IRDC3802 [INFINEON]

USER GUIDE FOR IR3802 EVALUATION BOARD; 用户指南IR3802评估板


型号：	IRDC3802
厂家：	Infineon
描述：	USER GUIDE FOR IR3802 EVALUATION BOARD 用户指南IR3802评估板
文件：	总16页 (文件大小：1186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IRDC3802

SupIRBuck

USER GUIDE FOR IR3802 EVALUATION BOARD

DESCRIPTION

An output over-current protection function is

implemented by sensing the voltage

developed across the on-resistance of the

synchronous rectifier MOSFET for optimum

cost and performance.

The IR3802 is a synchronous buck

converter, providing a compact, high

performance and flexible solution in a

small 5mmx6mm Power QFN package.

Key features offered by the IR3802

include programmable soft-start ramp,

precision 0.6V reference voltage, thermal

protection, fixed 600kHz switching

This user guide contains the schematic and

bill of materials for the IR3802 evaluation

board. The guide describes operation and

use of the evaluation board itself. Detailed

application information for IR3802 is

available in the IR3802 data sheet.

frequency requiring

no external

component, input under-voltage lockout

for proper start-up, and pre-bias start-up.

BOARD FEATURES

• V_in= +12V (13.2V Max)

• V_out= +3.3V @ 0- 4A

• L = 3.3uH

• C_in= 1x10uF (ceramic 1206)

• C_out= 1x22uF (ceramic 0805), 1x220uF/6.3V (SP-Cap)

Rev 0.1

6/16/2008

IRDC3802

CONNECTIONS and OPERATING INSTRUCTIONS

A well regulated +12V input supply should be connected to VIN+ and VIN-. A maximum 4A load

should be connected to VOUT+ and VOUT-. The connection diagram is shown in Fig. 1 and inputs

and outputs of the board are listed in Table I.

IR3802 has two input supplies, one for biasing (Vcc) and the other as input voltage (Vin). These

inputs are connected on the board with a 330 ohm resistor (R13). Separate supplies can be applied

to these inputs. Vcc input cannot be connected unless R13 is removed. Vcc input should be a well

regulated 5V-12V supply and it would be connected to Vcc+ and Vcc-.

Table I. Connections

Connection

VIN+

Signal Name

V_in(+12V)

VIN-

Ground of V_in

Vcc+

Optional Vcc input

Ground for Optional Vcc input

Ground of V_out

Vcc-

VOUT-

VOUT+

V_out(+3.3V)

LAYOUT

The PCB is a 4-layer board. All of layers are 2 Oz. copper. The IR3802A SupIRBuck and all of

the passive components are mounted on the bottom side of the board. The Inductor, Input and

Output Bulk Capacitors are located on the top side of the board.

Power supply decoupling capacitors, the charge-pump capacitor and feedback components are

located close to IR3802A. The feedback resistors are connected to the output voltage at the point

of regulation and are located close to the SupIRBuck.

To improve efficiency, the circuit board is designed to minimize the length of the on-board power

ground current path.

Rev 0.1

6/16/2008

IRDC3802

Connection Diagram

V_cc+

V_cc-

V_out+

V_in+

V_in-

V_out-

20mm/787mil’s

Front

V_cc- V_cc+

V_out+

V_in+

V_out-

V_in-

20mm/787mil’s

Back

Fig. 1: Connection diagram of IR3802A evaluation board

Rev 0.1

6/16/2008

IRDC3802

Fig. 2: Board layout, top overlay

Single point

connection

between

AGND and

PGND.

PGND

Plain

PGND

Plain

Fig. 3: Board layout, bottom overlay (rear

view)

Rev 0.1

6/16/2008

IRDC3802

Fig. 4: Board layout, mid-layer I.

Fig. 5: Board layout, mid-layer II.

Rev 0.1

6/16/2008

IRDC3802

Rev 0.1

6/16/2008

IRDC3802

Bill of Materials

Item

Number Quantity Part Reference

Value

Description

Manufacturer

Part Number

ESDB016,Rev A ESDB016,Rev A, PCB

International Rectifier

TDK Corporation

Panasonic - ECG

Sanyo

Panasonic - ECG

Kemet

Murata

Panasonic - ECG

TDK

Panasonic

International Rectifier

ACT

Panasonic - ECG

Rohm

Vishey/Dale

Rohm

International Rectifier

ESDB016,Rev A

10uF

0.1uF

47uF

Ceramic,16V,1206,X7R,10%

Ceramic,25V,0603,X7R,10%

Poscap,16V,D2,Polomer-Aluminum

Ceramic,50V,0603,NPO,5%

Ceramic,50V,0603,C0G,10%

Ceramic,50V,0603,X7R,10%

Ceramic,10V,0603,X5R,10%

Ceramic,16V,0603,X5R,10%

Ceramic,6.3V,0805,X5R,20%

SP-Cap,4.0V,D4,Polymer-Aluminum

Diode,Schotky,40V,SOD323,200mA

SMT-Inductor,18mOhms,7.5x7.5mm,20%

Thick-film,0603,1/10W,1%

Thick-film,0603,1/10 W,1%

Thick-film,0805,1/8W,1%

C3216X7R1C106K

ECJ-1VB1E104K

16TQC47M

C2 C12 C14

22pF

ECJ-1VC1H220J

C0603C102J5GACTU

GRM188R71H821KA01D

GRM188R71H561KA01D

ECJ-1VB1A224K

ECJ-BVB1C105K

C2012X5R0J226M

EEFUE0G221XE

BAT54WS

1000pF

820pF

560pF

0.22uF

1uF

C10

C13

C15

C16

R12

R13

22uF

220uF

BAT54WS

3.3uH

36.0K

28.7K

6.34K

1.8K

8.06K

330

STS704-3R3M

ERJ-3EKF3602V

MCR03EZPFX2872

MCR03EZPFX6341

MCR03EZPFX1801

CRCW060320R0FKEA

MCR03EZPFX8061

MCR10EZPF3300

IR3802

IR3802, Controller,PQFN,5x6mm

Rev 0.1

6/16/2008

IRDC3802

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc = 6.3V, Vo=3.3V, Io=0- 4A, Room Temperature, No Air Flow

Fig. 7: Start up at 4A Load

Fig. 8: Pre-Bias Start up, 0A Load

Ch₁:V_in, Ch₂:V_SS, Ch₃:V_out

Ch₁:V_in, Ch₂:V_SS, Ch₃:V_out, Ch₄:I_out

Fig. 9: Output Voltage Ripple, 4A load

Ch₁: V_{out ,}Ch₄: I_out

Fig. 10: Inductor node at 4A load

Ch₁:LX, Ch₄:I_out

Fig. 11: Short (Hiccup) Recovery

Ch₁:V_SS, Ch₂:V_out

Rev 0.1

6/16/2008

IRDC3802

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc = 6.3V, Vo=3.3V, Io=0- 4A, Room Temperature, No Air Flow

Fig. 12: Transient Response, 2A to 4A step

Ch₁:V_out, Ch₄:I_out

Rev 0.1

6/16/2008

IRDC3802

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc = 6.3V, Vo=3.3V, Io=0- 4A, Room Temperature, No Air Flow

Fig. 13: Bode Plot at 4A load shows a bandwidth of 32+kHz and phase margin of

52+degrees

Rev 0.1

6/16/2008

IRDC3802

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc = 6.3V, Vo=3.3V, Io=0- 4A, Room Temperature, No Air Flow

Efficiency for IR3802 at 12.0Vin, 3.3Vout and R13

= 330

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

Iout (A)

Fig.14: Efficiency versus load current

Power Loss for IR3802 at 12.0Vin, 3.3Vout, and

R13 = 330

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

Iout (A)

Fig.15: Power loss versus load

current

Rev 0.1

6/16/2008

IRDC3802

TYPICAL OPERATING WAVEFORMS

Vin=12.0V, Vcc = 6.3V, Vo=3.3V, Io=0- 4A, Room Temperature, No Air Flow

Fig. 16: Thermal Image at 4A load at 50.4^oC

Test point (square) 1 is IR3802

Rev 0.1

6/16/2008

IRDC3802

PCB Metal and Components Placement

The lead lands (the 11 IC pins) width should be equal to the nominal part lead width. The

minimum lead to lead spacing should be ≥ 0.2mm to minimize shorting.

Lead land length should be equal to the maximum part lead length + 0.3 mm outboard

extension. The outboard extension ensures a large and inspectable toe fillet.

The pad lands (the 4 big pads other than the 11 IC pins) length and width should be equal to

maximum part pad length and width. However, the minimum metal to metal spacing should be

no less than 0.17mm for 2 oz. Copper; no less than 0.1mm for 1 oz. Copper and no less than

0.23mm for 3 oz. Copper.

Rev 0.1

6/16/2008

IRDC3802

Solder Resist

It is recommended that the lead lands are Non Solder Mask Defined (NSMD). The solder

resist should be pulled away from the metal lead lands by a minimum of 0.025mm to

ensure NSMD pads.

The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder

resist onto the copper of 0.05mm to accommodate solder resist mis-alignment.

Ensure that the solder resist in between the lead lands and the pad land is ≥ 0.15mm due

to the high aspect ratio of the solder resist strip separating the lead lands from the pad

land.

Rev 0.1

6/16/2008

IRDC3802

Stencil Design

•

The Stencil apertures for the lead lands should be approximately 80% of the area

of the lead lads. Reducing the amount of solder deposited will minimize the

occurrences of lead shorts. If too much solder is deposited on the center pad the

part will float and the lead lands will be open.

•

The maximum length and width of the land pad stencil aperture should be equal to

the solder resist opening minus an annular 0.2mm pull back to decrease the

incidence of shorting the center land to the lead lands when the part is pushed into

the solder paste.

Rev 0.1

6/16/2008

IRDC3802

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105

TAC Fax: (310) 252-7903

This product has been designed and qualified for the Consumer market.

Visit us at www.irf.com for sales contact information

Data and specifications subject to change without notice. 11/07

Rev 0.1

6/16/2008

IRDC3802 [INFINEON]

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