IRF7807D2TRPBF [INFINEON]

Power Field-Effect Transistor, 8.3A I(D), 30V, 0.025ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, SO-8;
IRF7807D2TRPBF
型号: IRF7807D2TRPBF
厂家: Infineon    Infineon
描述:

Power Field-Effect Transistor, 8.3A I(D), 30V, 0.025ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, SO-8

开关 脉冲 光电二极管 晶体管
文件: 总8页 (文件大小:100K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PD- 93762  
IRF7807D2  
FETKYMOSFET / SCHOTTKY DIODE  
• Co-Pack N-channel HEXFET Power MOSFET  
and Schottky Diode  
• Ideal for Synchronous Rectifiers in DC-DC  
Converters up to 5A Output  
• Low Conduction Losses  
• Low Switching Losses  
1
2
3
4
8
7
K/D  
K/D  
A/S  
A/S  
6
5
A/S  
G
K/D  
K/D  
• Low Vf Schottky Rectifier  
SO-8  
Top View  
Description  
The FETKYfamily of Co-Pack HEXFET MOSFETs  
and Schottky diodes offers the designer an innovative,  
board space saving solution for switching regulator and  
power management applications. HEXFET power  
MOSFETs utilize advanced processing techniques to  
achieve extremely low on-resistance per silicon area.  
Combining this technology with International Rectifier’s  
low forward drop Schottky rectifiers results in an extremely  
efficient device suitable for use in a wide variety of  
portable electronics applications.  
Device Features (Max Values)  
IRF7807D2  
VDS  
30V  
RDS(on)  
Qg  
25mΩ  
14nC  
QSW  
Qoss  
5.2nC  
21.6nC  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics.The SO-  
8 package is designed for vapor phase, infrared or wave  
soldering techniques.  
Absolute Maximum Ratings  
Parameter  
Symbol  
VDS  
Max.  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain or Source  
Current (VGS 4.5V)  
Pulsed Drain Current  
Power Dissipation  
30  
±12  
V
VGS  
25°C  
70°C  
ID  
8.3  
6.6  
A
IDM  
PD  
66  
25°C  
70°C  
25°C  
70°C  
2.5  
W
A
1.6  
Schottky and Body Diode  
IF (AV)  
TJ,TSTG  
3.7  
Average ForwardCurrent„  
2.3  
Junction & Storage Temperature Range  
–55 to 150  
°C  
Thermal Resistance  
Parameter  
Max.  
Units  
Maximum Junction-to-Ambientƒ  
RθJA  
50  
°C/W  
www.irf.com  
1
11/8/99  
IRF7807D2  
Electrical Characteristics  
Parameter  
Min  
Typ  
Max Units  
Conditions  
Drain-to-Source  
V(BR)DSS  
30  
V
VGS = 0V, ID = 250µA  
Breakdown Voltage*  
Static Drain-Source  
on Resistance*  
RDS(on)  
17  
25  
mΩ  
VGS = 4.5V, ID = 7A‚  
Gate Threshold Voltage* VGS(th)  
1.0  
V
VDS = VGS,ID = 250µA  
Drain-Source Leakage  
Current*  
IDSS  
90  
7.2  
µA  
mA  
VDS = 24V, VGS = 0V  
VDS = 24V, VGS = 0V,  
Tj = 125°C  
Gate-Source Leakage  
Current*  
IGSS  
+/- 100 nA  
VGS = +/-12V  
Total Gate Charge  
Synch FET*  
Total Gate Charge  
Control FET*  
Pre-Vth  
Gate-Source Charge  
Post-Vth  
Qgsync  
Qgcont  
Qgs1  
Qgs2  
10.5  
12  
14  
17  
VDS<100mV,  
VGS = 5V, ID = 7A  
VDS= 16V,  
VGS = 5V, ID = 7A  
VDS = 16V, ID = 7A  
2.1  
0.76  
nC  
Gate-Source Charge  
Gate to Drain Charge  
Switch Charge*  
(Qgs2 + Qgd)  
Qgd  
QSW  
2.9  
3.66  
5.2  
Output Charge*  
Gate Resistance  
Qoss  
Rg  
17.6  
1.2  
21.6  
VDS = 16V, VGS = 0  
Schottky Diode & Body Diode Ratings and Characteristics  
Parameter  
Diode Forward Voltage  
Min  
Typ  
Max  
0.54  
0.43  
Units  
V
Conditions  
Tj = 25°C, Is = 3A, VGS =0V‚  
Tj = 125°C, Is = 3A, VGS =0V‚  
VSD  
trr  
Reverse Recovery Time  
36  
41  
ns T = 25°C, Is = 7.0A, VDS = 16V  
j
Reverse Recovery Charge  
Forward Turn-On Time  
Qrr  
ton  
nC di/dt = 100A/µs  
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)  

‚
ƒ
„
*
Repetitive rating; pulse width limited by max. junction temperature.  
Pulse width 300 µs; duty cycle 2%.  
When mounted on 1 inch square copper board, t < 10 sec.  
50% Duty Cycle, Rectangular  
Devices are 100% tested to these parameters.  
2
www.irf.com  
IRF7807D2  
100  
10  
1
100  
10  
1
VGS  
4.5V  
3.5V  
3.0V  
VGS  
4.5V  
3.5V  
3.0V  
TOP  
TOP  
BOTTOM 2.5V  
BOTTOM 2.5V  
2.5V  
2.5V  
380µs PULSE WIDTH  
Tj = 25°C  
380µs PULSE WIDTH  
Tj = 150°C  
0.1  
1
10  
0.1  
1
10  
V
, Drain-to-Source Voltage (V)  
V
, Drain-to-Source Voltage (V)  
DS  
DS  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
70  
70  
VGS  
4.5V  
3.5V  
3.0V  
2.5V  
2.0V  
VGS  
TOP  
TOP  
4.5V  
3.5V  
3.0V  
2.5V  
2.0V  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
BOTTOM 0.0V  
BOTTOM 0.0V  
O.OV  
0.0 V  
380µS PULSE WIDTH  
Tj = 150°C  
380µs PULSE WIDTH  
Tj = 25°C  
0
0.2  
0.4  
0.6  
0.8  
1
0
0.2  
0.4  
0.6  
0.8  
1
V
, Source-to-Drain Voltage (V)  
SD  
V
, Source-to-Drain Voltage (V)  
SD  
Fig 4. Typical Reverse Output Characteristics  
Fig 3. Typical Reverse Output Characteristics  
www.irf.com  
3
IRF7807D2  
2000  
6
4
2
0
V
= 0V,  
f = 1MHz  
C SHORTED  
ds  
GS  
I
= 7.0A  
C
= C + C  
D
iss  
gs  
gd ,  
C
= C  
V
= 16V  
rss  
gd  
DS  
C
= C + C  
gd  
1600  
1200  
800  
400  
0
oss  
ds  
C
iss  
C
oss  
C
rss  
1
10  
100  
0
4
8
12  
V
, Drain-to-Source Voltage (V)  
DS  
Q
Total Gate Charge (nC)  
G,  
Fig 5. Typical Capacitance Vs.  
Fig 6. Typical Gate Charge Vs.  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
2.0  
1.5  
1.0  
0.5  
100  
I
= 7.0A  
D
V
= 4.5V  
GS  
T = 25°C  
J
T = 150°C  
J
V
= 10V  
DS  
380µs PULSE WIDTH  
10  
-60 -40 -20  
0
20 40 60 80 100 120 140 160  
2.5  
3.0  
3.5  
T , Junction Temperature (°C )  
J
V
, Gate-to-Source Voltage (V)  
GS  
Fig 7. Normalized On-Resistance  
Fig 8. Typical Transfer Characteristics  
Vs. Temperature  
4
www.irf.com  
IRF7807D2  
0.024  
0.022  
0.020  
0.018  
0.016  
0.05  
0.04  
0.03  
0.02  
0.01  
VGS = 4.5V  
VGS = 10V  
I
= 7.0A  
D
0
20  
I
40  
60  
80  
2.0  
4.0  
6.0  
8.0  
10.0  
, Drain Current (A)  
D
V
Gate -to -Source Voltage (V)  
GS,  
Fig 10. On-Resistance Vs. Drain Current  
Fig 9. On-Resistance Vs. Gate Voltage  
100  
D = 0.50  
0.20  
10  
0.10  
0.05  
0.02  
P
0.01  
DM  
SINGLE PULSE  
(THERMAL RESPONSE)  
1
t
1
t
2
Notes:  
1. Duty factor D = t / t  
1
2
2. Peak T = P  
x Z  
+ T  
A
J
DM  
thJA  
0.1  
0.001  
0.01  
0.1  
1
10  
100  
t , Rectangular Pulse Duration (sec)  
1
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient (MOSFET)  
www.irf.com  
5
IRF7807D2  
Mosfet, Body Diode & Schottky Diode Characteristics  
100  
10  
1
100  
10  
Tj = 150°C  
125°C  
100°C  
75°C  
1
Tj = 125°C  
Tj = 25°C  
0.1  
50°C  
25°C  
0.01  
0.001  
0
5
10  
15  
20  
25  
30  
Reverse Voltage - V (V)  
R
Fig. 13 - Typical Values of  
Reverse Current Vs. Reverse Voltage  
0.1  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
Forward Voltage Drop - V  
( V )  
SD  
Fig. 12 - Typical Forward Voltage Drop  
Characteristics  
6
www.irf.com  
IRF7807D2  
SO-8 Package Details  
Part Marking  
www.irf.com  
7
IRF7807D2  
Tape and Reel  
TER M INAL NU M BER 1  
12.3 ( .484 )  
11.7 ( .461 )  
8.1 ( .318 )  
7.9 ( .312 )  
FEED D IREC TIO N  
N OTES:  
1. C ON TRO LLIN G DIM EN SION : M ILLIM ETER.  
2. ALL DIM ENSION S ARE SHO W N IN M ILLIM ETER S(INC HES).  
3. OU TLIN E C ON FOR M S TO EIA-481 & EIA-541.  
330.00  
(12.992)  
M AX.  
14.40 ( .566 )  
12.40 ( .488 )  
NO TES :  
1. CO NTRO LLING D IM EN SIO N : M ILLIM ETER .  
2. O U TLINE C O N FO RM S TO EIA-481 & EIA-541.  
WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331  
IR GREAT BRITAIN: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020  
IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200  
IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590  
IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111  
IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086  
IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 838 4630  
IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan Tel: 886-2-2377-9936  
Data and specifications subject to change without notice.  
11/99  
8
www.irf.com  

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