IRF7313TRPBF-1 [INFINEON]

Power Field-Effect Transistor;
IRF7313TRPBF-1
型号: IRF7313TRPBF-1
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor

文件: 总7页 (文件大小:204K)
中文:  中文翻译
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IRF7313PbF-1  
HEXFET® Power MOSFET  
VDS  
30  
0.029  
22  
V
Ω
1
2
3
4
8
S1  
G1  
D1  
RDS(on) max  
(@VGS = 10V)  
Qg (typical)  
7
D1  
6
S2  
D2  
nC  
A
5
G2  
D2  
ID  
6.5  
SO-8  
(@TA = 25°C)  
Top View  
Features  
Industry-standard pinout SO-8 Package  
Compatible with Existing Surface Mount Techniques  
RoHS Compliant, Halogen-Free  
Benefits  
Multi-Vendor Compatibility  
Easier Manufacturing  
Environmentally Friendlier  
Increased Reliability  
MSL1, Industrial qualification  
Standard Pack  
Form  
Tube/Bulk  
Base Part Number  
Package Type  
Orderable Part Number  
Quantity  
95  
4000  
IRF7313PbF-1  
IRF7313TRPbF-1  
IRF7313PbF-1  
SO-8  
Tape and Reel  
Absolute Maximum Ratings ( TA = 25°C Unless Otherwise Noted)  
Symbol  
VDS  
VGS  
Maximum  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
30  
± 20  
6.5  
V
TA = 25°C  
TA = 70°C  
Continuous Drain Current  
ID  
5.2  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)  
IDM  
IS  
30  
2.5  
TA = 25°C  
TA = 70°C  
2.0  
1.3  
Maximum Power Dissipation ꢀ  
PD  
W
Single Pulse Avalanche Energy ‚  
Avalanche Current  
EAS  
IAR  
82  
mJ  
A
4.0  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Junction and Storage Temperature Range  
EAR  
0.20  
5.8  
mJ  
V/ ns  
°C  
dv/dt  
TJ,TSTG  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Symbol  
Limit  
Units  
Maximum Junction-to-Ambientꢀ  
RθJA  
62.5  
°C/W  
1
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November 14, 2013  
IRF7313PbF-1  
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)  
Parameter  
Min. Typ. Max. Units  
Conditions  
V(BR)DSS  
Drain-to-Source Breakdown Voltage  
30 ––– –––  
V
VGS = 0V, ID = 250µA  
ΔV(BR)DSS/ΔTJ Breakdown Voltage Temp. Coefficient  
––– 0.022 ––– V/°C Reference to 25°C, ID = 1mA  
––– 0.023 0.029  
––– 0.032 0.046  
1.0 ––– –––  
––– 14 –––  
––– ––– 1.0  
––– ––– 25  
––– ––– 100  
––– ––– -100  
VGS = 10V, ID = 5.8A „  
GS = 4.5V, ID = 4.7A „  
RDS(on)  
Static Drain-to-Source On-Resistance  
Ω
V
VGS(th)  
gfs  
Gate Threshold Voltage  
V
S
VDS = VGS, ID = 250µA  
VDS = 15V, ID = 5.8A  
Forward Transconductance  
V
DS = 24V, VGS = 0V  
IDSS  
IGSS  
Drain-to-Source Leakage Current  
µA  
nA  
VDS = 24V, VGS = 0V, TJ = 55°C  
VGS = 20V  
Gate-to-Source Forward Leakage  
Gate-to-Source Reverse Leakage  
Total Gate Charge  
VGS = -20V  
Qg  
––– 22  
33  
ID = 5.8A  
Qgs  
Qgd  
td(on)  
tr  
Gate-to-Source Charge  
Gate-to-Drain ("Miller") Charge  
Turn-On Delay Time  
Rise Time  
––– 2.6 3.9  
––– 6.4 9.6  
nC VDS = 15V  
VGS = 10V, See Fig. 10 „  
––– 8.1  
––– 8.9  
––– 26  
––– 17  
12  
13  
39  
26  
VDD = 15V  
ID = 1.0A  
ns  
pF  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
RG = 6.0Ω  
RD = 15Ω „  
VGS = 0V  
Ciss  
Coss  
Crss  
Input Capacitance  
––– 650 –––  
––– 320 –––  
––– 130 –––  
Output Capacitance  
VDS = 25V  
Reverse Transfer Capacitance  
ƒ = 1.0MHz, See Fig. 9  
Source-Drain Ratings and Characteristics  
Parameter  
Continuous Source Current  
(Body Diode)  
Min. Typ. Max. Units  
Conditions  
MOSFET symbol  
showing the  
IS  
D
S
––– ––– 2.5  
A
G
ISM  
Pulsed Source Current  
(Body Diode)   
integral reverse  
––– ––– 30  
p-n junction diode.  
VSD  
trr  
Diode Forward Voltage  
Reverse Recovery Time  
Reverse RecoveryCharge  
––– 0.78 1.0  
V
TJ = 25°C, IS = 1.7A, VGS = 0V ƒ  
TJ = 25°C, IF = 1.7A  
––– 45  
––– 58  
68  
87  
ns  
nC  
Qrr  
di/dt = 100A/µs ƒ  
Notes:  
 Repetitive rating; pulse width limited by max. junction temperature. ( See fig. 11 )  
‚ Starting TJ = 25°C, L = 10mH, RG = 25Ω, IAS = 4.0A.  
ƒ ISD 4.0A, di/dt 74A/µs, VDD V(BR)DSS, TJ 150°C  
„ Pulse width 300µs; duty cycle 2%.  
Surface mounted on FR-4 board, t 10sec.  
2
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November 14, 2013  
IRF7313PbF-1  
100  
10  
1
100  
10  
1
VGS  
15V  
VGS  
15V  
TOP  
TOP  
10V  
10V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
7.0V  
5.5V  
4.5V  
4.0V  
3.5V  
BOTTOM 3.0V  
BOTTOM 3.0V  
3.0V  
3.0V  
20μs PULSE WIDTH  
20μs PULSE WIDTH  
T
J
= 25°C  
T
J
= 150°C  
A
A
0.1  
1
10  
0.1  
1
10  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
VDS  
100  
10  
1
100  
TJ = 25°C  
TJ = 150°C  
T = 150°C  
J
10  
T = 25°C  
J
VDS = 10V  
20μs PULSE WIDTH  
V
= 0V  
GS  
A
1
5.0A  
3.0  
3.5  
4.0  
4.5  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
VGS , Gate-to-Source Voltage (V)  
V
, Source-to-Drain Voltage (V)  
SD  
Fig 4. Typical Source-Drain Diode  
Fig 3. Typical Transfer Characteristics  
Forward Voltage  
3
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November 14, 2013  
IRF7313PbF-1  
2.0  
1.5  
1.0  
0.5  
0.0  
0.040  
0.036  
0.032  
0.028  
0.024  
0.020  
5.8A  
=
I
D
V
= 4.5V  
GS  
V
= 10V  
GS  
V
= 10V  
GS  
A
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
°
0
10  
20  
30  
40  
T , Junction Temperature ( C)  
J
I
, Drain Current (A)  
D
Fig 5. Normalized On-Resistance  
Fig 6. Typical On-Resistance Vs. Drain  
Vs. Temperature  
Current  
200  
0.12  
I
D
TOP  
1.8A  
3.2A  
BOTTOM 4.0A  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
160  
120  
80  
40  
0
I
= 5.8A  
D
A
A
0
3
6
9
12  
15  
25  
50  
75  
100  
125  
150  
Starting T , Junction Temperature (°C)  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 7. Typical On-Resistance Vs. Gate  
Fig 8. Maximum Avalanche Energy  
Voltage  
Vs. Drain Current  
4
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November 14, 2013  
IRF7313PbF-1  
1200  
900  
600  
300  
0
20  
16  
12  
8
V
C
C
C
= 0V,  
f = 1MHz  
GS  
iss  
rss  
oss  
I = 5.8A  
D
= C + C  
,
C
SHORTED  
gs  
gd  
gd  
ds  
V
= 15V  
DS  
= C  
= C + C  
ds  
gd  
C
iss  
C
oss  
C
rss  
4
0
A
0
10  
20  
30  
40  
1
10  
100  
Q , Total Gate Charge (nC)  
V
, Drain-to-Source Voltage (V)  
G
DS  
Fig 9. Typical Capacitance Vs.  
Fig 10. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
100  
10  
1
0.50  
0.20  
0.10  
0.05  
0.02  
0.01  
P
2
DM  
t
1
t
2
Notes:  
1. Duty factor D = t / t  
SINGLE PULSE  
1
(THERMAL RESPONSE)  
2. Peak T =P  
J
x Z  
+ T  
thJA A  
DM  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient  
5
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November 14, 2013  
IRF7313PbF-1  
SO-8 Package Outline  
Dimensions are shown in milimeters (inches)  
INCHES  
MILLIMETERS  
DIM  
A
D
B
MIN  
.0532  
MAX  
.0688  
.0098  
.020  
MIN  
1.35  
0.10  
0.33  
0.19  
4.80  
3.80  
MAX  
1.75  
0.25  
0.51  
0.25  
5.00  
4.00  
5
A
E
A1 .0040  
b
c
D
E
.013  
8
1
7
2
6
3
5
.0075  
.189  
.0098  
.1968  
.1574  
6
H
0.25 [.010]  
A
.1497  
4
e
.050 BASIC  
1.27 BASIC  
0.635 BASIC  
e1 .025 BASIC  
H
K
L
.2284  
.0099  
.016  
0°  
.2440  
.0196  
.050  
8°  
5.80  
0.25  
0.40  
0°  
6.20  
0.50  
1.27  
8°  
e
6X  
y
e1  
A
K x 45°  
A
C
y
0.10 [.004]  
8X c  
A1  
B
8X L  
8X b  
0.25 [.010]  
7
C
F OOT PRINT  
8X 0.72 [.028]  
NOT ES :  
1. DIMENSIONING & TOLERANCING PER ASME Y14.5M-1994.  
2. CONTROLLING DIMENSION: MILLIMETER  
3. DIMENS IONS ARE S HOWN IN MIL L IME T E RS [INCHES ].  
4. OUT L INE CONF OR MS T O JEDEC OU T LINE MS -012AA.  
5
6
7
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.15 [.006].  
6.46 [.255]  
DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS.  
MOLD PROTRUSIONS NOT TO EXCEED 0.25 [.010].  
DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO  
ASUBSTRATE.  
3X 1.27 [.050]  
8X 1.78 [.070]  
SO-8 Part Marking Information (Lead-Free)  
EXAMPLE: THIS IS AN IRF7101 (MOSFET)  
DATE CODE (YWW)  
P = DESIGNATES LEAD-FREE  
PRODUCT (OPTIONAL)  
Y = LAST DIGIT OF THE YEAR  
WW = WEEK  
XXXX  
F7101  
INTERNATIONAL  
RECTIFIER  
LOGO  
A = AS S E MB LY S IT E CODE  
LOT CODE  
PART NUMBER  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
6
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November 14, 2013  
IRF7313PbF-1  
SO-8 Tape and Reel (Dimensions are shown in milimeters (inches))  
TERMINAL NUMBER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
FEED DIRECTION  
7.9 ( .312 )  
NOTES:  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES).  
3. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
330.00  
(12.992)  
MAX.  
14.40 ( .566 )  
12.40 ( .488 )  
NOTES :  
1. CONTROLLING DIMENSION : MILLIMETER.  
2. OUTLINE CONFORMS TO EIA-481 & EIA-541.  
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/  
Qualification information†  
Industrial  
(per JEDEC JESD47F†† guidelines)  
Qualification level  
MS L 1  
Moisture Sensitivity Level  
RoHS compliant  
SO-8  
(per JEDEC J-STD-020D††  
Yes  
)
Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability  
†† Applicable version of JEDEC standard at the time of product release  
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA  
To contact International Rectifier, please visithttp://www.irf.com/whoto-call/  
7
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November 14, 2013  

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