achieves 2A output current over a wide input supply
range with excellent load and line regulation.
Current mode operation provides fast transient
● 2A Output Current
● 180mΩ Internal Power MOSFET Switch
● Stable with Low ESR Output Ceramic Capacitors
● Up to 92% Efficiency
● Fixed 600KHz Frequency
response and eases loop stabilization.
Fault
● Current Mode Operation
condition protection includes cycle-by-cycle current
limit and thermal shutdown.
● Thermal Shutdown
● Cycle-by-Cycle Over Current Protection
● Wide 4.5V to 23V Operating Input Range
● Output Adjustable from 0.805V to 15V
● 10μA Shutdown Current
● Available in SOP-8 and MSOP-10 (Exposed Pad)
Packages
The FR97063A is available in SOP-8 and MSOP-10
(exposed pad) packages, which provides a very
compact system solution and good thermal
conductance.
Applications
● Distributed Power System
● Battery Charger
● OLPC, Netbook
● Pre-Regulator for Linear Regulator
● WLED Driver
Pin Assignments
Ordering Information
SO Package (SOP-8)
FR97063A□□□
TR: Tape/Reel
8
7
6
5
1
2
BS
VIN
NC
EN
NC
FB
G: Green
3
4
SW
Package Type
SO: SOP-8
GND
MP: MSOP-10 (Exposed Pad)
MP Package (MSOP-10 Exposed Pad)
10
9
1
2
NC
NC
BS
EN
8
3
4
5
NC
FB
NC
VIN
SW
7
6
GND
Figure 1. Pin Assignment of FR97063A
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Typical Application Circuit
NOT USED
6.8
NC
2
1
3
VIN
BS
VIN
EN
C3
22nF
4.5V to 23V
L1
4.7μH
C1
10μF/25V
VOUT
3.3V
CERAMIC
FR97063ASW
D1
C4
(optional)
R1
30.9KΩ/1%
C2
47μF/6.3V
B230A
CERAMIC
7
5
OFF
FB
ON
GND
4
R2
10KΩ/1%
Figure 2. Typical Application Circuit of FR97063A (SOP-8 package)
NOT USED
1.3.8.10
NC
4
2
5
VIN
4.5V to 23V
BS
VIN
EN
C3
22nF
L1
4.7μH
C1
10μF/25V
VOUT
3.3V
CERAMIC
FR97063ASW
D1
C4
(optional)
R1
30.9KΩ/1%
C2
47μF/6.3V
B230A
CERAMIC
9
7
OFF
FB
ON
GND
6
R2
10KΩ/1%
Figure 3. Typical Application Circuit of FR97063A (MSOP-10 exposed pad package)
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Functional Pin Description
Pin Name
Pin Function
Bootstrap. A 22nF capacitor is connected between SW and BS pins to drive the power switch’s gate above the
supply voltage.
BS
Power Supply Input. Drive 4.5V to 23V voltage to this pin to power on this chip. Connect a 10μF ceramic bypass
capacitor between VIN and GND to eliminate noise.
VIN
SW
Switch Output. Connect this pin to the switch end of the inductor.
Ground. This pin is the voltage reference for the regulated output voltage. For this reason, care must be taken in
its layout.
GND
FB
Feedback. An external resistor divider from the output to GND, tapped to the FB pin sets the output voltage.
No Connection.
NC
EN
On/Off Control Input. Pull EN above 1.2V to turn the device on.
Block Diagram
+
OVP
-
Current Sense
Amplifier
VIN
0.9V
+
+
-
Oscillator
120KHz / 600KHz
+
6V
FB
-
CLK
0.45V
BS
High-Side
MOSFET
S SET
Q
+
-
Error
Amplifier
-
SW
Driver
R CLR
+
Current
Comparator
0.805V
GND
NC
-
EN
OVP
OTP
VIN UVLO
REGULATOR
+
950K
1.2V
CCOMP
Internal
Compensation
RC
RCOMP
Figure 4. Block Diagram of FR97063A
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Absolute Maximum Ratings
● Supply Voltage VIN --------------------------------------------------------------------------------------------- +25V
● VSW ---------------------------------------------------------------------------------------------------------------- -3V to VIN +0.3V
● VBS ----------------------------------------------------------------------------------------------------------------- Vsw +6V
● All Other Pins Voltage ----------------------------------------------------------------------------------------- -0.3V to +6V
● Maximum Junction Temperature (TJ) --------------------------------------------------------------------- +150°C
● Storage Temperature (TS) ----------------------------------------------------------------------------------- -65°C to +150°C
● Lead Temperature (Soldering, 10sec.) ------------------------------------------------------------------- +260°C
● Power Dissipation @TA=25°C, (PD)
SOP-8 ------------------------------------------------------------------------------------------------- 0.63W
MSOP-10 (Exposed Pad) ------------------------------------------------------------------------ 0.91W
● Package Thermal Resistance, (θJA)
SOP-8 ------------------------------------------------------------------------------------------------- 160°C/W
MSOP-10 (Exposed Pad) ------------------------------------------------------------------------ 160°C/W
Note 1：Stresses beyond those listed under “Absolute Maximum Ratings" may cause permanent damage to the device.
Recommended Operating Conditions
● Supply Voltage (VIN) ------------------------------------------------------------------------------------------- +4.5V to +23V
● Output Voltage (VOUT) ----------------------------------------------------------------------------------------- +0.805V to +15V
● Operation Temperature Range ------------------------------------------------------------------------------ -40°C to +85°C
Note 2：If out of its operation conditions, the device is not guaranteed to function.
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Electrical Characteristics
(VIN=12V, TA=25℃, unless otherwise specified.)
Parameter
Conditions
Min
Typ
0.805
180
Max
Unit
V
Feedback Voltage
4.5V ≤ VIN ≤ 23V
0.785
0.825
Switch-On Resistance (*)
Switch Leakage
mΩ
μA
A
VEN = 0V, VSW = 0V
10
Current Limit (*)
3
Oscillator Frequency
480
600
120
85
720
KHz
KHz
%
Fold-back Frequency
VFB = 0V
Maximum Duty Cycle
Minimum On-Time (*)
100
4.4
250
ns
Under Voltage Lockout Threshold Rising
Under Voltage Lockout Threshold Hysteresis
EN Input Low Voltage
4.1
1.2
4.7
0.4
V
mV
V
EN Input High Voltage
V
VEN = 2V
2.0
0.1
10
μA
EN Input Current
VEN = 0V
Supply Current (Shutdown)
Supply Current (Quiescent)
Thermal Shutdown (*)
VEN = 0V
μA
mA
°C
VEN = 2V, VFB = 1V
1.8
150
*: Guaranteed by design
Note 3：VIN = 5V, VOUT = 3.3V, maximum load current is about 1.4A.
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Typical Performance Curves
VIN = 12V, VOUT = 3.3V, C1 = 10μF, C2 = 47μF, L1 = 4.7μH, TA = +25°C, unless otherwise noted.
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
VOUT=1.2V
VOUT=1.8V
VOUT=3.3V
VOUT=5V
VIN= 12V
VIN= 5V
VOUT=1.2V
VOUT=1.8V
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
Load Current (A)
Load Current (A)
Figure 5. Efficiency vs. Loading
Figure 6. Efficiency vs. Loading
650
640
630
620
610
600
590
580
570
560
550
0.82
0.818
0.816
0.814
0.812
0.81
IOUT= 0.5A
IOUT= 0.5A
0.808
0.806
0.804
0.802
0.8
-40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90 100
-40 -30 -20 -10
0
10
20
30
40
50
60
70
80
90 100
Case Temperature (℃ )
Case Temperature ( ℃ )
Figure 7. Feedback Voltage vs. Case Temperature
Figure 8. Switching Frequency vs. Case Temperature
IOUT = 0.1A
IOUT = 2A
VIN 200mV/div.
VIN 50mV/div.
VOUT 10mV/div.
VOUT 10mV/div.
IL 1A/div.
IL 1A/div.
VSW 5V/div.
VSW 5V/div.
1μs/div.
1μs/div.
Figure 9. DC Ripple Waveform
Figure 10. DC Ripple Waveform
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Typical Performance Curves (Continued)
VIN = 12V, VOUT = 3.3V, C1 = 10μF, C2 = 47μF, L1 = 4.7μH, TA = +25°C, unless otherwise noted.
IOUT = 0.1A
IOUT = 2A
VEN, 5V/div.
VEN, 5V/div.
VOUT 1V/div.
IL 1A/div.
VOUT 1V/div.
IL 1A/div.
VSW 10V/div.
VSW 10V/div.
80μs/div.
80μs/div.
Figure 11. Startup Through Enable Waveform
Figure 12. Startup Through Enable Waveform
IOUT = 2A
IOUT = 0.1A
VEN, 5V/div.
VEN, 5V/div.
VOUT 1V/div.
IL 1A/div.
VOUT 1V/div.
IL 1A/div.
VSW 10V/div.
VSW 10V/div.
1ms/div.
80μs/div.
Figure 13. Shutdown Through Enable Waveform
Figure 14. Shutdown Through Enable Waveform
VOUT 1V/div.
VOUT 1V/div.
IL 1A/div.
IL 1A/div.
40μs/div.
20μs/div.
Figure 15. Short Circuit Test Waveform
Figure 16. Short Circuit Recovery Waveform
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Typical Performance Curves (Continued)
VIN = 12V, VOUT = 3.3V, C1 = 10μF, C2 = 47μF, L1 = 4.7μH, TA = +25°C, unless otherwise noted.
IOUT = 100mA to 2A step
VOUT ,, 200mV/div.
IL 1A/div.
400μs/div.
Figure 17. Load Transient Waveform
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Application Information
Setting EN Automatic Startup Voltage
Table 2 —Resistor Selection for Common
Output Voltages
VIN
VOUT
5V
R1
R2
43kΩ
8.2kΩ
10kΩ
10kΩ
10kΩ
R3
FR97063A
EN
3.3V
2.5V
1.8V
30.9kΩ
21kΩ
5V
R4
950K?
12.4kΩ
The external resistor divider is used to set the EN
automatic startup voltage:
Selecting the Inductor
A 4.ꢄμH inductor with a DC current rating of at least
25% percent higher than the maximum load current
is recommended for most applications. For the
highest efficiency, the inductor’s DC resistance
should be less than 200mΩ. For most designs, the
required inductance value can be derived from the
following equation.
VEꢁ
R4ꢀ
VIꢁꢂV
Eꢁꢀ
R3
For example, VIN=12V, R3=100KΩ, thus R4 resistor
value is:
5V
ꢈIꢀ0.3ꢆIꢉ(MAꢊꢋ
R4ꢀ
ꢃꢄ1.5kΩ
12Vꢂ5V
100kΩ
ꢀ
VOꢅT
ꢁ
ꢂ
ꢉꢌ VIꢁꢂVOꢅT ꢆ
ꢀ
FSWꢆꢈIꢆVIꢁ
Table 1 shows a list of resistor selection for common
input voltages:
Where ΔI is the inductor ripple current.
Choose the inductor ripple current to be 30% of the
maximum load current. The maximum inductor
peak current is calculated from:
Table 1 -- Resistor Selection for Common
Input Voltages
VIN
5V
R3
R4
ꢈIꢉ
100kΩ
100kΩ
100kΩ
NC
Iꢉ(MAꢊꢋꢀIꢉOAD
ꢇ
2
12V
16V
71.5kΩ
45.3kΩ
Under light load conditions below 100mA, a larger
inductance is recommended for improving
efficiency.
Setting Output Voltage
The external resistor divider is used to set the output
voltage. FR97063A feedback resistors are
unconcerned of compensation and provide an easy
way to program output voltage. Table 2 shows a list
of resistor selection for common output voltages:
Selecting the Input Capacitor
The input capacitor reduces the surge current
drawn from the input supply and the switching noise
from the device. The input capacitor impedance at
the switching frequency should be less than the
input source impedance to prevent high frequency
switching current from passing through the input.
Ceramic capacitors with X5R or X7R dielectrics are
highly recommended because of their low ESR and
R1
VOꢅTꢀ0.805ꢆ 1ꢇ ꢀ V
R2
small
temperature
coefficients.
For
most
applications, 10μF capacitor is sufficient.
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Application Information (Continued)
Selecting the Output Capacitor
5. The exposed pad of the package should be
soldered to an equivalent area of metal on the
PCB. This area should connect to the GND
plane and have multiple via connections to the
back of the PCB as well as connections to
intermediate PCB layers. The GND plane area
which connects to the exposed pad should be
maximized to improve thermal performance.
(Figure 6)
The output capacitor keeps the output voltage
ripple small, and a 47μF ceramic capacitor with
X5R or X7R dielectrics is recommended for its low
ESR characteristics.
External Bootstrap Diode
An external bootstrap diode is recommended if the
input voltage is less than 5V or there is a 5V system
rail available. This diode helps improving the
efficiency. Low cost diodes, such as 1N4148, are
suitable for this application.
R3
R1
R4
R2
8
1
7
6
3
5
4
D2
1N4148
GND
VIN
BS
VIN
5V
FR97063A
C2
C3
C1
2
D1
SW
VIN
VOUT
SW
L1
C3
Rectifier Diode
Figure 18. Recommended Layout Diagram (SOP-8 package)
Use a Schottky diode as the rectifier to conduct
current when the high-side power MOSFET is off.
The Schottky diode must have current rating higher
than the maximum output current and the reverse
voltage rating higher than the maximum input
voltage.
R3
R4
R1
R2
10
9
8
7
6
Exposed
Pad
GND
PCB Layout Recommendation
The device’s performance and stability are
C1
C2
D1
1
2
3
4
5
dramatically affected by PCB layout.
It is
recommended to follow these general guidelines
shown as below:
VIN
SW
L1
VOUT
C3
1. Place the input capacitors and output
capacitors as close to the device as possible.
The traces which connect to these capacitors
should be as short and wide as possible to
minimize parasitic inductance and resistance.
Figure 19. Recommended Layout Diagram (MSOP-10 exposed
pad package)
2. Place VIN bypass capacitors close to the VIN pin.
3. Place feedback resistors close to the FB pin.
4. Keep the sensitive signal (FB) away from the
switching signal (SW).
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Outline Information
SOP-8 Package (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
MAX
A
A1
A2
B
1.35
1.75
0.10
1.25
0.31
4.80
3.80
1.20
5.80
0.40
0.25
1.50
0.51
5.00
4.00
1.34
6.20
1.27
D
E
e
H
L
Note：Followed From JEDEC MO-012-E
Carrier Dimensions
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Outline Information (Continued)
MSOP-10 (Exposed Pad) Package (Unit: mm)
DIMENSION IN MILLIMETER
SYMBOLS
UNIT
MIN
0.75
0.00
0.75
0.17
2.90
4.80
2.90
0.40
0.40
0.75
0.75
MAX
1.10
0.15
0.95
0.30
3.10
5.00
3.10
0.60
0.80
2.50
2.50
A
A1
A2
B
D
E
E1
e
L
D1
E2
Note：Followed From JEDEC MO-187-E.
Carrier Dimensions
Life Support Policy
Fitipower’s products are not authorized for use as critical components in life support devices or other medical systems.
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