DSL70 [INFINEON]
Silicon TVS diodes Array; 硅TVS二极管阵列
| 型号： | DSL70 |
| 厂家： | 
Infineon |
| 描述： | Silicon TVS diodes Array |
| 文件： | 总6页 (文件大小：793K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DSL70
Silicon TVS diodes Array
• ESD / transient protection of e.g. ADSL, VDSL,
ISDN, WAN, LAN, I²C Bus, Microcontroller Inputs,
Video and other high-speed data lines in telecom
applications:
IEC61000-4-2 (ESD): ± ±15 kV (Air / Contact)
IEC61000-4-4 (EFT): 4 kV / 80 A (5/50 ns)
IEC61000-4-5 (Lightning): 27 A (8/20 µs)
• Very low capacitance
• Extremly low reverse current < 5 nA
• Pb-free (RoHS compliant) package
• Qualified according AEC Q101
DSL70
4
3
2
D3
D2
D4
D1
1
Type
DSL70
Package
SOT143
Configuration
2 channel, rail to rail
Marking
E4s
Maximum Ratings at T = 25°C, unless otherwise specified
Parameter
ESD contact discharge per diode
Peak pulse current (t = 8 / 20 µs)
Symbol
V
ESD
I
Value
15
27
Unit
kV
A
1)
2)
245
W
°C
Peak pulse power (t = 8 / 20 µs)
Operating temperature range
Storage temperature
P
T
T
pk
-55...125
-65...150
1V
ESD
according to IEC61000-4-2
2I according to IEC61000-4-5
pp
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DSL70
Electrical Characteristics at T = 25°C, unless otherwise specified
A
Parameter
Symbol
Values
typ. max.
Unit
min.
Characteristics -
Reverse working voltage
Reverse current
-
-
-
-
50
5
V
nA
V
RWM
I
R
V = 50 V
R
1)
Forward clamping voltage
V
V
FC
I
= 1 A, t = 8/20 µs
-
-
-
-
1
2.5
5
1.5
3
6
PP
P
I
= 10 A, t = 8/20 µs
PP
P
I
= 24 A, t = 8/20 µs
PP
P
I
= 27 A, t = 8/20 µs
6
9
PP
P
pF
Diode capacitance
V = 0 V, f = 1 MHz, between I/0 and GND
C
T
-
-
2.5
1.25
5
2.5
R
V = 0 V, f = 1 MHz, between I/0 pins
R
1I according to IEC61000-4-5
PP
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DSL70
Power derating curve P = ƒ (T )
Forward clamping voltage V = ƒ(I )
pk
A
FC
PP
t = 8 / 20 µs
p
8
110
V
90
80
70
60
50
40
30
20
10
0
6
5
4
3
2
1
0
°C
A
0
25
50
75
100
150
0
5
10
15
20
25
35
T
I
PP
A
Diode capacitance C = ı(V )
T
R
f = 1MHz
3
I/O to GND
pF
1
0
0
V
5
10
15
20
30
V
R
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DSL70
Application example DSL70
dual channel, rail to rail configuration
Connector
Protected signal line
Protected signal line
I/O
I/O
ESD sensitive
device
Vcc
4
3
D3
The protection diode should be placed
very close to the location where the
ESD or other transients can occur to
keep loops and inductances as small
as possible. Pin 1 should be connected
directly to a ground plane on the board.
D4
D2
D1
1
2
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Package SOT143
DSL70
Package Outline
0.1
1
0.1
2.9
B
1.9
0.1 MAX.
4
3
1
2
A
0.2
0.08...0.15
+0.1
0.8
-0.05
0...8˚
+0.1
0.4
-0.05
M
M
0.2
0.25
B
A
1.7
Foot Print
0.8 1.2 0.8
1.2
0.8
0.8
Marking Layout (Example)
Manufacturer
2005, June
RF s
Date code (YM)
Pin 1
BFP181
Type code
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
0.2
4
3.15
1.15
Pin 1
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DSL70
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
2009-03-11
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