CYBLE-022001-00 [INFINEON]
Infineon’s AIROC™ CYBLE-022001-00 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSoC™ 4 MCU with AIROC™ Bluetooth® LE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.1, helping cutdown the additional time needed for design, development and certification. It is available in 10 x 10 x 1.80 mm SMT form-factor, with a Chip antenna and is certified to FCC, ISED, MIC, and CE regulations.;
| 型号： | CYBLE-022001-00 |
| 厂家： | 
Infineon |
| 描述： | Infineon’s AIROC™ CYBLE-022001-00 is a fully certified Bluetooth® LE embedded module based on a proven hardware design and Infineon’s PSoC™ 4 MCU with AIROC™ Bluetooth® LE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.1, helping cutdown the additional time needed for design, development and certification. It is available in 10 x 10 x 1.80 mm SMT form-factor, with a Chip antenna and is certified to FCC, ISED, MIC, and CE regulations. |
| 文件： | 总49页 (文件大小：813K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CYBLE-022001-00
AIROC™ Bluetooth® LE module
General description
The Infineon AIROC™ CYBLE-022001-00 is a fully certified and qualified module supporting Bluetooth® Low
Energy wireless communication. The CYBLE-022001-00 is a turnkey solution and includes on-board crystal oscil-
lators, chip antenna, passive components, and Infineon PSoC™ 4 Bluetooth® LE. Refer to the PSoC™ 4 Bluetooth®
LE datasheet for additional details on the capabilities of the PSoC™ 4 Bluetooth® LE device used on this module.
The CYBLE-022001-00 supports a number of peripheral functions (ADC, timers, counters, PWM) and serial
communication protocols (I2C, UART, SPI) through its programmable architecture. The CYBLE-022001-00
includes a royalty-free Bluetooth® LE stack compatible with Bluetooth® 5.1 and provides up to 16 GPIOs in a small
10 × 10 × 1.80 mm package.
The CYBLE-022001-00 is a complete solution and an ideal fit for applications requiring Bluetooth® LE wireless
connectivity.
Module description
• Module size: 10.0 mm × 10.0 mm × 1.80 mm (with shield)
• Bluetooth® 5.1 single-mode module
• Industrial temperature range: –40°C to +85°C
• 32-bit processor (0.9 DMIPS/MHz) with single-cycle 32-bit multiply, operating at up to 48 MHz
• 128-KB flash memory, 16-KB SRAM memory
• Watchdog timer with dedicated internal low-speed oscillator (ILO)
• Two-pin SWD for programming
• Up to 16 GPIOs configurable as open drain high/low, pull-up/pull-down, HI-Z analog, HI-Z digital, or strong
output
• Certified to FCC, ISED, MIC, KC, and, CE regulations
- FCC ID: WAP2001
- IC ID: 7922A-2001
- MIC ID: 005-101007
- KC ID: MSIP-CRM-Cyp-2001
• Bluetooth® SIG 5.1 qualified
- QDID: 141250
- Declaration ID: U048555
Power consumption
• TX output power: –18 dbm to +3 dbm
• Received signal strength indicator (RSSI) with 1-dB resolution
• TX current consumption of 15.6 mA (radio only, 0 dbm)
• RX current consumption of 16.4 mA (radio only)
• Low power mode support
- Deep Sleep: 1.3 µA with watch crystal oscillator (WCO) on
- Hibernate: 150 nA with SRAM retention
- Stop: 60 nA with XRES wakeup
Datasheet
www.infineon.com
Please read the Important Notice and Warnings at the end of this document
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AIROC™ Bluetooth® LE module
Functional capabilities
Functional capabilities
• Up to 15 capacitive sensors for buttons or sliders with best-in-class signal-to-noise ration (SNR) and liquid
tolerance
• 12-bit, 1-Msps SAR ADC with internal reference, sample-and-hold (S/H), and channel sequencer
• Two Serial Communication Blocks (SCBs) supporting I2C (master/slave), SPI (master/slave), or UART
• Four dedicated 16-bit timer, counter, or PWM blocks (TCPWMs)
• Programmable low voltage detect (LVD) from 1.8 V to 4.5 V
• I2S master interface
• Bluetooth® Low Energy protocol stack supporting generic access profile (GAP) Central, Peripheral, Observer, or
Broadcaster roles
• Switches between Central and Peripheral roles on-the-go
• Standard Bluetooth® Low Energy profiles and services for interoperability
• Custom profile and service for specific use cases
Benefits
The CYBLE-022001-00 module is provided as a turnkey solution, including all necessary hardware required to use
Bluetooth® LE communication standards.
• Proven, qualified, and certified hardware design ready to use
• Small footprint (10 × 10 mm × 1.80 mm), perfect for space constrained applications
• Reprogrammable architecture
• Fully certified module eliminates the time needed for design, development and certification processes
• Bluetooth® SIG qualified with QDID and Declaration ID
• Flexible communication protocol support
• PSoC™ Creator provides an easy-to-use integrated design environment (IDE) to configure, develop, program,
and test a Bluetooth® LE application
More information
Infineon provides a wealth of data at www.infineon.com to help you to select the right module for your design,
and to help you to quickly and effectively integrate the module into your design.
• Overview: AIROC™ Bluetooth® & Multiprotocol
• PSoC™ 4 BLE silicon datasheet
• Application notes: Infineon offers a number of BLE application notes covering a broad range of topics, from
basic to advanced level. Recommended application notes for getting started with AIROC™ Bluetooth® LE
modules are:
- AN96841 - Getting Started with EZ-BLE Module
- AN91267 - Getting started with PSoC™ 4 CY8C4xxx-BL MCU with AIROC™ Bluetooth® LE
- AN97060 - PSoC™ 4 BLE and PRoC™ BLE - Over-The-Air (OTA) Device Firmware Upgrade (DFU) guide
- AN91162 - Creating a BLE Custom Profile
- AN91184 - PSoC™ 4 BLE - Designing BLE Applications
- AN92584 - Designing for Low Power and Estimating Battery Life for BLE Applications
- AN85951 - PSoC™ 4 and PSoC™ 6 MCU CAPSENSE™ design guide
- AN95089 - PSoC™ 4/PRoC™ BLE Crystal Oscillator Selection and Tuning Techniques
- AN91445 - Antenna Design and RF Layout Guidelines
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AIROC™ Bluetooth® LE module
Two easy-to-use design environments to get
you started quickly
• Technical reference manual (TRM):
- PRoC™ BLE Technical reference manual
• Knowledge base articles
- KBA97279 - Pin Mapping Differences Between the EZ-BLE™ Creator Evaluation Board
(CYBLE-022001-EVAL) and the BLE Pioneer Kit (CY8CKIT-042-BLE)
- KBA97094 - RF Regulatory Certifications for EZ-BLE™
Creator Module
- KBA97095 - EZ-BLE™ Module Placement
- KBA213976 - FAQ for BLE and Regulatory Certifications with EZ-BLE modules
- KBA210802 - Queries on BLE Qualification and Declaration Processes
- KBA218122 - 3D Model Files for EZ-BLE/EZ-BT Modules
• Development kits:
- CYBLE-022001-EVAL, CYBLE-022001-00 Evaluation Board
- CY8CKIT-042-BLE, Bluetooth® Low Energy Pioneer Kit
- CY8CKIT-002, PSoC™ MiniProg3 Program and Debug Kit
• Test and debug tools:
- CYSmart, AIROC™ Bluetooth® Connect App — Bluetooth® LE Test and Debug Tool
- CYSmart Mobile, AIROC™ Bluetooth® Connect App— Mobile App
Two easy-to-use design environments to get you started quickly
1. PSoC™ Creator Integrated Design Environment (IDE)
PSoC™ Creator is an Integrated Design Environment (IDE) that enables concurrent hardware and firmware
editing, compiling and debugging of PSoC™ 3, PSoC™ 4, PSoC™ 5LP, PSoC™ 4 Bluetooth® LE, and AIROC™
Bluetooth® LE module systems with no code size limitations. PSoC™ peripherals are designed using schematic
capture and simple graphical user interface (GUI) with over 120 pre-verified, production-ready PSoC™
Components.
PSoC™ Components are analog and digital “virtual chips,” represented by an icon that users can drag-and-drop
into a design and configure to suit a broad array of application requirements.
2. PSoC™ Creator Component Datasheet - Bluetooth Low Energy (BLE)
The PSoC™ Creator Component Datasheet - Bluetooth Low Energy (BLE)provides a comprehensive GUI-based
configuration window that lets you quickly design Bluetooth® LE applications. The Component incorporates a
Bluetooth® Core Specification v5.1 compliant Bluetooth® LE protocol stack and provides API functions to enable
user applications to interface with the underlying Bluetooth® Low Energy Sub-System (BLESS) hardware via the
stack.
AIROC™ Bluetooth® & Bluetooth® LE module firmware platform
The AIROC™ Bluetooth® & Bluetooth® LE module firmware platform provides a simple way to access the most
common hardware and communication features needed in Bluetooth® LE applications. AIROC™ Bluetooth® &
Bluetooth® LE module firmware implements an intuitive API protocol over the UART interface and exposes
various status and control signals through the module’s GPIOs, making it easy to add Bluetooth® LE functionality
quickly to existing designs.
Use a simple serial terminal and evaluation kit to begin development without requiring an IDE. Refer to the
AIROC™ Bluetooth® & Bluetooth® LE module firmware webpage for User Manuals and instructions for getting
started as well as detailed reference materials.
AIROC™ Bluetooth® LE modules are pre-flashed with the AIROC™ Bluetooth® & Bluetooth® LE module firmware
platform. If you do not have AIROC™ Bluetooth® & Bluetooth® LE module firmware pre-loaded on your module,
you can download each AIROC™ Bluetooth® LE module’s firmware images on the AIROC™ Bluetooth® &
Bluetooth® LE module firmware webpage.
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AIROC™ Bluetooth® LE module
Technical support
Technical support
• Frequently asked questions (FAQs): Learn more about our Bluetooth® LE ECO System.
• Forum: See if your question is already answered by fellow developers on the PSoC™ 4 Bluetooth® LE forum.
• Visit our support page and create a technical support case or contact a local sales representatives. If you are
in the United States, you can talk to our technical support team by calling our toll-free number: +1-800-541-4736.
Select option 2 at the prompt.
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Table of contents
Table of contents
General description ...........................................................................................................................1
Module description............................................................................................................................1
Power consumption...........................................................................................................................1
Functional capabilities.......................................................................................................................2
Benefits............................................................................................................................................2
More information ..............................................................................................................................2
Two easy-to-use design environments to get you started quickly...........................................................3
PSoC™ Creator™ Integrated Design Environment (IDE)..........................................................................3
Bluetooth® Low Energy component.....................................................................................................3
EZ-Serial™ BLE firmware platform ......................................................................................................3
Technical support..............................................................................................................................3
Table of contents...............................................................................................................................5
1 Overview .......................................................................................................................................7
1.1 Module description.................................................................................................................................................7
2 Pad connection interface.................................................................................................................9
3 Recommended host PCB layout......................................................................................................10
4 Digital and analog capabilities and connections ..............................................................................13
5 Power supply connections and recommended external components.................................................14
5.1 Power connections ...............................................................................................................................................14
5.2 Connection options ..............................................................................................................................................14
5.3 External component recommendation ...............................................................................................................15
5.4 Critical components list........................................................................................................................................17
5.5 Antenna design .....................................................................................................................................................17
6 Electrical specification ..................................................................................................................18
6.1 GPIO.......................................................................................................................................................................21
6.2 XRES.......................................................................................................................................................................23
6.2.1 Temperature sensor ..........................................................................................................................................23
6.2.2 SAR ADC..............................................................................................................................................................23
6.2.3 CSD .....................................................................................................................................................................25
6.3 Digital peripherals.................................................................................................................................................25
6.3.1 Timer...................................................................................................................................................................25
6.3.2 Counter...............................................................................................................................................................26
6.3.3 Pulse Width Modulation (PWM).........................................................................................................................27
6.3.4 LCD direct drive..................................................................................................................................................27
6.4 Serial communication ..........................................................................................................................................28
6.5 Memory..................................................................................................................................................................28
6.6 System resources..................................................................................................................................................29
6.6.1 Power-On-Reset (POR) ......................................................................................................................................29
6.6.2 ............................................................................................................................................................................29
6.6.3 Voltage monitors (LVD) .....................................................................................................................................30
6.6.4 SWD Interface ....................................................................................................................................................30
6.6.5 Internal Main Oscillator .....................................................................................................................................31
6.6.6 Internal Low-Speed Oscillator .........................................................................................................................31
6.6.7 Bluetooth® LE subsystem ..................................................................................................................................31
7 Environmental specifications ........................................................................................................35
7.1 Environmental compliance ..................................................................................................................................35
7.2 RF certification......................................................................................................................................................35
7.3 Safety certification................................................................................................................................................35
7.4 Environmental conditions....................................................................................................................................35
7.5 ESD and EMI protection........................................................................................................................................35
8 Regulatory information.................................................................................................................36
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AIROC™ Bluetooth® LE module
Table of contents
8.1 FCC.........................................................................................................................................................................36
8.2 ISED........................................................................................................................................................................37
8.3 European R&TTE declaration of conformity........................................................................................................38
8.4 MIC Japan..............................................................................................................................................................38
8.5 KC Korea ................................................................................................................................................................38
9 Packaging ....................................................................................................................................39
10 Ordering information ..................................................................................................................41
10.1 Part numbering convention ...............................................................................................................................41
11 Acronyms ...................................................................................................................................42
12 Document conventions................................................................................................................43
12.1 Units of measure .................................................................................................................................................43
Revision history ..............................................................................................................................44
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AIROC™ Bluetooth® LE module
Overview
1
Overview
1.1
Module description
The CYBLE-022001-00 module is a complete module designed to be soldered to the applications main board.
Module dimensions and drawing:
Infineon reserves the right to select components (including the appropriate Bluetooth® LE device) from various
vendors to achieve the Bluetooth® LE module functionality. Such selections will still guarantee that all height
restrictions of the component area are maintained. Designs should be held within the physical dimensions shown
in the mechanical drawings in Figure 1. All dimensions are in millimeters (mm).
Table 1
Module design dimensions
Dimension item
Specification
Length (X) 10.00 ± 0.15 mm
Width (Y) 10.00 ± 0.15 mm
Length (X) 7.00 ± 0.15 mm
Width (Y) 5.00 ± 0.15 mm
Height (H) 0.50 ± 0.10 mm
Height (H) 1.10 ± 0.10 mm
Height (H) 1.30-mm typical (chip antenna)
Module dimensions
Antenna location dimensions
PCB thickness
Shield height
Maximum component height
Total module thickness (bottom of module to highest
component)
Height (H) 1.80-mm typical
See Figure 1 for the mechanical reference drawing for CYBLE-022001-00.
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AIROC™ Bluetooth® LE module
Overview
Top View (See from Top)
Side View
Bottom View (Seen from Bottom)
Figure 1
Note
Module mechanical drawing
1. No metal should be located beneath or above the antenna area. Only bare PCB material should be located
beneath the antenna area. For more information on recommended host PCB layout, see “Recommended
host PCB layout” on page 10.
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AIROC™ Bluetooth® LE module
Pad connection interface
2
Pad connection interface
As shown in the bottom view of Figure 1, the CYBLE-022001-00 connects to the host board via solder pads on the
back of the module. Table 2 and Figure 2 detail the solder pad length, width, and pitch dimensions of the
CYBLE-022001-00 module.
Table 2
Name
SP
Solder pad connection description
Pad length
dimension
0.71 mm
Pad width di-
mension
Connections Connection type
Pad pitch
21
Solder Pads
0.41 mm
0.76 mm
Figure 2
Solder pad dimensions (seen from bottom)
To maximize RF performance, the host layout should follow these recommendations:
3. The ideal placement of the Infineon Bluetooth® LE module is in a corner of the host board with the chip antenna
located at the far corner. This placement minimizes the additional recommended keep out area stated in item
2. Refer to AN96841 for module placement best practices.
4. To maximize RF performance, the area immediately around the Infineon Bluetooth® LE module chip antenna
should contain an additional keep out area, where no grounding or signal traces are contained. The keep out
area applies to all layers of the host board. The recommended dimensions of the host PCB keep out area are
shown in Figure 4 (dimensions are in mm).
Host PCB Keep Out Area Around Chip Antenna
Figure 3
Recommended host PCB keep out area around the CYBLE-022001-00 chip antenna
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AIROC™ Bluetooth® LE module
Recommended host PCB layout
3
Recommended host PCB layout
Figure 4, Figure 5, Figure 6, and Table 3 provide details that can be used for the recommended host PCB layout
pattern for the CYBLE-022001-00. Dimensions are in millimeters unless otherwise noted. Pad length of 0.91 mm
(0.455 mm from center of the pad on either side) shown in Figure 6 is the minimum recommended host pad
length. The host PCB layout pattern can be completed using either Figure 4, Figure 5, or Figure 6. It is not
necessary to use all figures to complete the host PCB layout pattern.
Top view (seen on host PCB)
Figure 4
Host layout pattern for CYBLE-022001-00
Top view (seen on host PCB)
Figure 5
Module pad location from origin
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AIROC™ Bluetooth® LE module
Recommended host PCB layout
Table 3 provides the center location for each solder pad on the CYBLE-022001-00. All dimensions are referenced
to the center of the solder pad. Refer to Figure 6 for the location of each module solder pad.
Table 3
Module solder pad location
Solder pad
Location (X,Y) from orign (mm)
Dimension from orign (mils)
(Center of pad)
1
2
3
4
5
6
7
8
(0.26, 1.64)
(0.26, 2.41)
(0.26, 3.17)
(0.26, 3.93)
(0.26, 4.69)
(0.81, 9.74)
(1.57, 9.74)
(2.34, 9.74)
(3.10, 9.74)
(3.86, 9.74)
(4.62, 9.74)
(5.38, 9.74)
(6.15, 9.74)
(6.91, 9.74)
(7.67, 9.74)
(8.43, 9.74)
(9.19, 9.74)
(9.75, 8.50)
(9.75, 7.74)
(9.75, 6.98)
(9.75, 6.22)
(10.24, 64.57)
(10.24, 94.88)
(10.24, 124.80)
(10.24, 154.72)
(10.24, 184.65)
(31.89, 383.46)
(61.81, 383.46)
(92.13, 383.46)
(122.05, 383.46)
(151.97, 383.46)
(181.89, 383.46)
(211.81, 383.46)
(242.13, 383.46)
(272.05, 383.46)
(301.97, 383.46)
(331.89, 383.46)
(361.81, 383.46)
(383.86, 334.65)
(383.86, 304.72)
(383.86, 274.80)
(383.86, 244.88)
9
10
11
12
13
14
15
16
17
18
19
20
21
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AIROC™ Bluetooth® LE module
Recommended host PCB layout
Top view (seen on host PCB)
Figure 6
Solder pad reference location
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AIROC™ Bluetooth® LE module
Digital and analog capabilities and connec-
tions
4
Digital and analog capabilities and connections
Table 4 details the solder pad connection definitions and available functions for each connection pad. Table 4
lists the solder pads on CYBLE-022001-00, the Bluetooth® LE device port-pin, and denotes whether the function
shown is available for each solder pad. Each connection is configurable for a single option shown with a ✓.
Table 4
Solder pad connection definitions
Solderpad Device
WCO ECO
Out Out
UART
SPI
I2C
TCPWM[2,3]
Ground Connection
✓(TCPWM0_N)
CapSense
LCD
SWD
GPIO
number
port pin
1
GND[4]
✓(Sensor/
2
3
P4.1[5]
✓(SCB1_CTS)
✓(SCB1_MISO)
✓
✓
CTANK
)
P5.1
✓(SCB1_TX)
✓(SCB1_RX)
✓(SCB1_SCLK)
✓(SCB1_SS0)
✓(SCB1_SCL)
✓(SCB1_SDA)
✓(TCPWM3_N)
✓(TCPWM3_P)
✓(Sensor)
✓(Sensor)
✓
✓
✓
✓
✓
4
5
6
P5.0
VDDR
P1.6
Radio Power Supply (1.9V to 5.5V)
✓(SCB0_RTS)
✓(SCB0_CTS)
✓(SCB0_SS0)
✓(TCPWM)
✓(Sensor)
✓
✓
✓
✓
✓
7
8
P0.7
P0.4
✓(SCB0_SCLK)
✓(TCPWM)
✓(Sensor)
(SWDCLK)
✓(SCB0_RX)
✓(SCB0_TX)
✓(SCB0_MOSI)
✓(SCB0_MISO)
✓(SCB0_SDA)
✓(SCB0_SCL)
✓(TCPWM)
✓(TCPWM)
✓(Sensor)
✓(Sensor)
✓
✓
✓
✓
✓
9
P0.5
GND
10
Ground Connection
✓
11
P0.6
✓(SCB0_RTS)
✓(SCB0_CTS)
✓(SCB0_SS0)
✓(TCPWM)
✓(Sensor)
✓(Sensor)
✓
✓
✓
✓
(SWDIO)
12
P1.7
✓(SCB0_SCLK)
✓(TCPWM)
13
14
VDD
Digital Power Supply Input (1.71 to 5.5V)
External Reset Hardware Connection Input
XRES
15
16
17
18
19
20
21
P3.5
P3.4
✓(SCB1_TX)
✓(SCB1_RX)
✓(SCB1_CTS)
✓(SCB0_RX)
✓(SCB0_TX)
✓(SCB1_RTS)
✓(SCB1_RTS)
✓(SCB1_SCL)
✓(SCB1_SDA)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM)
✓(TCPWM0_P)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓(Sensor)
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
P3.7
✓
P1.4
✓(SCB0_MOSI)
✓(SCB0_MISO)
✓(SCB0_SDA)
✓(SCB0_SCL)
P1.5
P3.6
P4.0[6]
✓(SCB1_MOSI)
✓(CMOD)
Notes
2. TCPWM stands for timer, counter, and PWM. If supported, the pad can be configured to any of these peripheral functions.
3. TCPWM connections on ports 0, 1, 2, and 3 can be routed through the Digital Signal Interconnect (DSI) to any of the TCPWM blocks and can be either
positive or negative polarity. TCPWM connections on ports 4 and 5 are direct and can only be used with the specified TCPWM block and polarity
specified above.
4. The main board needs to connect both GND connections (Pad 1 and Pad 10) on the module to the common ground of the system.
5. When using the capacitive sensing functionality, Pad 2 (P4.1) can be connected to a CTANK capacitor (located off of Infineon Bluetooth® LE Module).
C
Tank should be used if implementing a shield layer on the capacitive sensor. If used, this capacitor should be placed as close to the module as possible.
6. When using the capacitive sensing functionality, Pad 21 (P4.0) must be connected to a CMOD capacitor (located off of Infineon Bluetooth® LE Module).
The value of this capacitor is 2.2 nF and should be placed as close to the module as possible.
7. If the I2S feature is used in the design, the I2S pins shall be dynamically routed to the appropriate available GPIO by PSoC™ Creator
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Power supply connections and recommended
external components
5
Power supply connections and recommended external
components
5.1
Power connections
The CYBLE-022001-00 contains two power supply connections, VDD and VDDR. The VDD connection supplies
power for both digital and analog device operation. The VDDR connection supplies power for the device radio.
VDD accepts a supply range of 1.71 V to 5.5 V. VDDR accepts a supply range of 1.9 V to 5.5 V. These specifications
can be found in Table 9. The maximum power supply ripple for both power connections on the module is 100 mV,
as shown in Table 7.
The power supply ramp rate of VDD must be equal to or greater than that of VDDR.
5.2
Connection options
Two connection options are available for any application:
• Single supply: Connect VDD and VDDR to the same supply.
• Independent supply: Power VDD and VDDR separately.
5.3
External component recommendation
In either connection scenario, it is recommended to place an external ferrite bead between the supply and the
module connection. The ferrite bead should be positioned as close as possible to the module pin connection.
Figure details the recommended host schematic options for a single supply scenario. The use of one or two
ferrite beads will depend on the specific application and configuration of the CYBLE-022001-00.
Figure 8 details the recommended host schematic for an independent supply scenario.
The recommended ferrite bead value is 330 , 100 MHz (Murata BLM21PG331SN1D).
Single ferrite bead
Two ferrite bead option (seen from bottom)
Figure 7
Recommended host schematic options for a Single Supply Option
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Power supply connections and recommended
external components
Independent power supply option (seen from bottom)
Figure 8
Recommended host schematic for an independent supply option
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Power supply connections and recommended
external components
The CYBLE-022001-00 schematic is shown in Figure 9.
Figure 9
CYBLE-022001-00 schematic diagram
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Power supply connections and recommended
external components
5.4
Critical components list
Table 5 details the critical components used in the CYBLE-022001-00 module.
Table 5
Critical component list
Reference designator
Component
Silicon
Description
68-pin WLCSP PSoC™ 4 Bluetooth®
LE
U1
Crystal
Crystal
Antenna
Y1
Y2
E1
24.000 MHz, 10PF
32.768 kHz, 12.5PF
2.4–2.5 GHz chip antenna
5.5
Antenna design
Table 6 details the chip antenna used in the CYBLE-022001-00 module. The specifications listed are according to
the vendor’s datasheet. The Infineon module performance improves many of these characteristics. For more
information, see Table 6.
Table 6
Item
Chip antenna specifications
Description
Chip antenna manufacturer
Chip antenna part number
Frequency range
Peak gain
Johanson Technology Inc.
2450AT18B100
2400–2500 MHz
0.5-dBi typical
Average gain
Return loss
–0.5-dBi typical
9.5-dB minimum
Datasheet
17
001-95662 Rev *P
2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
6
Electrical specification
Table 7 details the absolute maximum electrical characteristics for the Infineon Bluetooth® LE module.
Table 7
Parameter Description
VDDD_ABS
CYBLE-022001-00 absolute maximum ratings
Min Typ
Max Unit Details/conditions
Analog, digital, or radio supply relative to –0.5
VSS (VSSD = VSSA
–
6
Absolute maximum
Absolute maximum
3.0-V supply
)
V
VCCD_ABS
Direct digital core voltage input relative
to VSSD
–0.5
–
–
1.95
100
VDDD_RIPPLE Maximum power supply ripple for VDD
and VDDR input voltage
–
mV Ripple frequency of
100 kHz to 750 kHz
VGPIO_ABS
GPIO voltage
–0.5
–25
–
VDD
Absolute maximum
V
+0.5
IGPIO_ABS
Maximum current per GPIO
GPIO injection current: Maximum for VIH –0.5
> VDD and minimum for VIL < VSS
–
–
25
0.5
Absolute maximum
Absolute maximum
current injected per pin
IGPIO_in-
jection
LU
mA
Pin current for latch up
–200
200
–
Table 8 details the RF characteristics for the Infineon Bluetooth® LE module.
Table 8
CYBLE-022001-00 RF performance characteristics
Min Typ
Parameter Description
Max Unit Details/conditions
RFO
RXS
RF output power on ANT
Configurable via
–18
–
0
3
register settings
dBm
RF receive sensitivity on ANT
Guaranteed by design
simulation
–87
–
FR
GP
GAvg
RL
Module frequency range
Peak gain
Average gain
2400
–
0.5
–0.5
–10.5
2480 MHz
–
–
–
–
–
–
–
–
dBi
–
Return loss
–
dB
Datasheet
18
001-95662 Rev *P
2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
Table 9 through Table 46 list the module-level electrical characteristics for the CYBLE-022001-00. All specifica-
tions are valid for –40°C TA 85°C and TJ 100°C, except where noted. Specifications are valid for 1.71 V to 5.5
V, except where noted.
Table 9
CYBLE-022001-00 DC specifications
Parameter Description
Min
Typ
Max Unit Details/conditions
VDD1
VDD2
Power supply input voltage
Power supply input voltage unregulated
1.8
–
5.5
With regulator enabled
Internally unregulated
supply
1.71
1.8
1.89
V
VDDR1
VDDR2
Radio supply voltage (radio on)
Radio supply voltage (radio off)
1.9
1.71
–
–
5.5
5.5
–
–
Active Mode, VDD = 1.71 V to 5.5 V
T = 25°C,
IDD3
IDD4
IDD5
IDD6
IDD7
IDD8
IDD9
IDD10
IDD11
IDD12
Execute from flash; CPU at 3 MHz
–
–
–
–
–
–
–
–
–
–
1.7
–
–
–
–
–
–
–
–
–
–
–
VDD = 3.3 V
Execute from flash; CPU at 3 MHz
Execute from flash; CPU at 6 MHz
Execute from flash; CPU at 6 MHz
Execute from flash; CPU at 12 MHz
Execute from flash; CPU at 12 MHz
Execute from flash; CPU at 24 MHz
Execute from flash; CPU at 24 MHz
Execute from flash; CPU at 48 MHz
Execute from flash; CPU at 48 MHz
T = –40°C to 85°C
T = 25°C,
VDD = 3.3 V
T = –40°C to 85°C
T = 25°C,
VDD = 3.3 V
T = –40°C to 85°C
T = 25°C,
VDD = 3.3 V
2.5
–
mA
4
–
7.1
–
mA T = –40°C to 85°C
T = 25°C,
VDD = 3.3 V
T = –40°C to 85°C
13.4
–
Sleep Mode, VDD = 1.8 V to 5.5 V
IDD13 IMO on
Sleep Mode, VDD and VDDR = 1.9 V to 5.5 V
IDD14 ECO on
Deep-Sleep Mode, VDD = 1.8 V to 3.6 V
T = 25°C, VDD = 3.3 V,
mA
–
–
–
–
–
–
SYSCLK = 3 MHz
T = 25°C, VDD = 3.3 V,
mA
SYSCLK = 3 MHz
T = 25°C,
IDD15
IDD16
IDD17
IDD18
WDT with WCO on
WDT with WCO on
WDT with WCO on
WDT with WCO on
–
–
–
–
1.5
–
–
–
–
–
V
DD = 3.3 V
T = –40°C o 85°C
T = 25°C,
VDD = 5 V
µA
µA
–
–
T = –40°C to 85°C
Deep-Sleep Mode, VDD = 1.71 V to 1.89 V (regulator bypassed)
IDD19
IDD20
WDT with WCO on
WDT with WCO on
–
–
–
–
–
–
T = 25°C
T = –40°C to 85°C
Hibernate Mode, VDD = 1.8 V to 3.6 V
Datasheet
19
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2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
Table 9
CYBLE-022001-00 DC specifications (continued)
Parameter Description
Min
Typ
150
–
Max Unit Details/conditions
T = 25°C,
VDD = 3.3 V
IDD27
IDD28
Hibernate Mode, VDD = 3.6 V to 5.5 V
GPIO and reset active
–
–
nA
GPIO and reset active
–
–
T = –40°C to 85°C
T = 25 °C,
VDD = 5 V
T = –40°C to 85°C
IDD29
IDD30
GPIO and reset active
–
–
–
–
–
–
nA
GPIO and reset active
Stop Mode, VDD = 1.8 V to 3.6 V
T = 25°C,
IDD33
Stop-mode current (VDD
)
–
20
–
V
DD = 3.3 V
T = 25°C,
IDD34
IDD35
IDD36
Stop-mode current (VDDR
Stop-mode current (VDD
Stop-mode current (VDDR
)
)
–
–
–
40
–
–-
–
VDDR = 3.3 V
nA
nA
)
T = –40°C to 85°C
T = –40°C to 85°C,
–
–
V
DDR = 1.9 V to 3.6 V
Stop Mode, VDD = 3.6 V to 5.5 V
IDD37 Stop-mode current (VDD
T = 25°C,
VDD = 5 V
T = 25°C,
VDDR = 5 V
T = –40°C to 85°C
T = –40°C to 85°C
)
–
–
–
–
–
–
IDD38
IDD39
IDD40
Stop-mode current (VDDR
Stop-mode current (VDD
)
)
)
–
–
–
–
–
–
Stop-mode current (VDDR
Table 10
Parameter
FCPU
AC specifications
Description
CPU frequency
Min
DC
Typ
–
Max
48
Unit Details/conditions
MHz 1.71 V VDD 5.5 V
Guaranteed by
TSLEEP
Wakeup from Sleep mode
–
–
0
–
characterization
µs
TDEEPSLEEP
THIBERNATE
TSTOP
Wakeup from Deep-Sleep
mode
Wakeup from Hibernate mode
24-MHz IMO. Guaranteed by
characterization
–
25
Guaranteed by
–
–
–
–
2
2
characterization
ms
Wakeup from Stop mode
XRES wakeup
Datasheet
20
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2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
6.1
GPIO
Table 11
GPIO DC specifications
Parameter Description
Min
Typ
–
–
Max
Unit Details/conditions
Input voltage HIGH threshold 0.7 × VDD
LVTTL input, VDD < 2.7 V
–
–
–
CMOS input
–
–
[8]
VIH
0.7 × VDD
2.0
LVTTL input, VDD ≥ 2.7 V
–
0.3
CMOS input
Input voltage LOW threshold
LVTTL input, VDD < 2.7 V
–
–
–
–
× VDD
VIL
0.3× VD
–
D
V
–
LVTTL input, VDD ≥ 2.7 V
Output voltage HIGH level
Output voltage HIGH level
Output voltage LOW level
Output voltage LOW level
Output voltage LOW level
Pull-up resistor
–
–
–
–
–
–
–
5.6
5.6
0.8
–
–
0.6
0.6
0.4
8.5
8.5
VDD –0.6
DD –0.5
IOH = 4 mA at 3.3-V VDD
IOH = 1 mA at 1.8-V VDD
IOL = 8 mA at 3.3-V VDD
IOL = 4 mA at 1.8-V VDD
IOL = 3 mA at 3.3-V VDD
VOH
V
–
–
–
3.5
3.5
VOL
RPULLUP
–
–
k
RPULLDOWN Pull-down resistor
Inputleakage current (absolute
25 °C, VDD = 3.3 V
IIL
–
–
–
–
2
4
value)
nA
–
Input leakage on CTBm input
pins
IIL_CTBM
CIN
VHYSTTL
Input capacitance
Input hysteresis LVTTL
–
25
–
40
7
–
pF
–
mV VDD > 2.7 V
0.05 ×
VDD
–
VHYSCMOS
IDIODE
Input hysteresis CMOS
–
–
–
–
1
Current through protection
diode to VDD/VSS
Maximum total source or sink
chip current
–
–
–
100
200
µA
–
ITOT_GPIO
mA
Note
8. VIH must not exceed VDD + 0.2 V.
Datasheet
21
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2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
Table 12
GPIO AC specifications
Parameter Description
Min Typ
Max
12
12
60
60
Unit Details/conditions
TRISEF
Rise time in Fast-Strong mode
2
2
–
–
–
–
–
3.3-V VDDD, CLOAD = 25 pF
TFALLF
TRISES
TFALLS
FGPIOUT1
Fall time in Fast-Strong mode
Rise time in Slow-Strong mode
Fall time in Slow-Strong mode
3.3-V VDDD, CLOAD = 25 pF
3.3-V VDDD, CLOAD = 25 pF
ns
10
10
–
3.3-V VDDD, CLOAD = 25 pF
GPIO Fout; 3.3 V VDD 5.5 V
Fast-Strong mode
33
90/10%, 25-pF load, 60/40
duty cycle
FGPIOUT2
FGPIOUT3
FGPIOUT4
FGPIOIN
GPIO Fout; 1.7 VVDD 3.3 V
–
–
–
–
–
–
–
–
16.7
7
90/10%, 25-pF load, 60/40
duty cycle
90/10%, 25-pF load, 60/40
duty cycle
90/10%, 25-pF load, 60/40
duty cycle
90/10% VIO
Fast-Strong mode
GPIO Fout; 3.3 V VDD 5.5 V
Slow-Strong mode
GPIO Fout; 1.7 V VDD 3.3 V
Slow-Strong mode
GPIO input operating frequency
1.71 V VDD 5.5 V
MHz
3.5
48
Table 13
OVT GPIO DC specifications (P5_0 and P5_1 Only)
Parameter Description
Min Typ
Max
Unit Details/conditions
IIL
Input leakage (absolute value).
25°C, VDD = 0 V, VIH = 3.0 V
–
–
–
–
10
µA
VIH > VDD
VOL
Output voltage LOW level
0.4
V
IOL = 20 mA, VDD > 2.9 V
Table 14
OVT GPIO AC specifications (P5_0 and P5_1 Only)
Parameter Description
Min Typ
Max
Unit Details/conditions
TRISE_OVFS
TFALL_OVFS
TRISESS
Output rise time in Fast-Strong
1.5
1.5
10
10
–
–
–
–
–
–
–
12
25-pF load, 10%–90%,
VDD = 3.3 V
25-pF load, 10%–90%,
VDD = 3.3 V
25-pF load, 10%-90%,
VDD = 3.3 V
25-pF load, 10%-90%,
VDD = 3.3 V
90/10%, 25-pF load, 60/40
duty cycle
90/10%, 25-pF load, 60/40
duty cycle
mode
Output fall time in Fast-Strong
mode
Output rise time in Slow-Strong
mode
Output fall time in Slow-Strong
mode
GPIO FOUT; 3.3 V VDD 5.5 V
Fast-Strong mode
GPIO FOUT; 1.71 V VDD 3.3 V
Fast-Strong mode
12
60
60
24
16
ns
TFALLSS
FGPIOUT1
FGPIOUT2
MHz
–
Datasheet
22
001-95662 Rev *P
2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
6.2
XRES
Table 15
XRES DC specifications
Parameter Description
Min
Typ
Max Unit Details/conditions
VIH
Input voltage HIGH threshold
0.7 ×
VDDD
–
–
V
CMOS input
VIL
Input voltage LOW threshold
0.3 ×
VDDD
–
–
RPULLUP
CIN
VHYSXRES
IDIODE
Pull-up resistor
3.5
–
–
5.6
3
100
8.5
–
–
k
pF
mV
–
–
–
Input capacitance
Input voltage hysteresis
Current through protection diode
to VDD/VSS
–
–
100
µA
–
Table 16
XRES AC specifications
Parameter Description
Min
Typ
Max Unit Details/conditions
TRESETWIDTH Reset pulse width
1
–
–
µs
–
6.2.1
Temperature sensor
Table 17
Temperature sensor specifications
Parameter Description
Min
–5
Typ
±1
Max
5
Unit Details/conditions
°C –40 to +85°C
TSENSACC
Temperature-sensor accuracy
6.2.2
SAR ADC
Table 18
SAR ADC DC specifications
Parameter Description
A_RES Resolution
Min Typ
Max
12
Unit Details/Conditions
–
–
bits
–
A_CHNIS_S Number of channels -
single-ended
A-CHNKS_D Number of channels - differential
–
–
6
3
6 full-speed[9]
Diff inputs use neighboring
I/O[9]
–
–
A-MONO
A_GAINERR Gain error
A_OFFSET Input offset voltage
A_ISAR
A_VINS
Monotonicity
–
–
–
–
–
–
–
–
–
±0.1
2
Yes
%
With external reference
mV Measured with 1-V VREF
Current consumption
Input voltage range -
single-ended
1
mA
–
VSS
–
VDDA
–
V
A_VIND
Input voltage range - differential
Input resistance
Input capacitance
Trimmed internal reference to
SAR
VSS
–
–
–
–
–
VDDA
2.2
10
–
–
–
A_INRES
A_INCAP
VREFSAR
k
pF
–1
–
1
%
Percentage of Vbg (1.024 V)
Note
9. A maximum of six single-ended ADC Channels can be accomplished only if the AMUX Buses are not being used
for other funcitonality (e.g. CapSense). If the AMUX Buses are being used for other functionality, then the
Datasheet
23
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2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
Table 19
Parameter
A_PSRR
SAR ADC AC specifications
Description
Min
Typ
Max
Unit Details/conditions
Power-supply rejection ratio
Measured at 1-V
70
66
–
–
–
–
–
–
1
reference
–
dB
A_CMRR
A_SAMP
Common-mode rejection ratio
Sample rate
806 Ksps for Part
Numbers devices
Msps
Fsarintref
SAR operating speed without
external ref. bypass
Signal-to-noise ratio (SNR)
12-bit resolution
–
65
–
–
–
–
100
–
A_SAMP/
2
Ksps
dB
A_SNR
A_BW
FIN = 10 kHz
–
Input bandwidth without aliasing
kHz
A_INL
A_INL
A_INL
A_dnl
A_DNL
A_DNL
A_THD
Integral nonlinearity. VDD = 1.71 V to
5.5 V, 1 Msps
Integral nonlinearity. VDDD = 1.71 V to
3.6 V, 1 Msps
Integral nonlinearity. VDD = 1.71 V to
5.5 V, 500 Ksps
Differential nonlinearity. VDD = 1.71 V
to 5.5 V, 1 Msps
Differential nonlinearity. VDD = 1.71 V
to 3.6 V, 1 Msps
Differential nonlinearity. VDD = 1.71 V
to 5.5 V, 500 Ksps
VREF = 1 V to VDD
–1.7
–1.5
–1.5
–1
–
–
–
–
–
2
VREF = 1.71 V to VDD
1.7
1.7
2.2
2
VREF = 1 V to VDD
LSB
VREF = 1 V to VDD
VREF = 1.71 V to VDD
VREF = 1 V to VDD
–1
–1
–
–
–
2.2
Total harmonic distortion
–65
dB FIN = 10 kHz
Datasheet
24
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2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
6.2.3
Table 20
Parameter
VCSD
IDAC1
IDAC1
CSD
CSD block specifications
Description
Min
1.71
–1
–3
–1
Typ
–
–
–
–
Max
5.5
1
3
1
Unit Details/conditions
Voltage range of operation
DNL for 8-bit resolution
INL for 8-bit resolution
DNL for 7-bit resolution
INL for 7-bit resolution
Ratio of counts of finger to noise
V
–
–
–
–
–
LSB
IDAC2
IDAC2
SNR
–3
–
3
Capacitance range
of 9 pF to 35 pF,
0.1-pF sensitivity.
Radio is not
5
–
–
Ratio
µA
operating during
the scan
IDAC1_CRT1
IDAC1_CRT2
IDAC2_CRT1
IDAC2_CRT2
Output current of IDAC1 (8 bits) in
High range
Output current of IDAC1 (8 bits) in
Low range
Output current of IDAC2 (7 bits) in
High range
Output current of IDAC2 (7 bits) in
Low range
–
–
–
–
612
306
305
153
–
–
–
–
–
–
–
–
6.3
Digital peripherals
6.3.1
Timer
Table 21
Timer DC specifications
Parameter Description
Min
–
–
Typ
–
–
Max
42
130
535
Unit Details/conditions
ITIM1
ITIM2
ITIM3
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
µA 16-bit timer
–
–
Table 22
Timer AC specifications
Description
Operating frequency
Parameter
TTIMFREQ
Min
FCLK
Typ
–
–
–
–
–
–
–
–
Max
48
–
–
–
–
–
–
–
Unit Details/conditions
MHz
–
–
–
–
–
–
–
–
TCAPWINT
TCAPWEXT
TTIMRES
Capture pulse width (internal)
Capture pulse width (external)
Timer resolution
2 × TCLK
2 × TCLK
TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
TTENWIDINT
TTENWIDEXT
TTIMRESWINT
TTIMRESEXT
Enable pulse width (internal)
Enable pulse width (external)
Reset pulse width (internal)
Reset pulse width (external)
ns
Datasheet
25
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AIROC™ Bluetooth® LE module
Electrical specification
6.3.2
Table 23
Parameter
ICTR1
ICTR2
ICTR3
Counter
Counter DC specifications
Description
Min
–
–
Typ
–
–
Max Unit Details/conditions
42
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
130
535
µA 16-bit counter
–
–
Table 24
Counter AC specifications
Parameter Description
Min
FCLK
Typ
–
–
–
–
–
–
–
–
Max
48
–
–
–
–
–
–
–
Unit Details/conditions
TCTRFREQ
TCTRPWINT
TCTRPWEXT
TCTRES
Operating frequency
MHz
–
–
–
–
–
–
–
–
Capture pulse width (internal)
Capture pulse width (external)
Counter Resolution
2 × TCLK
2 × TCLK
TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
TCENWIDINT
Enable pulse width (internal)
ns
TCENWIDEXT Enable pulse width (external)
TCTRRESWINT Reset pulse width (internal)
TCTRRESWEXT Reset pulse width (external)
Datasheet
26
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AIROC™ Bluetooth® LE module
Electrical specification
6.3.3
Pulse Width Modulation (PWM)
Table 25
PWM DC specifications
Parameter Description
Min
–
–
Typ
–
–
Max Unit Details/conditions
42
IPWM1
IPWM2
IPWM3
Block current consumption at 3 MHz
Block current consumption at 12 MHz
Block current consumption at 48 MHz
130
535
µA 16-bit PWM
–
–
Table 26
PWM AC specifications
Description
Operating frequency
Pulse width (internal)
Pulse width (external)
Kill pulse width (internal)
Kill pulse width (external)
Enable pulse width (internal)
Enable pulse width (external)
Parameter
TPWMFREQ
TPWMPWINT
TPWMEXT
TPWMKILLINT
TPWMKILLEXT
TPWMEINT
Min
FCLK
Typ
Max
48
–
–
–
–
–
–
–
Unit Details/conditions
–
–
–
–
–
–
–
–
–
MHz
–
–
–
–
–
–
–
–
–
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
2 × TCLK
ns
TPWMENEXT
TPWMRESWINT Reset pulse width (internal)
TPWMRESWEXT Reset pulse width (external)
–
6.3.4
LCD direct drive
Table 27
Parameter
ILCDLOW
LCD direct drive DC specifications
Description
Operating current in low-power mode
Min
Typ
Max
Unit Details/conditions
16 × 4 small segment
–
17.5
–
µA
display at 50 Hz
CLCDCAP
LCD capacitance per
–
–
–
–
500
20
2
5000
pF
segment/common driver
LCDOFFSET
ILCDOP1
Long-term segment offset
LCD system operating current
VBIAS = 5 V
–
–
mV
–
32 × 4 segments.
50 Hz at 25°C
32 × 4 segments
50 Hz at 25°C
mA
ILCDOP2
LCD system operating current
–
2
–
VBIAS = 3.3 V
Table 28
Parameter
FLCD
LCD Direct Drive AC specifications
Description
LCD frame rate
Min
10
Typ
50
Max
150
Unit Details/conditions
Hz
–
Datasheet
27
001-95662 Rev *P
2023-03-30
AIROC™ Bluetooth® LE module
Electrical specification
6.4
Table 29
Serial communication
Fixed I2C DC specifications
Parameter Description
Min Typ
Max Unit Details/conditions
II2C1
II2C2
II2C3
II2C4
Block current consumption at 100 kHz
–
–
–
–
–
–
–
–
50
155
390
1.4
–
–
–
–
Block current consumption at 400 kHz
Block current consumption at 1 Mbps
I2C enabled in Deep-Sleep mode
µA
Table 30
Fixed I2C AC specifications
Parameter Description
Min
–
Typ
–
Max Unit Details/conditions
400 kHz
FI2C1
Bit rate
–
Table 31
Fixed UART DC specifications
Parameter Description
IUART1 Block current consumption at 100 kbps
IUART2
Min Typ Max Unit Details/conditions
–
–
–
–
55
312
–
–
µA
Block current consumption at 1000 kbps
Table 32
Fixed UART AC specifications
Parameter Description
Min Typ
Max Unit Details/conditions
Mbp
s
FUART
Bit rate
–
–
1
–
Table 33
Fixed SPI DC specifications
Parameter Description
Min Typ Max Unit Details/conditions
ISPI1
ISPI2
ISPI3
Block current consumption at 1 Mbps
Block current consumption at 4 Mbps
Block current consumption at 8 Mbps
–
–
–
–
–
–
360
560
600
–
–
–
µA
6.5
Memory
Table 34
Parameter
VPE
Flash DC specifications
Description
Erase and program voltage
Number of Wait states at 32–48 MHz
Min
1.71
2
Typ Max Unit Details/conditions
–
–
5.5
–
V
–
TWS48
CPU execution from
flash
TWS32
TWS16
Number of Wait states at 16–32 MHz
Number of Wait states for 0–16 MHz
1
0
–
–
–
–
CPU execution from
flash
CPU execution from
flash
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
Table 35
Flash AC specifications
Description
Row (block) write time (erase and
program)
Parameter
TROWWRITE
Min
Typ Max Unit Details/conditions
[10]
Row (block) = 128 bytes
–
–
–
–
–
–
–
–
20
13
7
[10]
TROWERASE
Row erase time
–
–
–
–
ms
[
TROWPROGRAM Row program time after erase
10]
[10]
TBULKERASE
TDEVPROG
Bulk erase time (128 KB)
Total device program time
–
35
25
–
–
[10]
secon –
ds
cycles –
–
–
FEND
FRET
Flash endurance
Flash retention. TA 55°C, 100 K P/E
cycles
100 K
20
–
years
–
FRET2
Flash retention. TA 85°C, 10 K P/E
cycles
10
–
–
6.6
System resources
6.6.1
Power-On-Reset (POR)
POR DC specifications
Description
Rising trip voltage
Falling trip voltage
Hysteresis
Table 36
Parameter
VRISEIPOR
VFALLIPOR
VIPORHYST
Min
0.80
0.75
15
Typ Max Unit Details/conditions
–
–
–
1.45
1.40
200
–
–
–
V
mV
Table 37
POR AC specifications
Description
Precision power-on reset (PPOR)
response time in Active and Sleep
modes
Parameter
TPPOR_TR
Min
–
Typ Max Unit Details/conditions
µs
–
1
–
Table 38
Brown-out detect
Description
BOD trip voltage in Active and Sleep
modes
Parameter
VFALLPPOR
Min
1.64
1.4
Typ Max Unit Details/conditions
–
–
–
–
–
–
V
VFALLDPSLP
BOD trip voltage in Deep Sleep
Table 39
Parameter
VHBRTRIP
Hibernate reset
Description
BOD trip voltage in
Hibernate
Min
1.1
Typ
–
Max
–
Unit Details/conditions
V
–
Note
10.It can take as much as 20 ms to write to flash. During this time, the device should not be reset, or flash
operations will be interrupted and cannot be relied on to have completed. Reset sources include the XRES
pin, software resets, CPU lockup states and privilege violations, improper power supply levels, and watch-
dogs. Make certain that these are not inadvertently activated.
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
6.6.2
Table 40
Parameter
VLVI1
VLVI2
VLVI3
Voltage monitors (LVD)
Voltage monitor DC specifications
Description
Min
Typ
Max
Unit Details/conditions
LVI_A/D_SEL[3:0] = 0000b 1.71
LVI_A/D_SEL[3:0] = 0001b 1.76
LVI_A/D_SEL[3:0] = 0010b 1.85
LVI_A/D_SEL[3:0] = 0011b 1.95
LVI_A/D_SEL[3:0] = 0100b 2.05
LVI_A/D_SEL[3:0] = 0101b 2.15
LVI_A/D_SEL[3:0] = 0110b 2.24
LVI_A/D_SEL[3:0] = 0111b 2.34
LVI_A/D_SEL[3:0] = 1000b 2.44
LVI_A/D_SEL[3:0] = 1001b 2.54
LVI_A/D_SEL[3:0] = 1010b 2.63
LVI_A/D_SEL[3:0] = 1011b 2.73
LVI_A/D_SEL[3:0] = 1100b 2.83
LVI_A/D_SEL[3:0] = 1101b 2.93
LVI_A/D_SEL[3:0] = 1110b 3.12
LVI_A/D_SEL[3:0] = 1111b 4.39
1.75 1.79
1.80 1.85
1.90 1.95
2.00 2.05
2.10 2.15
2.20 2.26
2.30 2.36
2.40 2.46
2.50 2.56
2.60 2.67
2.70 2.77
2.80 2.87
2.90 2.97
3.00 3.08
3.20 3.28
4.50 4.61
–
–
–
–
–
–
–
VLVI4
VLVI5
VLVI6
VLVI7
VLVI8
–
V
–
VLVI9
VLVI10
VLVI11
VLVI12
VLVI13
VLVI14
VLVI15
VLVI16
LVI_IDD
–
–
–
–
–
–
–
Block current
–
–
100
µA
–
Table 41
Parameter
TMONTRIP
Voltage monitor AC specifications
Description
Min
Typ
–
Max
1
Unit Details/conditions
µs
Voltage monitor trip time
–
–
6.6.3
Table 42
SWD interface
SWD interface specifications
Description
Parameter
F_SWDCLK1
F_SWDCLK2
Min
Typ
Max
Unit Details/conditions
3.3 V VDD 5.5 V
1.71 V VDD 3.3 V
–
–
–
–
–
–
–
–
14
7
–
–
0.5 × T
–
SWDCLK 1/3 CPU clock
MHz
frequency
T_SWDI_SETUP T = 1/f SWDCLK
T_SWDI_HOLD T = 1/f SWDCLK
T_SWDO_VALID T = 1/f SWDCLK
T_SWDO_HOLD T = 1/f SWDCLK
0.25 × T
0.25 × T
–
–
–
–
ns
–
1
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
6.6.4
Internal main oscillator
Table 43
IMO DC specifications
Parameter Description
Min
–
–
–
–
Typ
–
–
–
–
Max
1000
325
225
180
Unit Details/conditions
IIMO1
IIMO2
IIMO3
IIMO4
IIMO5
IMO operating current at 48 MHz
–
–
IMO operating current at 24 MHz
IMO operating current at 12 MHz
IMO operating current at 6 MHz
IMO operating current at 3 MHz
µA
–
–
–
–
–
150
Table 44
IMO AC specifications
Parameter Description
Min
Typ
Max
Unit Details/conditions
FIMOTOL3
Frequency variation from 3 to
48 MHz
–
–
±2
%
With API-called calibration
FIMOTOL3
IMO startup time
–
12
–
µs
–
6.6.5
Internal low-speed oscillator
Table 45
Parameter
IILO2
ILO DC specifications
Description
ILO operating current at 32 kHz
Min
–
Typ
0.3
Max
1.05
Unit Details/conditions
µA
–
Table 46
ILO AC specifications
Description
ILO startup time
Parameter
TSTARTILO1
FILOTRIM1
Min
–
15
Typ
–
32
Max
2
50
Unit Details/conditions
ms
–
–
32-kHz trimmed frequency
kHz
Table 47
Parameter
ECOTRIM
Recommended ECO trim value
Description
Value
Details/conditions
Recommended trim value that needs to be loaded
24-MHz trim value
(firmware configuration)
0x00009898 to register CY_SYS_XTAL_BLERD_BB_XO_CAP-
TRIM_REG
6.6.6
Bluetooth® LE subsystem
Table 48
Bluetooth® LE subsystem
Description
Parameter
Min
Typ
Max Unit Details/conditions
RF Receiver specification
RXS, IDLE
RX sensitivity with idle transmitter
RX sensitivity with idle transmitter
excluding Balun loss
–
–
–89
–91
–
–
–
Guaranteed by design
simulation
RX sensitivity with dirty
transmitter
RX sensitivity in high-gain mode
with idle transmitter
RF-PHY Specification
RXS, DIRTY
RXS, HIGHGAIN
PRXMAX
–
–
–87
–91
–1
–70
–
dBm (RCV-LE/CA/01/C)
–
RF-PHY Specification
(RCV-LE/CA/06/C)
Maximum input power
–10
–
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
Table 48
Bluetooth® LE subsystem (continued)
Parameter
Description
Min
Typ
Max Unit Details/conditions
Cochannel interference,
Wanted signal at –67 dBm and
Interferer at FRX
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at FRX ±1 MHz
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at FRX ±2 MHz
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at FRX ±3 MHz
RF-PHY Specification
CI1
CI2
CI3
CI4
–
9
21
15
–
dB
(RCV-LE/CA/03/C)
RF-PHY Specification
(RCV-LE/CA/03/C)
–
–
–
3
RF-PHY Specification
(RCV-LE/CA/03/C)
–29
–39
RF-PHY Specification
(RCV-LE/CA/03/C)
–
dB
Adjacent channel interference
Wanted Signal at –67 dBm and
Interferer at Image frequency
RF-PHY Specification
(RCV-LE/CA/03/C)
CI5
CI3
–
–
–20
–30
–
–
(FIMAGE
)
Adjacent channel interference
Wanted signal at –67 dBm and
Interferer at Image frequency
(FIMAGE ± 1 MHz)
RF-PHY Specification
(RCV-LE/CA/03/C)
Out-of-band blocking,
RF-PHY Specification
(RCV-LE/CA/04/C)
OBB1
OBB2
OBB3
OBB4
Wanted signal at –67 dBm and
Interferer at F = 30–2000 MHz
–30
–35
–35
–30
–27
–27
–27
–27
–
–
–
–
Out-of-band blocking,
Wanted signal at –67 dBm and
Interferer at F = 2003–2399 MHz
Out-of-band blocking,
Wanted signal at –67 dBm and
Interferer at F = 2484–2997 MHz
Out-of-band blocking,
Wanted signal a –67 dBm and
Interferer at F = 3000–12750 MHz
RF-PHY Specification
(RCV-LE/CA/04/C)
RF-PHY Specification
(RCV-LE/CA/04/C)
RF-PHY Specification
dBm (RCV-LE/CA/04/C)
Intermodulation performance
Wanted signal at –64 dBm and
1-Mbps Bluetooth® LE, third,
fourth, and fifth offset channel
RF-PHY Specification
(RCV-LE/CA/05/C)
IMD
–50
–
–
100-kHz measurement
bandwidth
Receiver spurious emission
30 MHz to 1.0 GHz
RXSE1
RXSE2
–
–
–
–
–57
–47
ETSI EN300 328 V1.8.1
1-MHz measurement
bandwidth
ETSI EN300 328 V1.8.1
Receiver spurious emission
1.0 GHz to 12.75 GHz
RF transmitter specifications
TXP, ACC
TXP, RANGE
RF power accuracy
RF power control range
–
–
±1
20
–
–
–
dB
–
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
Table 48
Bluetooth® LE subsystem (continued)
Parameter
Description
Min
Typ
Max Unit Details/conditions
Output power, 0-dB Gain setting
(PA7)
Output power, maximum power
setting (PA10)
Output power, minimum power
setting (PA1)
Average frequency deviation for
10101010 pattern
TXP, 0dBm
TXP, MAX
TXP, MIN
F2AVG
–
0
–
–
–
–
–
–
–
3
–18
–
dBm
kHz
–
RF-PHY Specification
(TRM-LE/CA/05/C)
RF-PHY Specification
(TRM-LE/CA/05/C)
RF-PHY Specification
(TRM-LE/CA/05/C)
RF-PHY Specification
(TRM-LE/CA/06/C)
RF-PHY Specification
(TRM-LE/CA/06/C)
RF-PHY Specification
(TRM-LE/CA/06/C)
185
225
0.8
–150
–50
–20
–20
–
–
Average frequency deviation for
11110000 pattern
F1AVG
250
–
275
–
EO
Eye opening = F2AVG/F1AVG
Frequency accuracy
FTX, ACC
FTX, MAXDR
FTX, INITDR
FTX, DR
IBSE1
–
150
50
Maximum frequency drift
Initial frequency drift
–
kHz
–
20
kHz/ RF-PHY Specification
50 µs (TRM-LE/CA/06/C)
Maximum drift rate
–
20
In-band spurious emission at
2-MHz offset
In-band spurious emission at
3-MHz offset
Transmitter spurious emissions
(average), <1.0 GHz
Transmitter spurious emissions
(average), >1.0 GHz
RF-PHY Specification
(TRM-LE/CA/03/C)
RF-PHY Specification
(TRM-LE/CA/03/C)
–
–20
-30
-55.5
-41.5
IBSE2
–
–
dBm
TXSE1
–
–
FCC-15.247
FCC-15.247
TXSE2
–
–
RF current specifications
IRX
Receive current in normal mode
Radio receive current in normal
mode
–
–
18.7
16.4
–
–
–
IRX_RF
Measured at VDDR
IRX, HIGHGAIN Receive current in high-gain mode
–
–
–
21.5
20
16.5
–
–
–
–
–
–
ITX, 3dBm
ITX, 0dBm
TX current at 3-dBm setting (PA10)
TX current at 0-dBm setting (PA7)
Radio TX current at 0 dBm setting
(PA7)
Radio TX current at 0 dBm
excluding Balun loss
ITX_RF, 0dBm
ITX_RF, 0dBm
–
–
15.6
14.2
–
–
Measured at VDDR
mA
Guaranteed by design
simulation
ITX,-3dBm
ITX,-6dBm
TX current at –3-dBm setting (PA4)
TX current at –6-dBm setting (PA3)
–
–
15.5
14.5
–
–
–
–
TX current at –12-dBm setting
(PA2)
TX current at –18-dBm setting
(PA1)
ITX,-12dBm
ITX,-18dBm
–
–
13.2
12.5
–
–
–
–
Datasheet
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AIROC™ Bluetooth® LE module
Electrical specification
Table 48
Bluetooth® LE subsystem (continued)
Parameter
Description
Min
Typ
Max Unit Details/conditions
TXP: 0 dBm; ±20-ppm
Iavg_1sec,
0dBm
Average current at 1-second
master and slave clock
–
17.1
–
Bluetooth® LE connection interval
accuracy.
For empty PDU exchange
µA
TXP: 0 dBm; ±20-ppm
Iavg_4sec,
0dBm
Average current at 4-second
Bluetooth® LE connection interval
master and slave clock
–
6.1
–
accuracy.
For empty PDU exchange
General RF specifications
FREQ
CHBW
DR
RF operating frequency
Channel spacing
On-air data rate
2400
–
–
–
2
1000
2482
–
–
–
–
–
MHz
kbps
Bluetooth® LE.IDLE to Bluetooth®
LE. TX transition time
Bluetooth® LE.IDLE to Bluetooth®
LE. RX transition time
IDLE2TX
IDLE2RX
–
–
120
75
140
120
–
–
µs
RSSI specifications
RSSI, ACC
RSSI, RES
RSSI, PER
RSSI accuracy
RSSI resolution
RSSI sample period
–
–
–
±5
1
6
–
–
–
–
–
–
dB
µs
Datasheet
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AIROC™ Bluetooth® LE module
Environmental specifications
7
Environmental specifications
7.1
Environmental compliance
This Infineon Bluetooth® LE module is built in compliance with the Restriction of Hazardous Substances (RoHS)
and Halogen Free (HF) directives. The Infineon module and components used to produce this module are RoHS
and HF compliant.
7.2
RF certification
The CYBLE-022001-00 module is certified under the following RF certification standards:
• FCC: WAP2001
• CE
• IC: 7922A-2001
• MIC: 005-101007
• KC: MSIP-CRM-Cyp-2001
7.3
Safety certification
The CYBLE-022001-00 module complies with the following safety regulations:
• Underwriters Laboratories, Inc. (UL): Filing E331901
• CSA
• TUV
7.4
Environmental conditions
Table 49 describes the operating and storage conditions for the Infineon Bluetooth® LE module.
Table 49
Environmental conditions for CYBLE-022001-00
Description
Minimum specification
Maximum specification
Operating temperature
Operating humidity (relative, non-condensation)
Thermal ramp rate
–40°C
5%
85°C
85%
3°C/minute
85°C
–
Storage temperature
–40°C
Storage temperature and humidity
ESD: Module integrated into system
Components[11]
–
–
85°C at 85%
15 kV Air
2.2 kV Contact
7.5
ESD and EMI protection
Exposed components require special attention to ESD and electromagnetic interference (EMI).
A grounded conductive layer inside the device enclosure is suggested for EMI and ESD performance. Any openings
in the enclosure near the module should be surrounded by a grounded conductive layer to provide ESD
protection and a low-impedance path to ground.
Device handling: Proper ESD protocol must be followed in manufacturing to ensure component reliability.
Note
11.TThis does not apply to the RF pins (ANT, XTALI, and XTALO). RF pins (ANT, XTALI, and XTALO) are tested for
500-V HBM.
Datasheet
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AIROC™ Bluetooth® LE module
Regulatory information
8
Regulatory information
8.1
FCC
FCC NOTICE:
The device CYBLE-022001-00, including the antenna 2450AT18B100 from Johanson Technology, complies with
Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC
public Notice DA00-1407.transmitter Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) This device must accept any interference received, including interference
that may cause undesired operation.
CAUTION:
The FCC requires the user to be notified that any changes or modifications made to this device that are not
expressly approved by Infineon Semiconductor may void the user's authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in
a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instructions,ê may cause harmful interference to radio communica-
tions. However, there is no guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to correct the interference by one or more of the following
measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that FCC labelling requirements are met. This includes
a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon Semiconductor
FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: WAP2001.
In any case the end product must be labeled exterior with "Contains FCC ID: WAP2001"
ANTENNA WARNING:
This device is tested with a standard SMA connector and with the antennas listed below. When integrated in the
OEMs product, these fixed antennas require installation preventing end-users from replacing them with
non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section
15.203 for unique antenna connectors and Section 15.247 for emissions.
RF EXPOSURE:
To comply with FCC RF Exposure requirements, the Original Equipment Manufacturer (OEM) must ensure to
install the approved antenna in the previous.
The preceding statement must be included as a CAUTION statement in manuals, for products operating with the
approved antennas in Table 6, to alert users on FCC RF Exposure compliance. Any notification to the end user of
installation or removal instructions about the integrated radio module is not allowed.
The radiated output power of CYBLE-022001-00 with the chip antenna mounted (FCC ID: WAP2001) is far below
the FCC radio frequency exposure limits. Nevertheless, use CYBLE-022001-00 in such a manner that minimizes
the potential for human contact during normal operation.
End users may not be provided with the module installation instructions. OEM integrators and end users must be
provided with transmitter operating conditions for satisfying RF exposure compliance.
Datasheet
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AIROC™ Bluetooth® LE module
Regulatory information
8.2
ISED
Innovation, Science and Economic Development Canada (ISED) certification
CYBLE-022001-00 is licensed to meet the regulatory requirements of Innovation, Science and Economic Devel-
opment Canada (ISED).
License: IC: 7922A-2001
Manufacturers of mobile, fixed or portable devices incorporating this module are advised to clarify any regulatory
questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on
RF exposure and compliance from www.ic.gc.ca.
This device has been designed to operate with the antennas listed in Table 6, having a maximum gain of 0.5 dBi.
Antennas not included in this list or having a gain greater than 0.5 dBi are strictly prohibited for use with this
device. The required antenna impedance is 50 ohms. The antenna used for this transmitter must not be
co-located or operating in conjunction with any other antenna or transmitter.
ISED NOTICE:
The device CYBLE-022001-00 including the antenna 2450AT18B100 from Johanson technology, complies with
Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in
RSS-GEN. Operation is subject to the following two conditions: (1) This device may not cause harmful inter-
ference, and (2) This device must accept any interference received, including interference that may cause
undesired operation.
ISED RADIATION EXPOSURE STATEMENT FOR CANADA
This device complies with Innovation, Science and Economic Development (ISED) Canada licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and
(2) this device must accept any interference, including interference that may cause undesired operation of the
device.
Cet appareil est conforme à la norme sur l'innovation, la science et le développement économique (ISED) norme
RSS exempte de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même
si le brouillage est susceptible d'en compromettre le fonctionnement.
LABELING REQUIREMENTS:
The Original Equipment Manufacturer (OEM) must ensure that ISED labelling requirements are met. This includes
a clearly visible label on the outside of the OEM enclosure specifying the appropriate Infineon Semiconductor IC
identifier for this product as well as the ISED Notice above. The IC identifier is 7922A-2001. In any case, the end
product must be labeled in its exterior with “Contains IC: 7922A-2001”
Datasheet
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AIROC™ Bluetooth® LE module
Regulatory information
8.3
European R&TTE declaration of conformity
Hereby, Infineon Semiconductor declares that the Bluetooth® module CYBLE-022001-00 complies with the
essential requirements and other relevant provisions of Directive 2014/53/EU. As a result of the conformity
assessment procedure described in Annex III of the Directive 1999/5/EC, the end-customer equipment should be
labeled as follows:
All versions of the CYBLE-022001-00 in the specified reference design can be used in the following countries:
Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary,
Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, The
Netherlands, the United Kingdom, Switzerland, and Norway.
8.4
MIC Japan
CYBLE-022001-00 is certified as a module with type certification number 005-101007. End products that integrate
CYBLE-022001-00 do not need additional MIC Japan certification for the end product.
End product can display the certification label of the embedded module.
Model Name: EZ‐BLE PRoC Module
Part Number: CYBLE‐022001‐00
Manufactured by Cypress Semiconductor.
005‐101007
8.5
KC Korea
CYBLE-022001-00 is certified for use in Korea with certificate number MSIP-CRM-Cyp-2001.
Datasheet
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AIROC™ Bluetooth® LE module
Packaging
9
Packaging
Table 50
Solder reflow peak temperature
Maximum time at peak
temperature
No. of
cycles
Module part number
Package
Maximum peak temperature
CYBLE-022001-00
21-pad SMT
260°C
30 seconds
2
Table 51
Module part number
CYBLE-022001-00
Package Moisture Sensitivity Level (MSL), IPC/JEDEC J-STD-2
Package
21-pad SMT
MSL
MSL 3
The CYBLE-022001-00 is offered in tape and reel packaging. Figure 10 details the tape dimensions used for the
CYBLE-022001-00.
Figure 10
CYBLE-022001-00 tape dimensions
Figure 11 details the orientation of the CYBLE-022001-00 in the tape as well as the direction for unreeling.
Figure 11
Component orientation in tape and unreeling direction
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AIROC™ Bluetooth® LE module
Packaging
Figure 12 details reel dimensions used for the CYBLE-022001-00.
Figure 12
Reel dimensions
The CYBLE-022001-00 is designed to be used with pick-and-place equipment in an SMT manufacturing
environment. The center-of-mass for the CYBLE-022001-00 is detailed in Figure 13.
Figure 13
CYBLE-022001-00 center of mass
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AIROC™ Bluetooth® LE module
Ordering information
10
Ordering information
Table 52 lists the CYBLE-022001-00 part number and features. Table 53 lists the reel shipment quantities for the
CYBLE-022001-00.
Table 52
Ordering information
CPU Flash
12-bit
Part number
Speed Size CapSense™ SCB TCPWM SAR
I2S
LCD Package Packing
(MHz) (KB)
48 128
ADC
1 Msps Yes
Tape and
CYBLE-022001-00
Yes
2
4
Yes
21-SMT
Reel
Table 53
Tape and reel package quantity and minimum order amount
Minimum reel quantity Maximum reel quantity Comments
Description
Ships in 500 unit reel
quantities.
Reel Quantity
500
500
Minimum Order Quantity
(MOQ)
Order Increment (OI)
500
500
–
–
–
–
The CYBLE-022001-00 is offered in tape and reel packaging. The CYBLE-022001-00 ships with a maximum of 500
units/reel.
10.1
Part numbering convention
The part numbers are of the form CYBLE-FATT##-SB where the fields are defined as follows.
—
##
—
CY BLE
F
A
T
T
S
B
Bluetooth version:
0 = BT4.1, 1 = BT 4.2, 2 = BT 5.0
Integration type:
0 = Full integration with shield, 1 = No shield
Device identification number:
Unique sequential product number for each module
Temperature range:
0 = Industrial, 1 = Extended industrial
AIROC™ Bluetooth® LE module type:
2/4 = PSoC™ 4, 3 = WICED, 4 = PSoC™ 6
Antenna type:
0 = No antenna, 1 = PCB antenna, 2 = Chip antenna
Flash size:
0 = 128kb, 2 = 256kb
Marketing code:
BLE = BLE product family
Company ID:
CY = CYPRESS (An Infineon company)
For additional information and a complete list of Infineon Semiconductor Bluetooth® LE products, contact your
local Infineon sales representative. To locate the nearest Infineon office, visit our website.
U.S. Infineon Headquarters Address
U.S. Infineon Headquarter Contact Info
Infineon website address
198 Champion Court, San Jose, CA 95134
(408) 943-2600
http://www.infineon.com
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AIROC™ Bluetooth® LE module
Acronyms
11
Acronyms
Table 54
Acronym
BLE
Acronyms used in this document
Description
Bluetooth® Low-energy
Bluetooth® SIG
CE
Bluetooth® Special Interest Group
European Conformity
CSA
Canadian Standards Association
electromagnetic interference
electrostatic discharge
EMI
ESD
FCC
GPIO
IC
Federal Communications Commission
general-purpose input/output
Industry Canada
IDE
KC
integrated design environment
Korea Certification
MIC
PCB
Ministry of Internal Affairs and Communications (Japan)
Printed circuit board
RX
receive
QDID
SMT
qualification design ID
surface-mount technology; a method for producing electronic circuitry in which the
components are placed directly onto the surface of PCBs
TCPWM
TUV
TX
timer, counter, pulse-width modulation
Germany: Technischer Überwachungs-Verein (Technical Inspection Association)
transmit
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Document conventions
12
Document conventions
12.1
Table 55
Symbol
°C
Units of measure
Unit of measures
Unit of measure
degree Celsius
kilovolt
kV
mA
mm
mV
milliamperes
millimeters
millivolt
µA
microamperes
micrometers
megahertz
gigahertz
volt
µm
MHz
GHz
V
dB
decibel
ms
µs
ns
pF
millisecond
microsecond
nanosecond
picofarad
kΩ
kiloohm
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Revision history
Revision history
Document
Date
Description of changes
revision
**
2015-02-18 Preliminary data sheet for CYBLE-022001-00 module.
Updated Overview:
Updated Module description:
Updated Module dimensions and drawing:
Updated Figure (Updated Module Pad Assignment).
Updated Recommended host PCB layout:
Updated Table 3:
Updated table caption to read as “Module Solder Pad Connection Dimensions”.
*A
2015-03-09
Updated Table 4:
Changed Pad 10 from NC to GND.
Updated Power supply connections and recommended external components:
Updated External component recommendation:
Updated Figure (Changed Pad 10 from NC to GND).
Updated Figure 8 (Changed Pad 10 from NC to GND).
Updated Figure 9 (Changed Pad 10 from NC to GND).
Updated Document Title to read as “CYBLE-022001-00, EZ-BLE™ Creator Module”.
Replaced terms “pre-certified” with “certified” and “pre-qualified” with “qualified”
respectively in all instances across the document.
Updated General description:
Updated Module description:
Updated description.
Added hyperlinks in required places.
Updated Power consumption:
*B
2015-04-01 Updated description.
Updated Functional capabilities:
Updated description.
Updated Electrical specification:
Updated Table 10:
Updated details in “Details/Conditions” column of TSTOP parameter to “XRES
wakeup”.
Updated Acronyms:
Added “QDID”.
Changed status from Preliminary to Final.
Updated General description:
Updated Module description:
Updated description.
Updated Functional capabilities:
Change number of capacitive sensors supported from 13 to 15.
Updated Power supply connections and recommended external components:
Updated Power connections:
Updated description.
*C
2015-06-23 Updated Figure 9 (To final design schematic).
Updated Electrical specification:
Update Table 9:
Changed typical value of IDD15 from 1.3 µA to 1.5 µA.
Updated Ordering information:
No change in part numbers.
Added Part numbering convention.
Added Packaging.
Updated Acronyms:
Added “SMT”.
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AIROC™ Bluetooth® LE module
Revision history
Document
Date
Description of changes
revision
Updated General description:
Updated description.
Added hyperlinks in required places.
Added More information.
Updated Overview:
Updated Module description:
Updated Module dimensions and drawing:
Updated Figure (to improve clarity and viewing).
Updated Pad connection interface:
Updated description.
Updated Figure (to improve clarity and viewing).
Updated Figure 4 (to improve clarity and viewing).
Updated Recommended host PCB layout:
Updated Figure (to improve clarity and viewing).
Added Figure (to show solder pad location from module origin).
Updated Table 3(to provide the location to the center of each solder pad from the
origin (in mm and mils)).
Added Figure (to provide the location to the center of each solder pad from the
origin (in mm and mils)).
*D
2015-12-14
Updated Electrical specification:
Updated XRES:
Added Temperature sensor.
Added SAR ADC.
Added CSD.
Updated Digital peripherals:
Added Timer.
Added Counter.
Added Pulse Width Modulation (PWM).
Added LCD direct drive.
Updated System resources:
Added Bluetooth® LE subsystem.
Updated ISED:
Updated description (Added French translation for IC Radiation Exposure Statement
for Canada in accordance with IC requirements).
Updated Packaging:
Added Table 50.
Added Table 51.
Completing Sunset Review.
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Revision history
Document
Date
Description of changes
revision
Updated General description:
Updated Module description:
Re-ordered descriptions. No change to content.
Updated Overview:
Updated Module description:
Updated Module dimensions and drawing:
Updated Figure 1 (changed orientation to match PSoC™ Creator).
Updated Pad connection interface:
Updated Figure 2 (changed orientation to match PSoC™ Creator).
Updated Figure 3 (changed orientation to match PSoC™ Creator).
Updated Recommended host PCB layout:
*E
2016-02-22 Updated Figure 4 (changed orientation to match PSoC™ Creator).
Updated Figure 5 (changed orientation to match PSoC™ Creator).
Updated Figure 6 (changed orientation to match PSoC™ Creator).
Updated Table 4 (Added additional information with respect to the functional
capabilities for each solder pad).
Updated Power supply connections and recommended external components:
Updated External component recommendation:
Updated Figure (changed orientation to match PSoC™ Creator).
Updated Figure 8 (changed orientation to match PSoC™ Creator).
Updated Figure 9 (changed orientation to match PSoC™ Creator).
Updated Packaging:
Updated Figure 13 (changed orientation to match PSoC™ Creator).
Updated More information:
Updated description.
Updated hyperlinks.
Updated Electrical specification:
Updated System resources:
Updated Internal low-speed oscillator:
Updated Table 6:
*F
2016-09-02 Updated details in “Value” column corresponding to ECOTRIM parameter.
Updated Environmental specifications:
Added Safety certification.
Updated Ordering information:
No change in part numbers.
Added Table 53 (To specify minimum and maximum reel quantities that ship for
orders of the CYBLE-022001-00 module).
Updated to new template.
Updated Two easy-to-use design environments to get you started quickly:
Added AIROC™ Bluetooth® & Bluetooth® LE module firmware platform.
Updated Recommended host PCB layout:
Updated Figure 4.
Updated Figure 5.
Updated Figure 6.
Updated Power supply connections and recommended external components:
*G
2016-11-23
Updated External component recommendation:
Updated Figure .
Updated Figure 8.
Updated Digital and analog capabilities and connections:
Updated Table 4:
Updated details under “TCPWM” column (to add TCPWM capability on Port 2 pins).
Added Note 3 and referred the same note in “TCPWM” column.
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Revision history
Document
Date
Description of changes
revision
Updated Electrical specification:
Updated SAR ADC:
Updated Table 18:
*H
2016-12-14
Added Note 9 and referred the same note in “Details/Conditions” column corre-
sponding to A_CHNIS_S and A-CHNKS_D parameters.
Completing Sunset Review.
*I
2017-04-18 Updated Cypress Logo and Copyright.
Updated Packaging:
Updated Figure 10 (Updated reel dimensions).
*J
2017-12-22
Updated Figure 12 (Updated reel dimensions).
Completing Sunset Review.
Updated Document Title to read as “CYBLE-022001-00, EZ-BLE™ Creator Module”.
Replaced “PRoC™ Module” and “PRoC Module” with “Creator Module” in all
instances across the document.
Replaced “PRoC™ BLE” and “PRoC BLE” with “PSoC™ 4 BLE” and “PSoC 4 BLE” in all
instances across the document.
Updated General description:
Updated Module description:
Updated description.
Updated More information:
Updated description.
Updated hyperlinks.
*K
2018-03-08
Updated Environmental specifications:
Updated Environmental compliance:
Updated description.
Updated Regulatory information:
Updated ISED:
Updated description.
Updated Ordering information:
No change in part numbers.
Updated Part numbering convention.
Updated Regulatory information:
Updated European R&TTE declaration of conformity:
*L
2019-07-03
Replaced 1999/5/EC with 2014/53/EU.
Updated to new template.
Updated General description:
Updated hyperlinks.
Updated description.
Updated Module description:
Updated description.
Updated hyperlinks.
Updated More information:
Updated hyperlinks.
Updated Two easy-to-use design environments to get you started quickly:
*M
2020-09-02
Updated PSoC™ Creator Integrated Design Environment (IDE):
Updated PSoC™ Creator Component Datasheet - Bluetooth Low Energy (BLE):
Updated hyperlinks.
Updated description.
Updated Regulatory information:
Added Packaging.
Updated to new template.
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AIROC™ Bluetooth® LE module
Revision history
Document
Date
Description of changes
revision
Replaced “Bluetooth® Low Energy (BLE)” with “Bluetooth® Low Energy” in all
2020-13-23 instances across the document.
Replaced “BLE” with “Bluetooth® LE” in all instances across the document.
*N
No technical updates.
*O
*P
2021-03-29
2023-03-30
Completing Sunset Review.
Removed ANATEL section.
Migrated to Infineon template.
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Please read the Important Notice and Warnings at the end of this document
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IMPORTANT NOTICE
WARNINGS
The information given in this document shall in no Due to technical requirements products may contain
Edition 2023-03-30
Published by
event be regarded as a guarantee of conditions or dangerous substances. For information on the types
characteristics (“Beschaffenheitsgarantie”).
in question please contact your nearest Infineon
Technologies office.
With respect to any examples, hints or any typical
Infineon Technologies AG
81726 Munich, Germany
values stated herein and/or any information Except as otherwise explicitly approved by Infineon
regarding the application of the product, Infineon Technologies in
a
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Technologies hereby disclaims any and all authorized
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warranties and liabilities of any kind, including Technologies, Infineon Technologies’ products may
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product or any consequences of the use thereof can
reasonably be expected to result in personal injury.
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All Rights Reserved.
In addition, any information given in this document
is subject to customer’s compliance with its
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applicable legal requirements, norms and standards
concerning customer’s products and any use of the
product of Infineon Technologies in customer’s
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product information given in this document with
respect to such application.
Document reference
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