AUIRFR1010ZTRL [INFINEON]

Advanced Process Technology; 先进的工艺技术
AUIRFR1010ZTRL
型号: AUIRFR1010ZTRL
厂家: Infineon    Infineon
描述:

Advanced Process Technology
先进的工艺技术

晶体 晶体管 功率场效应晶体管 开关 脉冲
文件: 总13页 (文件大小:247K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD - 97683  
AUTOMOTIVE GRADE  
AUIRFR1010Z  
HEXFET® Power MOSFET  
Features  
D
VDSS  
55V  
Advanced Process Technology  
LowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
RDS(on) typ.  
5.8m  
7.5m  
91A  
42A  
Ω
Ω
max.  
ID (Silicon Limited)  
ID (Package Limited)  
G
S
Automotive Qualified *  
Description  
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low  
on-resistance per silicon area. Additional features  
of this design are a 175°C junction operating  
temperature, fast switching speed and improved  
repetitive avalanche rating . These features com-  
bine to make this design an extremely efficient and  
reliable device for use in Automotive applications  
and a wide variety of other applications.  
D
S
G
D-Pak  
AUIRFR1010Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
91  
Units  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
I
I
I
I
@ T = 25°C  
C
D
D
D
@ T = 100°C  
C
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
65  
A
@ T = 25°C  
C
42  
360  
140  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.9  
± 20  
W/°C  
V
V
GS  
Single Pulse Avalanche Energy (Thermally limited)  
EAS  
110  
220  
mJ  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
EAS (tested )  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
300  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.11  
40  
Units  
Junction-to-Case  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)  
Junction-to-Ambient  
°C/W  
110  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/16/11  
AUIRFR1010Z  
Static Electrical @ TJ = 25°C (unless otherwise specified)  
Symbol  
V(BR)DSS  
Parameter  
Drain-to-Source Breakdown Voltage  
Min. Typ. Max. Units  
55 ––– –––  
Conditions  
VGS = 0V, ID = 250μA  
V
Δ
Δ
V(BR)DSS/ TJ  
Breakdown Voltage Temp. Coefficient ––– 0.051 ––– V/°C Reference to 25°C, ID = 1mA  
Ω
m
RDS(on)  
VGS(th)  
Static Drain-to-Source On-Resistance  
Gate Threshold Voltage  
–––  
2.0  
5.8  
–––  
–––  
–––  
–––  
–––  
7.5  
4.0  
–––  
20  
VGS = 10V, ID = 42A  
VDS = VGS, ID = 100μA  
VDS = 25V, ID = 42A  
V
gfs  
IDSS  
Forward Transconductance  
31  
S
Drain-to-Source Leakage Current  
–––  
–––  
–––  
–––  
μA  
V
DS = 55V, VGS = 0V  
250  
200  
VDS = 55V, VGS = 0V, TJ = 125°C  
IGSS  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
nA VGS = 20V  
VGS = -20V  
––– -200  
Dynamic Electrical @ TJ = 25°C (unless otherwise specified)  
Symbol  
Parameter  
Total Gate Charge  
Min. Typ. Max. Units  
Conditions  
Qg  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
63  
17  
23  
17  
76  
42  
48  
4.5  
95  
ID = 42A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
–––  
–––  
–––  
–––  
–––  
–––  
–––  
nC  
V
V
DS = 44V  
GS = 10V  
VDD = 28V  
ID = 42A  
td(off)  
tf  
Ω
Turn-Off Delay Time  
Fall Time  
ns RG = 7.6  
VGS = 10V  
LD  
Internal Drain Inductance  
Between lead,  
D
S
nH 6mm (0.25in.)  
from package  
G
LS  
Internal Source Inductance  
–––  
7.5  
–––  
and center of die contact  
Ciss  
Input Capacitance  
––– 2840 –––  
VGS = 0V  
Coss  
Output Capacitance  
–––  
–––  
470  
250  
–––  
–––  
VDS = 25V  
Crss  
Reverse Transfer Capacitance  
Output Capacitance  
pF ƒ = 1.0MHz  
Coss  
––– 1630 –––  
VGS = 0V, VDS = 1.0V, ƒ = 1.0MHz  
VGS = 0V, VDS = 44V, ƒ = 1.0MHz  
VGS = 0V, VDS = 0V to 44V  
Coss  
Output Capacitance  
–––  
–––  
360  
560  
–––  
–––  
Coss eff.  
Effective Output Capacitance  
Diode Characteristics  
Symbol  
Parameter  
Min. Typ. Max. Units  
Conditions  
I
I
Continuous Source Current  
–––  
–––  
42  
MOSFET symbol  
S
(Body Diode)  
Pulsed Source Current  
A
showing the  
integral reverse  
–––  
–––  
360  
SM  
(Body Diode)  
p-n junction diode.  
V
t
Diode Forward Voltage  
–––  
–––  
–––  
–––  
24  
1.3  
36  
30  
V
T = 25°C, I = 42A, V = 0V  
SD  
J
S
GS  
Reverse Recovery Time  
Reverse Recovery Charge  
Forward Turn-On Time  
ns T = 25°C, I = 42A, VDD = 28V  
J F  
rr  
di/dt = 100A/μs  
Q
t
20  
nC  
rr  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  
on  
Notes:  
Limited by TJmax , see Fig.12a, 12b, 15, 16 for typical  
repetitive avalanche performance.  
 Repetitive rating; pulse width limited by  
max. junction temperature. (See fig. 11).  
‚ Limited by TJmax, starting TJ = 25°C, L = 0.13mH  
RG = 25Ω, IAS = 42A, VGS =10V. Part not  
† This value determined from sample failure population.  
100% tested to this value in production.  
recommended for use above this value.  
‡ When mounted on 1" square PCB (FR-4 or G-10 Material) .  
For recommended footprint and soldering techniques refer to  
application note #AN-994  
ƒ Pulse width 1.0ms; duty cycle 2%.  
„ Coss eff. is a fixed capacitance that gives the same  
charging time as Coss while VDS is rising from  
ˆ Rθ is measured at TJ approximately 90°C  
0 to 80% VDSS  
.
2
www.irf.com  
AUIRFR1010Z  
Qualification Information†  
Automotive  
††  
(per AEC-Q101)  
Qualification Level  
Comments: This part number(s) passed Automotive qualification.  
IR’s Industrial and Consumer qualification level is granted by  
extension of the higher Automotive level.  
Moisture Sensitivity Level  
D-PAK  
MSL1  
Class M4 (+/- 700V)†††  
Machine Model  
AEC-Q101-002  
Class H1C (+/- 1500V)†††  
Human Body Model  
ESD  
AEC-Q101-001  
Class C5 (+/- 2000V)†††  
AEC-Q101-005  
Charged Device  
Model  
Yes  
RoHS Compliant  
†
Qualification standards can be found at International Rectifier’s web site: http//www.irf.com/  
†† Exceptions to AEC-Q101 requirements are noted in the qualification report.  
††† Highest passing voltage.  
www.irf.com  
3
AUIRFR1010Z  
1000  
100  
10  
1000  
VGS  
15V  
VGS  
15V  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
TOP  
TOP  
10V  
8.0V  
7.0V  
6.0V  
5.5V  
5.0V  
4.5V  
100  
10  
1
BOTTOM  
BOTTOM  
4.5V  
60μs PULSE WIDTH  
60μs PULSE WIDTH  
4.5V  
1
Tj = 175°C  
Tj = 25°C  
1
0.1  
1
10  
100  
0.1  
10  
100  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
1000  
120  
T
= 25°C  
J
100  
80  
60  
40  
20  
0
100  
10  
1
T
= 175°C  
J
T
= 175°C  
J
T
= 25°C  
V
J
V
= 10V  
= 25V  
DS  
380μs PULSE WIDTH  
DS  
60μs PULSE WIDTH  
0.1  
2
4
6
8
10  
0
20  
40  
60  
80  
100  
I ,Drain-to-Source Current (A)  
D
V
, Gate-to-Source Voltage (V)  
GS  
Fig 3. Typical Transfer Characteristics  
Fig 4. Typical Forward Transconductance  
vs. Drain Current  
4
www.irf.com  
AUIRFR1010Z  
20  
16  
12  
8
5000  
4000  
3000  
2000  
1000  
0
V
C
= 0V,  
f = 1 MHZ  
I = 42A  
GS  
D
= C + C , C SHORTED  
iss  
gs  
gd ds  
V
= 44V  
DS  
C
= C  
rss  
gd  
VDS= 28V  
VDS= 11V  
C
= C + C  
ds  
oss  
gd  
C
iss  
4
C
C
oss  
rss  
0
0
20  
40  
60  
80  
100  
1
10  
100  
Q
Total Gate Charge (nC)  
G
V
, Drain-to-Source Voltage (V)  
DS  
Fig 6. Typical Gate Charge vs.  
Fig 5. Typical Capacitance vs.  
Gate-to-SourceVoltage  
Drain-to-SourceVoltage  
1000.00  
100.00  
10.00  
1.00  
10000  
1000  
100  
10  
OPERATION IN THIS AREA  
LIMITED BY R  
(on)  
DS  
T
= 175°C  
J
100μsec  
1msec  
10msec  
T
= 25°C  
1
J
Tc = 25°C  
Tj = 175°C  
Single Pulse  
V
= 0V  
DC  
GS  
0.1  
0.10  
1
10  
, Drain-toSource Voltage (V)  
100  
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
, Source-to-Drain Voltage (V)  
V
V
DS  
SD  
Fig 8. Maximum Safe Operating Area  
Fig 7. Typical Source-Drain Diode  
nce  
Forward Voltage  
www.irf.com  
5
AUIRFR1010Z  
100  
2.5  
2.0  
1.5  
1.0  
0.5  
I
= 42A  
LIMITED BY PACKAGE  
D
V
= 10V  
GS  
80  
60  
40  
20  
0
25  
50  
75  
100  
125  
150  
175  
-60 -40 -20  
0
20 40 60 80 100 120 140 160 180  
T
, Case Temperature (°C)  
C
T
, Junction Temperature (°C)  
J
Fig 10. Normalized On-Resistance  
Fig 9. Maximum Drain Current vs.  
vs.Temperature  
CaseTemperature  
10  
1
0.1  
D = 0.50  
0.20  
0.10  
0.05  
R1  
R2  
R2  
R3  
R3  
Ri (°C/W) τi (sec)  
R1  
τ
J τJ  
τ
τ
Cτ  
0.3854  
0.3138  
0.4102  
0.000251  
τ
1τ1  
τ
0.02  
0.01  
2τ2  
3τ3  
0.001092  
0.015307  
0.01  
0.001  
Ci= τi/Ri  
/
Notes:  
1. Duty Factor D = t1/t2  
2. Peak Tj = P dm x Zthjc + Tc  
SINGLE PULSE  
( THERMAL RESPONSE )  
1E-006  
1E-005  
0.0001  
0.001  
0.01  
0.1  
t
, Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case  
6
www.irf.com  
AUIRFR1010Z  
15V  
500  
400  
300  
200  
100  
0
I
D
TOP  
7.6A  
11A  
42A  
DRIVER  
+
L
V
DS  
BOTTOM  
D.U.T  
AS  
R
G
V
DD  
-
I
A
V
20V  
GS  
Ω
0.01  
t
p
Fig 12a. Unclamped Inductive Test Circuit  
V
(BR)DSS  
t
p
25  
50  
75  
100  
125  
150  
175  
Starting T , Junction Temperature (°C)  
J
I
AS  
Fig 12c. Maximum Avalanche Energy  
Fig 12b. Unclamped Inductive Waveforms  
vs. Drain Current  
Q
G
10 V  
Q
Q
GD  
GS  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
V
G
I
I
I
= 1.0mA  
= 250μA  
= 100μA  
D
D
D
Charge  
Fig 13a. Basic Gate Charge Waveform  
L
VCC  
DUT  
-75 -50 -25  
0
J
25 50 75 100 125 150 175  
, Temperature ( °C )  
0
T
1K  
Fig 14. Threshold Voltage vs. Temperature  
Fig 13b. Gate Charge Test Circuit  
www.irf.com  
7
AUIRFR1010Z  
1000  
Duty Cycle = Single Pulse  
100  
Allowed avalanche Current vs  
avalanche pulsewidth, tav  
assuming ΔTj = 25°C due to  
avalanche losses  
0.01  
0.05  
10  
0.10  
1
0.1  
1.0E-06  
1.0E-05  
1.0E-04  
1.0E-03  
1.0E-02  
1.0E-01  
tav (sec)  
Fig 15. Typical Avalanche Current vs.Pulsewidth  
120  
Notes on Repetitive Avalanche Curves , Figures 15, 16:  
(For further info, see AN-1005 at www.irf.com)  
1. Avalanche failures assumption:  
Purely a thermal phenomenon and failure occurs at a  
temperature far in excess of Tjmax. This is validated for  
every part type.  
2. Safe operation in Avalanche is allowed as long asTjmax is  
not exceeded.  
3. Equation below based on circuit and waveforms shown in  
Figures 12a, 12b.  
4. PD (ave) = Average power dissipation per single  
avalanche pulse.  
5. BV = Rated breakdown voltage (1.3 factor accounts for  
voltage increase during avalanche).  
6. Iav = Allowable avalanche current.  
TOP  
BOTTOM 1% Duty Cycle  
= 42A  
Single Pulse  
100  
80  
60  
40  
20  
0
I
D
7. ΔT = Allowable rise in junction temperature, not to exceed  
Tjmax (assumed as 25°C in Figure 15, 16).  
tav = Average time in avalanche.  
175  
25  
50  
75  
100  
125  
150  
D = Duty cycle in avalanche = tav ·f  
ZthJC(D, tav) = Transient thermal resistance, see figure 11)  
Starting T , Junction Temperature (°C)  
J
PD (ave) = 1/2 ( 1.3·BV·Iav) = DT/ ZthJC  
Iav = 2DT/ [1.3·BV·Zth]  
EAS (AR) = PD (ave)·tav  
Fig 16. Maximum Avalanche Energy  
vs.Temperature  
8
www.irf.com  
AUIRFR1010Z  
Driver Gate Drive  
P.W.  
P.W.  
Period  
D.U.T  
Period  
D =  
+
*
=10V  
V
GS  
ƒ
CircuitLayoutConsiderations  
Low Stray Inductance  
Ground Plane  
Low Leakage Inductance  
Current Transformer  
-
D.U.T. I Waveform  
SD  
+
‚
-
Reverse  
Recovery  
Current  
Body Diode Forward  
„
Current  
di/dt  
-
+
D.U.T. V Waveform  
DS  
Diode Recovery  
dv/dt  

V
DD  
VDD  
Re-Applied  
Voltage  
dv/dtcontrolledbyRG  
RG  
+
-
Body Diode  
Forward Drop  
Driver same type as D.U.T.  
ISD controlled by Duty Factor "D"  
D.U.T. - Device Under Test  
Inductor Curent  
I
SD  
Ripple 5%  
* VGS = 5V for Logic Level Devices  
Fig 17. Peak Diode Recovery dv/dt Test Circuit for N-Channel  
HEXFET® Power MOSFETs  
RD  
VDS  
VGS  
D.U.T.  
RG  
+VDD  
-
10V  
PulseWidth ≤ 1 µs  
Duty Factor≤ 0.1 %  
Fig 18a. Switching Time Test Circuit  
V
DS  
90%  
10%  
V
GS  
t
t
r
t
t
f
d(on)  
d(off)  
Fig 18b. Switching Time Waveforms  
www.irf.com  
9
AUIRFR1010Z  
D-Pak (TO-252AA) Package Outline  
Dimensions are shown in millimeters (inches)  
D-Pak (TO-252AA) Part Marking Information  
PartNumber  
AUFR1010Z  
DateCode  
Y= Year  
WW= Work Week  
A=Automotive,LeadFree  
IRLogo  
YWWA  
XX or XX  
LotCode  
Note: For the most current drawing please refer to IR website at: http://www.irf.com/package/  
10  
www.irf.com  
AUIRFR1010Z  
D-Pak (TO-252AA) Tape & Reel Information  
Dimensions are shown in millimeters (inches)  
TR  
TRL  
TRR  
16.3 ( .641 )  
15.7 ( .619 )  
16.3 ( .641 )  
15.7 ( .619 )  
12.1 ( .476 )  
11.9 ( .469 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED DIRECTION  
FEED DIRECTION  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES ).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
13 INCH  
16 mm  
NOTES :  
1. OUTLINE CONFORMS TO EIA-481.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
www.irf.com  
11  
AUIRFR1010Z  
Ordering Information  
Base part number Package Type  
Standard Pack  
Form  
Complete Part Number  
Quantity  
75  
2000  
3000  
3000  
AUIRFR1010Z  
Dpak  
Tube  
AUIRFR1010Z  
AUIRFR1010ZTR  
AUIRFR1010ZTRL  
AUIRFR1010ZTRR  
Tape and Reel  
Tape and Reel Left  
Tape and Reel Right  
12  
www.irf.com  
AUIRFR1010Z  
IMPORTANTNOTICE  
Unless specifically designated for the automotive market, International Rectifier Corporation and its  
subsidiaries (IR) reserve the right to make corrections, modifications, enhancements, improvements, and  
other changes to its products and services at any time and to discontinue any product or services without  
notice. Part numbers designated with the “AU” prefix follow automotive industry and / or customer specific  
requirements with regards to product discontinuance and process change notification. All products are sold  
subject to IR’s terms and conditions of sale supplied at the time of order acknowledgment.  
IR warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with IR’s standard warranty. Testing and other quality control techniques are used to the extent  
IR deems necessary to support this warranty. Except where mandated by government requirements, testing  
of all parameters of each product is not necessarily performed.  
IR assumes no liability for applications assistance or customer product design. Customers are responsible  
for their products and applications using IR components. To minimize the risks with customer products and  
applications, customers should provide adequate design and operating safeguards.  
Reproduction of IR information in IR data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Repro-  
duction of this information with alterations is an unfair and deceptive business practice. IR is not responsible  
or liable for such altered documentation. Information of third parties may be subject to additional restrictions.  
Resale of IR products or serviced with statements different from or beyond the parameters stated by IR for  
that product or service voids all express and any implied warranties for the associated IR product or service  
and is an unfair and deceptive business practice. IR is not responsible or liable for any such statements.  
IR products are not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or in other applications intended to support or sustain life, or in any other  
application in which the failure of the IR product could create a situation where personal injury or death may  
occur. Should Buyer purchase or use IR products for any such unintended or unauthorized application, Buyer  
shall indemnify and hold International Rectifier and its officers, employees, subsidiaries, affiliates, and  
distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended  
or unauthorized use, even if such claim alleges that IR was negligent regarding the design or manufacture  
of the product.  
Only products certified as military grade by the Defense Logistics Agency (DLA) of the US Department of  
Defense, are designed and manufactured to meet DLA military specifications required by certain military,  
aerospace or other applications. Buyers acknowledge and agree that any use of IR products not certified  
by DLA as military-grade, in applications requiring military grade products, is solely at the Buyer’s own risk  
and that they are solely responsible for compliance with all legal and regulatory requirements in connection  
with such use.  
IR products are neither designed nor intended for use in automotive applications or environments unless  
the specific IR products are designated by IR as compliant with ISO/TS 16949 requirements and bear a part  
number including the designation “AU”. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, IR will not be responsible for any failure to meet such requirements.  
For technical support, please contact IR’s Technical Assistance Center  
http://www.irf.com/technical-info/  
WORLDHEADQUARTERS:  
101 N. Sepulveda Blvd., El Segundo, California 90245  
Tel: (310) 252-7105  
www.irf.com  
13  

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