AOT8N65 [FREESCALE]

600V,8A N-Channel MOSFET; 600V , 8A N沟道MOSFET
AOT8N65
型号: AOT8N65
厂家: Freescale    Freescale
描述:

600V,8A N-Channel MOSFET
600V , 8A N沟道MOSFET

文件: 总6页 (文件大小:464K)
中文:  中文翻译
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AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
General Description  
an advanced high voltage MOSFET process that is  
The AOT8N65 & AOTF8N65 have been fabricated using  
designed to deliver high levels of performance and robustness in popular AC-DC applications.  
By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability these parts can be  
adopted quickly into new and existing offline power supply  
designs.  
Features  
VDS  
750V@150  
8A  
ID (at VGS=10V)  
RDS(ON) (at VGS=10V)  
< 1.15  
D
G
S
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
AOT8N65  
AOTF8N65  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
650  
±30  
V
V
VGS  
TC=25°C  
8
8*  
Continuous Drain  
Current  
ID  
TC=100°C  
5.2  
5.2*  
A
Pulsed Drain Current C  
IDM  
32  
3.4  
173  
347  
5
Avalanche Current C  
IAR  
A
Repetitive avalanche energy C  
EAR  
EAS  
dv/dt  
mJ  
Single plused avalanche energy G  
Peak diode recovery dv/dt  
TC=25°C  
mJ  
V/ns  
W
W/ oC  
208  
50.0  
0.3  
PD  
Power Dissipation B  
Derate above 25oC  
1.67  
Junction and Storage Temperature Range  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds  
Thermal Characteristics  
TJ, TSTG  
TL  
-55 to 150  
300  
°C  
°C  
Parameter  
Symbol  
RθJA  
AOT8N65  
AOTF8N65  
Units  
°C/W  
°C/W  
°C/W  
Maximum Junction-to-Ambient A,D  
65  
0.5  
0.6  
65  
--  
Maximum Case-to-sink A  
RθCS  
Maximum Junction-to-Case  
RθJC  
2.5  
* Drain current limited by maximum junction temperature.  
1/6  
www.freescale.net.cn  
AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
ID=250A, VGS=0V, TJ=25°C  
ID=250A, VGS=0V, TJ=150°C  
650  
BVDSS  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current  
Zero Gate Voltage Drain Current  
750  
0.7  
V
BVDSS  
V/ oC  
/TJ  
ID=250A, VGS=0V  
VDS=650V, VGS=0V  
1
IDSS  
µA  
VDS=520V, TJ=125°C  
VDS=0V, VGS=±30V  
VDS=5V ID=250µA  
VGS=10V, ID=4A  
VDS=40V, ID=4A  
IS=1A,VGS=0V  
10  
IGSS  
VGS(th)  
RDS(ON)  
gFS  
Gate-Body leakage current  
Gate Threshold Voltage  
±100  
4.5  
nΑ  
V
3
4
Static Drain-Source On-Resistance  
Forward Transconductance  
Diode Forward Voltage  
0.91  
11  
1.15  
S
VSD  
0.74  
1
8
V
IS  
Maximum Body-Diode Continuous Current  
Maximum Body-Diode Pulsed Current  
A
ISM  
32  
A
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
930  
80  
7
1165  
101  
9
1400  
120  
11  
pF  
pF  
pF  
VGS=0V, VDS=25V, f=1MHz  
VGS=0V, VDS=0V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
1.8  
3.7  
5.6  
SWITCHING PARAMETERS  
Qg  
Qgs  
Qgd  
tD(on)  
tr  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
18.5  
5
23.5  
6.2  
9.5  
26  
28  
7.5  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
VGS=10V, VDS=520V, ID=8A  
7.5  
11.5  
51  
VGS=10V, VDS=325V, ID=8A, RG=25Ω  
tD(off)  
tf  
65  
43  
trr  
IF=8A,dI/dt=100A/µs,VDS=100V  
IF=8A,dI/dt=100A/µs,VDS=100V  
235  
4
295  
5
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
355  
6
ns  
Qrr  
C  
A. The value of R θJA is measured with the device in a still air environment with T A =25°C.  
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation  
limit for cases where additional heatsinking is used.  
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ  
=25°C.  
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.  
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.  
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a  
maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.  
G. L=60mH, IAS=3.3A, VDD=150V, RG=25, Starting TJ=25°C  
2/6  
www.freescale.net.cn  
AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
14  
12  
10  
8
100  
10  
1
10V  
6.5V  
6V  
-55°C  
VDS=40V  
125°C  
6
4
25°C  
VGS=5.5V  
2
0.1  
0
2
4
6
8
10  
0
5
10  
15  
VDS (Volts)  
20  
25  
30  
VGS(Volts)  
Fig 1: On-Region Characteristics  
Figure 2: Transfer Characteristics  
1.8  
1.5  
1.2  
0.9  
0.6  
0.3  
3
2.5  
2
VGS=10V  
ID=4A  
VGS=10V  
1.5  
1
0.5  
0
2
4
6
8
10  
12  
14  
16  
0
-100  
-50  
0
50  
Temperature (°C)  
Figure 4: On-Resistance vs. Junction Temperature  
100  
150  
200  
ID (A)  
Figure 3: On-Resistance vs. Drain Current and Gate  
Voltage  
1.0E+02  
1.2  
1.1  
1
1.0E+01  
1.0E+00  
1.0E-01  
1.0E-02  
125°C  
25°C  
1.0E-03  
1.0E-04  
1.0E-05  
0.9  
0.8  
-100  
-50  
0
50  
100  
150  
200  
0.0  
0.2  
0.4  
VSD (Volts)  
Figure 6: Body-Diode Characteristics (Note E)  
0.6  
0.8  
1.0  
TJ (oC)  
Figure 5: Break Down vs. Junction Temperature  
3/6  
www.freescale.net.cn  
AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
15  
12  
9
10000  
1000  
100  
10  
Ciss  
VDS=520V  
ID=8A  
Coss  
6
3
Crss  
1
0
0.1  
1
10  
100  
0
5
10  
15  
Q
20  
g (nC)  
Figure 7: Gate-Charge Characteristics  
25  
30  
35  
VDS (Volts)  
Figure 8: Capacitance Characteristics  
100  
10  
100  
10µs  
10µs  
100µ  
10  
1
RDS(ON)  
limited  
RDS(ON)  
limited  
100µs  
1ms  
1ms  
1
10ms  
10ms  
0.1s  
1s  
DC  
DC  
0.1  
0.01  
0.1  
0.01  
TJ(Max)=150°C  
TC=25°C  
TJ(Max)=150°C  
TC=25°C  
1
10  
100  
1000  
1
10  
100  
1000  
VDS (Volts)  
VDS (Volts)  
Figure 10: Maximum Forward Biased Safe  
Operating Area for AOTF8N65 (Note F)  
Figure 9: Maximum Forward Biased Safe  
Operating Area for AOT8N65 (Note F)  
10  
8
6
4
2
0
0
25  
50  
75  
100  
125  
150  
TCASE (°C)  
Figure 11: Current De-rating (Note B)  
4/6  
www.freescale.net.cn  
AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
10  
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=Tc+PDM.ZθJC.RθJC  
RθJC=0.6°C/W  
1
0.1  
PD  
Ton  
0.01  
0.001  
T
Single Pulse  
0.001  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
Pulse Width (s)  
Figure 12: Normalized Maximum Transient Thermal Impedance for AOT8N65 (Note F)  
10  
1
D=Ton/T  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
TJ,PK=Tc+PDM.ZθJC.RθJC  
RθJC=2.5°C/W  
0.1  
PD  
0.01  
0.001  
Ton  
T
Single Pulse  
0.001  
0.00001  
0.0001  
0.01  
Pulse Width (s)  
Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF8N65 (Note F)  
0.1  
1
10  
100  
5/6  
www.freescale.net.cn  
AOT8N65/AOTF8N65  
600V,8A N-Channel MOSFET  
Gate Charge Test Circuit &Waveform  
Vgs  
Qg  
10V  
+
VDC  
+
Qgs  
Qgd  
Vds  
VDC  
-
-
DUT  
Vgs  
Vds  
Ig  
Charge  
Resistive Switching Test Circuit & Waveforms  
RL  
Vds  
90%  
10%  
+
DUT  
Vdd  
Vgs  
VDC  
Rg  
-
Vgs  
Vgs  
t d(on)  
t
r
t d(off)  
t
f
t on  
toff  
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms  
L
2
EAR=1/2 LI  
AR  
BVDSS  
Vds  
Id  
Vds  
+
Vgs  
Vdd  
IAR  
Vgs  
VDC  
Id  
Rg  
-
DUT  
Vgs  
Vgs  
Diode RecoveryTestCircuit &Waveforms  
Qrr=- Idt  
Vds +  
Vds -  
Ig  
DUT  
Vgs  
Isd  
trr  
L
IF  
Isd  
dI/dt  
+
IRM  
Vdd  
Vgs  
VDC  
Vdd  
-
Vds  
6/6  
www.freescale.net.cn  

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