MPX5100_08 [FREESCALE]
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated; 集成硅压力传感器片上信号调节，温度补偿和校准
| 型号： | MPX5100_08 |
| 厂家： | 
Freescale |
| 描述： | Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated |
| 文件： | 总16页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MPX5100
Rev 11, 4/2008
Freescale Semiconductor
Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated, and
Calibrated
The MPX5100 series piezoresistive transducer is a state-of-the-art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly
those employing a microcontroller or microprocessor with A/D inputs. This
patented, single element transducer combines advanced micromachining
techniques, thin-film metallization, and bipolar processing to provide an accurate,
high level analog output signal that is proportional to the applied pressure.
MPX5100/MPXV5100
SERIES
INTEGRATED PRESSURE SENSOR
0 to 100 kpa (0 to 14.5 psi)
15 to 115 kPa
(2.2 to 16.7 psi)
0.2 to 4.7 V Output
SMALL OUTLINE PACKAGES
Features
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Patented Silicon Shear Stress Strain Gauge
Available in Absolute, Differential and Gauge Configurations
Durable Epoxy Unibody Element
MPXV5100GC6U
CASE 482A-01
MPXV5100GC7U
CASE 482C-03
Easy-to-Use Chip Carrier Option
Typical Applications
MPXV5100GP
CASE 1369-01
MPXV5100DP
CASE 1351-01
•
•
•
•
Patient Monitoring
Process Control
Pump/Motor Control
Pressure Switching
PIN NUMBER(1)
1
2
N/C
VS
5
6
N/C
N/C
ORDERING INFORMATION
3
4
GND
VOUT
7
8
N/C
N/C
Device
Type
UNIBODY PACKAGE (MPX5100 SERIES)
Case MPX SeriesOrder
Options
Device Marking
No.
Number
1. Pins 1, 5, 6, 7, and 8 are internal device
connections. Do not connect to external
circuitry or ground. Pin1 is noted by the
notch in the lead.
Basic
Elements
Absolute
867
867
MPX5100A
MPX5100D
MPX5100A
MPX5100D
MPX5100DP
MPX5100AP
MPX5100GP
MPX5100D
Differential
PIN NUMBER(1)
VOUT
Ported
Elements
Differential Dual Ports
Absolute, Single Port
Gauge, Single Port
Gauge, Axial PC Mount
Gauge, Axial Port, SMT
Gauge, Axial Port, DIP
Gauge, Dual Port, SMT
Gauge, Side Port, SMT
867C MPX5100DP
867B MPX5100AP
867B MPX5100GP
867F MPX5100GSX
1
4
N/C
2
3
GND
VS
5
6
N/C
N/C
1. Pins 4, 5, and 6 are internal device
482A MPXV5100GC6U MPXV5100G
482C MPX5V100GC7U MPXV5100G
connections. Do not connect to external
circuitry or ground. Pin 1 is noted by the
notch in the lead.
1351 MPXV5100DP
1369 MPXV5100GP
MPXV5100
MPXV5100G
UNIBODY PACKAGES
MPX5100A/D
CASE 867-08
MPX5100GSX
CASE 867F-03
MPX5100DP
CASE 867C-05
MPX5100AP/GP
CASE 867B-04
© Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
VS
Thin Film
Temperature
Compensation
and Gain
Gain Stage # 2
and Ground
Reference
Sensing
Element
VOUT
Shift Circuitry
Stage # 1
Pins 1 and 5 through 8 are NO CONNECTS for small outline packages
Pins 4, 5, and 6 are NO CONNECTS for unibody packages
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
TABLE 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Storage Temperature
PMAX
400
kPa
TSTG
TA
-40° to +125°C
-40° to +125°C
°C
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
TABLE 2. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
Figure 4 required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
kPa
0
15
—
—
100
115
Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G
Absolute: MPX5100A
Supply Voltage(2)
Supply Current
VS
IO
4.75
—
5.0
7.0
5.25
10
VDC
mAdc
VDC
Minimum Pressure Offset(3)
@ VS = 5.0 V
(0 to 85°C)
VOFF
0.088
0.20
0.313
Full Scale Output(4)
@ VS = 5.0 V
Differential and Absolute (0 to 85°C)
Differential and Absolute (0 to 85°C)
VFSO
VFSS
—
4.587
—
4.700
4.500
—
4.813
—
VDC
Full Scale Span(5)
@ VS = 5.0 V
VDC
Accuracy(6)
Sensitivity
—
±2.5
%VFSS
V/P
tR
—
—
45
—
—
mV/kPa
ms
Response Time(7)
1.0
Output Source Current at Full Scale Output
IO+
—
—
—
—
0.1
20
—
—
—
mAdc
ms
Warm-Up Time(8)
Offset Stability(9)
—
±0.5
%VFSS
1. 1 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range.
3. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
• TcSpan:
• TcOffset:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied over the temperature range of 0° to 85°C, relative to 25°C.
• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C.
MPX5100
Sensors
2
Freescale Semiconductor
7. Response Time is defined as the time for the incremental changed in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
8. Warm-Up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
Figure 2 shows the sensor output signal relative to
pressure input. Typical, minimum, and maximum output
curves are shown for operation over a temperature range of
0× to 85×C using the decoupling circuit shown in Figure 4.
The output will saturate outside of the specified pressure
range.
Figure 3 illustrates both the Differential/Gauge and the
Absolute Sensing Chip in the basic chip carrier (Case 867). A
fluorosilicone gel isolates the die surface and wire bonds from
the environment, while allowing the pressure signal to be
transmitted to the sensor diaphragm.
The MPX5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Contact the factory for
information regarding media compatibility in your application.
5
4
V
= V *(0.009*P+0.04)
S
out
± (Pressure Error * Temperature Factor * 0.009 * V
S
V
= 5.0 V ± 0.25 Vdc
S
PE = 2.5
TM = 1
TEMP = 0 to 85°C
3
2
1
0
MAX
TYP
MIN
Pressure (kPa)
(Typ)
Offset
Figure 2. Output Vs. Pressure Differential
Stainless Steel
Fluorosilicone Gel
Stainless Steel
Fluorosilicone
Metal Cover
Die Coat
Gel Die Coat
Die
Metal Cover
Die
Epoxy Plastic
Case
Epoxy Plastic
Wire Bond
Wire Bond
Case
Die Bond
Die Bond
Lead Frame
Lead Frame
Differential/Gauge Element
Absolute Element
Figure 3. Cross Sectional Diagrams (Not to Scale)
Figure 4 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
+5.0 V
VOUT
OUTPUT
Vs
IPS
GND
1.0 μF
0.01 μF
470 pF
Figure 4. Recommended Power Supply Decoupling and Output Filtering
(For additional output filtering, please refer to Application Note AN1646.)
MPX5100
Sensors
Freescale Semiconductor
3
Transfer Function (MPX5100D, MPX5100G, MPXV5100G
Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.04)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ±5% P kPa
Temperature Error Multiplier
MPX5100D/MPX5100G/MPXV5100G Series
Break Points
Temp
Multiplier
4.0
- 40
0 to 85°C
+125°
3
1
3
3.0
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
MPX5100D/MPX5100G/MPXV5100G Series
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure in kPa
0
20
40
60
80
100
120
-1.0
-2.0
-3.0
Pressure
0 to 100 kPa
Error (max)
± 2.5 kPa
MPX5100
Sensors
Freescale Semiconductor
4
Transfer Function (MPX5100A)
Nominal Transfer Value: VOUT = VS (P x 0.009 + 0.095)
± (Pressure Error x Temp. Mult. x 0.009 x VS)
VS = 5.0 V ±5% P kPa
Temperature Error Multiplier
Series
MPX5100A
Break Points
Temp
Multiplier
4.0
- 40
0 to 85°C
+125°
3
1
3
3.0
2.0
1.0
0.0
-40
-20
0
20
40
60
80
100
120
130
140
Temperature in °C
Note: The Temperature Multiplier is a linear response from 0° to -40°C and from 85° to 125°C.
Pressure Error Band
Series
MPX5100A
Error Limits for Pressure
3.0
2.0
1.0
0.0
Pressure in kPa
0
20
40
60
80
100
130
-1.0
-2.0
-3.0
Pressure
15 to 115 kPa
Error (max)
± 2.5 kPa
MPX5100
Sensors
Freescale Semiconductor
5
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor sensor is designed to operate with positive differential
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluoro silicone gel
which protects the die from harsh media. The MPX pressure
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using Table 3
below.
TABLE 3. PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Part Number
Case Type
867
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX5100A, MPX5100D
MPX5100DP
867C
867B
867F
Side with Part Marking
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Port Attached
Side with Part Marking
Side with Port Attached
MPX5100AP, MPX5100GP
MPX5100GSX
MPXV5100GC6U
MPXV5100GC7U
MPXV5100DP
482A
482C
1351
MPXV5100GP
1369
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
Figure 5. Small Outline Package Footprint
MPX5100
Sensors
6
Freescale Semiconductor
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
1
M
S
S
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
T
B
5
8
N
-B-
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
G
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
D
G
H
J
K
M
N
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
S
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
W
2.54 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0.05
0.23
1.55
0˚
0.25
0.28
1.80
7˚
V
0˚
7˚
C
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
11.28
18.01
6.22
2.92
11.38
18.41
6.48
3.17
S
V
W
H
J
-T-
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
-A-
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
N
-B-
D 8 PL
G
M
S
S
A
INCHES
MILLIMETERS
8
0.25 (0.010)
T B
1
DIM MIN MAX MIN
MAX
10.79
10.79
13.21
0.864
A
B
C
D
G
J
K
M
N
S
0.415
0.425 10.54
0.425 10.54
0.520 12.70
DETAIL X
0.415
0.500
0.026
S
W
0.034
0.66
0.100 BSC
2.54 BSC
0.009
0.100
0˚
0.011
0.120
15˚
0.23
2.54
0˚
0.28
3.05
15˚
V
PIN 1
IDENTIFIER
0.444
0.540
0.245
0.115
0.448 11.28
0.560 13.72
11.38
14.22
6.48
3.17
C
V
W
0.255
0.125
6.22
2.92
SEATING
PLANE
-T-
K
M
J
DETAIL X
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
R
POSITIVE PRESSURE
(P1)
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
M
B
-A-
INCHES
DIM MIN MAX MIN
MILLIMETERS
N
L
MAX
16.00
13.56
5.59
A
B
C
D
F
0.595
0.630 15.11
0.534 13.06
PIN 1
1
2
3
4
5
6
0.514
0.200
0.027
0.048
SEATING
PLANE
-T-
0.220
0.033
0.064
5.08
0.68
1.22
0.84
1.63
G
J
S
G
J
L
M
N
R
S
0.100 BSC
2.54 BSC
F
0.014
0.695
0.016 0.36
0.725 17.65
0.40
18.42
D 6 PL
0.136 (0.005)
30˚ NOM
30˚ NOM
M
M
T A
0.475
0.430
0.090
0.495 12.07
0.450 10.92
12.57
11.43
2.66
0.105
2.29
STYLE 1:
PIN 1. VOUT
2. GROUND
STYLE 2:
PIN 1. OPEN
2. GROUND
STYLE 3:
PIN 1. OPEN
2. GROUND
3. VCC
4. V1
5. V2
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. VEX
6. OPEN
CASE 867-08
ISSUE N
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
8
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 867B-04
ISSUE G
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
10
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
P
0.25 (0.010)
2. CONTROLLING DIMENSION: INCH.
-A-
U
W
M
M
T Q
INCHES
DIM MIN MAX
MILLIMETERS
MIN
29.08
17.40
10.29
0.68
MAX
29.85
18.16
11.05
0.84
X
A
B
C
D
F
1.145
0.685
0.405
0.027
0.048
1.175
0.715
0.435
0.033
0.064
L
V
R
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2 VACUUM (P2)
1.22
1.63
PORT #1 POSITIVE
PRESSURE (P1)
G
J
K
L
N
P
Q
R
S
U
V
W
X
0.100 BSC
2.54 BSC
N
0.014
0.695
0.290
0.420
0.153
0.153
0.063
0.220
0.016
0.725
0.300
0.440
0.159
0.159
0.083
0.240
0.36
17.65
7.37
10.67
3.89
3.89
1.60
5.59
0.41
18.42
7.62
11.18
4.04
4.04
2.11
6.10
-Q-
PORT #2
VACUUM
(P2)
B
PIN 1
0.910 BSC
23.11 BSC
K
1
2
3
4
5
6
0.182
0.310
0.248
0.194
0.330
0.278
4.62
7.87
6.30
4.93
8.38
7.06
C
S
SEATING
PLANE
SEATING
PLANE
-T-
-T-
6 PL
D
STYLE 1:
PIN 1. VOUT
2. GROUND
G
J
M
M
0.13 (0.005)
A
F
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
UNIBODY PACKAGE
-T-
NOTES:
C
A
U
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
E
-Q-
INCHES
MILLIMETERS
DIM MIN MAX
MIN
27.43
18.80
16.00
0.68
MAX
28.45
19.30
16.51
0.84
A
B
C
D
E
F
1.080 1.120
0.740 0.760
0.630 0.650
0.027 0.033
0.160 0.180
0.048 0.064
0.100 BSC
N
S
V
4.06
1.22
4.57
1.63
B
G
J
2.54 BSC
R
0.014 0.016
0.220 0.240
0.070 0.080
0.150 0.160
0.150 0.160
0.440 0.460
0.695 0.725
0.840 0.860
0.182 0.194
0.36
5.59
0.41
6.10
PIN 1
PORT #1
POSITIVE
PRESSURE
(P1)
K
N
P
Q
R
S
U
V
1.78
3.81
2.03
4.06
-P-
6
5
4
3
2
1
M
M
T Q
0.25 (0.010)
3.81
4.06
11.18
17.65
21.34
4.62
11.68
18.42
21.84
4.93
K
6 PL
J
D
G
STYLE 1:
PIN 1. VOUT
M
S
S
0.13 (0.005)
T P
Q
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
F
CASE 867F-03
ISSUE D
UNIBODY PACKAGE
MPX5100
Sensors
Freescale Semiconductor
11
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
12
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
13
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
14
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX5100
Sensors
Freescale Semiconductor
15
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MPX5100
Rev. 11
04/2008
相关型号：
MPX5100_10
Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
FREESCALE
MPX5500
INTEGRATED SILICON PRESSURE SENSOR ON CHIP SIGNAL CONDITIONED TEMPERATURE COMPENSATED AND CALIBRATED
MOTOROLA
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