AOT9610 [AOS]
600V, 12A N-Channel MOSFET; 600V ，12A N沟道MOSFET
| 型号： | AOT9610 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | 600V, 12A N-Channel MOSFET |
| 文件： | 总6页 (文件大小：151K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOT12N60 / AOTF12N60
600V, 12A N-Channel MOSFET
formerly engineering part number AOT9610/AOTF9610
General Description
Features
The AOT12N60 & AOTF12N60 have been fabricated
using an advanced high voltage MOSFET process
that is designed to deliver high levels of performance
and robustness in popular AC-DC applications.
By providing low RDS(on), Ciss and Crss along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power
supply designs.
VDS (V) = 700V @ 150°C
ID = 12A
RDS(ON) < 0.55 Ω (VGS = 10V)
100% UIS Tested!
100% R g Tested!
C iss , C oss , C rss Tested!
Top View
D
TO-220F
TO-220
G
G
G
D
S
D
S
S
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
VDS
AOT12N60
600
AOTF12N60
Units
V
V
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain
Current B
Pulsed Drain Current C
Avalanche Current C
VGS
±30
TC=25°C
12
12*
TC=100°C
ID
8.1
8.1*
A
IDM
IAR
48
5.5
450
900
5
A
Repetitive avalanche energy C
EAR
EAS
dv/dt
mJ
Single pulsed avalanche energy G
Peak diode recovery dv/dt
TC=25°C
mJ
V/ns
W
223
1.8
50
PD
Power Dissipation B
Derate above 25oC
0.4
W/ C
o
TJ, TSTG
Junction and Storage Temperature Range
-50 to 150
300
°C
°C
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
TL
Parameter
Symbol
RθJA
AOT12N60
AOTF12N60
Units
Maximum Junction-to-Ambient A,D
Maximum Case-to-Sink A
°C/W
65
65
RθCS
0.5
--
2.5
°C/W
°C/W
Maximum Junction-to-Case D,F
RθJC
0.56
* Drain current limited by maximum junction temperature.
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT12N60 / AOTF12N60
Electrical Characteristics (TJ=25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max Units
STATIC PARAMETERS
ID=250µA, VGS=0V, TJ=25°C
ID=250µA, VGS=0V, TJ=150°C
600
V
V
BVDSS
Drain-Source Breakdown Voltage
700
BVDSS
Breakdown Voltage Temperature
Coefficient
V/ oC
ID=250µA, VGS=0V
/∆TJ
0.65
VDS=600V, VGS=0V
1
IDSS
Zero Gate Voltage Drain Current
µA
10
V
DS=480V, TJ=125°C
VDS=0V, VGS=±30V
DS=VGS, ID=250µA
IGSS
VGS(th)
RDS(ON)
gFS
Gate-Body leakage current
Gate Threshold Voltage
±100
5
nA
V
V
3
4
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
VGS=10V, ID=6A
VDS=40V, ID=6A
IS=1A, VGS=0V
0.46
20
0.55
Ω
S
VSD
0.72
1
V
Maximum Body-Diode Continuous Current
Maximum Body-Diode Pulsed Current
IS
12
48
A
ISM
A
DYNAMIC PARAMETERS
Ciss
Coss
Crss
Rg
Input Capacitance
1400 1751 2100
pF
pF
pF
Ω
VGS=0V, VDS=25V, f=1MHz
GS=0V, VDS=0V, f=1MHz
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
130
10
164
13
200
16
5
V
2.5
3.3
SWITCHING PARAMETERS
Qg
Qgs
Qgd
tD(on)
tr
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
40.5
8.7
17.9
39
50
11
nC
nC
nC
ns
ns
ns
ns
VGS=10V, VDS=480V, ID=12A
22
50
VGS=10V, VDS=300V, ID=12A,
70
85
RG=25Ω
tD(off)
tf
122
74
150
90
trr
IF=12A,dI/dt=100A/µs,VDS=100V
IF=12A,dI/dt=100A/µs,VDS=100V
311
5.2
373
6.2
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
ns
Qrr
µC
A: The value of R θJA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation
limit for cases where additional heatsinking is used.
C: Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C.
D. The R θJA is the sum of the thermal impedence from junction to case R θJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedence which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of TJ(MAX)=150°C.
G. L=60mH, IAS=5.5A, VDD=50V, RG=25Ω, Starting TJ=25°C
Rev 0. July 2008
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT12N60 / AOTF12N60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
30
100
10V
-55°C
VDS=40V
125°C
25
20
15
10
5
6.5V
10
1
6V
25°C
VGS=5.5V
0
0.1
0
5
10
15
20
25
30
2
4
6
8
10
VDS (Volts)
V
GS(Volts)
Fig 1: On-Region Characteristics
Figure 2: Transfer Characteristics
1.0
0.8
0.6
0.4
0.2
2.5
VGS=10V
ID=6A
2
1.5
1
VGS=10V
0.5
0
0
5
10
15
20
25
-100
-50
0
50
100
150
200
ID (A)
Temperature (°C)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage
Figure 4: On-Resistance vs. Junction Temperature
1.2
1.1
1
1.0E+02
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
125°C
25°C
0.9
0.8
0.2
0.4
0.6
VSD (Volts)
Figure 6: Body-Diode Characteristics
0.8
1.0
-100
-50
0
50
100
150
200
TJ (oC)
Figure 5: Break Down vs. Junction Temperature
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT12N60 / AOTF12N60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
15
12
9
10000
1000
100
VDS=480V
ID=12A
Ciss
Coss
6
Crss
3
0
10
0
10
20
30
40
50
60
0.1
1
10
100
Q
g (nC)
VDS (Volts)
Figure 7: Gate-Charge Characteristics
Figure 8: Capacitance Characteristics
100
100
10
1
10µs
10µs
RDS(ON)
limited
RDS(ON)
limited
10
1
100µs
100µs
1ms
1ms
10ms
0.1s
1s
10ms
0.1s
DC
DC
0.1
0.01
0.1
10s
TJ(Max)=150°C
TC=25°C
TJ(Max)=150°C
TC=25°C
0.01
1
10
100
1000
1
10
100
1000
VDS (Volts)
VDS (Volts)
Figure 9: Maximum Forward Biased Safe
Operating Area for AOT12N60 (Note F)
Figure 10: Maximum Forward Biased Safe
Operating Area for AOTF12N60 (Note F)
14
12
10
8
50
6
4
2
0
0
25
50
75
100
125
150
TCASE (°C)
Figure 11: Current De-rating (Note B)
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT12N60 / AOTF12N60
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
10
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TA+PDM.ZθJC.RθJC
RθJC=0.45°C/W
1
0.1
PD
0.01
Ton
T
Single Pulse
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance for AOT12N60 (Note F)
10
1
D=Ton/T
In descending order
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
TJ,PK=TA+PDM.ZθJC.RθJC
RθJC=2.5°C/W
0.1
PD
0.01
Ton
T
Single Pulse
0.0010.01
0.001
0.00001
0.0001
0.1
1
10
100
Pulse Width (s)
Figure 13: Normalized Maximum Transient Thermal Impedance for AOTF12N60 (Note F)
50
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
AOT12N60 / AOTF12N60
Gate Charge Test Circuit & Waveform
Vgs
Qg
10V
+
VDC
+
Qgs
Qgd
Vds
VDC
-
-
DUT
Vgs
Ig
Charge
Resistive Switching TestCircuit& Waveforms
RL
Vds
Vds
90%
10%
+
DUT
Vdd
Vgs
VDC
Rg
-
Vgs
Vgs
t d(on)
t
r
t d(off)
t
f
t on
toff
Unclamped Inductive Switching (UIS) Test Circuit & Waveforms
L
2
EAR= 1/2 LI
AR
BVDSS
Vds
Id
Vds
+
Vgs
Vdd
IAR
Vgs
VDC
Id
Rg
-
DUT
Vgs
Vgs
Diode RecoveryTest Circuit & Waveforms
Qrr = - Idt
Vds +
Vds -
Ig
DUT
Vgs
Isd
trr
L
IF
Isd
dI/dt
+
IRM
Vdd
Vgs
VDC
Vdd
-
Vds
Alpha & Omega Semiconductor, Ltd.
www.aosmd.com
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